KR100331836B1 - Intelligent power module - Google Patents
Intelligent power module Download PDFInfo
- Publication number
- KR100331836B1 KR100331836B1 KR1019990058359A KR19990058359A KR100331836B1 KR 100331836 B1 KR100331836 B1 KR 100331836B1 KR 1019990058359 A KR1019990058359 A KR 1019990058359A KR 19990058359 A KR19990058359 A KR 19990058359A KR 100331836 B1 KR100331836 B1 KR 100331836B1
- Authority
- KR
- South Korea
- Prior art keywords
- pin
- metal
- ipm
- metal pcb
- case
- Prior art date
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- 229910052751 metal Inorganic materials 0.000 claims abstract description 39
- 239000002184 metal Substances 0.000 claims abstract description 39
- 229920005989 resin Polymers 0.000 claims abstract description 8
- 239000011347 resin Substances 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims description 8
- VTLYHLREPCPDKX-UHFFFAOYSA-N 1,2-dichloro-3-(2,3-dichlorophenyl)benzene Chemical compound ClC1=CC=CC(C=2C(=C(Cl)C=CC=2)Cl)=C1Cl VTLYHLREPCPDKX-UHFFFAOYSA-N 0.000 description 9
- LAXBNTIAOJWAOP-UHFFFAOYSA-N 2-chlorobiphenyl Chemical compound ClC1=CC=CC=C1C1=CC=CC=C1 LAXBNTIAOJWAOP-UHFFFAOYSA-N 0.000 description 7
- 101710149812 Pyruvate carboxylase 1 Proteins 0.000 description 7
- 238000005476 soldering Methods 0.000 description 5
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000000306 component Substances 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 208000037805 labour Diseases 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
본 발명은 각 핀(pin)과 일체화 된 메탈 PCB와, 이 메탈 PCB를 포함하는 IPM에 관한 것이다.The present invention relates to a metal PCB integrated with each pin and an IPM including the metal PCB.
이를 위해, 본 발명은 각종 회로소자가 결합된 수지판과, 상기 회로소자로부터 발생되는 열을 흡열하여 외부로 방열하는 금속판이 일체로 된 구성을 가짐과 함께, 상기 수지판에 모터의 구동에 필요한 파워핀(power pin)과 마이컴으로부터 온 신호를 각 회로소자와 연결시켜주는 시그널 핀(signal pin)이 일체로 구비되는 메탈 피씨비(METAL PCB)가 포함되어 이루어짐을 특징으로 하는 아이피엠(IPM)을 제공한다.To this end, the present invention has a structure in which a resin plate to which various circuit elements are coupled, and a metal plate for absorbing heat generated from the circuit elements to dissipate heat to the outside, are integrally formed, and necessary for driving the motor to the resin plate. IPM (Metal PCB) is provided that is integrally provided with a signal pin (signal pin) for connecting the signal from the power pin and the microcomputer with each circuit element (IPM) to provide.
Description
본 발명은 인버터 제어용 회로부품으로 사용되는 메탈 피씨비를 갖는 아이피엠에 관한 것이다.The present invention relates to an IPPM having a metal PC ratio used as a circuit component for inverter control.
일반적으로 아이피엠(IPM:intelligent power module)은 모터를 구동시키는데 쓰이는 회로소자로서, 특히 인버터(inverter)를 구동시키는데 주로 사용되고 있다.In general, an intelligent power module (IPM) is a circuit element used to drive a motor, and is mainly used to drive an inverter.
이러한 아이피엠(이하 'IPM'이라 함)은 도 1에 도시된 바와 같이 각종 회로소자들이 결합된 핵심부품인 메탈 피씨비(이하 '메탈 PCB'라 함)(1)와, 이를 지지해주는 케이스(3)의 결합에 의해 이루어져 있다.This IPM (hereinafter referred to as 'IPM') is a metal PCB (hereinafter referred to as 'metal PCB') 1, which is a core component to which various circuit elements are combined, as shown in FIG. ) Consists of a combination of
이 때, 상기 메탈 PCB(1)는 PCB(printed circuit board)의 일종으로서, 회로소자(13)들이 에스엠디(SMD:surface mounted device) 형태로 결합되어 있는 에폭시(epoxy) 수지판(10)과, 상기 회로소자(13)에서 발생되는 열을 흡열하여 방열판(미도시)으로 방열시키는 작용을 하는 알루미늄(Al)으로 된 금속판(15)이 중첩되어 있는 구성을 가진다.At this time, the metal PCB (1) is a kind of printed circuit board (PCB), and the epoxy resin plate 10, the circuit elements 13 are coupled in the form of a surface mounted device (SMD), The metal plate 15 made of aluminum (Al), which absorbs heat generated by the circuit element 13 and dissipates heat by a heat sink (not shown), is overlapped.
