KR19990051845A - Manufacturing method of semiconductor package - Google Patents

Abstract

The present invention relates to a method of manufacturing a semiconductor package that can solve the deflection problem of the die pad. The method of the present invention is such that one die of an inner lead located on both sides of the die pad is fixed and an inner portion of the other surface is exposed to the outside while one surface of the die pad is fixed and the other surface is exposed to the outside. Molding a pad and the lead frame; Attaching an integrated circuit chip on the exposed surface of the die pad; Connecting the exposed portion of the integrated circuit chip and the inner lead as a bonding wire; Encapsulating the bonding wire and the integrated circuit chip.

Description

Manufacturing method of semiconductor package

The present invention relates to a semiconductor package for mounting an integrated chip in an electronic device, and more particularly, to a method of manufacturing a thin small outlead package (TSOP) package.

Semiconductor packages are being developed in a variety of new forms to meet the demands of electronic devices such as light weight, high speed, and high functionality. In addition, the proper use of semiconductor packages has become important in response to the use of electronic devices. In memory semiconductor products, the miniaturization and thinning of packages is an important subject, and as a memory, there is a strong demand for high-density packaging of large-capacity semiconductor chips. In view of this, a TSOP package with a thickness of 1.0 mm has been developed. Such a TSOP package is of a first type TSOP 1a in which the lead 2a protrudes in the long axis as shown in FIG. 1A and a second type in which the lead 2b protrudes in the short axis as shown in FIG. 1B. It is divided into TSOP 2b. Among such TSOP packages, the second type TSOP (2b) package has a problem in that the die pad is tilted due to an imbalance between the top and the bottom during the flow of the mold for molding it.

Accordingly, in order to solve the above problem, an object of the present invention is to provide a method of manufacturing a semiconductor package that can solve the deflection problem of the die pad.

1a and b are plan views showing a typical TSOP package.

2 is a cross-sectional view showing a die mold for a semiconductor package according to a preferred embodiment of the present invention.

3A to 3C are cross-sectional views for sequentially explaining a method of manufacturing a semiconductor package according to a preferred embodiment of the present invention using the die mold according to FIG.

* Explanation of symbols for the main parts of the drawings

10: die mold 12: die pad

13: Inner lead 14: Mold body

15: integrated circuit chip 16: bonding wire

17: sealing

In order to achieve the above object of the present invention, the present invention

The die pad and the lead frame such that one surface of the inner lead located on both sides of the die pad is fixed and an inner portion of the other surface is exposed to the outside while one surface of the die pad is fixed and the other surface is exposed to the outside Molding a step;

Attaching an integrated circuit chip on the exposed surface of the die pad;

Connecting the exposed portion of the integrated circuit chip and the inner lead as a bonding wire;

It provides a method for manufacturing a semiconductor package comprising the step of encapsulating the bonding wire and the integrated circuit chip.

According to the present invention, it is possible to fundamentally prevent the deflection problem of the die pad by performing the wire bonding and encapsulation process while the die pad is fixed by molding.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. 2 is a cross-sectional view showing a die mold for a semiconductor package according to a preferred embodiment of the present invention, Figures 3a to 3c is a method of manufacturing a semiconductor package according to a preferred embodiment of the present invention using the die mold according to FIG. It is sectional drawing for demonstrating sequentially. 2 and 3A to 3C, the same reference numerals are used for the same members.

2, a die mold 10 according to a preferred embodiment of the present invention is shown in cross section. The die mold 10 includes a mold body 14 having a groove 14a formed at its center portion, and a die having one surface fixed to the bottom of the groove 14a by a molding and the other surface exposed to the outside. Pad 12. On both sides of the die pad 12, one surface of the inner lead 13 of the lead frame is fixed to the edge surface of the mold body 14 by molding. On the other hand, as for the other surface of the inner lead 13, the inner part near the die pad 12 is exposed to the outside.

Now, a method of manufacturing a semiconductor package using the mold die shown in FIG. 2 will be described.

First, as shown in FIG. 3A, dotting the adhesive 18 onto the exposed surface of the die pad 12 and attaching the integrated circuit chip 15.

Then, as shown in FIG. 3B, the bonding wire 16 is connected between the integrated circuit chip 15 and the exposed surface portion of the inner lead 13. At this time, since the integrated circuit chip 15 and the inner lead 13 are in a fixed state, there is no need to use the clamps conventionally used for fixing them.

Then, as shown in FIG. 3C, the bonding wire 16 and the integrated circuit chip 15 are encapsulated with an encapsulant 17 such as an epoxy resin or a molding compound.

After such an encapsulation process, a trimming and forming process as conventionally performed for manufacturing a semiconductor package may be performed, although not shown.

As described above, according to the present invention, the problem of deflection of the die pad can be solved by performing the process of attaching, wire bonding and encapsulating the integrated circuit chip while the die pad is fixed by molding. In addition, in the prior art, at the time of wire bonding, machine conversion was performed for each device. However, the present invention can shorten the process time since the machine conversion only needs to be performed when the outer dimensions of the package are changed. In addition, the present invention can reduce damage to integrated circuit chips or wires that have occurred in the handling of lead frames.

Although the present invention has been described and illustrated with reference to preferred embodiments thereof, it will be apparent to those skilled in the art that various changes and modifications can be made to the above embodiments without departing from the gist of the present invention.

Claims (1)

The die pad and the lead frame such that one surface of the inner lead located on both sides of the die pad is fixed and an inner portion of the other surface is exposed to the outside while one surface of the die pad is fixed and the other surface is exposed to the outside Molding a step; Attaching an integrated circuit chip on the exposed surface of the die pad; Connecting the exposed portion of the integrated circuit chip and the inner lead as a bonding wire; And sealing the bonding wire and the integrated circuit chip.