KR102484339B1 - Heat distortion compensation type jig device for wiring - Google Patents

Abstract

Disclosed is an invention for a heat deformation compensation type jig device for a wiring. The disclosed heat deformation compensation type jig device for the wiring comprises: a jig on which a first substrate provided in any one direction and a second substrate connected to the first substrate through a connecting part are seated and supported; and a heat expansion compensation part which prevents a poor contact between the first and second substrates by compensating for a movement of the connecting part in the jig with heat deformation caused by a difference in a heat expansion coefficient between the jig and the first and second substrates, when melting, by an SMD method, a solder with reflow high heat with respect to the soldering joint of the connecting part. Therefore, the present invention is capable of preventing an occurrence of an electrical contact failure between the substrates.

Description

Heat distortion compensation type jig device for wiring {HEAT DISTORTION COMPENSATION TYPE JIG DEVICE FOR WIRING}

The present invention relates to a thermal strain compensation jig device for wiring, and more particularly, in placing a plurality of substrates on a jig, connecting the substrates by SMD type soldering, and performing heat treatment, using a thermal expansion compensation unit to By compensating for the movement of the connection part of the boards due to the difference in thermal expansion coefficient between the boards, it is possible to prevent electrical contact failure between the boards, as well as to cover a plurality of boards seated on the jig with a fixing cover, stably It relates to a thermal strain compensation jig device for wiring that can help spread a board.

In general, a battery used in an electric vehicle is composed of a plurality of battery pack modules to supply power as needed. The battery pack module is composed of a plurality of battery cells, and when the battery cells are connected in series, relatively large power can be supplied.

A battery pack module may refer to a component in which a plurality of secondary batteries are connected in series or parallel to increase capacity and output. A conventional battery pack module is composed of a cartridge stack in which a plurality of cartridges each accommodating battery cells, which are secondary batteries, are stacked in multiple stages, and a connection device for connecting these cartridge stacks.

Types of secondary batteries include lithium ion batteries, lithium polymer batteries, nickel cadmium batteries, nickel hydride batteries, nickel zinc batteries, and the like.

In this way, a flexible printed circuit board (FPCB) or a rigid printed circuit board (FPCB) or the like is applied to electrically connect the battery cells of the battery pack module.

By the way, in the process of coupling flexible printed circuit boards to each other or between rigid printed circuit boards and flexible printed circuit boards, after seating the rigid printed circuit boards or flexible printed circuit boards using a jig, using SMD (Surface Mount Device) Soldering between boards is made by melting and combining solder with high heat in the reflow process. Due to the difference in thermal expansion between the jig and the rigid printed circuit board and/or the flexible circuit board, the connection between the boards is damaged, resulting in poor contact in the wiring. has a problem with

Therefore, there is a need to improve this.

As a related background art, there is Republic of Korea Patent Registration No. 1397580 (May 14, 2014, title of the invention: printed circuit board and wiring connection jig used therein).

The present invention was created due to the above needs, and the difference in thermal expansion coefficient between the jig and the substrate is achieved by using a thermal expansion compensation unit in mounting a plurality of substrates on a jig, connecting the substrates by SMD soldering, and performing heat treatment. By compensating for the movement of the connection part of the boards by the board, it is possible to prevent electrical contact failure between boards, and by covering a plurality of boards seated on the jig with a fixed cover, it helps to spread the boards stably. Its purpose is to provide a thermal strain compensation jig device for wiring that can be used.

In order to achieve the above object, a thermal strain compensation jig device for wiring according to the present invention includes a jig in which a first substrate provided in one direction and a second substrate connected to the first substrate through a connection part are seated and supported; And it is provided in the jig and is installed in the connection part, respectively, and when the soldering joint of the connection part is reflowed by SMD method and the solder is melted with high heat, thermal deformation due to the difference in thermal expansion coefficient between the jig and the first and second substrates It is characterized in that it includes; a thermal expansion compensator for preventing a contact defect between the first and second substrates by compensating for the movement of the connecting portion in the jig.

The first substrate and the second substrate are provided in plurality, and the first substrate and the second substrate are each disposed to cross each other.

Each of the second substrates is characterized in that each of the second substrates is formed as a closed curve integrally connected.

