KR20040004139A - 전극 내장형 서셉터 및 그 제조 방법 - Google Patents
전극 내장형 서셉터 및 그 제조 방법 Download PDFInfo
- Publication number
- KR20040004139A KR20040004139A KR1020030044645A KR20030044645A KR20040004139A KR 20040004139 A KR20040004139 A KR 20040004139A KR 1020030044645 A KR1020030044645 A KR 1020030044645A KR 20030044645 A KR20030044645 A KR 20030044645A KR 20040004139 A KR20040004139 A KR 20040004139A
- Authority
- KR
- South Korea
- Prior art keywords
- aluminum nitride
- susceptor
- electrode
- plate
- sintered body
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4581—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber characterised by material of construction or surface finish of the means for supporting the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
- H01J37/3255—Material
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Analytical Chemistry (AREA)
- Plasma & Fusion (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Resistance Heating (AREA)
Abstract
Description
Claims (7)
- 일주면(一主面)이 판상 시료를 올려놓는 재치면(載置面)으로 된 질화 알루미늄계 소결체로 이루어지는 서셉터 본체, 상기 서셉터 본체에 내장된 내부 전극, 및 상기 서셉터 본체 내에 설치되어 상기 내부 전극에 접합된 급전용 단자를 구비한 전극 내장형 서셉터로서, 상기 급전용 단자는 도전성 질화 알루미늄-질화 탄탈륨 복합 소결체로 이루어지는 것을 특징으로 하는 전극 내장형 서셉터.
- 제 1 항에 있어서, 상기 서셉터 본체는 일주면이 판상 시료를 올려놓는 재치면으로 된 질화 알루미늄계 소결체로 이루어지는 재치판과, 상기 재치판에 접합되어 일체화된 질화 알루미늄계 소결체로 이루어지는 지지판을 구비하고 있는 것을 특징으로 하는 전극 내장형 서셉터.
- 제 1 항 또는 제 2 항에 있어서, 상기 내부 전극은 도전성 질화 알루미늄-질화 탄탈륨 복합 소결체, 또는 도전성 질화 알루미늄-텅스텐 복합 소결체로 이루어지는 것을 특징으로 하는 전극 내장형 서셉터.
- 제 1 항, 제 2 항 또는 제 3 항에 있어서, 상기 질화 알루미늄-질화 탄탈륨 복합 소결체는 50∼98 중량%의 질화 탄탈륨을 함유하는 것을 특징으로 하는 전극 내장형 서셉터.
- 제 3 항에 있어서, 상기 질화 알루미늄-텅스텐 복합 소결체는 58∼80 중량%의 텅스텐을 함유하는 것을 특징으로 하는 전극 내장형 서셉터.
- 판상 시료를 올려놓는 재치판 및 상기 재치판을 지지하는 지지판을 질화 알루미늄계 소결체를 이용하여 제작하는 단계;상기 지지판에 관통공을 형성하고, 상기 관통공에 도전성 질화 알루미늄-질화 탄탈륨 복합 소결체로 이루어지는 급전용 단자를 삽입 고정하는 단계;상기 지지판의 일주면에, 상기 급전용 단자에 접촉되도록 도전성 분말을 함유하는 도포재를 도포하는 단계;상기 지지판에 상기 도포재를 개재시켜 상기 재치판을 중첩하고, 가압하에 열처리함으로써 상기 지지판과 상기 재치판 사이에, 상기 도포재를 소성하여 이루어진 내부 전극을 형성함과 동시에, 이들을 접합하여 일체화하는 단계를 포함하는 것을 특징으로 하는 전극 내장형 서셉터의 제조 방법.
