KR20000048749A - 파워 mos 소자 - Google Patents
파워 mos 소자 Download PDFInfo
- Publication number
- KR20000048749A KR20000048749A KR1019990702734A KR19997002734A KR20000048749A KR 20000048749 A KR20000048749 A KR 20000048749A KR 1019990702734 A KR1019990702734 A KR 1019990702734A KR 19997002734 A KR19997002734 A KR 19997002734A KR 20000048749 A KR20000048749 A KR 20000048749A
- Authority
- KR
- South Korea
- Prior art keywords
- column
- power mos
- gate
- mos device
- doped
- Prior art date
Links
- 238000000034 method Methods 0.000 claims abstract description 14
- 239000000758 substrate Substances 0.000 claims abstract description 12
- 239000004065 semiconductor Substances 0.000 claims abstract description 11
- 238000004519 manufacturing process Methods 0.000 claims abstract description 6
- 239000002800 charge carrier Substances 0.000 claims abstract description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 17
- 229910052710 silicon Inorganic materials 0.000 claims description 17
- 239000010703 silicon Substances 0.000 claims description 17
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 13
- 229920005591 polysilicon Polymers 0.000 claims description 13
- 150000004767 nitrides Chemical class 0.000 claims description 10
- 238000005530 etching Methods 0.000 claims description 7
- 238000002513 implantation Methods 0.000 claims description 2
- 230000001590 oxidative effect Effects 0.000 claims 2
- 238000010030 laminating Methods 0.000 claims 1
- 239000002019 doping agent Substances 0.000 abstract description 8
- 238000009413 insulation Methods 0.000 abstract description 4
- 230000015556 catabolic process Effects 0.000 abstract description 3
- 238000001020 plasma etching Methods 0.000 description 6
- 238000005229 chemical vapour deposition Methods 0.000 description 5
- 238000009826 distribution Methods 0.000 description 5
- 230000000903 blocking effect Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
- 229910052785 arsenic Inorganic materials 0.000 description 2
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000005669 field effect Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 239000005380 borophosphosilicate glass Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000005368 silicate glass Substances 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
- H01L29/7813—Vertical DMOS transistors, i.e. VDMOS transistors with trench gate electrode, e.g. UMOS transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19640308A DE19640308A1 (de) | 1996-09-30 | 1996-09-30 | Leistungs-MOS-Bauelement |
DE19640308.1 | 1996-09-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20000048749A true KR20000048749A (ko) | 2000-07-25 |
Family
ID=7807451
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019990702734A KR20000048749A (ko) | 1996-09-30 | 1997-09-01 | 파워 mos 소자 |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP0931354A1 (de) |
JP (1) | JP2001501372A (de) |
KR (1) | KR20000048749A (de) |
DE (1) | DE19640308A1 (de) |
WO (1) | WO1998015011A1 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101480077B1 (ko) * | 2013-06-26 | 2015-01-09 | 경북대학교 산학협력단 | 반도체 소자 및 그의 제조방법 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3744513B2 (ja) * | 2003-05-30 | 2006-02-15 | トヨタ自動車株式会社 | ダイオード |
GB0324313D0 (en) * | 2003-10-17 | 2003-11-19 | Koninkl Philips Electronics Nv | Trench insulated gate field effect transistor |
JP2007043123A (ja) * | 2005-07-01 | 2007-02-15 | Toshiba Corp | 半導体装置 |
JP2008066708A (ja) * | 2006-08-09 | 2008-03-21 | Toshiba Corp | 半導体装置 |
GB2572442A (en) * | 2018-03-29 | 2019-10-02 | Cambridge Entpr Ltd | Power semiconductor device with a double gate structure |
JP2020126932A (ja) * | 2019-02-05 | 2020-08-20 | トヨタ自動車株式会社 | トレンチゲート型半導体装置 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4903189A (en) * | 1988-04-27 | 1990-02-20 | General Electric Company | Low noise, high frequency synchronous rectifier |
JP3219307B2 (ja) * | 1991-08-28 | 2001-10-15 | シャープ株式会社 | 半導体装置の構造および製造方法 |
US5430315A (en) * | 1993-07-22 | 1995-07-04 | Rumennik; Vladimir | Bi-directional power trench MOS field effect transistor having low on-state resistance and low leakage current |
US5323040A (en) * | 1993-09-27 | 1994-06-21 | North Carolina State University At Raleigh | Silicon carbide field effect device |
-
1996
- 1996-09-30 DE DE19640308A patent/DE19640308A1/de not_active Withdrawn
-
1997
- 1997-09-01 WO PCT/DE1997/001910 patent/WO1998015011A1/de not_active Application Discontinuation
- 1997-09-01 JP JP10516099A patent/JP2001501372A/ja active Pending
- 1997-09-01 EP EP97941862A patent/EP0931354A1/de not_active Ceased
- 1997-09-01 KR KR1019990702734A patent/KR20000048749A/ko not_active Application Discontinuation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101480077B1 (ko) * | 2013-06-26 | 2015-01-09 | 경북대학교 산학협력단 | 반도체 소자 및 그의 제조방법 |
Also Published As
Publication number | Publication date |
---|---|
JP2001501372A (ja) | 2001-01-30 |
WO1998015011A1 (de) | 1998-04-09 |
DE19640308A1 (de) | 1998-04-02 |
EP0931354A1 (de) | 1999-07-28 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E601 | Decision to refuse application | ||
E601 | Decision to refuse application |