KR20040068359A - 연마 제품의 제조 방법 - Google Patents
연마 제품의 제조 방법 Download PDFInfo
- Publication number
- KR20040068359A KR20040068359A KR10-2004-7010169A KR20047010169A KR20040068359A KR 20040068359 A KR20040068359 A KR 20040068359A KR 20047010169 A KR20047010169 A KR 20047010169A KR 20040068359 A KR20040068359 A KR 20040068359A
- Authority
- KR
- South Korea
- Prior art keywords
- abrasive
- coating
- foam
- backing
- embossed
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
- B24D11/008—Finishing manufactured abrasive sheets, e.g. cutting, deforming
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D2203/00—Tool surfaces formed with a pattern
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Disintegrating Or Milling (AREA)
Abstract
Description
습식 쉬퍼 시험 | ||||
샘플 | R z -개시 ㎛ (μ-인치) | R z @ 30 주기 ㎛ (μ-인치) | R z @ 60 주기 ㎛ (μ-인치) | R z @ 90 주기 ㎛ (μ-인치) |
비교샘플 1 | 1.74 (68.5) | 0.76 (30.0) | 0.66 (25.8) | 0.67 (26.4) |
실시예 1엠보싱되지 않은연마재 | 1.67 (65.8) | 0.80 (31.6) | 0.52 (20.7) | 0.40 (15.6) |
엠보싱된 연마재 | 1.70 (67.0) | 0.76 (29.8) | 0.62 (24.6) | 0.60 (23.7) |
실시예2엠보싱되지 않은연마재 | 1.70 (67.3) | 0.76 (30.0) | 0.48 (19.0) | 0.39 (15.5) |
실시예2엠보싱된 연마재 | 1.67 (65.6) | 0.82 (32.3) | 0.53 (20.7) | 0.45 (17.8) |
패널 시험 | |||||
실시예 | 스틱션 | R z -개시 ㎛ (μ-인치) | R z @ 10 초 ㎛ (μ-인치) | R z @ 30 초 ㎛ (μ-인치) | R z @ 60 초 ㎛ (μ-인치) |
비교샘플 1 | 없음 | 1.70 (67.1) | 0.69 (27.3) | 0.56 (22.1) | 0.56 (22.1) |
실시예 1엠보싱되지 않은연마재 | 있음 | 1.66 (65.4) | 0.41 (16.1) | 0.44 (17.3) | 0.44 (17.5) |
실시예 1엠보싱된 연마재 | 없음 | 1.70 (66.9) | 0.65 (25.7) | 0.56 (22.2) | 0.55 (21.7) |
실시예 2엠보싱되지 않은연마재 | 없음 | 1.71 (67.4) | 0.68 (26.8) | 0.55 (21.5) | 0.55 (21.7) |
실시예 2엠보싱된 연마재 | 없음 | 1.73 (68.0) | 0.66 (26.1) | 0.56 (22.0) | 0.57 (22.3) |
Claims (26)
- a. 제1 표면 및 대향 제2 표면을 갖는 시트형 발포체 배킹을 제공하는 단계;b. 상기 제1 표면상에 연마재 입자 및 결합제를 포함한 연마재 코팅을 제공하여 연마 용품을 제공하는 단계; 및c. 엠보싱 표면이 적어도 볼록부 영역의 패턴을 포함하는 패턴화된 엠보싱 공구를 압력하에 연마 용품의 연마재 코팅에 적용하여, 상기 연마재 코팅 및 상기 발포체 배킹에서 적어도 상기 엠보싱 표면의 볼록부 영역에 상응하는 오목부 영역을 포함하는 엠보싱된 패턴을 제공함으로써 엠보싱된 연마 용품을 제공하는 단계를 포함하는, 엠보싱된 연마 용품의 제조 방법.
- 제1항에 있어서, 엠보싱 표면이 또한 오목부 영역을 포함하고, 또한 엠보싱된 패턴이 상기 엠보싱 표면의 오목부 영역에 상응하는 볼록부 영역을 포함하는 방법.
- 제1항 또는 제2항에 있어서, 패턴이 균일 패턴을 포함하는 방법.
- 제1항 또는 제2항에 있어서, 패턴이 랜덤 패턴을 포함하는 방법.
- 제1항 내지 제4항 중 어느 한 항에 있어서, 제1 표면에 유동성인 경화성 결합제 메이크 코팅을 도포함으로써 연마재 입자 및 적어도 부분적으로 경화한 메이크 코팅을 그 안에 적어도 부분적으로 매립함으로써 연마재 코팅을 제공하는 방법.
- 제5항에 있어서, 메이크 코팅 및 연마재 입자 상에 상기 유동성 결합제 사이즈 코팅 및 경화 사이즈 코팅을 도포하는 것을 더 포함하는 방법.
- 제6항에 있어서, 하나 이상의 결합제 메이크 코팅 및 결합제 사이즈 코팅이 방사-경화성 결합제를 포함하고, 상기 경화가 방사 경화에 의한 것인 방법.
- 제1항에 있어서, 유동성인 경화성 결합제와 연마재 입자의 혼합물을 제1 표면에 도포하고 상기 유동성인 경화성 결합제를 경화시켜 연마재 코팅을 제공함으로써 연마재 코팅을 제공하는 방법.
- 제8항에 있어서, 유동성인 경화성 결합제가 방사-경화성 결합제를 포함하고, 상기 경화가 방사 경화에 의한 것인 방법.