- 질화 알루미늄계 분말을 함유하는 슬러리에 의해 판상 시료를 올려놓는 재치판용 사출성형품(green body) 및 상기 재치판을 지지하기 위한 지지판용 사출성형품을 제작하는 단계;상기 지지판용 사출성형품에 관통공을 형성하고, 상기 관통공에 급전용 단자가 되는 질화 알루미늄-질화 탄탈륨 복합재를 충전하고, 상기 지지판용 사출성형품의 일주면에 상기 복합재에 접촉되도록 도전성 분말을 함유하는 도포재를 도포하는 단계;상기 지지판용 사출성형품에 상기 도포재를 개재시켜 상기 재치판용 사출성형품을 중첩하고, 가압하에서 열처리함으로써 질화 알루미늄계 소결체로 이루어지는 지지판과 재치판 사이에 상기 도포재를 소성하여 이루어진 내부 전극을 형성함과 동시에 이들을 접합하여 일체화하는 단계를 포함하는 것을 특징으로 하는 전극 내장형 서셉터의 제조 방법.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002197970A JP3808407B2 (ja) | 2002-07-05 | 2002-07-05 | 電極内蔵型サセプタ及びその製造方法 |
JPJP-P-2002-00197970 | 2002-07-05 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20040004139A true KR20040004139A (ko) | 2004-01-13 |
KR100978395B1 KR100978395B1 (ko) | 2010-08-26 |
Family
ID=31705566
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020030044645A KR100978395B1 (ko) | 2002-07-05 | 2003-07-02 | 전극 내장형 서셉터 및 그 제조 방법 |
Country Status (3)
Country | Link |
---|---|
US (1) | US7175714B2 (ko) |
JP (1) | JP3808407B2 (ko) |
KR (1) | KR100978395B1 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100701510B1 (ko) * | 2006-08-30 | 2007-04-02 | 최진열 | 반도체 및 액정패널 제조설비용 서셉터 및 그 제조방법 |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3808407B2 (ja) * | 2002-07-05 | 2006-08-09 | 住友大阪セメント株式会社 | 電極内蔵型サセプタ及びその製造方法 |
WO2004030411A1 (ja) * | 2002-09-27 | 2004-04-08 | Sumitomo Electric Industries, Ltd. | ウエハー保持体及び半導体製造装置 |
JP5062959B2 (ja) * | 2005-03-25 | 2012-10-31 | 日本碍子株式会社 | セラミックス部材及びその製造方法 |
JP2007258610A (ja) | 2006-03-24 | 2007-10-04 | Ngk Insulators Ltd | アルミナ焼成体 |
US7696455B2 (en) * | 2006-05-03 | 2010-04-13 | Watlow Electric Manufacturing Company | Power terminals for ceramic heater and method of making the same |
US8637794B2 (en) | 2009-10-21 | 2014-01-28 | Lam Research Corporation | Heating plate with planar heating zones for semiconductor processing |
JP6066728B2 (ja) * | 2009-12-15 | 2017-01-25 | ラム リサーチ コーポレーションLam Research Corporation | Cdの均一性を向上させるための基板温度調整を行う方法及びプラズマエッチングシステム |
US8791392B2 (en) | 2010-10-22 | 2014-07-29 | Lam Research Corporation | Methods of fault detection for multiplexed heater array |
US8546732B2 (en) | 2010-11-10 | 2013-10-01 | Lam Research Corporation | Heating plate with planar heater zones for semiconductor processing |
US9307578B2 (en) | 2011-08-17 | 2016-04-05 | Lam Research Corporation | System and method for monitoring temperatures of and controlling multiplexed heater array |
US10388493B2 (en) | 2011-09-16 | 2019-08-20 | Lam Research Corporation | Component of a substrate support assembly producing localized magnetic fields |
US8624168B2 (en) | 2011-09-20 | 2014-01-07 | Lam Research Corporation | Heating plate with diode planar heater zones for semiconductor processing |
US8461674B2 (en) | 2011-09-21 | 2013-06-11 | Lam Research Corporation | Thermal plate with planar thermal zones for semiconductor processing |
US9324589B2 (en) | 2012-02-28 | 2016-04-26 | Lam Research Corporation | Multiplexed heater array using AC drive for semiconductor processing |
