KR20010036622A - method and device for combine of PCB - Google Patents

Abstract

PURPOSE: A coupling method and coupling apparatus for printed circuit board(PCB) is provided to increase yield rate of product and reduce cost by re-utilizing substrate sheet in an easy and convenient manner. CONSTITUTION: An apparatus comprises a substrate location determining unit(12) having a substrate mounting jig(10) which accommodates a plurality of circuit pattern sections(2a,2b) fixed in the substrate mounting jig; a substrate fixing unit(11) for fixing the non-defective circuit pattern section(2b) integrally to the substrate mounting jig so as to prevent movement of the non-defective circuit pattern section(2b) which is inserted, through a connection section, to a PCB(3); and an adhesion member which fills the space between the PCB fixed to the substrate mounting jig and the non-defective circuit pattern section so as to coupled the PCB and the non-defective circuit pattern section.

Description

METHOD AND DEVICE FOR COMBINATION OF PCB

The present invention provides a printed circuit board in which a plurality of serially arranged and arranged through a connection part without a board frame is provided, wherein after removing and removing the connection part of the defective circuit pattern from the plurality of circuit pattern parts of the printed circuit board, the other parts are integral with the connection part. The present invention relates to a method and an apparatus for joining a printed circuit board, wherein the circuit pattern part is joined to a connection part of the circuit pattern part of the printed circuit board. The connection part of the defective circuit pattern part is cut and removed, and the printed circuit board from which the defective pattern part is removed is inserted into the substrate fixing jig to fix the position through the substrate positioning part, and the other good quality circuit is removed from the printed circuit board. Insert the pattern part to fix it through the fixing part, and print it in the substrate fixing jig The defective circuit pattern of the printed circuit board, in which a plurality of circuit pattern portions, which are addressed through the connecting portion without the substrate frame at the periphery, are integrally bonded by the bonding means in the connection space between the substrate and the good circuit pattern portion joined thereto. After removing the part, the printed circuit board can be recycled easily and easily with other good circuit pattern parts, thereby enabling the recycling of the printed circuit board, and also the mass production of the discarded circuit pattern parts. The present invention relates to a coupling method and an apparatus.

In the structure of a conventionally known conventional printed circuit board, as shown in FIG. 1, a plurality of circuit pattern parts 52 are integrally connected and installed on a printed circuit board 53 via a connection part 51. Consists of the configuration.

The conventional printed circuit board 53 is a printed circuit in which a plurality of circuit pattern portions 52 are printed on the upper side without a substrate frame supporting the circuit pattern portion at the periphery thereof and are directly connected to each other through the connection portion 51. After fabrication of the substrate 53, the jig and fixture are placed on the jig and fixture to perform the connection connection state inspection of the circuit pattern portion 51 through the probe.

As described above, the printed circuit board 53 in which the inspection operation of the pattern state of the circuit pattern part 52 of the printed circuit board 53 is completed is transferred to an electronic component insertion process, which is a post-process. In this case, the connection part 51 When any one of the plurality of circuit pattern units 52 connected to each other through the connection is judged to be defective connection, there is a disadvantage that must be disposed of integrally with the circuit pattern unit 52 which has been subjected to a number of good quality decisions.

In particular, the loss of the printed circuit board 53 due to the scrapping of the defective pattern unit integrally with the plurality of non-defective circuit pattern parts as described above, as well as the workability and productivity according to the production of the substrate sheet is reduced, the product Increasing the unit cost of the, there was a lot of problems, such as an increase in the cost of discarding the printed circuit board occurs.

The present invention is to solve the various problems of the prior art as described above, the object is, after removing the defective circuit pattern portion of the plurality of circuit pattern portion that is spoken through the connecting portion without the substrate frame at the periphery, and easily other good quality circuit pattern portion, Easily bonded and secured to allow the recycling of the plurality of circuit pattern parts, as well as to enable the mass production of the plurality of circuit patterns discarded accordingly, to increase the product yield according to the recycling of the substrate sheet, product cost To provide a coupling device of a printed circuit board that can reduce the.

Another object of the present invention, after removing the connection portion of the printed circuit board to which the bad circuit pattern is spoken by using a cutting machine, and inserts the printed circuit board and other good-quality circuit pattern parts to which the plurality of circuit pattern portions are spoken into a substrate fixing jig. To easily and easily fix the position by the substrate positioning unit, and to secure the space between the coupling portions of the printed circuit board to the good circuit pattern portion simply by fixing and bonding means with heat-resistant tape, It is to provide a method of bonding a printed circuit board that can further improve the workability and productivity according to the production of the substrate.

