KR20030051233A - 인쇄기판의 부분 납땜 방법 및 그 장치 - Google Patents
인쇄기판의 부분 납땜 방법 및 그 장치 Download PDFInfo
- Publication number
- KR20030051233A KR20030051233A KR1020020076205A KR20020076205A KR20030051233A KR 20030051233 A KR20030051233 A KR 20030051233A KR 1020020076205 A KR1020020076205 A KR 1020020076205A KR 20020076205 A KR20020076205 A KR 20020076205A KR 20030051233 A KR20030051233 A KR 20030051233A
- Authority
- KR
- South Korea
- Prior art keywords
- soldering
- printed board
- flux
- fluxer
- nozzle
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/08—Soldering by means of dipping in molten solder
- B23K1/085—Wave soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
- B23K1/203—Fluxing, i.e. applying flux onto surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/082—Flux dispensers; Apparatus for applying flux
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/087—Soldering or brazing jigs, fixtures or clamping means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/111—Preheating, e.g. before soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
Abstract
Description
Claims (3)
- 인쇄기판(印刷基板)을 푸셔(pusher)로 슬라이딩 주행시켜서 플럭서(fluxer) 위에서 일정시간 정지시켜 이 정지 중에 인쇄기판을 플럭서의 도포 노즐에 재치(載置)시키거나 근접시켜서 인쇄기판의 소정의 부분에 플럭스(flux)를 도포하고, 다음에 상기 인쇄기판을 푸셔로 프리히터(pre-heater) 위까지 슬라이딩 주행시키고 프리히터 위에서 일정시간 정지시켜이 정지 중에 인쇄기판의 소정의 부분 또는 인쇄기판 전체를 프리히터로 예비 가열하고, 그 후 상기 인쇄기판을 푸셔로 분류납땜조(噴流납땜槽) 위까지 슬라이딩 주행시키고 분류납땜조 위에서 일정시간 정지시켜 이 정지 중에 인쇄기판을 분류납땜조의 분류 노즐에 재치시키거나 근접시켜서 인쇄기판의 소정의 부분에 용융(熔融) 땜납을 부착시키는 것을 특징으로 하는 인쇄기판의 부분 납땜방법.
- 인쇄기판의 소정의 부분과 일치시킨 플럭서의 도포 노즐과, 상기 플럭스 도포부를 건조시키는 프리히터의 가열부와, 인쇄기판의 소정의 부분과 일치시킨 분류납땜조의 분류 노즐이 동일한 위치가 되도록 플럭서, 프리히터, 분류납땜조 등의 처리장치가 설치되어 있고, 이들의 처리장치 위에는 인쇄기판을 슬라이딩 주행시키는 반송장치가 설치됨과 아울러 또한 반송장치의 상방에는 인쇄기판을 다음 공정의 처리장치 위로 이동시킬 수 있는 푸셔가 복수 개 설치되어 있는 것을 특징으로 하는 인쇄기판의 부분 납땜장치.
- 제2항에 있어서,상기 푸셔는 회전할 수 있는 것을 특징으로 하는 인쇄기판의 부분납땜장치.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001384362A JP2003188517A (ja) | 2001-12-18 | 2001-12-18 | プリント基板の部分はんだ付け方法およびその装置 |
JPJP-P-2001-00384362 | 2001-12-18 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20030051233A true KR20030051233A (ko) | 2003-06-25 |
KR100910620B1 KR100910620B1 (ko) | 2009-08-04 |
Family
ID=19187717
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020020076205A KR100910620B1 (ko) | 2001-12-18 | 2002-12-03 | 인쇄기판의 부분 납땜 방법 및 그 장치 |
Country Status (6)
Country | Link |
---|---|
US (1) | US6799709B2 (ko) |
EP (1) | EP1321215B8 (ko) |
JP (1) | JP2003188517A (ko) |
KR (1) | KR100910620B1 (ko) |
CN (1) | CN1222202C (ko) |
TW (1) | TWI260959B (ko) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20070021817A (ko) * | 2005-08-19 | 2007-02-23 | 삼성전자주식회사 | 솔더링 장치 및 솔더링 방법 |
WO2009125601A1 (en) * | 2008-04-10 | 2009-10-15 | Panasonic Corporation | Flow soldering apparatus and flow soldering method |
JP5205653B2 (ja) * | 2009-06-04 | 2013-06-05 | 三菱電機株式会社 | はんだ接合装置、はんだ接合部、はんだ接合方法、およびプリント配線板の製造方法 |
JP5458727B2 (ja) * | 2009-07-29 | 2014-04-02 | ソニー株式会社 | 流動体供給装置、流動体塗布装置及び流動体供給方法 |
GB2483265B (en) * | 2010-09-01 | 2018-03-28 | Pillarhouse Int Ltd | Soldering nozzle |
CN102689068A (zh) * | 2011-03-24 | 2012-09-26 | 代芳 | 一种增加喷焊料微颗粒的喷锡技术 |
HUE039123T2 (hu) | 2012-12-07 | 2018-12-28 | Seho Systemtechnik Gmbh | Eljárás és forrasztó eszköz szelektív forrasztáshoz legalább egy forrasztófúvókával és további mûködõ elemekkel, amelyek egy mozgatóeszközzel szinkronizálva vannak mozgatva |
DE102012111946B4 (de) * | 2012-12-07 | 2015-11-19 | Seho Systemtechnik Gmbh | Lötvorrichtung und Verfahren zum Selektivlöten |
CN103302373B (zh) * | 2013-05-27 | 2015-08-19 | 深圳市劲拓自动化设备股份有限公司 | 隔离式双喷嘴装置和用于锡炉与助焊剂的双喷嘴装置 |
