KR20010044604A - cover-film detaching apparatus - Google Patents

cover-film detaching apparatus Download PDF

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Publication number
KR20010044604A
KR20010044604A KR1020010012364A KR20010012364A KR20010044604A KR 20010044604 A KR20010044604 A KR 20010044604A KR 1020010012364 A KR1020010012364 A KR 1020010012364A KR 20010012364 A KR20010012364 A KR 20010012364A KR 20010044604 A KR20010044604 A KR 20010044604A
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KR
South Korea
Prior art keywords
tape
circuit
adhesion
protective film
adhesive tape
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KR1020010012364A
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Korean (ko)
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한효용
백정민
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한효용
주식회사 트라이맥스
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Priority to KR1020010012364A priority Critical patent/KR20010044604A/en
Publication of KR20010044604A publication Critical patent/KR20010044604A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/79—Apparatus for Tape Automated Bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Adhesive Tapes (AREA)

Abstract

PURPOSE: An apparatus for eliminating a protection film of a circuit tape is provided to prevent an adhesion layer of the circuit tape from being damaged and to automatically collect detached protection film, by detaching the protection film of the circuit tape while using adhesion tape passing through the upper surface of a supporting unit. CONSTITUTION: An adhesion surface is formed on one side of an adhesion tape(7). The adhesion tape is wound around a winding roll(8). A collecting roll(10) collects the adhesion tape unwound from the winding roll. A supporting unit is horizontally installed in a lower portion of an intermediate part of a transfer path through which the adhesion tape passes, supporting the adhesion tape. The adhesion tape changes its direction by a predetermined angle at an end when the adhesion tape is unwound from the winding roll to make the adhesion surface of the adhesion tape face upward, and is collected to the collecting roll. Circuit tape(2) is placed on the adhesion tape by a transfer unit(4) to adhere a protection film(6) to the adhesion tape. The collecting roll collects the adhesion tape by using the collecting roll. The adhesion tape changes its direction at the end of the supporting unit, and the protection film is detached from the lower surface of the circuit tape.

Description

서킷테이프의 보호필름 제거장치{cover-film detaching apparatus}Protective film removing device of circuit tape {cover-film detaching apparatus}

본 발명은 서킷테이프의 보호필름 제거장치에 관한 것으로, 보다 상세하게는, 서킷필름의 접착제층이 손상되는 것을 방지할 수 있을 뿐 아니라, 제거된 보호필름을 자동을 수집하여 처리할 수 있도록 된 새로운 서킷테이프 부착장치에 관한 것이다.The present invention relates to an apparatus for removing a protective film of a circuit tape, and more particularly, to prevent damage to an adhesive layer of a circuit film, and to newly collect and process a removed protective film. It relates to a circuit tape attaching device.

일반적으로, 종래의 반도체패키지는 리드프레임에 부착된 반도체칩의 둘레에 합성수지를 몰딩하여 구성된 것으로, 상기 반도체칩에 연결된 리드를 전자제품의 회로기판에 연결되므로써, 반도체칩을 기판에 설치할 수 있었다.In general, a conventional semiconductor package is formed by molding a synthetic resin around a semiconductor chip attached to a lead frame. By connecting the lead connected to the semiconductor chip to a circuit board of an electronic product, the semiconductor chip can be installed on the substrate.

한편, 최근들어, 전자제품의 사이즈가 경박단소화 되어가고, 반도체칩의 집적도가 높아지고 연산속도가 증가되어 감에 따라, 종래의 합성수지몰드를 이용하지 않고, 합성수지재의 서킷테이프(circuit tape)를 이용하는 TBGA(Tape Ball Grid array)가 개발되었다.On the other hand, in recent years, as the size of electronic products has become smaller and lighter, the degree of integration of semiconductor chips is increased, and the computation speed is increased, a circuit tape of synthetic resin material is used instead of a conventional synthetic resin mold. Tape Ball Grid array (TBGA) has been developed.

