KR19980060526A - Metal wiring formation method of semiconductor device - Google Patents
Metal wiring formation method of semiconductor device Download PDFInfo
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- KR19980060526A KR19980060526A KR1019960079888A KR19960079888A KR19980060526A KR 19980060526 A KR19980060526 A KR 19980060526A KR 1019960079888 A KR1019960079888 A KR 1019960079888A KR 19960079888 A KR19960079888 A KR 19960079888A KR 19980060526 A KR19980060526 A KR 19980060526A
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- wnx
- metal wiring
- tungsten
- forming
- contact hole
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- 238000000034 method Methods 0.000 title claims abstract description 29
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 18
- 239000002184 metal Substances 0.000 title claims abstract description 18
- 239000004065 semiconductor Substances 0.000 title abstract description 7
- 230000015572 biosynthetic process Effects 0.000 title description 2
- 229910052721 tungsten Inorganic materials 0.000 claims abstract description 30
- 238000000151 deposition Methods 0.000 claims abstract description 28
- 239000010937 tungsten Substances 0.000 claims abstract description 28
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims abstract description 24
- 239000000758 substrate Substances 0.000 claims abstract description 14
- 238000010438 heat treatment Methods 0.000 claims abstract description 12
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 12
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 11
- 239000010703 silicon Substances 0.000 claims abstract description 11
- 238000005229 chemical vapour deposition Methods 0.000 claims abstract description 10
- -1 tungsten nitride Chemical class 0.000 claims abstract description 4
- 230000008021 deposition Effects 0.000 claims description 14
- 238000004519 manufacturing process Methods 0.000 claims description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 2
- 238000005530 etching Methods 0.000 claims description 2
- 239000001257 hydrogen Substances 0.000 claims description 2
- 229910052739 hydrogen Inorganic materials 0.000 claims description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims 2
- 229910052757 nitrogen Inorganic materials 0.000 claims 1
- 239000010410 layer Substances 0.000 description 8
- 239000010936 titanium Substances 0.000 description 6
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 5
- 239000012790 adhesive layer Substances 0.000 description 4
- 229910052719 titanium Inorganic materials 0.000 description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 229910008484 TiSi Inorganic materials 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 230000003405 preventing effect Effects 0.000 description 2
- 229910021332 silicide Inorganic materials 0.000 description 2
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 2
- 229910010421 TiNx Inorganic materials 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- IVHJCRXBQPGLOV-UHFFFAOYSA-N azanylidynetungsten Chemical compound [W]#N IVHJCRXBQPGLOV-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76841—Barrier, adhesion or liner layers
- H01L21/76843—Barrier, adhesion or liner layers formed in openings in a dielectric
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
- H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
- H01L21/28512—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table
- H01L21/28556—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table by chemical means, e.g. CVD, LPCVD, PECVD, laser CVD
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76877—Filling of holes, grooves or trenches, e.g. vias, with conductive material
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
본 발명은 반도체소자의 금속 배선 형성 방법에 관한 것으로, 실리콘 기판 상부에 절연막을 형성하고, 상기 절연막의 일정 부분을 식각하여 콘택홀을 형성한 다음, 상기 실리콘 기판에 콘택되는 금속 배선을 증착하는 방법에 있어서, 상기와 같이 콘택홀을 형성한 다음, 화학기상증착법으로 50 내지 1000Å 두께의 WNx를 증착하는 단계와, 상기 WNx 상부면에 텅스텐막을 증착하는 단계와, 열처리공정으로 상기 콘택홀의 저부면에 WSi2과 텅스텐 나이트라이드막을 형성하는 단계로 이루어진다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of forming metal wirings in a semiconductor device, wherein an insulating film is formed on a silicon substrate, a portion of the insulating film is etched to form a contact hole, and then a metal wiring contacted to the silicon substrate is deposited. Forming a contact hole as described above, depositing a WNx having a thickness of 50 to 1000 mm by chemical vapor deposition, depositing a tungsten film on the upper surface of the WNx, and performing a heat treatment on the bottom surface of the contact hole. And forming a tungsten nitride film with WSi 2 .
Description
본 발명은 반도체소자의 금속 배선 형성 방법에 관한 것으로, 특히 화학기상증착법을 이용하여 텅스텐 증착 챔버에서 WNx와 텅스텐막을 한 번에 증착하고, 열처리를 실시하여 WSi2를 형성하는 금속 배선 형성 방법에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for forming metal wirings in a semiconductor device, and more particularly, to a method for forming metal wirings by depositing WNx and a tungsten film at a time in a tungsten deposition chamber using chemical vapor deposition and then performing heat treatment to form WSi 2 . will be.