The jig is characterized in that a first seating groove portion to seat the first substrate and a second seating groove portion to seat the second substrate are formed.

It is characterized in that it includes one or more fixing covers covered on one side of the jig to fix the first substrate and the second substrate in an unfolded state.

The fixing cover is formed through a positioning hole for confirming the position of the second substrate, and the jig is provided with a seating display groove that surrounds and displays the seated state of the second substrate and is exposed through the positioning hole. characterized by being

The jig is characterized in that to form a cover seating groove in which the fixing cover is seated.

The jig is characterized in that a heat dissipation hole is formed through the arrangement trajectory of the second substrate pressed by the fixed cover, and a lightweight hole for light weight is formed through the jig in an area not covered by the fixed cover.

The thermal expansion compensation unit may include a plurality of fitting holes formed through the connecting portion where the first and second substrates overlap; Position variable fixing pins inserted into each of the fitting holes to fix the first and second substrates; and a position moving unit provided in the jig and compensating for a moving position for thermal deformation by moving the first and second substrates in the jig according to a difference in thermal expansion coefficient of the position variable fixing pin inserted into the fitting hole. It is characterized by including.

The positioning unit may include a guide hole formed through the jig and allowing movement of the position variable fixing pin; a moving block provided at a lower side of the variable position fixing pin and operating in all directions at the lower side of the jig by connecting each of the variable position fixing pins; and by fixing the moving block with a magnetic force and forcing the restraint of the position variable fixing pin inserted into the fitting holes of the first and second substrates with a magnetization elastic force, to secure the first and second substrates to the jig by thermal deformation. Characterized in that it comprises a; magnetic fixing part enabling movement.

In the thermal strain compensation jig device for wiring according to the present invention, a plurality of substrates are seated on a jig, and the thermal expansion coefficient difference between the jig and the substrate is used by using a thermal expansion compensator when a plurality of substrates are seated on the jig, and the substrates are connected by SMD-type soldering and heat treated. By compensating for the movement of the connecting portion of the substrate due to, it is possible to prevent electrical contact failure between the substrates.

In addition, the present invention can help spread and connect the substrates stably and effectively by covering a plurality of substrates seated on the jig with a fixing cover.

In addition, according to the present invention, a plurality of first and second substrates seated on the jig are provided in a state of being spaced apart from each other by a set distance, thereby forming a closed curve integrally connected to each substrate.

In addition, in the present invention, the location of the flexible printed circuit board, which is the second substrate seated on the jig, can be confirmed by forming a positioning hole through the fixed cover.

In addition, the present invention can lighten the jig by forming a plurality of through holes in the jig and facilitate the discharge of hot air.

1 is an exploded perspective view of a thermal strain compensation jig device for wiring according to an embodiment of the present invention.
2 is an assembly plan view of a thermal strain compensation jig device for wiring according to an embodiment of the present invention.
3 is an enlarged view of main parts in the jig device for thermal strain compensation for wiring according to an embodiment of the present invention, in which first and second substrates are seated on the jig.
4 is an enlarged view of a main part showing a positioning hole in a fixed cover in a thermal strain compensation jig device for wiring according to an embodiment of the present invention.
5 is an exploded perspective view of a thermal expansion compensation unit in a thermal deformation compensation jig device for wiring according to an embodiment of the present invention.
6 is an assembly plan view of a thermal expansion compensation unit in a thermal strain compensation jig device for wiring according to an embodiment of the present invention.
7 is an assembled perspective view of a bottom surface of a thermal expansion compensation unit in a thermal strain compensation jig device for wiring according to an embodiment of the present invention.
8 is an assembled cross-sectional view of a thermal expansion compensation unit in a thermal strain compensation jig device for wiring according to an embodiment of the present invention.
9 is an assembly cross-sectional view of a thermal expansion compensation unit of a thermal deformation compensation type jig device for wiring according to an embodiment of the present invention, showing states before and after thermal deformation.

Hereinafter, a thermal strain compensation jig device for wiring according to an embodiment of the present invention will be described with reference to the accompanying drawings.

In this process, the thickness of lines or the size of components shown in the drawings may be exaggerated for clarity and convenience of explanation. In addition, terms to be described later are terms defined in consideration of functions in the present invention, which may vary according to the intention or custom of a user or operator. Therefore, definitions of these terms will have to be made based on the content throughout this specification.