상기 서킷테이프는 수지필름에 회로를 형성한 서킷필름(circuit film)의 배면에 접착제층과, 접착제층이 오염되는 것을 방지하는 보호필름이 부착되여 구성된 것으로, 이 서킷테이프의 보호필름을 제거하여, 구리재질의 판형상으로 구성된 캐리어에 서킷필름과 반도체칩을 부착한 후, 반도체칩과 서킷필름의 회로를 상호 연결하고, 상기 서킷필름의 회로면에 작은 납알갱이로 구성된 솔더볼을 부착하여, 테이프 볼그리드 어레이 반도체 패키지가 완성되며, 이 솔더볼을 회로기판에 융착시키므로써, 반도체 패키지를 기판에 설치할 수 있다.The circuit tape is formed by attaching an adhesive layer and a protective film to prevent the adhesive layer from being contaminated on the back of a circuit film having a circuit formed on the resin film, and removing the protective film of the circuit tape. After attaching the circuit film and the semiconductor chip to a carrier made of a copper plate, the circuits of the semiconductor chip and the circuit film are interconnected, and a solder ball composed of small lead grains is attached to the circuit surface of the circuit film. The grid array semiconductor package is completed, and the solder balls are fused to the circuit board, whereby the semiconductor package can be installed on the substrate.

한편, 종래에는, 흡착장치를 이용하여 상기 서킷테이프의 보호필름을 제거하였다. 이 흡착장치는 서킷테이프를 이송하는 이송장치의 하측에 설치되는 것으로, 상기 이송장치를 이용하여 서킷테이프를 이송하는 도중에, 상기 흡착장치로 보호필름을 흡착하여 보호필름을 강제로 떼어내게 된다.On the other hand, conventionally, the protective film of the circuit tape was removed using an adsorption device. The adsorption device is installed below the transport device for transporting the circuit tape. During the transport of the circuit tape using the transport device, the adsorption device adsorbs the protective film and forcibly removes the protection film.

그런데, 이와같은 흡착장치는 보호필름의 전면을 동시에 하측으로 잡아당겨 강제로 떼어내므로, 보호필름을 떼어낼 때 서킷테이프의 접착제층에 무리한 힘이 가해져 접착제층이 떨어져나갈 수 있을 뿐 아니라, 접착제와 보호필름 사이의 정전기를 제거하는 별도의 장치가 필요하며, 특히, 상기 흡착장치에 의해 제거된 보호필름을 별도의 장치나 수작업을 통해 수집하여 처리하여야 하는 문제점이 있다.However, such an adsorption device pulls the front side of the protective film downward simultaneously and forcibly removes the adhesive film. Therefore, when the protective film is removed, the adhesive layer of the circuit tape may be exerted and the adhesive layer may fall off. A separate device is needed to remove the static electricity between the protective film and, in particular, there is a problem in that the protective film removed by the adsorption device has to be collected and processed through a separate device or by hand.

본 발명은 상기의 문제점을 해결하기 위한 것으로서, 본 발명의 목적은 서킷테이프의 접착제층이 손상되는 것을 방지할 수 있을 뿐 아니라, 제거된 보호필름을 자동으로 수집하여 처리할 수 있도록 된 새로운 서킷테이프의 보호필름 제거장치를 제공하는 것이다.The present invention is to solve the above problems, an object of the present invention can not only prevent the adhesive layer of the circuit tape is damaged, but also a new circuit tape that can automatically collect and process the removed protective film It is to provide a protective film removing device.