반도체 소자에서 금속 배선은 알루미늄이나 텅스텐을 사용하고 있으며, 이중 텅스텐 증착은 화학기상 증착법을 이용하기 때문에 콘택에서의 층덮힘 및 콘택 매립에 있어서 매우 유용하다.In the semiconductor device, the metal wiring is made of aluminum or tungsten, and since the double tungsten deposition uses chemical vapor deposition, it is very useful for layer covering and contact filling in contacts.
반도체 소자의 메탈-1 공정은 접착층으로 티타늄(Ti)과 티타늄 나이트라이드(TiN)를 스퍼터링으로 증착하고 급속 열처리를 실시한 후에 WF6를 SiH4또는 수소로 환원시키는 화학기상증착법을 사용하여 텅스텐을 배선 금속으로 증착하게 된다. 이 경우에는 급속 열처리 과정 중에 TiSi2가 형성되는데 이러한 실리사이드는 P+콘택 저항을 낮추는 효과를 가져오지만 소자의 집적도가 커져 접합깊이(junction depth)가 감소하면서 누설전류를 크게 하는 요인으로 작용하고 있다. 또한 층덮힘이 문제가 되는 스퍼터링법으로 접착층을 증착하기 때문에 고집적 소자로 갈수록 콘택 바닥에서 WF6침투에 의한 접합층 파괴가 문제가 될 수 있으며, ‘티타늄, 티타늄 나이트라이드(TiN) 증착→급속열처리→텅스텐 증착’의 3단계로서 메탈-1 증착이 이루어지게 된다.The metal-1 process of the semiconductor device is sputtered by depositing titanium (Ti) and titanium nitride (TiN) as an adhesive layer, followed by rapid heat treatment, and then tungsten is wired using a chemical vapor deposition method in which WF 6 is reduced to SiH 4 or hydrogen. It is deposited with metal. In this case, TiSi 2 is formed during the rapid heat treatment process. The silicide lowers the P + contact resistance, but increases the integration density of the device, thereby reducing the junction depth and acting as a factor for increasing the leakage current. In addition, since the adhesion layer is deposited by the sputtering method, which is a problem of layer covering, the bonding layer destruction due to WF 6 penetration from the contact bottom may become a problem as the high density device is developed.Titanium, titanium nitride (TiN) deposition → rapid heat treatment → tungsten deposition 'three steps of metal-1 deposition is carried out.
본 발명은 상기한 문제를 극복하기 위하여 접착층으로 티타늄, 티타늄 나이트라이드를 증착하는 대신에 바로 텅스텐 증착 챔버에서 WNx(0.3X0.9)와 텅스텐을 한 번에 증착하고 이후 급속 열처리를 실시하여 메탈-1 공정을 완료하는 금속 배선 형성 방법을 제공하는데 그 목적이 있다.In order to overcome the above-mentioned problems, the present invention instead of depositing titanium and titanium nitride as an adhesive layer, deposits WNx (0.3X0.9) and tungsten at once in a tungsten deposition chamber and then rapidly heat-treats the metal- It is an object of the present invention to provide a method for forming a metal wiring that completes one step.
도 1 내지 도 3은 본 발명의 실시예에 의해 금속 배선을 형성하는 단계를 도시한 것이다.1 to 3 illustrate a step of forming a metal wiring according to an embodiment of the present invention.
*도면의 주요 부분에 대한 부호의 설명** Description of the symbols for the main parts of the drawings *
1:실리콘 기판2:절연막1: Silicon Substrate 2: Insulation Film
3:WNx4:텅스텐막3: WNx4: Tungsten film
5:WSi26:텅스텐 나이트라이드막5: WSi 2 6: tungsten nitride film
10:콘택홀10: contact hole
상기한 목적을 달성하기 위한 본 발명은 실리콘 기판 상부에 절연막을 형성하고, 상기 절연막의 일정 부분을 식각하여 콘택홀을 형성한 다음, 상기 실리콘 기판에 콘택되는 금속 배선을 증착하는 방법에 있어서, 상기와 같이 콘택홀을 형성한 다음, 화학기상증착법으로 50 내지 1000Å 두께의 WNx를 증착하는 단계와, 상기 WNx 상부면에 텅스텐막을 증착하는 단계와, 열처리 공정으로 상기 콘택홀의 저부면에 WSi2과 텅스텐 나이트라이드막을 형성하는 단계로 이루어진다.According to an aspect of the present invention, an insulating film is formed on a silicon substrate, a portion of the insulating film is etched to form a contact hole, and then a metal wiring contacted to the silicon substrate is deposited. Forming a contact hole as described above, depositing WNx having a thickness of 50 to 1000 mm by chemical vapor deposition, depositing a tungsten film on the upper surface of the WNx, and heat treating to WSi 2 and tungsten at the bottom of the contact hole. Forming a nitride film.