- 제8항 또는 제9항에 있어서, 유동성인 경화성 결합제와 연마재 입자의 코팅 혼합물을 제1 표면에 도포한 후 및 경화 전에, 연마재 코팅에 패턴을 부여하는 표면을 갖는 소자와 상기 코팅을 접촉시켜, 발포체 배킹에서가 아닌 연마재 코팅에 볼록부 영역 및 오목부 영역을 제공하고, 패턴화된 연마재 코팅을 적어도 부분적으로 경화시키는 방법.
- 제1항 내지 제10항 중 어느 한 항에 있어서, 패턴화된 엠보싱 공구가 엠보싱 롤인 방법.
- 제1항 내지 제11항 중 어느 한 항에 있어서, 오목부 영역을 발포체 배킹 내 200 ㎛ 이상의 깊이로 확장하는 방법.
- 제1항 내지 제12항 중 어느 한 항에 있어서, 발포체 배킹이 약 0.2 밀리미터 이상의 두께를 갖는 방법.
- 제1항 내지 제12항 중 어느 한 항에 있어서, 발포체 배킹이 약 1 밀리미터 내지 약 6 밀리미터의 두께를 갖는 방법.
- 제1항 내지 제14항 중 어느 한 항에 있어서, 발포체 배킹이 연속기포 발포체인 방법.
- 제1항 내지 제15항 중 어느 한 항에 있어서, 발포체 배킹이 독립기포 발포체인 방법.
- 제1항 내지 제16항 중 어느 한 항에 있어서, 연마재 입자가 0.1 내지 60 마이크로미터의 평균 입도를 갖는 방법.
- 제1항 내지 제17항 중 어느 한 항에 있어서, 상기 평균 입도가 1 내지 30 마이크로미터인 방법.
- 제1항 내지 제18항 중 어느 한 항에 있어서, 오목부 영역과 연마재 코팅 사이의 거리가 200 마이크로미터 이상인 방법.
- 제1항 내지 제19항 중 어느 한 항에 있어서, 상기 거리가 500 마이크로미터 이상인 방법.
- 제1항 내지 제20항 중 어느 한 항에 있어서, 발포체 배킹이 폴리에틸렌 발포체 배킹을 포함하는 방법.
- 제1항 내지 제 20항 중 어느 한 항에 있어서, 발포체 배킹이 폴리우레탄 발포체 배킹을 포함하는 방법.
- 제1항 내지 제22항 중 어느 한 항에 있어서, 엠보싱 공구를 가열하는 방법.
- 제1항 내지 제23항 중 어느 한 항에 있어서, 엠보싱 공구를 30℃ 이상에서 가열하는 방법.
- 제1항 내지 제23항 중 어느 한 항에 있어서, 상기 엠보싱 공구를 80℃ 내지 210℃의 온도로 가열하는 방법.
- 제1항 내지 제25항 중 어느 한 항에 있어서, 엠보싱 공구에 1.5 내지 200 N/웹 폭 cm의 압력을 인가하는 방법.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/033,464 US6949128B2 (en) | 2001-12-28 | 2001-12-28 | Method of making an abrasive product |
US10/033,464 | 2001-12-28 | ||
PCT/US2002/035541 WO2003057410A1 (en) | 2001-12-28 | 2002-11-06 | Method of making an abrasive product |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20040068359A true KR20040068359A (ko) | 2004-07-30 |
KR100940953B1 KR100940953B1 (ko) | 2010-02-05 |
Family
ID=21870558
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020047010169A KR100940953B1 (ko) | 2001-12-28 | 2002-11-06 | 연마 제품의 제조 방법 |
Country Status (12)
Country | Link |
---|---|
US (1) | US6949128B2 (ko) |
EP (1) | EP1458524B1 (ko) |
JP (1) | JP4291695B2 (ko) |
KR (1) | KR100940953B1 (ko) |
CN (1) | CN100491078C (ko) |
AT (1) | ATE318677T1 (ko) |
AU (1) | AU2002356909A1 (ko) |
BR (1) | BRPI0215335B1 (ko) |
CA (1) | CA2469808C (ko) |
DE (1) | DE60209573T2 (ko) |
ES (1) | ES2261792T3 (ko) |
WO (1) | WO2003057410A1 (ko) |
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KR101227209B1 (ko) * | 2004-12-20 | 2013-01-28 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 연마 제품, 그 제조 및 이용 방법 그리고 그 제조 장치 |
KR100927109B1 (ko) * | 2005-04-14 | 2009-11-18 | 생-고뱅 어브레이시브즈, 인코포레이티드 | 구조화된 연마 제품의 형성방법 |
US9522454B2 (en) | 2012-12-17 | 2016-12-20 | Seagate Technology Llc | Method of patterning a lapping plate, and patterned lapping plates |
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DE60209573T2 (de) | 2006-12-07 |
BRPI0215335B1 (pt) | 2017-05-02 |
EP1458524A1 (en) | 2004-09-22 |
DE60209573D1 (de) | 2006-04-27 |
JP4291695B2 (ja) | 2009-07-08 |
CA2469808A1 (en) | 2003-07-17 |
CN1767926A (zh) | 2006-05-03 |
CA2469808C (en) | 2011-03-22 |
US6949128B2 (en) | 2005-09-27 |
ES2261792T3 (es) | 2006-11-16 |
CN100491078C (zh) | 2009-05-27 |
EP1458524B1 (en) | 2006-03-01 |
ATE318677T1 (de) | 2006-03-15 |
WO2003057410A1 (en) | 2003-07-17 |
BR0215335A (pt) | 2004-11-16 |
AU2002356909A1 (en) | 2003-07-24 |
US20030150169A1 (en) | 2003-08-14 |
JP2005514217A (ja) | 2005-05-19 |
KR100940953B1 (ko) | 2010-02-05 |
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