US8809747B2 (en) | 2012-04-13 | 2014-08-19 | Lam Research Corporation | Current peak spreading schemes for multiplexed heated array |
US10049948B2 (en) | 2012-11-30 | 2018-08-14 | Lam Research Corporation | Power switching system for ESC with array of thermal control elements |
US9543171B2 (en) | 2014-06-17 | 2017-01-10 | Lam Research Corporation | Auto-correction of malfunctioning thermal control element in a temperature control plate of a semiconductor substrate support assembly that includes deactivating the malfunctioning thermal control element and modifying a power level of at least one functioning thermal control element |
JP6643093B2 (ja) * | 2016-01-15 | 2020-02-12 | 京セラ株式会社 | ヒータ |
JP2023138085A (ja) * | 2022-03-18 | 2023-09-29 | 住友大阪セメント株式会社 | 静電チャック部材、および静電チャック装置 |
Family Cites Families (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US189696A (en) * | 1877-04-17 | Improvement in car-track clearers | ||
US151044A (en) * | 1874-05-19 | Improvement in ore-separators | ||
US151332A (en) * | 1874-05-26 | Improvement in land-rollers | ||
US85505A (en) * | 1869-01-05 | Improvement in motive powers for sewing-machines | ||
US124296A (en) * | 1872-03-05 | Improvement in broilers | ||
US89687A (en) * | 1869-05-04 | Improved tool for turning- centres | ||
US308165A (en) * | 1884-11-18 | Assigistoe to | ||
US153706A (en) * | 1874-08-04 | Improvement in hat-supporting attachments for chairs | ||
US152064A (en) * | 1874-06-16 | Improvement in steam-boilers | ||
US6678A (en) * | 1849-08-28 | Straw-cutter | ||
US287982A (en) * | 1883-11-06 | tucker | ||
US3001136A (en) * | 1957-11-08 | 1961-09-19 | Agfa Ag | Bearing arrangement |
JPH041136Y2 (ko) | 1987-02-27 | 1992-01-16 | ||
JP3177026B2 (ja) | 1992-11-12 | 2001-06-18 | 日本碍子株式会社 | セラミックスヒーター及びその製造方法 |
JPH06151332A (ja) | 1992-11-12 | 1994-05-31 | Ngk Insulators Ltd | セラミックスヒーター |
DE69432383D1 (de) * | 1993-05-27 | 2003-05-08 | Applied Materials Inc | Verbesserungen betreffend Substrathalter geeignet für den Gebrauch in Vorrichtungen für die chemische Abscheidung aus der Dampfphase |
JPH07153706A (ja) | 1993-05-27 | 1995-06-16 | Applied Materials Inc | サセプタ装置 |
JP3457477B2 (ja) * | 1995-09-06 | 2003-10-20 | 日本碍子株式会社 | 静電チャック |
JP3457495B2 (ja) * | 1996-03-29 | 2003-10-20 | 日本碍子株式会社 | 窒化アルミニウム焼結体、金属埋設品、電子機能材料および静電チャック |
JP3605254B2 (ja) * | 1997-03-31 | 2004-12-22 | 京セラ株式会社 | 半絶縁性窒化アルミニウム焼結体 |
JP3447495B2 (ja) | 1996-12-26 | 2003-09-16 | 京セラ株式会社 | ウエハ保持装置の給電構造 |
CA2252113A1 (en) * | 1997-10-29 | 1999-04-29 | Yoshihiko Numata | Substrate and process for producing the same |
JPH11162112A (ja) | 1997-11-28 | 1999-06-18 | Mitsumi Electric Co Ltd | 光ディスク装置およびデータの終端検出方法 |
JP2000332090A (ja) | 1999-05-18 | 2000-11-30 | Sumitomo Metal Ind Ltd | 静電チャックおよびその製造方法 |
JP3685962B2 (ja) | 1999-09-13 | 2005-08-24 | 住友大阪セメント株式会社 | サセプタ及びその製造方法 |
US6693789B2 (en) * | 2000-04-05 | 2004-02-17 | Sumitomo Osaka Cement Co., Ltd. | Susceptor and manufacturing method thereof |