본 발명은 접착층으로 TiN/Ti를 증착하는 대신에 바로 텅스텐 증착챔버에서 WNx(0.3X0.9)와 W을 한 번에 증착하고 이후 급속 열처리를 실시하여 메탈-1 공정을 완료하는 것이다. 이러한 WNx를 텅스텐의 접착층으로 사용하게 되면 텅스텐 증착시 WF6와 실리콘과의 반응에 의한 접합층 파괴를 억제하면서 급속 열처리 동안에 WNx가 미세한 WSi2와 WN으로 분해된다.Instead of depositing TiN / Ti as an adhesive layer, the present invention immediately deposits WNx (0.3X0.9) and W in a tungsten deposition chamber and then performs a rapid heat treatment to complete the metal-1 process. When the WNx is used as an adhesive layer of tungsten, WNx is decomposed into fine WSi 2 and WN during rapid heat treatment while suppressing the breakdown of the bonding layer caused by the reaction between WF 6 and silicon during tungsten deposition.
따라서 콘택 바닥에서 형성되는 금속 실리사이드의 두께가 최대한 억제되며 균일도도 기존의 TiSi2보다 매우 우수하게 되어 콘택 저항 및 누설 전류를 감소시키는 효과를 가져오게 된다. 그리고 공정의 단순화를 동시에 꾀할 수 있다.Therefore, the thickness of the metal silicide formed at the bottom of the contact is suppressed to the maximum, and uniformity is much better than that of the existing TiSi 2 , resulting in an effect of reducing contact resistance and leakage current. And the process can be simplified at the same time.
실리콘 기판 위에 형성된 WNx(0.3X0.9)는 후속 열공정을 거치면서 WN/WSi2로 분해된다. WNx(0.3X0.9) 내에 존재하는 여유 W이 Si과 반응하여 WSi2를 형성하고 그 위에 WN(tungsten nitride)가 형성된다. 이때 형성되는 WSi2의 두께는 500Å 이하로 균일하게 형성되어 접합층의 누설전류를 증가시키지 않는다. 또한 WN는 확산 방지 특성이 우수하여 W/WN/WSi2로 변환된 콘택 구조에서 텅스텐 증착시 WF6와 Si의 반응 및 급속 열처리시 W과 접합층의 Si과의 반응을 방지시킨다. 즉 우수한 확산 장벽의 WN과 얇고 균일한 WSi2의 형성이 가능해짐으로써 콘택 저항과 누설전류를 최소화시킬 수 있는 우수한 소자 특성을 얻을 수 있다.WNx (0.3X0.9) formed on the silicon substrate is decomposed into WN / WSi 2 during the subsequent thermal process. The margin W present in WNx (0.3X0.9) reacts with Si to form WSi 2 and on it, tungsten nitride (WN) is formed. At this time, the thickness of WSi 2 formed is uniformly formed to 500 Å or less so as not to increase the leakage current of the bonding layer. In addition, WN has excellent diffusion preventing properties to prevent the reaction of WF 6 and Si during tungsten deposition and the reaction between W and Si in the bonding layer in the contact structure converted to W / WN / WSi 2 . In other words, the WN of the excellent diffusion barrier and the formation of a thin and uniform WSi 2 can be obtained, thereby obtaining excellent device characteristics that can minimize contact resistance and leakage current.
또한 W/WNx(0.3X0.9)는 W/TiN/Ti 또는 W/TiNx(0.3X0.9)에 비해 제조 공정을 단순화시킬 수 있는 장점을 가지고 이다. 즉 하나의 증착용기(deposition chamber)에서 W/WNx의 일괄 공정이 가능하여 생산성 및 원가의 절감 효과가 있다.In addition, W / WNx (0.3X0.9) has the advantage of simplifying the manufacturing process compared to W / TiN / Ti or W / TiNx (0.3X0.9). That is, a batch process of W / WNx is possible in one deposition chamber, thereby reducing productivity and cost.
본 발명에 의한 금속 배선 공정의 전체적인 공정 단계는 다음과 같다.The overall process steps of the metallization process according to the present invention are as follows.
먼저 반도체 소자 소정 부위에 하부 기판과 수직 배선을 위한 콘택홀을 형성한 후 콘택 크리닝 공정을 거친 후, 화학기상증착법에 의해 WNx(0.3X0.9)를 증착하는 제1단계; 기판 전체 상부에 화학기상증착법에 의해 텅스텐(W)막을 증착하는 제2단계(여기에서 1, 2 단계는 하나의 증착용기에서 순차적으로 진행하여 형성한다); 600~900℃에서 급속열처리를 실시하는 제3단계로 구성된다.A first step of forming a contact hole for a vertical substrate and a lower substrate in a predetermined portion of the semiconductor device and then performing a contact cleaning process, and then depositing WNx (0.3X0.9) by chemical vapor deposition; A second step of depositing a tungsten (W) film by chemical vapor deposition on the entire substrate (where steps 1 and 2 are formed by sequentially proceeding in one deposition container); It consists of a third step of performing a rapid heat treatment at 600 ~ 900 ℃.