1 is a schematic perspective view showing a typical printed circuit board in which a plurality of circuit pattern portions are addressed to the printed circuit board.

2 is a schematic perspective view illustrating a state in which a good circuit pattern part is positioned and fixed inside a substrate fixing jig to be bonded to one side of a defective pattern removing part of a printed circuit board in which a plurality of circuit pattern parts are spoken through a connecting part;

Figure 3 is a schematic perspective view of a bonded state of the present invention the printed circuit board and the good circuit pattern portion.

Figure 4 is a plan view showing a coupling state of the good circuit pattern portion bonded to one side of the printed circuit board of the present invention.

Figure 5 is a schematic cross-sectional structure of the coupling state of the present invention circuit board and the good circuit pattern portion.

Explanation of symbols on the main parts of the drawings

1 ... connections 2a, 2b ... circuit pattern

3 ... printed circuit board 5 ... board fixing tape

6.Board fixing pin 7 ... Pin fixing hole

8.Adhesive 9 ... Cover

10 ... substrate fixing jig 11 ... substrate fixing

12 substrate positioning part 13 space part

14 ... Adhesive Means

As a technical configuration for achieving the above object, the present invention is located in the cut portion of the defective circuit pattern connecting portion of the printed circuit board is provided with a plurality of circuit pattern portion connected through the connection portion is formed with a constant gap, A substrate positioning jig portion which is installed to fix the position by inserting the circuit pattern portions into the substrate fixing jig;

A substrate fixing part which is integrally fixed with the substrate fixing jig to prevent flow of the good quality circuit pattern part interposed through the printed circuit board on which the plurality of circuit pattern parts are spread and a connection part of one side thereof;

And a bonding means for bonding the printed circuit board and the good circuit pattern part of one side by filling and curing in the space between the printed circuit board fixed in the substrate fixing jig and the good circuit pattern part located on one side thereof. By providing a coupling device for a printed circuit board characterized in that.

In addition, the present invention, the defective circuit pattern portion removing step of performing the connection portion cutting operation of the defective circuit pattern portion to remove the defective circuit pattern portion of the printed circuit board is connected to the plurality of circuit pattern portion is installed through the connection portion;

A substrate sheet positioning step of providing another good circuit pattern portion on the defective circuit pattern removal portion of the printed circuit board which has been extended to the plurality of circuit pattern portions and interpolating the inside of the substrate fixing jig to fix the position;

A substrate to which a heat-resistant tape for preventing the flow of the printed circuit board and other good circuit pattern portions fixed in the board fixing jig is installed on the bottom of the printed circuit board and the good circuit pattern portion and fixed to the board fixing jig The fixing step,

A space portion is formed between the printed circuit board and the good circuit pattern portion fixed inside the substrate fixing jig, and an epoxy-based adhesive in which the volatile content is removed is injected into the space portion to cure at 120 ° to 200 ° in a drying furnace. Adhesive injection and curing step,

After installing the cover part to protect the circuit pattern of the printed circuit board and the part of the good circuit pattern to be bonded thereto from heat, the printed circuit board having completed the curing of the adhesive by heating is separated from the substrate fixing jig, and then the printed circuit board and the good circuit By providing a method of joining the substrate sheet, characterized in that the bonding operation of the pattern portion is completed.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 2 is a schematic perspective view illustrating a state in which a good circuit pattern part is positioned and fixed inside a substrate fixing jig to be bonded to one side of a defective pattern removing part of a printed circuit board in which a plurality of circuit pattern parts are spoken through a connection part; FIG. FIG. 3 is a schematic perspective view of a coupling state of a printed circuit board and a good circuit pattern portion of the present invention, wherein a plurality of circuit pattern portions 2a are connected to each other via a connection portion 1 to a defective circuit of the printed circuit board 3. In order to remove the pattern portion, another good circuit pattern portion 2b is positioned inside the substrate fixing jig 10 by the substrate fixing portion 11 and fixed to the portion where the connection portion 1 'of the defective circuit pattern portion is cut off. .

The non-defective circuit pattern portion 2b to be inserted into the substrate fixing jig 10 integrally with the connecting portion 1 on one side of the printed circuit board 3 is connected to and fixed to the portion where the defective circuit pattern portion is removed. In order to prevent the flow of the printed circuit board 3 and the good circuit pattern part 2b and the leakage of the adhesive, a substrate fixing tape 5 composed of double-sided tape is installed at the bottom of the coupling part. The substrate fixing jig 10 is integrally fixed.

