KR20010030546A - 임의 전압 발생 구조 및 이 구조를 사용하는 고체 촬상 소자 - Google Patents
임의 전압 발생 구조 및 이 구조를 사용하는 고체 촬상 소자 Download PDFInfo
- Publication number
- KR20010030546A KR20010030546A KR1020000057446A KR20000057446A KR20010030546A KR 20010030546 A KR20010030546 A KR 20010030546A KR 1020000057446 A KR1020000057446 A KR 1020000057446A KR 20000057446 A KR20000057446 A KR 20000057446A KR 20010030546 A KR20010030546 A KR 20010030546A
- Authority
- KR
- South Korea
- Prior art keywords
- substrate
- fuses
- fuse
- voltage
- arbitrary voltage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000007787 solid Substances 0.000 title description 2
- 239000000758 substrate Substances 0.000 claims abstract description 81
- 239000011810 insulating material Substances 0.000 claims abstract description 29
- 238000003384 imaging method Methods 0.000 claims description 20
- 238000009413 insulation Methods 0.000 claims 1
- 230000001681 protective effect Effects 0.000 description 11
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 8
- 229910004298 SiO 2 Inorganic materials 0.000 description 7
- 229920005591 polysilicon Polymers 0.000 description 7
- 239000011241 protective layer Substances 0.000 description 6
- 239000010410 layer Substances 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000009825 accumulation Methods 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 230000000903 blocking effect Effects 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 108010075750 P-Type Calcium Channels Proteins 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 239000013256 coordination polymer Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/15—Charge-coupled device [CCD] image sensors
- H10F39/153—Two-dimensional or three-dimensional array CCD image sensors
- H10F39/1534—Interline transfer
Landscapes
- Semiconductor Integrated Circuits (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31280699A JP4395941B2 (ja) | 1999-09-29 | 1999-09-29 | 任意電圧発生構造及びこれを用いた固体撮像素子 |
| JP1999-312806 | 1999-09-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20010030546A true KR20010030546A (ko) | 2001-04-16 |
Family
ID=18033644
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020000057446A Withdrawn KR20010030546A (ko) | 1999-09-29 | 2000-09-29 | 임의 전압 발생 구조 및 이 구조를 사용하는 고체 촬상 소자 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP4395941B2 (enExample) |
| KR (1) | KR20010030546A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100466284C (zh) * | 2004-03-05 | 2009-03-04 | 三星电子株式会社 | 偏置电路、固态成像装置及其制造方法 |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4940517B2 (ja) * | 2001-08-07 | 2012-05-30 | ソニー株式会社 | 固体撮像装置およびその製造方法 |
| JP2005277398A (ja) * | 2004-02-25 | 2005-10-06 | Sony Corp | Ccdリニアセンサ |
| KR101096439B1 (ko) | 2006-06-29 | 2011-12-20 | 주식회사 하이닉스반도체 | 반도체 소자의 퓨즈 박스 형성방법 |
-
1999
- 1999-09-29 JP JP31280699A patent/JP4395941B2/ja not_active Expired - Fee Related
-
2000
- 2000-09-29 KR KR1020000057446A patent/KR20010030546A/ko not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100466284C (zh) * | 2004-03-05 | 2009-03-04 | 三星电子株式会社 | 偏置电路、固态成像装置及其制造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2001102533A (ja) | 2001-04-13 |
| JP4395941B2 (ja) | 2010-01-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 20000929 |
|
| PG1501 | Laying open of application | ||
| PC1203 | Withdrawal of no request for examination | ||
| WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid |