KR20010024685A - 다이아몬드납땜법 및 질화티타늄을 이용하는 폴리싱패드의조정방법 및 장치 - Google Patents

다이아몬드납땜법 및 질화티타늄을 이용하는 폴리싱패드의조정방법 및 장치 Download PDF

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Publication number
KR20010024685A
KR20010024685A KR1020007006095A KR20007006095A KR20010024685A KR 20010024685 A KR20010024685 A KR 20010024685A KR 1020007006095 A KR1020007006095 A KR 1020007006095A KR 20007006095 A KR20007006095 A KR 20007006095A KR 20010024685 A KR20010024685 A KR 20010024685A
Authority
KR
South Korea
Prior art keywords
cutting element
conditioning
polishing pad
ring
composition
Prior art date
Application number
KR1020007006095A
Other languages
English (en)
Korean (ko)
Inventor
폴 홀자프펠
Original Assignee
카리 홀란드
스피드팜-아이피이씨 코포레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 카리 홀란드, 스피드팜-아이피이씨 코포레이션 filed Critical 카리 홀란드
Publication of KR20010024685A publication Critical patent/KR20010024685A/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S228/00—Metal fusion bonding
    • Y10S228/903—Metal to nonmetal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4981—Utilizing transitory attached element or associated separate material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining
    • Y10T29/49888—Subsequently coating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4998—Combined manufacture including applying or shaping of fluent material
    • Y10T29/49982—Coating

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
KR1020007006095A 1997-12-03 1998-11-20 다이아몬드납땜법 및 질화티타늄을 이용하는 폴리싱패드의조정방법 및 장치 KR20010024685A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US08/984,243 US6371838B1 (en) 1996-07-15 1997-12-03 Polishing pad conditioning device with cutting elements
US08/984,243 1997-12-03
PCT/US1998/024960 WO1999028084A1 (fr) 1997-12-03 1998-11-20 Procede et dispositif de conditionnement de tampons a polir utilisant la technologie du brasage au diamant associee a du nitrure de titane

Publications (1)

Publication Number Publication Date
KR20010024685A true KR20010024685A (ko) 2001-03-26

Family

ID=25530409

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020007006095A KR20010024685A (ko) 1997-12-03 1998-11-20 다이아몬드납땜법 및 질화티타늄을 이용하는 폴리싱패드의조정방법 및 장치

Country Status (6)

Country Link
US (4) US6371838B1 (fr)
EP (1) EP1035946A1 (fr)
JP (3) JP2001524396A (fr)
KR (1) KR20010024685A (fr)
TW (1) TW411293B (fr)
WO (1) WO1999028084A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100430581B1 (ko) * 2001-12-11 2004-05-10 동부전자 주식회사 Ｃｍｐ 장치의 상부링
KR100468111B1 (ko) * 2002-07-09 2005-01-26 삼성전자주식회사 연마 패드 컨디셔너 및 이를 갖는 화학적 기계적 연마 장치

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US9199357B2 (en) 1997-04-04 2015-12-01 Chien-Min Sung Brazed diamond tools and methods for making the same
US9463552B2 (en) 1997-04-04 2016-10-11 Chien-Min Sung Superbrasvie tools containing uniformly leveled superabrasive particles and associated methods
US9868100B2 (en) 1997-04-04 2018-01-16 Chien-Min Sung Brazed diamond tools and methods for making the same
US9221154B2 (en) 1997-04-04 2015-12-29 Chien-Min Sung Diamond tools and methods for making the same
US9238207B2 (en) 1997-04-04 2016-01-19 Chien-Min Sung Brazed diamond tools and methods for making the same
US9409280B2 (en) 1997-04-04 2016-08-09 Chien-Min Sung Brazed diamond tools and methods for making the same
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US6290584B1 (en) * 1999-08-13 2001-09-18 Speedfam-Ipec Corporation Workpiece carrier with segmented and floating retaining elements
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US7658666B2 (en) * 2004-08-24 2010-02-09 Chien-Min Sung Superhard cutters and associated methods
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US9138862B2 (en) 2011-05-23 2015-09-22 Chien-Min Sung CMP pad dresser having leveled tips and associated methods
US8622787B2 (en) * 2006-11-16 2014-01-07 Chien-Min Sung CMP pad dressers with hybridized abrasive surface and related methods
US8678878B2 (en) 2009-09-29 2014-03-25 Chien-Min Sung System for evaluating and/or improving performance of a CMP pad dresser
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US8393934B2 (en) 2006-11-16 2013-03-12 Chien-Min Sung CMP pad dressers with hybridized abrasive surface and related methods
US9724802B2 (en) 2005-05-16 2017-08-08 Chien-Min Sung CMP pad dressers having leveled tips and associated methods
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Publication number Priority date Publication date Assignee Title
KR100430581B1 (ko) * 2001-12-11 2004-05-10 동부전자 주식회사 Ｃｍｐ 장치의 상부링
KR100468111B1 (ko) * 2002-07-09 2005-01-26 삼성전자주식회사 연마 패드 컨디셔너 및 이를 갖는 화학적 기계적 연마 장치

Also Published As

Publication number Publication date
US6371838B1 (en) 2002-04-16
US6347981B1 (en) 2002-02-19
JP2001524396A (ja) 2001-12-04
TW411293B (en) 2000-11-11
JP2009072908A (ja) 2009-04-09
US6347982B1 (en) 2002-02-19
JP2004001212A (ja) 2004-01-08
WO1999028084A1 (fr) 1999-06-10
US6350184B1 (en) 2002-02-26
EP1035946A1 (fr) 2000-09-20

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