KR20010014440A - 전기도금조 내의 첨가제 농도 측정방법 - Google Patents

전기도금조 내의 첨가제 농도 측정방법 Download PDF

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Publication number
KR20010014440A
KR20010014440A KR1019997012635A KR19997012635A KR20010014440A KR 20010014440 A KR20010014440 A KR 20010014440A KR 1019997012635 A KR1019997012635 A KR 1019997012635A KR 19997012635 A KR19997012635 A KR 19997012635A KR 20010014440 A KR20010014440 A KR 20010014440A
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KR
South Korea
Prior art keywords
electrolytic
measurement
technique
electroplating
amount
Prior art date
Application number
KR1019997012635A
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English (en)
Korean (ko)
Inventor
토마스 씨. 테일러
토마스 엘. 리츠도르프
프레드릭 에이. 린드버그
브래들리 씨. 카펜터
Original Assignee
세미툴 인코포레이티드
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Application filed by 세미툴 인코포레이티드 filed Critical 세미툴 인코포레이티드
Publication of KR20010014440A publication Critical patent/KR20010014440A/ko

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/26Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
    • G01N27/416Systems
    • G01N27/4161Systems measuring the voltage and using a constant current supply, e.g. chronopotentiometry
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/26Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
KR1019997012635A 1998-05-01 1999-05-03 전기도금조 내의 첨가제 농도 측정방법 KR20010014440A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US8388298P 1998-05-01 1998-05-01
US60/083,882 1998-05-01

Publications (1)

Publication Number Publication Date
KR20010014440A true KR20010014440A (ko) 2001-02-26

Family

ID=22181267

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019997012635A KR20010014440A (ko) 1998-05-01 1999-05-03 전기도금조 내의 첨가제 농도 측정방법

Country Status (5)

Country Link
EP (1) EP0993606A1 (zh)
JP (1) JP2002506531A (zh)
KR (1) KR20010014440A (zh)
CN (1) CN1213295C (zh)
WO (1) WO1999057549A1 (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101691949B1 (ko) 2016-10-28 2017-01-02 서울대학교 산학협력단 도금액 내 요오드화물 농도 측정방법
KR20170018188A (ko) * 2015-08-06 2017-02-16 서울대학교산학협력단 도금용액에 포함된 가속제 농도의 측정방법
KR101725456B1 (ko) 2016-10-28 2017-04-10 서울대학교 산학협력단 도금액 내 감속제의 평균 분자량 측정방법

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6899805B2 (en) 1998-05-01 2005-05-31 Semitool, Inc. Automated chemical management system executing improved electrolyte analysis method
US6280602B1 (en) * 1999-10-20 2001-08-28 Advanced Technology Materials, Inc. Method and apparatus for determination of additives in metal plating baths
EP1203950B1 (en) 2000-11-02 2005-09-07 Shipley Company LLC Plating bath analysis
JP2004323971A (ja) 2003-04-25 2004-11-18 Rohm & Haas Electronic Materials Llc 改良された浴分析
CN101470097B (zh) * 2007-12-25 2013-05-29 比亚迪股份有限公司 一种电镀液中有机添加剂浓度的测定方法
ATE546730T1 (de) * 2008-11-26 2012-03-15 Atotech Deutschland Gmbh Verfahren zur kontrolle von stabilisatoradditiven in elektrolyten zur chemischen metall- und metalllegierungsabscheidung
JP6011874B2 (ja) * 2013-07-01 2016-10-19 住友金属鉱山株式会社 めっき液に含まれる抑制剤の評価方法
KR20170070809A (ko) * 2015-12-14 2017-06-22 가부시키가이샤 호리바 세이사꾸쇼 측정장치
CN108760821B (zh) * 2018-06-04 2020-09-25 电子科技大学 一种电镀添加剂的定性和定量分析方法
CN109444245B (zh) * 2018-12-24 2021-04-27 广州广电计量检测股份有限公司 一种循环伏安分析仪的校准系统及其校准方法
TWI704346B (zh) * 2019-08-02 2020-09-11 財團法人工業技術研究院 智慧濃度測量系統、方法及智慧濃度分析模組
CN114705747A (zh) * 2022-03-31 2022-07-05 生益电子股份有限公司 一种基于伏安循环法监控深镀能力的方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4090926A (en) * 1974-09-11 1978-05-23 Environmental Sciences, Inc. Testing product
DE2521282C2 (de) * 1975-05-13 1977-03-03 Siemens Ag Prozessteueranlage zum selbsttaetigen analysieren und auffrischen von galvanischen baedern
CA1064852A (en) * 1975-12-31 1979-10-23 Cominco Ltd. Method for evaluating a system for electrodeposition of metals
US4132605A (en) * 1976-12-27 1979-01-02 Rockwell International Corporation Method for evaluating the quality of electroplating baths
US4917774A (en) * 1986-04-24 1990-04-17 Shipley Company Inc. Method for analyzing additive concentration
US4948473A (en) * 1987-10-13 1990-08-14 The Clorox Company Surfactant sensing electrode for potentiometric titrations
US5223118A (en) * 1991-03-08 1993-06-29 Shipley Company Inc. Method for analyzing organic additives in an electroplating bath
US5192403A (en) * 1991-05-16 1993-03-09 International Business Machines Corporation Cyclic voltammetric method for the measurement of concentrations of subcomponents of plating solution additive mixtures
US5196096A (en) * 1992-03-24 1993-03-23 International Business Machines Corporation Method for analyzing the addition agents in solutions for electroplating of PbSn alloys
US5389215A (en) * 1992-11-05 1995-02-14 Nippon Telegraph And Telephone Corporation Electrochemical detection method and apparatus therefor
US5364510A (en) * 1993-02-12 1994-11-15 Sematech, Inc. Scheme for bath chemistry measurement and control for improved semiconductor wet processing
US5391271A (en) * 1993-09-27 1995-02-21 Hughes Aircraft Company Method of monitoring acid concentration in plating baths

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170018188A (ko) * 2015-08-06 2017-02-16 서울대학교산학협력단 도금용액에 포함된 가속제 농도의 측정방법
KR101691949B1 (ko) 2016-10-28 2017-01-02 서울대학교 산학협력단 도금액 내 요오드화물 농도 측정방법
KR101725456B1 (ko) 2016-10-28 2017-04-10 서울대학교 산학협력단 도금액 내 감속제의 평균 분자량 측정방법

Also Published As

Publication number Publication date
EP0993606A1 (en) 2000-04-19
WO1999057549A1 (en) 1999-11-11
CN1213295C (zh) 2005-08-03
CN1266487A (zh) 2000-09-13
JP2002506531A (ja) 2002-02-26

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