The substrate fixing jig 10 has a substrate fixing pin 6 protruding from the periphery thereof, and a substrate at the periphery of the printed circuit board 3 and the good circuit pattern portion 2b respectively positioned therein. Substrate fixing pins (12) on which each of the pin fixing holes (7) to be laid for the transfer of the substrate are provided, so that the board fixing pin (6) of the substrate fixing jig (10) is a printed circuit board (3) It is inserted into the pin fixing hole 7 of the circuit pattern portion 2b, so that the good quality circuit pattern portion 2b is fixed to the printed circuit board and one side thereof in the substrate fixing jig 10.

At this time, a groove is formed between the printed circuit board 3 and the good circuit pattern portion 2b which is fixed at one side thereof, and a space 13 for injecting the adhesive 8, which is an adhesive means 14.

Subsequently, the printed circuit board 3 on which the plurality of circuit pattern portions 2a positioned and fixed inside the substrate fixing jig 10 is spoken and the good circuit pattern portion 21 spaced apart from each other are fixed. The cover part 9 is installed on the upper side to protect the circuit pattern part 2a of the printed circuit board and the good circuit pattern part 2b coupled thereto from heat, and to expose the inside of the space part 13 to the outside. The adhesive 8 is injected and cured so that the printed circuit board 3 and the good circuit pattern portion 2b on one side thereof are bonded to each other.

In the figure, reference numeral 15 denotes a partition wall which protrudes inside the substrate fixing jig 10 to separate and fix the circuit pattern portion 2a and the good circuit pattern portion 2b of the printed circuit board 3.

Referring to the bonding method of the printed circuit board of the present invention having such a configuration as follows.

2 to 5, the circuit pattern portion 2 of any part of the printed circuit board 3, in which the plurality of circuit pattern portions 2a are spoken through the connecting portion 1, is measured (not shown). In the case where an error occurs due to the measurement of), the cutting part 1 'of the defective circuit pattern portion is cut using a router or a cutter to remove the defective circuit pattern portion determined to be defective. After performing, the other defective circuit pattern part 2b is also provided on the defective circuit pattern removal part to which the connection part 1 is integrally integrated to be integrally bonded to the printed circuit board 3.

As described above, the printed circuit board 3, in which the cutting operation of the connection part of the defective circuit pattern part of the printed circuit board 3 is completed, is inserted into the substrate fixing jig 10 so as to fix the position thereof. 10) On one side of the other good circuit pattern portion 2b is interpolated and fixed in position.

The substrate fixing jig 10 has a plurality of substrate fixing pins 6 protruding from the periphery of the substrate fixing jig 10 and is formed at the periphery of the printed circuit board 3 and the good circuit pattern portion 2b for the transfer of the substrate. The substrate fixing pin 6 is inserted into the printed circuit board 3, and the fixed circuit pattern part 2b is fixed to the printed circuit board 3 and one side thereof at a predetermined interval.

As described above, the printed circuit board 3 and the good circuit pattern portion 2b, which are to be fixed to the inside of the substrate fixing jig 10, are formed of a double-sided tape to prevent flow at the bottom of the joining portion. The tape 5 is installed and fixed to the substrate fixing jig 10 integrally. In this case, the substrate fixing tape 5 can minimize the deformation due to heat, and the printed circuit board 3 and the good side thereof. When the circuit pattern portion 2b is bonded, it is preferable to configure the heat resistant tape so that it can be easily removed.

On the other hand, the printed circuit board 3 located inside the substrate fixing jig 10 and the non-defective circuit pattern portion 2b on one side thereof are used to inject the adhesive 8, which is an adhesive means 14, between the coupling portions. In the state in which the space portion 13 having a separation distance of about 1 to 5 mm is provided, in order to prevent leakage of the adhesive agent 8 injected into the bottom of the groove 9, which is the space portion 13, in FIG. 5. As described above, a substrate fixing tape 5 composed of a heat resistant tape is mounted.

In this case, when the separation distance of the space portion 13 formed between the printed circuit board 3 in the substrate fixing jig 10 and the good circuit pattern portion 2b on one side thereof is 1 mm or less, a narrow separation The adhesive 8 which is injected and cured therein by the distance cannot sufficiently bond the good circuit pattern portion 2b, and when the separation distance exceeds 5 mm, the printed circuit board 3 and the good circuit pattern While the combination of the parts 2b is sufficiently made, there is an uneconomical disadvantage in that an expensive adhesive is excessively introduced into the widened space 13, and preferably about 2 mm is appropriate in the embodiment of the present invention. In this case, the adhesive 8 filled in the grooves of the space 13 is filled smaller than or equal to the groove area of the space 13.