1 is an exploded perspective view of a thermal strain compensation jig device for wiring according to an embodiment of the present invention, FIG. 2 is an assembled plan view of the thermal strain compensation type jig device for wiring according to an embodiment of the present invention, and FIG. In the thermal strain compensation jig device for wiring according to an embodiment of the present invention, an enlarged view of a main part in which first and second substrates are seated on the jig, and FIG. 4 is a thermal strain compensation jig for wiring according to an embodiment of the present invention. In the device, it is an enlarged view of the main part showing the positioning hole in the fixed cover.

5 is an exploded perspective view of a thermal expansion compensation unit in a thermal strain compensation jig device for wiring according to an embodiment of the present invention, and FIG. 6 is an exploded perspective view of a thermal expansion compensation unit in a thermal expansion compensation jig apparatus for wiring according to an embodiment of the present invention. 7 is an assembled perspective view of a bottom surface of a thermal expansion compensation unit in a thermal strain compensation jig device for wiring according to an embodiment of the present invention, and FIG. 8 is a thermal strain compensation jig device for wiring according to an embodiment of the present invention. Figure 9 is a cross-sectional view of assembling the thermal expansion compensation unit, and FIG. 9 is an assembly cross-sectional view of the thermal expansion compensation unit of the thermal strain compensation jig device for wiring according to an embodiment of the present invention, showing states before and after thermal deformation.

Referring to FIGS. 1 to 9 , a thermal strain compensation jig device for wiring according to an embodiment of the present invention includes a jig 100 and a thermal expansion compensator 300 .

In the jig 100, a first substrate 10 provided in one direction and a second substrate 20 connected to the first substrate 10 through a connecting portion 30 are seated and supported.

The jig 100 may include a carrier jig.

As an example, the first substrate 10 may be a rigid printed circuit board (rigid PCB), and the second substrate 20 may be made of a flexible printed circuit board (FPCB). Of course, both the first substrate 10 and the second substrate 20 may be flexible printed circuit boards, and the first substrate 10 may be a flexible printed circuit board and the second substrate 20 may be a rigid printed circuit board. may be

A plurality of first substrates 10 are provided, spaced apart from each other by a set interval. A plurality of second substrates 20 are also provided, spaced apart from each other by set intervals. Each of the first substrate 10 and the second substrate 20 is disposed to cross each other. In particular, each of the first substrate 10 and the second substrate 20 is orthogonal to each other.

The jig 100 supports the first substrate 10 and the second substrate 20 respectively and prevents the first substrate 10 and the second substrate 20 from being exposed to the outside.

The plurality of first substrates 10 and the plurality of second substrates 20 are patterned for current transmission and reception.

Each of the first substrates 10 and each of the second substrates 20 is formed as a closed curve integrally connected. That is, the closed curve formed by each of the first substrate 10 and each of the second substrate 20 is formed in a quadrangular shape. Thus, as an example, it is assumed that a total of four connection units 30 in which the plurality of first substrates 10 and the plurality of second substrates 20 are interconnected are provided. Each of the four connection parts 30 is heat-treated after SMD bonding, so that the first and second substrates 10 and 20 are connected to each other. A thermal expansion compensation unit 300 may be provided in at least one of the four connection units 30 .

The jig 100 forms a first seating groove 110 to seat the first substrate 10 and a second seating groove 120 to seat the second substrate 20 . The first seating groove 110 is formed to a depth matched to the thickness of the first substrate 10 , and the second seating groove 120 is formed to a depth matched to the thickness of the second substrate 20 .

Meanwhile, the first seating groove 110 is formed deeper than the second seating groove 120 . That is, since the first seating groove 110 is formed to fit the first substrate 10, which is a rigid printed circuit board, it is deeper than the second seating groove 120, which is formed to fit the second substrate 20, which is a flexible printed circuit board. can be formed

In the thermal strain compensation jig device for wiring according to an embodiment of the present invention, one or more fixings covered on one side of the jig 100 are provided to fix the first substrate 10 and the second substrate 20 in an unfolded state. A cover 200 may be included.