도 1은 본 발명에 따른 서킷테이프의 보호필름 제거장치를 도시한 구성도1 is a block diagram showing a protective film removing device of the circuit tape according to the present invention

〈도면의 주요부분에 대한 부호의 설명〉<Explanation of symbols for main parts of drawing>

2. 서킷테이프 4. 이송장치2. Circuit tape 4. Transfer device

6. 보호필름 7. 접착테이프6. Protective film 7. Adhesive tape

8. 권취롤 10. 수거롤8. Winding roll 10. Collection roll

12. 지지대12. Support

본 발명에 따르면, 서킷테이프(2)를 이송하는 이송장치(4)의 하측에 배치되어, 서킷테이프(2)의 저면에 부착된 보호필름(6)을 제거하는 보호필름 제거장치에 있어서, 일면에 접착면이 형성된 접착테이프(7)가 감긴 권취롤(8)과, 이 권취롤(8)에서 풀려나온 접착테이프(7)를 감아 수거하는 수거롤(10)과, 상기 접착테이프(7)가 지나는 이송경로의 중간부 하측에 수평설치되어 접착테이프(7)를 지지하는 지지대(12)를 포함하여 구성되며, 상기 접착테이프(7)는 접착면이 상측을 향하도록 상기 권취롤(8)에서 풀려나오면서 상기 지지대(12)의 단부에서 소정각도로 방향전환한 후, 상기 수거롤(10)에 수거되도록 구성되어, 상기 이송장치(4)를 이용하여 서킷테이프(2)를 상기 접착테이프(7)의 접착면에 올려놓아 서킷테이프(2) 저면의 보호필름(6)을 접착테이프(7)에 접착한 후, 상기 수거롤(10)을 이용하여 접착테이프(7)를 감아 회수하면, 상기 지지대(12)의 단부에서 방향전환 되면서, 서킷케이프의 저면에서 보호필름(6)을 떼어낼 수 있도록 된 것을 특징으로 하는 서킷테이프의 보호필름 제거장치가 제공된다.According to the present invention, there is provided a protective film removing device disposed below the transfer device 4 for transferring the circuit tape 2 to remove the protective film 6 attached to the bottom of the circuit tape 2. A winding roll 8 wound around the adhesive tape 7 having an adhesive surface formed thereon, a collection roll 10 for winding up and collecting the adhesive tape 7 released from the winding roll 8, and the adhesive tape 7 It is installed on the lower side of the middle of the transport path passing through the support tape 12 is configured to support the adhesive tape (7), the adhesive tape (7) is the winding roll (8) so that the adhesive surface facing upward It is configured to be diverted at a predetermined angle from the end of the support 12 while being released from the collection roll 10, and to collect the circuit tape 2 using the transfer device 4 to the adhesive tape ( The protective film (6) on the bottom of the circuit tape (2) to the adhesive tape (7). When the adhesive tape 7 is wound and collected using the collection roll 10, the protective film 6 may be detached from the bottom of the circuit cap while being turned at the end of the support 12. There is provided a protective film removing device for a circuit tape.

이하, 본 발명의 바람직한 실시예를 첨부한 도면에 의거하여 설명하면 다음과 같다.Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

도 1은 본 발명에 따른 서킷테이프의 보호필름 제거장치를 도시한 것으로, 서킷테이프(2)를 흡착하여 이송하는 이송장치(4)의 하측에 배치되어, 서킷테이프(2)의 저면에 부착된 보호필름(6)을 제거할 수 있도록 된 것은 종래의 보호필름 제거장치와 동일하다.Figure 1 shows a protective film removing device of the circuit tape according to the present invention, which is disposed on the lower side of the transfer device 4 for absorbing and transporting the circuit tape 2, attached to the bottom surface of the circuit tape (2) The protective film 6 can be removed in the same manner as the conventional protective film removing apparatus.

이때, 이 보호필름 제거장치는 일면에 접착면이 형성된 접착테이프(7)가 감긴 권취롤(8)과, 구동모터에 의해 구동되며 이 권취롤(8)에서 풀려나온 접착테이프(7)를 감아 수거하는 수거롤(10)과, 상기 접착테이프(7)의 이송경로 중간부에 수평설치되어 그 상면을 지나는 접착테이프(7)의 저면을 지지하는 지지대(12)로 구성된다.At this time, the protective film removing device is wound by the winding roll 8, the adhesive tape (7) having an adhesive surface formed on one surface, and the adhesive tape (7) driven by the driving motor and released from the winding roll (8). It is composed of a collection roll (10) for collecting and a support (12) which is horizontally installed in the middle of the transfer path of the adhesive tape (7) to support the bottom surface of the adhesive tape (7) passing through the upper surface.