JP3746935B2 (ja) | 2000-04-05 | 2006-02-22 | 住友大阪セメント株式会社 | サセプタ及びその製造方法 |
JP2001308165A (ja) | 2000-04-19 | 2001-11-02 | Sumitomo Osaka Cement Co Ltd | サセプタ及びその製造方法 |
US6444957B1 (en) * | 2000-04-26 | 2002-09-03 | Sumitomo Osaka Cement Co., Ltd | Heating apparatus |
US6483690B1 (en) * | 2001-06-28 | 2002-11-19 | Lam Research Corporation | Ceramic electrostatic chuck assembly and method of making |
JP3973872B2 (ja) * | 2001-10-17 | 2007-09-12 | 住友大阪セメント株式会社 | 電極内蔵型サセプタ及びその製造方法 |
JP2003124296A (ja) | 2001-10-17 | 2003-04-25 | Sumitomo Osaka Cement Co Ltd | サセプタ及びその製造方法 |
JP2003152064A (ja) | 2001-11-13 | 2003-05-23 | Sumitomo Osaka Cement Co Ltd | 電極内蔵型サセプタ及びその製造方法 |
JP3808407B2 (ja) * | 2002-07-05 | 2006-08-09 | 住友大阪セメント株式会社 | 電極内蔵型サセプタ及びその製造方法 |
JP2004055608A (ja) * | 2002-07-16 | 2004-02-19 | Sumitomo Osaka Cement Co Ltd | 電極内蔵型サセプタ |
-
2002
- 2002-07-05 JP JP2002197970A patent/JP3808407B2/ja not_active Expired - Fee Related
-
2003
- 2003-07-02 KR KR1020030044645A patent/KR100978395B1/ko active IP Right Grant
- 2003-07-03 US US10/613,574 patent/US7175714B2/en not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100701510B1 (ko) * | 2006-08-30 | 2007-04-02 | 최진열 | 반도체 및 액정패널 제조설비용 서셉터 및 그 제조방법 |
Also Published As
Publication number | Publication date |
---|---|
JP3808407B2 (ja) | 2006-08-09 |
JP2004040000A (ja) | 2004-02-05 |
KR100978395B1 (ko) | 2010-08-26 |
US7175714B2 (en) | 2007-02-13 |
US20040074606A1 (en) | 2004-04-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4040284B2 (ja) | プラズマ発生用電極内蔵型サセプタ及びその製造方法 | |
KR100978395B1 (ko) | 전극 내장형 서셉터 및 그 제조 방법 | |
KR100618530B1 (ko) | 정전 척과 그 제조 방법 및 알루미나 소결 부재와 그 제조방법 | |
KR100748924B1 (ko) | 정전 척 및 그 제조 방법 | |
JP5117146B2 (ja) | 加熱装置 | |
JP3155802U (ja) | ウエハー載置装置 | |
US6267839B1 (en) | Electrostatic chuck with improved RF power distribution | |
JP4879929B2 (ja) | 静電チャック及びその製造方法 | |
KR100553444B1 (ko) | 서셉터 및 그 제조방법 | |
US6590760B1 (en) | Joint structure of ceramics and metal and intermediate insertion member used in this joint structure | |
KR100911485B1 (ko) | 전극내장형 서셉터 및 그 제조방법 | |
JP3685962B2 (ja) | サセプタ及びその製造方法 | |
JP2001308165A (ja) | サセプタ及びその製造方法 | |
JP3746935B2 (ja) | サセプタ及びその製造方法 | |
US20050028739A1 (en) | Semiconductor Manufacturing Apparatus | |
KR100918714B1 (ko) | 전극 내장형 서셉터 및 그 제조 방법 | |
JP2004055608A (ja) | 電極内蔵型サセプタ | |
JP2003124296A (ja) | サセプタ及びその製造方法 | |
JP2006344999A (ja) | サセプタ及びその製造方法 | |
JP2003017552A (ja) | セラミックヒータ及びセラミックヒータ内臓型静電チャック | |
JP7240232B2 (ja) | 保持装置 | |
JP2004351491A (ja) | タングステンの接合方法およびこれを用いたセラミックヒータ |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20130801 Year of fee payment: 4 |
|
FPAY | Annual fee payment |
Payment date: 20140808 Year of fee payment: 5 |
|
FPAY | Annual fee payment |
Payment date: 20150807 Year of fee payment: 6 |
|
FPAY | Annual fee payment |
Payment date: 20160812 Year of fee payment: 7 |
|
FPAY | Annual fee payment |
Payment date: 20170811 Year of fee payment: 8 |
|
FPAY | Annual fee payment |
Payment date: 20190809 Year of fee payment: 10 |