The fixing cover 200 overlaps one side of the jig 100 on which the first substrate 10 and the second substrate 20 are seated. Thus, the fixing cover 200 comes into surface contact with one side surface of the jig 100 and the first and second substrates 10 and 20 .

In particular, when the fixed cover 200 is made of a thin plate, the fixed cover 200 is in close contact with one side of the jig 100 by friction. Accordingly, the fixing cover 200 is fixed to one side of the jig 100 in a state in which the first substrate 10 and the second substrate 200 are spread out.

The fixed cover 200 is formed of various materials. As an example, the fixed cover 200 is made of a metallic material, and the fixed cover 200 may be magnetically fixed in a state in which the fixed cover 200 covers one side of the jig 100. In addition, as an example, the fixed cover 200 is shown as being provided with four. Of course, the number of fixed covers 200 can be changed.

Referring to FIGS. 3 and 4 , the fixing cover 200 penetrates a positioning hole 210 for checking the position of the second substrate 20 . The positioning hole 210 may be provided in plural in various forms.

In addition, the jig 100 is provided with a seating display groove 130 that surrounds and displays the seating state of the second substrate 20 and is exposed through the positioning hole 210 . The seating indication groove 130 wraps at least a portion of the circumference of the display portion of the second substrate 20 and exposes it to the outside through the positioning hole 210 to notify the outside of the seating state of the second substrate 20, thereby providing control. Allows the operator to confirm that the second substrate 20 is properly seated.

The jig 100 forms a cover seating groove 140 on which the fixed cover 200 is seated. The cover seating groove 140 is formed as deep as the thickness of the fixed cover 200 .

The jig 100 forms a heat dissipation hole 150 penetrating the arrangement trajectory of the second substrate 20 pressed by the fixed cover 200 .

The heat dissipation hole 150 is formed to be larger than the arrangement trajectory of the second substrate 20 so that the first and second substrates 10 and 20 are seated on one side of the jig 100, and the first and second substrates ( 10) After soldering to the connection part 30 of (20) by SMD (Surface Mount Device) method, it plays a role of effectively discharging heat generated in the process of heat treatment. Of course, the heat dissipation hole 150 also contributes to lightening the weight of the jig 100.

In the jig 100, a light hole 160 for light weight is formed through a region not covered by the fixed cover 200. Of course, the lightweight hole 160 not only reduces the weight of the jig 100, but also helps to dissipate heat.

The thermal expansion compensator 300 is provided in the jig 100 and is installed in each of the connection parts 30, and when the soldering joint of the connection part 30 is melted by reflowing high heat by SMD method, the jig 100 and the first ,The thermal deformation caused by the difference in thermal expansion coefficient between the second substrate 10 and 20 compensates for the movement of the connection part 30 in the jig 100, thereby preventing poor contact between the first and second substrates 10 and 20. It is a composition that

The thermal expansion compensator 300 is a metal material in the heat treatment process when interconnecting the first substrate 10 and the second substrate 20 seated on one side of the jig 10 by SMD method soldering at the connection portion 30. The moving amount is different between the jig 100 and the first and second substrates 10 and 20 made of synthetic resin due to the difference in thermal expansion coefficient, so that the SMD bonding process of the first substrate 10 and the second substrate 20 Since the connection part 30 is damaged, the occurrence of poor contact between the first substrate 10 and the second substrate 20 is solved through compensation movement.

The thermal expansion compensator 300 is inserted into a plurality of fitting holes 310 formed through the connection part 30 where the first and second substrates 10 and 20 overlap, and each of the fitting holes 310 to provide a first, The variable-position fixing pin 320 for fixing the second substrate 10 and 20 and the variable-position fixing pin 310 provided in the jig 100 and inserted into the fitting hole 310 according to the difference in thermal expansion coefficient. The jig 100 includes a position moving unit 330 that moves the first and second substrates 10 and 20 to compensate for the movement position for thermal deformation.

After being fitted into the fitting hole 310, the position variable fixing pin 320 may correspond to the depth of the fitting hole 310 or protrude slightly more than the fitting hole 310.

Position variable fixing pin 320 is formed of a circular column. Of course, the position variable fixing pin 320 may be formed in various shapes.