그리고, 상기 메탈 PCB(1)를 보호함과 함께 대상물에 설치하기 위한 수단으로 사용되는 케이스(3)는 합성수지로 된 사출물로써 사각틀 형상을 가지며, 그 내부에 상기 메탈 PCB(1)가 삽입된다.In addition, the case 3 used as a means for protecting the metal PCB 1 and installing it on an object has a rectangular frame shape as an injection molded product made of synthetic resin, and the metal PCB 1 is inserted therein.
아울러, 상기 케이스(3)는 일측에 모터의 구동에 필요한 파워핀(이하 'P 핀' 이라 함)(17)을 위시하여 U, V, W, N 핀(19)(21)(23)(25)이 위쪽으로부터 아래쪽을 향해 순차적으로 배열되어 있으며, 다른 일측에는 마이컴(미도시)으로부터 온 신호를 각 회로소자와 연결시켜주는 시그널 핀(signal pin)(27)이 일정간격을 두고 순차적으로 배열되어 있다.In addition, the case 3 includes U, V, W, N pins 19, 21, 23, including power pins (hereinafter referred to as 'P pins') 17 necessary for driving the motor on one side. 25) are arranged in order from the top to the bottom, and on the other side, signal pins 27 for connecting signals from a microcomputer (not shown) to each circuit element are sequentially arranged at regular intervals. It is.
이 때, 상기 각 핀은 케이스(3)와 일체로 사출되어 각 핀이 케이스(3)에 의해 견고한 고정상태를 유지하고 있다.At this time, the pins are integrally injected with the case 3 so that each pin is firmly fixed by the case 3.
또한, 상기 케이스(3)에는 그 내면을 따라 돌출턱(3a)이 형성되어 케이스(3)내로 메탈 PCB(1)를 삽입할 때 상기 돌출턱(3a)에 의해 케이스(3)에 대한 메탈 PCB(1)의 삽입위치가 지정되도록 하였다.In addition, a protruding jaw 3a is formed along the inner surface of the case 3 so that the metal PCB for the case 3 is formed by the protruding jaw 3a when the metal PCB 1 is inserted into the case 3. The insertion position of (1) was specified.
이와 같은 구성을 가진 IPM은 메탈 PCB(1)의 회로소자(13) 결합면을 케이스(3)를 향하게 한 상태에서 케이스(3)의 내부로 삽입하므로써 간단히 결합할 수 있다.The IPM having such a configuration can be simply combined by inserting the circuit element 13 coupling surface of the metal PCB 1 into the case 3 with the case 3 facing the case 3.
그리고, 메탈 PCB(1)와 케이스(3)가 결합되더라도 사출에 의해 케이스(3)에 일체화 된 각 핀과 메탈 PCB(1)의 단자는 상호 접속되지 않은 상태이므로 이를 납땜에 의해 접속시키는 공정을 해야하며, 이로써 IPM은 완성된다.In addition, even though the metal PCB 1 and the case 3 are combined, the pins integrated in the case 3 by injection and the terminals of the metal PCB 1 are not connected to each other. This completes the IPM.
그러나, 종래의 IPM은 상술한 바와 같이 메탈 PCB(1)와 각 핀이 별개로 되어 있으므로 이를 접속시키기 위해 반드시 납땜공정을 거쳐야 하는데, 이 과정에서 납땜불량이 빈번히 발생하는 문제점으로 제품의 신뢰도를 저하시키는 요인이 되어 왔다.However, in the conventional IPM, since the metal PCB 1 and each pin are separate as described above, a soldering process must be performed in order to connect them. It has been a factor.
또한, 납땜공정에 따른 작업공수의 증가로 생산성 저하는 물론 가격 경쟁력면에서 불리한 조건으로 작용되고 있다.In addition, productivity increases due to the increase in the number of labors due to the soldering process, which is a disadvantage in terms of price competitiveness.