Subsequently, the good quality circuit pattern part 2b which has been fixed by the board fixing tape 5 in a state of being spaced at a predetermined interval on one side of the printed circuit board 3 as described above is in the space 13 therebetween. After injecting the adhesive (8), the adhesive means 14, it is transferred to a drying furnace for curing, wherein the adhesive (8) is made of epoxy-based volatiles removed to minimize expansion or contraction deformation by heat While allowing it to cure at 120 ° -200 °.

In addition, the adhesive 8 is to add a curing agent composed of a heat-resistant epoxy resin so that the printed circuit board 3 and the good circuit pattern portion 2b can be firmly bonded without a deformation point due to heat, the addition of the curing agent The ratio is added at a ratio of 1-5 wt% of the curing agent to 99-95 wt% of the adhesive.

As described above, a plurality of circuit pattern portions 2a of the printed circuit board 3 in which the adhesive 8 is injected into the recesses of the space 13 and a plate-shaped cover portion above the non-defective circuit pattern portion 2b. (9) is installed to protect the circuit pattern portion (2a) and the good circuit pattern portion (2b) of the printed circuit board (3) from the heat applied when the adhesive is heated, at this time inside the space portion (13) The adhesive 8 to be filled is exposed to the outside to be cured, and is transferred to a heating furnace integrally with the substrate fixing jig 10 and heated to a temperature of 120 ° to 200 °, whereby the printed circuit board 3 and the good The adhesive 8 filled in the spaces between the circuit pattern portions 2b is allowed to cure.

As described above, the printed circuit board 3 and the good circuit pattern portion 2b having completed the curing of the adhesive 8 by the heating of the heater are mounted on the bottom of the substrate fixing tape 5 and the substrate fixing jig 10. By the operation of separating the joining is complete.

According to the method and apparatus for bonding a printed circuit board according to the present invention as described above, after removing the defective circuit pattern portion of the plurality of circuit pattern portion that is spoken through the connecting portion without the substrate frame at the periphery, other good circuit pattern portion easily and easily By bonding and fixing the plurality of circuit pattern parts to be recycled, as well as allowing a number of circuit pattern parts to be discarded accordingly, increasing the yield of products by recycling the substrate sheet and reducing product costs And, there is an excellent effect that can further improve the workability and productivity according to the production of the printed arc furnace substrate.

While the invention has been shown and described with respect to specific embodiments thereof, it will be appreciated that the invention can be varied and modified without departing from the spirit or scope of the invention as set forth in the claims below. It will be clear to those skilled in the art that it can be easily understood.

Claims (18)