The position moving unit 330 is formed through the jig 100 and is provided with a guide hole 340 allowing movement of the position variable fixing pin 320 and a lower side of the position variable fixing pin 320, and the position is variable. A moving block 350 that operates in all directions on the lower side of the jig 100 by connecting each of the fixing pins 320, and the first and second substrates 10 ( 20), the movement of the first and second substrates 10 and 20 with respect to the jig 100 due to thermal deformation is performed by forcing the restraint of the position variable fixing pin 320 inserted into the fitting hole 310 with magnetization elasticity. It includes a magnetic fixing part 360 that enables.

The guide hole 340 is formed as a circular hole so that the position variable fixing pin 320 can move the same distance from the center of the guide hole 340 in all directions. Of course, the guide hole portion 340 may be formed in various shapes.

The moving block 350 fixes the position variable fixing pin 320 integrally. At this time, the moving block 350 is a jig by thermal deformation in a state where the position variable fixing pin 320 is inserted into the fitting hole 310 of the connecting portion 30 provided on the first and second substrates 10 and 20. Even if the 10 moves a lot, the jig 100 maintains a moving state or moves finely so as to adjust the position of the fitting holes 310 of the first and second substrates 10 and 20 .

The magnetic fixing part 360 is connected to the cover member 362 coupled to the jig 100 by the fastening member 361 so as to cover the moving block 350 and the first installation groove 352 of the moving block 350. It is inserted into the first magnet member 364 to be inserted and installed and the second installation groove 363 of the cover member 362, and the position is variable by magnetizing and fixing the first magnet member 364 in the jig 100 by manpower. It includes a second magnet member 366 that allows the movement of the jig 100 with respect to thermal deformation while supporting the first and second substrates 10 and 20 with the fixing pins 320 .

As shown in FIG. 7 , the cover member 362 is coupled to the jig 100 through a plurality of fastening members 361 in the form of covering one side of the lower side of the jig 100 .

The first magnet member 364 may be inserted into the first installation groove 352 of the moving block 350 by magnetic force. Of course, a friction pressing force may be applied to the first magnet member 364 from the first installation groove 352 .

The second magnet member 366 may be inserted into the second installation groove 363 of the cover member 362 by magnetic force. Of course, a friction pressing force may be applied to the second magnet member 366 in the second installation groove 363 .

A movement guide groove 368 for guiding movement of the moving block 350 may be formed on the lower side of the jig 100 and the upper side of the cover member 362 .

The movement guide groove 368 allows the position variable fixing pin 320 to secure a movement distance equal to or greater than that from the center of the guide hole 340 to the edge contact portion.

Referring to FIG. 9 , a state in which thermal strain is compensated for between the first and second substrates 10 and 20 in the jig 100 using the thermal expansion compensator 300 will be described.

First, the first and second substrates 10 and 20 are jig ( 100), and insert and fix the position variable fixing pin 320 into the fitting hole 310 of the connection part 30.

Subsequently, the first and second substrates 10 (20) are seated on one side of the jig 100, and the connection portion ( 20), apply heat to dry the SMD bonding area.

On the other hand, when heat is applied to the jig 100, the first and second substrates 10 and 20, and the fixing cover 200, the metal jig 100, the fixing cover 200 and the first and second substrates made of synthetic resin Due to the difference in thermal expansion coefficient between (10) and (20), the metal jig 100 and the fixed cover 200 further expand.

Thus, for example, while the jig 100 and the cover member 362 move to the right, the first and second substrates 10 and 20 inserted into the variable position fixing pin 320 of the moving block 350 are deformed. As the state of trying to keep it small, the second magnet member 366 mounted in the second installation groove 363 of the cover member 362 is the first magnet member 366 mounted in the first magnet groove 352 of the moving block 350. While the magnetization is fixed by the first magnet member 364, the movement of the jig 100 and the cover member 362 is allowed (compensated) through the magnetization support force formed by the magnetic force.

Therefore, in the thermal strain compensation jig device for wiring according to an embodiment of the present invention, in placing a plurality of substrates on the jig, connecting the substrates by SMD soldering, and performing heat treatment, the thermal expansion compensation unit is used to By compensating for the movement of the connecting portion of the substrates due to the difference in thermal expansion coefficient between the substrates, it is possible to prevent electrical contact failure between the substrates.