상기 권취롤(8)은 그 둘레면에 감긴 접착테이프(7)가 다 소모되었는지의 여부를 감지하는 감지장치(14)가 일측에 구비되어, 접착테이프(7)가 다 풀려나가면 이 감지장치(14)의 신호에 따라 상기 수거롤(10)의 구동모터를 정지시킴과 동시에, 경보음을 발생하도록 구성된다. 상기 지지대(12)는 그 선단면(16)이 상면과 예각을 이루도록 경사지게 구성되며, 상기 접착테이프(7)는 이 지지대(12)의 선단부를 지나면서 방향을 바꾸어 상기 수거롤(10)에 감겨 수거된다.The take-up roll 8 is provided with a sensing device 14 on one side for detecting whether the adhesive tape 7 wound around the periphery is exhausted, and when the adhesive tape 7 is released, the sensing device ( Stopping the drive motor of the collection roll 10 in accordance with the signal of 14), and is configured to generate an alarm sound. The support 12 is configured to be inclined such that its front end face 16 is at an acute angle with the upper surface, and the adhesive tape 7 is wound around the collection roll 10 while changing the direction while passing through the front end of the support 12. It is collected.

따라서, 서킷테이프(2)를 이송하는 이송장치(4)를 이용하여, 접착테이프(7)의 접착면에 서킷테이프(2)를 공급하면, 이 서킷테이프(2)의 하측면에 구비된 보호필름(6)이 상기 접착테이프(7)에 접착된다. 그리고, 상기 구동모터를 구동시키면 수거롤(10)이 회전되면서 접착테이프(7)를 감아 수거하게 되며, 상기 서킷테이프(2)는 접착테이프(7)와 함께 지지대(12)의 단부로 이송된다. 이때, 접착테이프(7)와 상기 서킷테이프(2)의 보호필름(6)은 상기 지지대(12)의 선단면(16)을 따라 접히면서 방향전환되어 수거롤(10)에 감겨 수거되는 반면, 상기 서킷테이프(2)는 강도가 높아 접히지 않으므로, 상기 보호필름(6)이 서킷테이프(2)에서 떨어져 접착테이프(7)와 함께 수거롤(10)에 감기게 된다. 따라서, 접착테이프(7)가 제거된 서킷테이프(2)를 별도의 공급장치를 이용하여 다시 흠착한 후, 다음공정으로 이송할 수 있다.Therefore, when the circuit tape 2 is supplied to the adhesive surface of the adhesive tape 7 using the transfer apparatus 4 for conveying the circuit tape 2, the protection provided on the lower surface of the circuit tape 2 is provided. The film 6 is adhered to the adhesive tape 7. When the driving motor is driven, the collecting roll 10 is rotated to collect and collect the adhesive tape 7, and the circuit tape 2 is transferred to the end of the support 12 together with the adhesive tape 7. . At this time, the adhesive tape 7 and the protective film 6 of the circuit tape 2 are folded along the front end surface 16 of the support 12 while being turned and collected on the collection roll 10, Since the circuit tape 2 is not folded due to high strength, the protective film 6 is separated from the circuit tape 2 and wound around the collecting roll 10 together with the adhesive tape 7. Therefore, the circuit tape 2 from which the adhesive tape 7 has been removed can be again scratched using a separate feeder, and then transferred to the next step.

