KR20020016757A - 앨범식 폼스틱 패널을 위한 이형 접착제 및 이를 이용한패널 - Google Patents
앨범식 폼스틱 패널을 위한 이형 접착제 및 이를 이용한패널 Download PDFInfo
- Publication number
- KR20020016757A KR20020016757A KR1020010073717A KR20010073717A KR20020016757A KR 20020016757 A KR20020016757 A KR 20020016757A KR 1020010073717 A KR1020010073717 A KR 1020010073717A KR 20010073717 A KR20010073717 A KR 20010073717A KR 20020016757 A KR20020016757 A KR 20020016757A
- Authority
- KR
- South Korea
- Prior art keywords
- pts
- panel
- weight
- parts
- adhesive
- Prior art date
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Laminated Bodies (AREA)
Abstract
Description
Claims (3)
- 과산화벤조일 100중량부와, 아세트산 비닐모노머 140중량부와, 아세트산에틸 60중량부와, 유화제인 비이온 계면활성제 10중량부를 균일하게 혼합한 다음 75-100℃의 물중탕에서 200-400RPM의 교반기로 1시간 동안 중합시킨 것을 특징으로 하는 앨범식 폼스틱 패널을 위한 이형 접착제.
- 제 1항에 따라 중합된 수지 650중량부에 이소프로필알코올 100중량부, 습윤제 12중량부, 분산제 8중량부, 이형제인 디메틸 폴리 실록산 20중량부를 75-95℃의 물중탕에서 200-400RPM의 교반기로 30-50분 동안 중합시키고, 이와 같이 중합시킨 수지를 실온에서 냉각한 후 안정제인 벤조익 산으로 pH를 4-6 정도로 조정하는 것을 특징으로 하는 앨범식 폼스틱 패널을 위한 이형 접착제.
- 합지와 냉각 및 절단공정을 거친 원자재 고강도 폴리스티렌평판이나, 플라스틱, 폴리에틸렌, 폴리우레탄, 합성고무등의 평판위에 상기한 제 2항의 제조방법에 의하여 제조된 접착제를 단면 도포한 후, 코팅 처리된 고투명 수지를 부착한 것을 특징으로 하는 앨범식 폼스틱 패널을 위한 이형 접착제를 이용한 패널.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2001-0073717A KR100445690B1 (ko) | 2001-11-26 | 2001-11-26 | 앨범식 폼스틱 패널을 위한 이형 접착제 및 이를 이용한패널 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2001-0073717A KR100445690B1 (ko) | 2001-11-26 | 2001-11-26 | 앨범식 폼스틱 패널을 위한 이형 접착제 및 이를 이용한패널 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20020016757A true KR20020016757A (ko) | 2002-03-06 |
KR100445690B1 KR100445690B1 (ko) | 2004-08-21 |
Family
ID=19716300
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR10-2001-0073717A KR100445690B1 (ko) | 2001-11-26 | 2001-11-26 | 앨범식 폼스틱 패널을 위한 이형 접착제 및 이를 이용한패널 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR100445690B1 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102484574B1 (ko) * | 2022-07-28 | 2023-01-09 | (주)성건설 | 스티로폼을 이용한 불연성 보드 및 그 제조방법 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05339549A (ja) * | 1992-06-11 | 1993-12-21 | Sekisui Chem Co Ltd | 木質天井パネル又は木質壁パネル施工用接着剤組成物 |
JP2002129120A (ja) * | 2000-10-23 | 2002-05-09 | Konishi Co Ltd | リサイクル型水性接着剤組成物 |
-
2001
- 2001-11-26 KR KR10-2001-0073717A patent/KR100445690B1/ko active IP Right Grant
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102484574B1 (ko) * | 2022-07-28 | 2023-01-09 | (주)성건설 | 스티로폼을 이용한 불연성 보드 및 그 제조방법 |
Also Published As
Publication number | Publication date |
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KR100445690B1 (ko) | 2004-08-21 |
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