IL156485A0 - Cmp pad with long user life - Google Patents

Cmp pad with long user life

Info

Publication number
IL156485A0
IL156485A0 IL15648503A IL15648503A IL156485A0 IL 156485 A0 IL156485 A0 IL 156485A0 IL 15648503 A IL15648503 A IL 15648503A IL 15648503 A IL15648503 A IL 15648503A IL 156485 A0 IL156485 A0 IL 156485A0
Authority
IL
Israel
Prior art keywords
cmp pad
user life
long user
long
life
Prior art date
Application number
IL15648503A
Original Assignee
J G Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by J G Systems Inc filed Critical J G Systems Inc
Priority to IL15648503A priority Critical patent/IL156485A0/en
Priority to US10/678,830 priority patent/US20040256055A1/en
Publication of IL156485A0 publication Critical patent/IL156485A0/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/11Lapping tools
    • B24B37/20Lapping pads for working plane surfaces
    • B24B37/26Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/11Lapping tools
    • B24B37/20Lapping pads for working plane surfaces
    • B24B37/24Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
IL15648503A 2003-06-17 2003-06-17 Cmp pad with long user life IL156485A0 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
IL15648503A IL156485A0 (en) 2003-06-17 2003-06-17 Cmp pad with long user life
US10/678,830 US20040256055A1 (en) 2003-06-17 2003-10-03 CMP pad with long user life

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IL15648503A IL156485A0 (en) 2003-06-17 2003-06-17 Cmp pad with long user life

Publications (1)

Publication Number Publication Date
IL156485A0 true IL156485A0 (en) 2004-01-04

Family

ID=32587638

Family Applications (1)

Application Number Title Priority Date Filing Date
IL15648503A IL156485A0 (en) 2003-06-17 2003-06-17 Cmp pad with long user life

Country Status (2)

Country Link
US (1) US20040256055A1 (en)
IL (1) IL156485A0 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101974689A (en) * 2010-09-26 2011-02-16 金川集团有限公司 Method for processing material containing copper
CN109420973B (en) * 2017-09-05 2020-11-17 联华电子股份有限公司 Wafer polishing disk and use method thereof
CN107641835B (en) * 2017-10-23 2019-11-26 大连理工大学 A kind of method of semiconductor wafer optical electro-chemistry mechanical polishing

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5197999A (en) * 1991-09-30 1993-03-30 National Semiconductor Corporation Polishing pad for planarization
US6099394A (en) * 1998-02-10 2000-08-08 Rodel Holdings, Inc. Polishing system having a multi-phase polishing substrate and methods relating thereto
US5709598A (en) * 1993-06-02 1998-01-20 Dai Nippon Printing Co., Ltd. Abrasive tape and method of producing the same
US5489233A (en) * 1994-04-08 1996-02-06 Rodel, Inc. Polishing pads and methods for their use
US6090475A (en) * 1996-05-24 2000-07-18 Micron Technology Inc. Polishing pad, methods of manufacturing and use
WO1998016347A1 (en) * 1996-10-15 1998-04-23 Nippon Steel Corporation Semiconductor substrate polishing pad dresser, method of manufacturing the same, and chemicomechanical polishing method using the same dresser
US6435947B2 (en) * 1998-05-26 2002-08-20 Cabot Microelectronics Corporation CMP polishing pad including a solid catalyst
JP2000301450A (en) * 1999-04-19 2000-10-31 Rohm Co Ltd Cmp polishing pad and cmp processing device using it
WO2001045900A1 (en) * 1999-12-23 2001-06-28 Rodel Holdings, Inc. Self-leveling pads and methods relating thereto
US6537144B1 (en) * 2000-02-17 2003-03-25 Applied Materials, Inc. Method and apparatus for enhanced CMP using metals having reductive properties
US6652764B1 (en) * 2000-08-31 2003-11-25 Micron Technology, Inc. Methods and apparatuses for making and using planarizing pads for mechanical and chemical-mechanical planarization of microelectronic substrates
US7255637B2 (en) * 2000-09-08 2007-08-14 Applied Materials, Inc. Carrier head vibration damping
US20020090901A1 (en) * 2000-11-03 2002-07-11 3M Innovative Properties Company Flexible abrasive product and method of making and using the same
US7192340B2 (en) * 2000-12-01 2007-03-20 Toyo Tire & Rubber Co., Ltd. Polishing pad, method of producing the same, and cushion layer for polishing pad
WO2002070194A1 (en) * 2001-03-02 2002-09-12 Igc-Superpower, Llc Reel-to-reel substrate tape polishing system
US20020160692A1 (en) * 2001-04-27 2002-10-31 Applied Materials, Inc. Method for planarizing organosilicate layers
US6949128B2 (en) * 2001-12-28 2005-09-27 3M Innovative Properties Company Method of making an abrasive product
US6758734B2 (en) * 2002-03-18 2004-07-06 3M Innovative Properties Company Coated abrasive article
US7018268B2 (en) * 2002-04-09 2006-03-28 Strasbaugh Protection of work piece during surface processing
US6918820B2 (en) * 2003-04-11 2005-07-19 Eastman Kodak Company Polishing compositions comprising polymeric cores having inorganic surface particles and method of use

Also Published As

Publication number Publication date
US20040256055A1 (en) 2004-12-23

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