IL156485A0 - Cmp pad with long user life - Google Patents
Cmp pad with long user lifeInfo
- Publication number
- IL156485A0 IL156485A0 IL15648503A IL15648503A IL156485A0 IL 156485 A0 IL156485 A0 IL 156485A0 IL 15648503 A IL15648503 A IL 15648503A IL 15648503 A IL15648503 A IL 15648503A IL 156485 A0 IL156485 A0 IL 156485A0
- Authority
- IL
- Israel
- Prior art keywords
- cmp pad
- user life
- long user
- long
- life
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IL15648503A IL156485A0 (en) | 2003-06-17 | 2003-06-17 | Cmp pad with long user life |
US10/678,830 US20040256055A1 (en) | 2003-06-17 | 2003-10-03 | CMP pad with long user life |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IL15648503A IL156485A0 (en) | 2003-06-17 | 2003-06-17 | Cmp pad with long user life |
Publications (1)
Publication Number | Publication Date |
---|---|
IL156485A0 true IL156485A0 (en) | 2004-01-04 |
Family
ID=32587638
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IL15648503A IL156485A0 (en) | 2003-06-17 | 2003-06-17 | Cmp pad with long user life |
Country Status (2)
Country | Link |
---|---|
US (1) | US20040256055A1 (en) |
IL (1) | IL156485A0 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101974689A (en) * | 2010-09-26 | 2011-02-16 | 金川集团有限公司 | Method for processing material containing copper |
CN109420973B (en) * | 2017-09-05 | 2020-11-17 | 联华电子股份有限公司 | Wafer polishing disk and use method thereof |
CN107641835B (en) * | 2017-10-23 | 2019-11-26 | 大连理工大学 | A kind of method of semiconductor wafer optical electro-chemistry mechanical polishing |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5197999A (en) * | 1991-09-30 | 1993-03-30 | National Semiconductor Corporation | Polishing pad for planarization |
US6099394A (en) * | 1998-02-10 | 2000-08-08 | Rodel Holdings, Inc. | Polishing system having a multi-phase polishing substrate and methods relating thereto |
US5709598A (en) * | 1993-06-02 | 1998-01-20 | Dai Nippon Printing Co., Ltd. | Abrasive tape and method of producing the same |
US5489233A (en) * | 1994-04-08 | 1996-02-06 | Rodel, Inc. | Polishing pads and methods for their use |
US6090475A (en) * | 1996-05-24 | 2000-07-18 | Micron Technology Inc. | Polishing pad, methods of manufacturing and use |
WO1998016347A1 (en) * | 1996-10-15 | 1998-04-23 | Nippon Steel Corporation | Semiconductor substrate polishing pad dresser, method of manufacturing the same, and chemicomechanical polishing method using the same dresser |
US6435947B2 (en) * | 1998-05-26 | 2002-08-20 | Cabot Microelectronics Corporation | CMP polishing pad including a solid catalyst |
JP2000301450A (en) * | 1999-04-19 | 2000-10-31 | Rohm Co Ltd | Cmp polishing pad and cmp processing device using it |
WO2001045900A1 (en) * | 1999-12-23 | 2001-06-28 | Rodel Holdings, Inc. | Self-leveling pads and methods relating thereto |
US6537144B1 (en) * | 2000-02-17 | 2003-03-25 | Applied Materials, Inc. | Method and apparatus for enhanced CMP using metals having reductive properties |
US6652764B1 (en) * | 2000-08-31 | 2003-11-25 | Micron Technology, Inc. | Methods and apparatuses for making and using planarizing pads for mechanical and chemical-mechanical planarization of microelectronic substrates |
US7255637B2 (en) * | 2000-09-08 | 2007-08-14 | Applied Materials, Inc. | Carrier head vibration damping |
US20020090901A1 (en) * | 2000-11-03 | 2002-07-11 | 3M Innovative Properties Company | Flexible abrasive product and method of making and using the same |
US7192340B2 (en) * | 2000-12-01 | 2007-03-20 | Toyo Tire & Rubber Co., Ltd. | Polishing pad, method of producing the same, and cushion layer for polishing pad |
WO2002070194A1 (en) * | 2001-03-02 | 2002-09-12 | Igc-Superpower, Llc | Reel-to-reel substrate tape polishing system |
US20020160692A1 (en) * | 2001-04-27 | 2002-10-31 | Applied Materials, Inc. | Method for planarizing organosilicate layers |
US6949128B2 (en) * | 2001-12-28 | 2005-09-27 | 3M Innovative Properties Company | Method of making an abrasive product |
US6758734B2 (en) * | 2002-03-18 | 2004-07-06 | 3M Innovative Properties Company | Coated abrasive article |
US7018268B2 (en) * | 2002-04-09 | 2006-03-28 | Strasbaugh | Protection of work piece during surface processing |
US6918820B2 (en) * | 2003-04-11 | 2005-07-19 | Eastman Kodak Company | Polishing compositions comprising polymeric cores having inorganic surface particles and method of use |
-
2003
- 2003-06-17 IL IL15648503A patent/IL156485A0/en unknown
- 2003-10-03 US US10/678,830 patent/US20040256055A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
US20040256055A1 (en) | 2004-12-23 |
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