EP3062592B1 (en) | 2013-10-21 | 2018-11-21 | FUJI Corporation | Electronic component mounting apparatus |
CN105659719B (zh) | 2013-10-21 | 2019-10-18 | 株式会社富士 | 电子元件装配装置 |
CN106105415B (zh) * | 2014-03-20 | 2019-02-26 | 株式会社富士 | 基板搬运装置 |
CN104646782B (zh) * | 2014-11-28 | 2017-02-22 | 歌尔股份有限公司 | 一种波峰焊设备 |
JP6226028B1 (ja) * | 2016-05-20 | 2017-11-08 | 千住金属工業株式会社 | 噴流はんだ槽及び噴流はんだ付け装置 |
JP6269793B1 (ja) | 2016-12-05 | 2018-01-31 | 千住金属工業株式会社 | 搬送装置 |
CN108927583B (zh) * | 2017-01-04 | 2021-03-05 | 东莞理工学院 | 一种能够精准给进的线圈自动浸锡机 |
CN106735711B (zh) * | 2017-02-15 | 2019-04-26 | 扬州扬杰电子科技股份有限公司 | 助焊烟雾发生器、包含该发生器的焊接生产线及加工工艺 |
DE102017212887A1 (de) * | 2017-07-26 | 2019-01-31 | Gebr. Schmid Gmbh | Verfahren, Vorrichtung und Anlage zur Leiterplattenherstellung |
CN108419428B (zh) * | 2017-07-26 | 2021-08-06 | 珠海智新自动化科技有限公司 | 一种多功能pcb传送定位系统 |
US20190366460A1 (en) * | 2018-06-01 | 2019-12-05 | Progress Y&Y Corp. | Soldering apparatus and solder nozzle module thereof |
JP6928018B2 (ja) * | 2019-03-06 | 2021-09-01 | ファナック株式会社 | 半田付けを行うロボット装置 |
CN113182635A (zh) * | 2021-05-14 | 2021-07-30 | 埃斯特(深圳)智能科技有限公司 | 一种全自动选择性波峰焊接装置 |
CN114473107B (zh) * | 2022-03-23 | 2024-03-29 | 美的集团股份有限公司 | 波峰焊设备 |
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US3565319A (en) * | 1967-05-15 | 1971-02-23 | Banner Ind Inc | Apparatus for application of solder to circuit boards |
US3732615A (en) * | 1968-12-11 | 1973-05-15 | Gale Systems | Method for producing standing wave of solder and protective film means |
DE3111809C2 (de) * | 1981-03-25 | 1985-05-15 | Zevatron GmbH Gesellschaft für Fertigungseinrichtungen der Elektronik, 3548 Arolsen | Verfahren und Vorrichtung zum maschinellen Löten von Werkstücken |
DE3539585A1 (de) * | 1985-10-11 | 1987-07-02 | Kaspar Eidenberg | Verfahren zum verloeten der anschluesse von bauteilen mit den leiterbahnen und loetaugen von leiterplatten und vorrichtung zum durchfuehren dieses verfahrens |
US5186377A (en) * | 1991-04-29 | 1993-02-16 | Intergraph Corporation | Apparatus for stiffening a circuit board |
JPH05261529A (ja) * | 1992-01-24 | 1993-10-12 | Nec Home Electron Ltd | 局所はんだ付け装置 |
JPH08162750A (ja) * | 1994-12-01 | 1996-06-21 | Komatsu Giken Kk | 部分ハンダ付け装置 |
DE19618227A1 (de) * | 1996-05-07 | 1997-11-13 | Herbert Streckfus Gmbh | Verfahren und Vorrichtung zum Verlöten von elektronischen Bauelementen auf einer Leiterplatte |
US6119915A (en) * | 1997-05-07 | 2000-09-19 | Mcms, Inc. | Alignment fixture for solder-wave machines |
US6168065B1 (en) * | 1998-02-17 | 2001-01-02 | Soltec B.V. | Movable selective debridging apparatus for debridging soldered joints on printed circuit boards |
US6237832B1 (en) * | 1999-10-18 | 2001-05-29 | Henry Chung | Wave soldering fixture |
-
2001
- 2001-12-18 JP JP2001384362A patent/JP2003188517A/ja active Pending
-
2002
- 2002-11-07 TW TW091132745A patent/TWI260959B/zh not_active IP Right Cessation
- 2002-12-03 KR KR1020020076205A patent/KR100910620B1/ko active IP Right Grant
- 2002-12-06 CN CNB021545405A patent/CN1222202C/zh not_active Expired - Lifetime
- 2002-12-18 EP EP02258728A patent/EP1321215B8/en not_active Expired - Lifetime
- 2002-12-18 US US10/321,581 patent/US6799709B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
CN1222202C (zh) | 2005-10-05 |
JP2003188517A (ja) | 2003-07-04 |
CN1427666A (zh) | 2003-07-02 |
US6799709B2 (en) | 2004-10-05 |
EP1321215A3 (en) | 2004-10-27 |
US20030111517A1 (en) | 2003-06-19 |
EP1321215B1 (en) | 2012-07-04 |
EP1321215A2 (en) | 2003-06-25 |
TWI260959B (en) | 2006-08-21 |
TW200301674A (en) | 2003-07-01 |
EP1321215B8 (en) | 2012-08-08 |
KR100910620B1 (ko) | 2009-08-04 |
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