JPH0465150A - Stripping apparatus for protective film of semiconductor device - Google Patents

Abstract

PURPOSE:To prevent a semiconductor wafer from being broken by a method wherein a guide member provided with the following is installed: a plane coming into contact with one face of the semiconductor wafer; and a face extended to the plane by forming an acute angle to the plane. CONSTITUTION:The following are installed: guide rollers 12 under a support member 10 so as to be separated from it; and a guide member 11 on the downstream side. The guide member is a triangular prism body whose cross section is a triangle. It is arranged in such a way that the wide bottom face of the triangular prism body comes into contact with a semiconductor wafer 8. The force acting on the semiconductor wafer is dispersed over its face when a protective film 9 is stripped off so that a strong force is not exerted on the wafer 8 and that the wafer 8 is not broken. A rope is separated from the support member by means of the guide rollers 12 so that the rope is not loaded on the support member 10.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates generally to semiconductor device manufacturing lines, and specifically to an apparatus for stripping a protective film from a semiconductor wafer.

Conventional technology Semiconductor wafers (0.2 to 0.25 mm thick) are fragile as they are, so to prevent damage during handling, a protective film such as vinyl is attached to one side of the semiconductor wafer, and a mount is attached to the other side. I'm letting you do it. To process a semiconductor wafer, it is first necessary to peel off the protective film. Peeling the vinyl protective film off the semiconductor wafer with one's fingertips is time-consuming and labor-intensive, and also prevents the full automation of semiconductor device lines. Therefore, the present inventor proposed a protective film stripping apparatus for semiconductor wafers as shown in FIG. Semiconductor Univer's protective film peeling device consists of a semiconductor wafer feeding device that continuously feeds a semiconductor wafer 8 with a protective film 9 attached to one side in one direction, and an adhesive tape that is attached along the semiconductor wafer feeding path. The upstream guide pins 4 and guide rollers 5 and the downstream guide rollers 6 to be arranged and the adhesive surface of the adhesive tape are separated from the one surface of the semiconductor wafer being fed, and the adhesive tape is applied to the feeding path. An adhesive tape driving means for feeding the semiconductor wafer in the same direction as the semiconductor wafer feeding direction, namely, a driven roller 2 to which an adhesive tape roll 1 is attached, a driving roller 3 for winding up the adhesive tape roll, and an upstream guide roller. 5, and a support member 10 that presses the one surface of the semiconductor wafer against the adhesive surface of the adhesive tape. The semiconductor wafer feeding device includes two ropes arranged at a spacing narrower than the width of the semiconductor wafer and driven in the direction of feeding the semiconductor wafer, the ropes extending along both sides of the support member 10. A tensioning roller 7 is arranged downstream to tension the adhesive tape.

The operation will be explained. The semiconductor wafer 8 sent from the upstream side enters between the support member 10 and the guide roller 5 and presses the protective film 9 against the adhesive surface of the adhesive tape.
Adhere to the adhesive side of the tape. The feeding direction of the adhesive tape is changed by the guide roller 6 on the lower side, and the protective film 9 is peeled off from the semiconductor wafer 8 at this time.

Problems to be Solved by the Invention This automatic peeling device completely peels off the protective film 9 from the semiconductor wafer 8, but the protective film 9 breaks the semiconductor wafer at the downstream edge of the guide roller 6 where it separates from the semiconductor wafer. Sometimes it happens. In addition, the rope may sometimes rest on the support member 10, making it impossible to completely press the film of the semiconductor wafer against the adhesive surface of the tape, which may impede downstream peeling operations. .

It is an object of the present invention to provide an apparatus for automatically stripping a semiconductor wafer of its protective film, completely eliminating the possibility of breaking the semiconductor wafer. This purpose is achieved according to the invention by providing, in place of the downstream guide roller, a guide member 11 which has a plane tangent to said one side of the semiconductor wafer and a plane extending at an acute angle to this plane.

In the case of the conventional guide roller, when the protective film 9 separates from the semiconductor wafer, the guide roller 6 comes into contact with the line between the semiconductor wafer and the roller generatrix, and a strong force acts on the semiconductor wafer, breaking it.

In the present invention, instead of the downstream guide roller, a guide member with a triangular cross section is used, and the wide bottom of this member is placed in contact with the semiconductor wafer to prevent strong force from acting on the semiconductor wafer. This completely eliminates the possibility of breaking the wafer.

Furthermore, the situation where the rope rests on the support member 10 can be completely avoided by separating the rope from the support member and placing it below it.

Example The present invention will be described in detail below with reference to FIG.

The same parts as in FIG. 2 are given the same reference numerals in FIG. 1, and their explanations will be omitted. The difference from the conventional device shown in FIG. 2 is a guide roller 12 provided below the support member 10 and separated therefrom, and a guide member 11 on the downstream side.

This guide member is a triangular prism with a triangular cross section, and the wide bottom surface of this triangular prism is arranged so as to be in contact with the semiconductor wafer, so that the force acting on the semiconductor wafer when peeling off the protective film 9 is dispersed over that surface. In this way, strong force is not applied to the semiconductor wafer, and the semiconductor wafer is prevented from being broken.

Further, the guide roller 12 separates the rope from the support member to prevent the rope from resting on the support member 10.

[Brief explanation of drawings]

FIG. 1 is a schematic diagram showing an embodiment of the invention. Figure 2 shows a conventional semiconductor thin film stripping system! FIG. In the figure, 1 is an adhesive tape row novel, 2 is a driven roller, 3 is a driving roller, 4 is a guide bottle, 5 and 6 are guide rollers, 7 is a tension roller, 8 is a single conductor wafer, 9 is a protective film, 10 is a support member, 11 is a guide member and 12 is a guide roller.

Claims (1)

[Claims] 1. A semiconductor wafer feeding device that continuously feeds semiconductor wafers with a protective film attached to one side in one direction; A guiding means and a downstream guiding means, the adhesive tape is directed along the feeding path in the same direction as the feeding direction of the semiconductor wafer, with the adhesive surface of the adhesive tape facing the one side of the semiconductor wafer being fed. An adhesive tape driving means for feeding and disposed at the upstream guiding means or between the upstream guiding means and the downstream guiding means, the driving means for driving the adhesive tape to adhere the one side of the semiconductor wafer to the adhesive tape. The downstream guide means is characterized in that it includes a support member that presses against the surface, and the downstream guide means is a guide member that has a plane that is in contact with the one surface of the semiconductor wafer and a surface that extends at an acute angle with respect to the plane. Protective film stripping equipment for semiconductor wafers. 2. The semiconductor wafer feeding device includes two linear bodies extending in parallel, a driving means for feeding these linear bodies in one direction, and a guide roll for the linear bodies, and the guide roll is placed under the support member. 2. The device for removing a protective film on a semiconductor wafer according to claim 1, wherein the device is arranged to guide the linear body away from the support member.