이때, 상기 서킷테이프(2)에서 보호필름(6)을 완전히 떼어내면, 서킷테이프(2)를 지지할 물체가 없어 서킷테이프(2)가 바닥에 떨어지게 되므로, 지지대(12)의 전방에는 서킷테이프(2)가 일정위치 이상으로 전진되는 것을 방지하는 별도의 스토퍼나 감지센서(18)를 설치하여, 이 스토퍼나 감지센서(18)에 서킷테이프가 닿으면, 수거롤(10)의 구동모터를 정지시켜, 서킷테이프(2)에서 보호필름(6)이 완전히 떨어져나가는 것을 방지할 수 있도록 하는 것이 바람직하다. 또한, 상기 이송기구는 한번에 한 개씩의 서킷테이프(2)를 상기 접착테이프(7)에 공급하거나, 필요에 따라, 복수개의 서킷테이프(2)를 상기 접착테이프(7)에 공급하도록 구성하는 것도 가능하다.At this time, when the protective film 6 is completely removed from the circuit tape 2, there is no object to support the circuit tape 2 so that the circuit tape 2 falls on the floor, so that the circuit tape is located in front of the support 12. Install a separate stopper or sensor (18) to prevent (2) from advancing beyond a certain position. When the circuit tape touches the stopper or sensor (18), drive motor of collection roll (10) It is preferable to stop and to prevent the protective film 6 from completely falling off the circuit tape 2. In addition, the transfer mechanism may be configured to supply one circuit tape 2 to the adhesive tape 7 at a time, or to supply the plurality of circuit tapes 2 to the adhesive tape 7 as necessary. It is possible.

이와같이 구성된 보호필름 제거장치는 상기 접착테이프(7)와 지지대(12)를 이용하여 보호필름(6)의 일측부터 순차적으로 떼어내게 되므로, 접착제층이 손상되거나 떨어져나가는 것을 방지할 수 있는 장점이 있다. 또한, 보호필름(6)이 접착된 접착테이프(7)는 상기 수거롤(10)에 수거되므로, 별도로 보호필름(6)을 수거하여 처리할 필요가 없으므로, 사용이 매우 편리한 장점이 있다.The protective film removing device configured as described above is detached from one side of the protective film 6 sequentially by using the adhesive tape 7 and the support 12, and thus, the adhesive layer may be prevented from being damaged or fallen off. . In addition, since the adhesive tape 7 to which the protective film 6 is adhered is collected on the collection roll 10, there is no need to separately collect and process the protective film 6, and thus it is very convenient to use.

이상에서와 같이 본 발명에 의하면, 지지대(12)의 상면을 지나는 접착테이프(7)를 이용하여 서킷테이프(2)의 보호필름(6)을 제거할 수 있도록 구성하므로써, 서킷테이프의 접착제층이 손상되는 것을 방지할 수 있을 뿐 아니라, 제거된 보호필름(6)을 자동을 수집하여 처리할 수 있도록 된 새로운 서킷테이프의 보호필름 제거장치를 제공할 수 있다.As described above, according to the present invention, the adhesive layer of the circuit tape is formed by removing the protective film 6 of the circuit tape 2 by using the adhesive tape 7 passing through the upper surface of the support 12. In addition to preventing damage, it is possible to provide a new circuit tape protective film removing device that can automatically collect and process the removed protective film (6).

Claims (1)