In the coupling device of a printed circuit board, A defective circuit pattern of a printed circuit board in which a plurality of circuit pattern parts are connected through a connecting part is positioned at a cutting part of another part of the circuit pattern part to form a constant gap, and the circuit pattern parts are inserted into a substrate fixing jig to fix the position. A jig portion for positioning substrates, A substrate fixing part which is integrally fixed with the substrate fixing jig to prevent flow of the good quality circuit pattern part interposed through the printed circuit board on which the plurality of circuit pattern parts are spread and a connection part of one side thereof; And a bonding means for bonding the printed circuit board and the good circuit pattern part of one side by filling and curing in the space between the printed circuit board fixed in the substrate fixing jig and the good circuit pattern part located on one side thereof. A coupling device for a printed circuit board. The substrate fixing jig (10) according to claim 1, wherein the positioning portion (12) for fixing the printed circuit board (3) and the good circuit pattern portion (2b) on one side thereof to the substrate fixing jig (10) is fixed. The substrate fixing pin 6 protrudes from the periphery of the board, and pin fixing holes 7 for transferring the substrate are formed in the printed circuit board 3 and the good circuit pattern part 2b. 10. A coupling device for a printed circuit board, characterized in that the substrate fixing pin (6) of the 10 is inserted into the pin fixing hole (7) of the printed circuit board (3) and the good circuit pattern portion (2b) to fix the position. The substrate fixing portion 12 of claim 1, wherein the printed circuit board 3 and the good circuit pattern portion 2b are integrally fixed to the substrate fixing jig 10, and the heat resistant substrate fixing for preventing thermal deformation. Bonding device for a printed circuit board, characterized in that the tape (5). 3. The substrate fixing tape (5) is made of a double-sided tape, and the printed circuit board (3) and the good circuit pattern portion (2b) on one side thereof are mounted on the substrate fixing jig (10). Combined circuit board. 2. The coupling device of a printed circuit board according to claim 1, wherein the space portion (13) for joining and fixing between the printed circuit board (3) and the good circuit pattern portion (2b) bonded to the ring side thereof is a recess. . The method of claim 1, wherein the bonding means 14 for filling and curing the inside of the space 13 between the printed circuit board 3 and the good circuit pattern portion 2b to couple the good circuit pattern portion 2b. Is a heat-resistant adhesive (8) for preventing deformation due to heat. The circuit pattern part 2a and the good circuit pattern part 2b of the printed circuit board 3 which are inserted in the inside of the said board | substrate fixing jig 10, and are inserted in the inside of the said board | substrate fixing jig 10. Bonding device of a printed circuit board, characterized in that for fixing to separate. 2. The plate pattern of claim 1, wherein the circuit pattern portion 2 of the printed circuit board 3 inserted into and fixed to the substrate fixing jig 10 and the good circuit pattern portion 2b joined thereto are plate-shaped. Joining device of a printed circuit board, characterized in that the cover portion 10 is installed. According to claim 1, The space 13 is formed for the injection of the adhesive 8 between the printed circuit board 3 and the good circuit pattern portion 2b located in the substrate fixing jig 10, Bonding device of a printed circuit board, characterized in that the space is formed by forming a separation distance of 1-5mm between the printed circuit board (3) and the good circuit pattern portion (2b). In the method of joining a printed circuit board, Removing the defective circuit pattern portion for cutting the connection portion of the defective circuit pattern portion to remove the defective circuit pattern portion of the printed circuit board in which a plurality of circuit pattern portions are connected through the connection portion; A plurality of good circuit pattern parts are provided on the defective circuit pattern removal portion of the printed circuit board, wherein the plurality of circuit pattern portions are positioned to form a constant gap, whereby the good circuit pattern portions are interposed in the substrate fixing jig to fix the positions. A substrate sheet positioning step, A substrate to which a heat-resistant tape for preventing the flow of the printed circuit board and other good circuit pattern portions fixed in the board fixing jig is installed on the bottom of the printed circuit board and the good circuit pattern portion and fixed to the board fixing jig The fixing step, A space portion is formed between the printed circuit board and the good circuit pattern portion fixed inside the substrate fixing jig, and an epoxy-based adhesive in which the volatile content is removed is injected into the space portion to cure at 120 ° to 200 ° in a drying furnace. Adhesive injection and curing step, After installing the cover part to protect the circuit pattern of the printed circuit board and the part of the good circuit pattern to be bonded thereto from heat, the printed circuit board having completed the curing of the adhesive by heating is separated from the substrate fixing jig, and then the printed circuit board and the good circuit Joining method of a printed circuit board, characterized in that to complete the bonding operation of the pattern portion. 11. The method of claim 10, wherein the positioning of the other good circuit pattern portion located on the substrate fixing jig located in the defective circuit pattern removing unit removed to one side of the printed circuit board, the substrate fixing pin protruding from the substrate fixing jig, A method of joining a printed circuit board, characterized in that the printed circuit board and the good circuit pattern portion are positioned by being inserted into the circuit board and the board fixing pin installed on the good circuit pattern portion on one side thereof. 11. The method of claim 10, wherein the printed circuit board and the good circuit pattern part positioned inside the substrate fixing jig are mounted on a bottom thereof with a heat resistant substrate fixing tape to prevent flow. The method of claim 10, wherein the adhesive filled in the space grooves between the printed circuit board and the good circuit pattern portion bonded thereto is to be cured at 120 ° to 200 °. . 11. The method of claim 10, wherein the adhesive filled in the space grooves between the printed circuit board and the good circuit pattern portion bonded to the printed circuit board is composed of a heat-resistant epoxy resin so that the substrate sheet and the good circuit pattern portion can be bonded without a strain point caused by heat. Bonding method of a printed circuit board, characterized in that the curing agent is added. 15. The method of claim 14, wherein the addition ratio of the curing agent added to the adhesive is added in a ratio of 1-5 wt% of the curing agent to 99-95 wt% of the adhesive. 11. The method of claim 10, wherein the printed circuit board in which the adhesive is injected into the recess of the space portion and the good circuit pattern portion on one side, the plate-shaped cover portion on the upper side to protect the circuit pattern portion from the heat to heat the adhesive Bonding method of a printed circuit board, characterized in that the installation. 11. The method of claim 10, wherein the adhesive that is filled and cured in the space between the printed circuit board and the good circuit pattern portion is exposed to the outside. 11. The method of claim 10, wherein the adhesive filled in the space between the printed circuit board and the good circuit pattern portion is filled in less than or equal to the area of the recess of the space.