KR19990037924U - 튜너 기판 분할구조 - Google Patents
튜너 기판 분할구조 Download PDFInfo
- Publication number
- KR19990037924U KR19990037924U KR2019980003810U KR19980003810U KR19990037924U KR 19990037924 U KR19990037924 U KR 19990037924U KR 2019980003810 U KR2019980003810 U KR 2019980003810U KR 19980003810 U KR19980003810 U KR 19980003810U KR 19990037924 U KR19990037924 U KR 19990037924U
- Authority
- KR
- South Korea
- Prior art keywords
- substrate
- tuner
- substrate structure
- cutting
- productivity
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 57
- 238000000638 solvent extraction Methods 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 5
- 238000005476 soldering Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
Landscapes
- Structure Of Receivers (AREA)
Abstract
Description
Claims (1)
- 튜너 조립에 따른 튜너 기판의 분할구조에 있어서,기판의 성형시 기판과 기판 사이를 한개 이상의 연결편으로 연결하되 연결편의 기판 연결부분을 뾰족하고 얇게하여 접촉면을 최소하도록 구성한 것을 특징으로 하는 튜너 기판 분할구조.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019980003810U KR19990037924U (ko) | 1998-03-16 | 1998-03-16 | 튜너 기판 분할구조 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019980003810U KR19990037924U (ko) | 1998-03-16 | 1998-03-16 | 튜너 기판 분할구조 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR19990037924U true KR19990037924U (ko) | 1999-10-15 |
Family
ID=69713831
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR2019980003810U KR19990037924U (ko) | 1998-03-16 | 1998-03-16 | 튜너 기판 분할구조 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR19990037924U (ko) |
-
1998
- 1998-03-16 KR KR2019980003810U patent/KR19990037924U/ko not_active Application Discontinuation
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6239380B1 (en) | Singulation methods and substrates for use with same | |
KR20080003802A (ko) | 반도체 장치 및 반도체 장치의 제조 방법 | |
KR100491502B1 (ko) | 리드부품및쉴드케이스의프린트기판에의부착방법및칩부품,리드부품및쉴드케이스의프린트기판에의부착방법 | |
JP4023971B2 (ja) | チップ型半導体装置 | |
KR100236254B1 (ko) | 다단 결합 반도체 캐리어, 그 캐리어를 사용하는 반도체 장치, 및 그 장치의 제조 방법 | |
KR19990037924U (ko) | 튜너 기판 분할구조 | |
US5118556A (en) | Film material for film carrier manufacture and a method for manufacturing film carrier | |
KR19990051014A (ko) | 튜너 기판 분할구조 | |
US20050051905A1 (en) | Semiconductor component having a plastic housing and methods for its production | |
KR19990051013A (ko) | 튜너 기판 분할구조 | |
JP2010004011A (ja) | 半導体装置及び半導体装置の製造方法 | |
KR19990039868A (ko) | 튜너 기판 분할방법 | |
JP2666778B2 (ja) | 電子装置用基板編集体およびその分割方法 | |
JPH0730240A (ja) | プリント配線板及びその製造方法 | |
JPS589360A (ja) | 混成集積回路の製造方法 | |
KR19990051030A (ko) | 튜너 기판 분할방법 | |
JP2902762B2 (ja) | 半導体装置 | |
KR850000166B1 (ko) | 프린트 배선판의 제조방법 | |
JPH0983106A (ja) | プリント配線板の製造方法 | |
JP3967011B2 (ja) | ハイブリット集積回路装置の製造方法 | |
KR100266781B1 (ko) | 회로기판 조립방법 | |
JPH04103154A (ja) | 半導体装置及びその製造方法及びその実装方法 | |
JP2911286B2 (ja) | 回路基板の製造方法 | |
KR100340430B1 (ko) | 볼그리드 어레이기판의 가공방법 | |
KR100214570B1 (ko) | 반도체 패키지의 제조방법 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
UA0108 | Application for utility model registration |
Comment text: Application for Utility Model Registration Patent event code: UA01011R08D Patent event date: 19980316 |
|
UA0201 | Request for examination |
Patent event date: 19980316 Patent event code: UA02012R01D Comment text: Request for Examination of Application |
|
UG1501 | Laying open of application | ||
E902 | Notification of reason for refusal | ||
UE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event code: UE09021S01D Patent event date: 20000630 |
|
E601 | Decision to refuse application | ||
UE0601 | Decision on rejection of utility model registration |
Comment text: Decision to Refuse Application Patent event code: UE06011S01D Patent event date: 20001005 |