서킷테이프(2)를 이송하는 이송장치(4)의 하측에 배치되어, 서킷테이프(2)의 저면에 부착된 보호필름(6)을 제거하는 보호필름 제거장치에 있어서, 일면에 접착면이 형성된 접착테이프(7)가 감긴 권취롤(8)과, 이 권취롤(8)에서 풀려나온 접착테이프(7)를 감아 수거하는 수거롤(10)과, 상기 접착테이프(7)가 지나는 이송경로의 중간부 하측에 수평설치되어 접착테이프(7)를 지지하는 지지대(12)를 포함하여 구성되며, 상기 접착테이프(7)는 접착면이 상측을 향하도록 상기 권취롤(8)에서 풀려나오면서 상기 지지대(12)의 단부에서 소정각도로 방향전환한 후, 상기 수거롤(10)에 수거되도록 구성되어, 상기 이송장치(4)를 이용하여 서킷테이프(2)를 상기 접착테이프(7)의 접착면에 올려놓아 서킷테이프(2) 저면의 보호필름(6)을 접착테이프(7)에 접착한 후, 상기 수거롤(10)을 이용하여 접착테이프(7)를 감아 회수하면, 상기 지지대(12)의 단부에서 방향전환 되면서, 서킷케이프의 저면에서 보호필름(6)을 떼어낼 수 있도록 된 것을 특징으로 하는 서킷테이프의 보호필름 제거장치A protective film removal device disposed below the transfer device 4 for transferring the circuit tape 2 to remove the protective film 6 attached to the bottom of the circuit tape 2, wherein one surface has an adhesive surface. Of the transfer path through which the winding roll 8 on which the adhesive tape 7 is wound, the collection roll 10 which winds and collects the adhesive tape 7 released from the winding roll 8, and the adhesive tape 7 pass. It is configured to include a support 12 for horizontally installed on the lower side of the middle portion to support the adhesive tape (7), the adhesive tape (7) is released from the take-up roll (8) so that the adhesive surface facing upwards After turning at a predetermined angle at the end of the (12), it is configured to be collected on the collection roll 10, the circuit tape 2 using the transfer device 4, the adhesive surface of the adhesive tape (7) The protective film 6 on the bottom surface of the circuit tape 2 to the adhesive tape 7, and then the collection roll 10 When the adhesive tape 7 is wound and collected, the protective film 6 is removed from the end of the support 12 while removing the protective film 6 from the bottom of the circuit cap. Device
KR1020010012364A 2001-03-09 2001-03-09 cover-film detaching apparatus KR20010044604A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100583985B1 (en) * 2004-12-10 2006-05-29 주식회사 쎄크 Apparatus for removing support film of chip bonding tape
WO2007129844A1 (en) * 2006-05-04 2007-11-15 Seho Robot Industries Co., Ltd System and method for attaching stiffening plate on flexible printed circuit board

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6393641U (en) * 1986-12-05 1988-06-17
JPH01125947A (en) * 1987-11-11 1989-05-18 Ryoji Wakabayashi Protective film exfoliating device for semiconductor wafer
JPH034548A (en) * 1989-05-31 1991-01-10 Nitto Denko Corp Peeling of protective film of semiconductor wafer
JPH0465150A (en) * 1990-07-05 1992-03-02 Ryoji Wakabayashi Stripping apparatus for protective film of semiconductor device
JPH06302572A (en) * 1993-04-12 1994-10-28 Hitachi Ltd Manufacture of semiconductor device and tape adhering and peeling apparatus
JP2001056574A (en) * 1999-08-19 2001-02-27 Nitto Denko Corp Method for removing resist mask and apparatus therefor
KR20010016610A (en) * 2000-12-27 2001-03-05 정도화 cover tape detach device for manufacturing semi-conductor

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6393641U (en) * 1986-12-05 1988-06-17
JPH01125947A (en) * 1987-11-11 1989-05-18 Ryoji Wakabayashi Protective film exfoliating device for semiconductor wafer
JPH034548A (en) * 1989-05-31 1991-01-10 Nitto Denko Corp Peeling of protective film of semiconductor wafer
JPH0465150A (en) * 1990-07-05 1992-03-02 Ryoji Wakabayashi Stripping apparatus for protective film of semiconductor device
JPH06302572A (en) * 1993-04-12 1994-10-28 Hitachi Ltd Manufacture of semiconductor device and tape adhering and peeling apparatus
JP2001056574A (en) * 1999-08-19 2001-02-27 Nitto Denko Corp Method for removing resist mask and apparatus therefor
KR20010016610A (en) * 2000-12-27 2001-03-05 정도화 cover tape detach device for manufacturing semi-conductor

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100583985B1 (en) * 2004-12-10 2006-05-29 주식회사 쎄크 Apparatus for removing support film of chip bonding tape
WO2007129844A1 (en) * 2006-05-04 2007-11-15 Seho Robot Industries Co., Ltd System and method for attaching stiffening plate on flexible printed circuit board

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