본 발명은 상기와 같은 종래의 문제점을 해결하기 위해 안출한 것으로서, 메탈 PCB와 각 핀을 일체화 하여, 메탈 PCB와 각 핀과의 접속불량요인을 제거하므로써 제품의 신뢰도 향상 및 제조공정의 단순화를 이룰 수 있도록 하는데 그 목적이 있다.The present invention has been made to solve the conventional problems as described above, by integrating the metal PCB and each pin, by removing the defects of the connection between the metal PCB and each pin to achieve the reliability of the product and simplify the manufacturing process. The purpose is to make it possible.
도 1은 종래 아이피엠의 구성을 보인 분리 사시도1 is an exploded perspective view showing a configuration of a conventional IPPM
도 2는 본 발명에 따른 아이피엠중 메탈 PCB의 사시도Figure 2 is a perspective view of the metal PCB of the IPPM in accordance with the present invention
도면의 주요부분에 대한 부호의 설명Explanation of symbols for main parts of the drawings
17, 19, 21, 23, 25, 27 : 핀 40 : 메탈 PCB17, 19, 21, 23, 25, 27: Pin 40: Metal PCB
43 : 수지판 45 : 금속판43: resin plate 45: metal plate
50 : 케이스50: case
상기 목적을 달성하기 위해, 본 발명은 각종 회로소자가 결합된 수지판과, 상기 회로소자로부터 발생되는 열을 흡열하여 외부로 방열하는 금속판이 일체로 된 구성을 가짐과 함께, 상기 수지판에 모터의 구동에 필요한 파워핀(power pin)과 마이컴으로부터 온 신호를 각 회로소자와 연결시켜주는 시그널 핀(signal pin)이 일체로 구비되는 메탈 피씨비(METAL PCB)가 포함되어 이루어짐을 특징으로 하는 아이피엠(IPM)을 제공한다.In order to achieve the above object, the present invention has a structure in which a resin plate to which various circuit elements are coupled, and a metal plate that absorbs heat generated from the circuit elements and dissipates heat to the outside, are integrally formed. IPM, characterized in that the power pin (metal pin) that is integrally provided with a signal pin (signal pin) for connecting the signal from the microcomputer with a power pin required for driving the (IPM).
이와 더불어, 상기 메탈 피씨비와 일체화 되어, 상기 메탈 피씨비와 상기 파워핀 그리고 상기 시그널 핀을 함께 지지하는 케이스가 더 포함되어 이루어짐이 바람직하다.In addition, it is preferable that the case is integrated with the metal PC, and further includes a case for supporting the metal PC, the power pin and the signal pin together.
이하, 첨부된 도 2를 참조하여 본 발명의 바람직한 실시예를 보다 상세히 설명하면 다음과 같다.Hereinafter, with reference to the accompanying Figure 2 will be described in detail a preferred embodiment of the present invention.
우선, 메탈 PCB(40)는 기본적으로 에폭시 수지물로 이루어져 각종 회로소자(13)가 결합된 수지판(43)과, 상기 수지판에 중첩되게 결합되어 회로소자(13)로 부터 발생된 열을 방열판(미도시)으로 전도(conduction)시키는 역할을 하는 알루미늄으로 된 금속판(45)으로 구성되어 있다.First, the metal PCB 40 basically consists of an epoxy resin material, and a resin plate 43 to which various circuit elements 13 are coupled, and is coupled to overlap with the resin plate to heat generated from the circuit elements 13. It consists of a metal plate 45 made of aluminum that serves to conduct a heat sink (not shown).
이 때, 상기 메탈 PCB(40)의 회로소자 형성면 일측에는 P 핀(17)을 포함한 U, V, W, N 핀(19)(21)(23)(25)이 일렬로 일체화 되고, 그 반대편에는 다수개의 시그널 핀(27)이 일렬로 일체화 되어 있다.At this time, the U, V, W, N pins 19, 21, 23, 25 including the P pin 17 are integrated in one line on one side of the circuit element forming surface of the metal PCB 40. On the other side, a plurality of signal pins 27 are integrated in a line.
이렇게 각 핀과 메탈 PCB(40)가 일체화 되므로 인해서 각 핀과 메탈 PCB간의 접속을 위해 기존에 행해졌던 납땜작업이 필요없게 되어 접속불량을 해소할 수 있게 된다.Since the pins and the metal PCB 40 are integrated in this way, the soldering work that has been previously performed for the connection between each pin and the metal PCB is not necessary, thereby eliminating the connection failure.
한편, IPM은 상기한 메탈 PCB(40)를 포함하여 이를 대상물에 설치하기 위한 케이스(50)를 포함하여 이루어진다.On the other hand, the IPM comprises a case 50 for including the metal PCB 40 and installing it on the object.