In addition, the present invention can help spread and connect the substrates stably and effectively by covering a plurality of substrates seated on the jig with a fixing cover. In addition, according to the present invention, a plurality of first and second substrates seated on the jig are provided in a state of being spaced apart from each other by a set distance, thereby forming a closed curve integrally connected to each substrate.

In addition, in the present invention, the location of the flexible printed circuit board, which is the second substrate seated on the jig, can be confirmed by forming a positioning hole through the fixed cover. In addition, the present invention can lighten the jig by forming a plurality of through holes in the jig and facilitate the discharge of hot air.

The present invention has been described with reference to the embodiments shown in the drawings, but this is only exemplary, and those skilled in the art can make various modifications and equivalent other embodiments. will understand

Therefore, the true technical protection scope of the present invention should be determined by the claims below.

10: first substrate 20: second substrate
30: connection part 100: jig
110: first seating groove 120: second seating groove
130: seating display groove 140: cover seating groove
150: heat dissipation hole 160: lightweight hole
200: fixed cover 210: positioning hole
300: thermal expansion compensation unit 310: fitting hole
320: position variable fixing pin 330: position moving unit
340: guide hole 350: moving block
352: first installation groove 360: magnetic fixing
361: fastening member 362: cover member
363: second installation groove 364: first magnet member
366: second magnet member 368: moving guide groove

Claims (10)

a jig in which a first substrate provided in one direction and a second substrate connected to the first substrate through a connecting portion are seated and supported; And it is provided in the jig and is installed in the connection part, and when the solder is melted with high heat to reflow the soldering joint of the connection part in the SMD method, the thermal deformation due to the difference in thermal expansion coefficient between the jig and the first and second substrates A thermal expansion compensator for preventing poor contact between the first and second substrates by compensating for the movement of the connecting portion in the jig;
The thermal expansion compensation unit may include a plurality of fitting holes formed through the connecting portion where the first and second substrates overlap; Position variable fixing pins inserted into each of the fitting holes to fix the first and second substrates; and a position moving unit provided in the jig and compensating for a moving position for thermal deformation by moving the first and second substrates in the jig according to a difference in thermal expansion coefficient of the position variable fixing pin inserted into the fitting hole. contains,
The positioning unit may include a guide hole formed through the jig and allowing movement of the position variable fixing pin; a moving block provided at a lower side of the variable position fixing pin and operating in all directions at the lower side of the jig by connecting each of the variable position fixing pins; and by fixing the moving block with a magnetic force and forcing the restraint of the variable position fixing pin inserted into the fitting holes of the first and second substrates with magnetization elastic force, so as to secure the first and second substrates to the jig by thermal deformation. A magnetic fixing unit that enables movement;
Thermal strain compensation jig device for wiring, characterized in that it comprises.
According to claim 1,
The first substrate and the second substrate are provided in plurality,
The thermal strain compensation jig device for wiring, characterized in that the first substrate and the second substrate are disposed to cross each other.
According to claim 2,
Thermal strain compensation jig device for wiring, characterized in that each of the first substrate and each of the second substrate is formed as a closed curve integrally connected.
According to claim 1,
The jig is a thermal strain compensation jig device for wiring, characterized in that a first seating groove portion to seat the first substrate and a second seating groove portion to seat the second substrate.
According to claim 1,
The thermal strain compensation type jig device for wiring, characterized in that it includes one or more fixing covers covered on one side of the jig to fix the first substrate and the second substrate in an unfolded state.
According to claim 5,
The fixing cover is formed through a positioning hole for confirming the position of the second substrate,
The jig device is thermal strain compensation type jig device for wiring, characterized in that the jig is provided with a seating display groove that surrounds and displays the seating state of the second substrate and is exposed through the position confirmation hole.
According to claim 5,
The jig device for thermal strain compensation for wiring, characterized in that the jig forms a cover seating groove in which the fixed cover is seated.
According to claim 5,
The jig forms a heat dissipation hole through a disposition trajectory of the second substrate pressed by the fixed cover,
The jig is a thermal strain compensation jig device for wiring, characterized in that the lightweight hole for lightening is formed through the area not covered by the fixed cover.
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