이 때, 본 발명의 메탈 PCB(40)는 각 핀과 일체화 된 구성을 가지므로 케이스(50)와의 결합구조도 달라지게 된다.At this time, since the metal PCB 40 of the present invention has a configuration integrated with each pin, the coupling structure with the case 50 is also different.
즉, 메탈 PCB(40)를 금형에 삽입한 상태에서 그 주변부로 케이스(50)가 형성되도록 하는 인써트 사출을 통해 메탈 PCB(40)와 이에 일체로 된 각 핀을 케이스(50)에 의해 함께 지지되도록 하였다.That is, the metal PCB 40 and the pins integrated with the metal PCB 40 are integrally supported by the case 50 through an insert injection in which the case 50 is formed at the periphery thereof while the metal PCB 40 is inserted into the mold. It was made.
물론, 이 방법외에도 케이스(50)를 별도로 사출하여 각 핀과 일체화 된 상기 메탈 PCB(40)를 끼워 넣는 기존의 방식을 그대로 적용해도 관계는 없지만, 이 경우 각 핀이 별도로 지지되지 않으므로 길고 가느다란 형상의 핀이 취급중 변형되거나 부러지는 등의 손상이 발생될 수 있음을 감안하면 전자의 방법, 즉 케이스(50)에 의해 각 핀이 지지되도록 하는 방법을 적용함이 보다 바람직 하다 하겠다.Of course, in addition to this method, it is irrelevant to apply the existing method of inserting the metal PCB 40 integrated with each pin by separately injecting the case 50, but in this case, since each pin is not separately supported, it is long and thin. Considering that the pins of the shape may be deformed or broken during handling, it is more preferable to apply the former method, that is, a method in which each pin is supported by the case 50.
이상과 같은 본 발명은 메탈 PCB와 각 핀을 일체화 하므로써 이 들간의 접속을 위해 별도의 납땜작업이 필요없으므로 공정의 단순화를 이룰 수 있음은 물론, 납땜불량으로 단자간의 단락현상을 방지할 수 있으므로 제품의 신뢰도를 향상시킬 수 있는 장점도 갖추게 된다.The present invention as described above, by integrating the metal PCB and each pin, there is no need for a separate soldering operation for the connection between them, it is possible to simplify the process, as well as to prevent short circuit between terminals due to poor soldering products It also has the advantage of improving the reliability of the.
Claims (2)
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019990058359A KR100331836B1 (en) | 1999-12-16 | 1999-12-16 | Intelligent power module |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019990058359A KR100331836B1 (en) | 1999-12-16 | 1999-12-16 | Intelligent power module |
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| Publication Number | Publication Date |
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| KR20010056762A KR20010056762A (en) | 2001-07-04 |
| KR100331836B1 true KR100331836B1 (en) | 2002-04-09 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| KR101464984B1 (en) * | 2013-07-25 | 2014-11-25 | 엘에스파워세미텍 주식회사 | Intelligent power module with compaction size standardized |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20030080726A (en) * | 2002-04-10 | 2003-10-17 | 엘지전자 주식회사 | Integrated power module and fabricating method thereof |
| KR100672537B1 (en) * | 2005-08-11 | 2007-01-24 | 엘지전자 주식회사 | Combined fixing device of pcb(printed circuit board) and magmate |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09130068A (en) * | 1995-10-26 | 1997-05-16 | Matsushita Electric Ind Co Ltd | Printed board |
| KR19980050367A (en) * | 1996-12-20 | 1998-09-15 | 김광호 | Semiconductor Module Package |
| KR19990032792U (en) * | 1997-12-31 | 1999-07-26 | 김영환 | Memory Module PCB Connection Mechanism |
-
1999
- 1999-12-16 KR KR1019990058359A patent/KR100331836B1/en not_active IP Right Cessation
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09130068A (en) * | 1995-10-26 | 1997-05-16 | Matsushita Electric Ind Co Ltd | Printed board |
| KR19980050367A (en) * | 1996-12-20 | 1998-09-15 | 김광호 | Semiconductor Module Package |
| KR19990032792U (en) * | 1997-12-31 | 1999-07-26 | 김영환 | Memory Module PCB Connection Mechanism |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101464984B1 (en) * | 2013-07-25 | 2014-11-25 | 엘에스파워세미텍 주식회사 | Intelligent power module with compaction size standardized |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20010056762A (en) | 2001-07-04 |
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