이하 첨부된 도면을 참조하여 본 발명의 바람직한 실시예를 상세히 설명하기로 한다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.
도 1 내지 도 3은 본 발명의 실시예에 의해 금속 배선을 형성하는 단계를 도시한 것이다.1 to 3 illustrate a step of forming a metal wiring according to an embodiment of the present invention.
도 1은 실리콘 기판(1)의 상부에 절연막(2)을 형성하고, 상기 절연막(2)의 일정 부분을 식각하여 콘택홀(10)을 형성한 다음, 콘택 크리닝(cleaning) 공정을 거친 후 콘택홀(10)이 형성된 기판 상부에 화학기상증착법으로 50 내지 1000Å 두께의 WNx(0.3X0.9)(3)를 증착한다.FIG. 1 illustrates an insulating film 2 formed on an upper surface of a silicon substrate 1, etching a portion of the insulating film 2 to form a contact hole 10, and then performing a contact cleaning process. A WNx (0.3X0.9) 3 having a thickness of 50 to 1000 mm 3 is deposited on the substrate on which the holes 10 are formed by chemical vapor deposition.
도 2는 이 후 같은 증착 용기 내에서 텅스텐막(4)을 1000 내지 10000Å의 두께로 증착하여 콘택홀(10)을 충분히 매립한 것을 도시한 단면도이다.FIG. 2 is a cross-sectional view showing that the contact hole 10 is sufficiently filled by depositing a tungsten film 4 at a thickness of 1000 to 10000 kPa in the same deposition container.
도 3은 상기 텅스텐막(4)을 증착한 다음, 600 내지 900℃에서 10초 내지 10000초간 급속열처리를 실시하면 콘택홀(10)에서 실리콘 기판(1)과 텅스텐배선(4)과의 사이에 WSi2(5)과 텅스텐 나이트라이드막(6)막이 생성된다.FIG. 3 shows that the tungsten film 4 is deposited and then subjected to rapid heat treatment at 600 to 900 ° C. for 10 seconds to 10000 seconds, between the silicon substrate 1 and the tungsten wiring 4 in the contact hole 10. The WSi 2 (5) and tungsten nitride film 6 films are formed.
본 발명에 의하면 반도체 소자에서 메탈-1 공정을 한 증착 용기에서 화학기상증착에 의한 WNx과 텅스텐을 적층함으로써 콘택홀에서의 우수한 층덮힘과 확산방지 성능을 가져올 수 있으며 후속 열처리 공정으로 접합층과의 콘태 저항 및 누설전류를 안정적으로 낮게 유지함으로써 소자의 속도 및 신뢰성을 향상시키게 된다. 또한 전체적인 메탈-1 공정 단계가 감소되므로 공정시간과 비용을 절감하는 효과가 있다.According to the present invention, by stacking WNx and tungsten by chemical vapor deposition in a deposition container subjected to a metal-1 process in a semiconductor device, excellent layer covering and diffusion preventing performance in a contact hole can be brought about. By keeping the contact resistance and leakage current stable, the device's speed and reliability are improved. In addition, the overall metal-1 process step is reduced, which saves processing time and costs.
아울러 본 발명의 바람직한 실시예들은 예시의 목적을 위해 개시된 것이며, 당업자라면 본 발명의 사상과 범위안에서 다양한 수정, 변경, 부가 등이 가능할 것이며, 이러한 수정 변경 등은 이하의 특허 청구의 범위에 속하는 것으로 보아야 할 것이다.In addition, preferred embodiments of the present invention are disclosed for the purpose of illustration, those skilled in the art will be able to make various modifications, changes, additions, etc. within the spirit and scope of the present invention, such modifications and modifications belong to the following claims You will have to look.
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| KR1019960079888A KR100430687B1 (en) | 1996-12-31 | 1996-12-31 | Method of forming metal line of semiconductor device for improving anti-diffusion performance and electrical properties |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20000011910A (en) * | 1998-07-24 | 2000-02-25 | 니시무로 타이죠 | A semiconductor device and a method of making thereof |
| KR20020011479A (en) * | 2000-08-02 | 2002-02-09 | 박종섭 | The method of fabricating metal-line in semiconductor device |
| KR100546938B1 (en) * | 1999-06-28 | 2006-01-26 | 주식회사 하이닉스반도체 | Method of forming a storage node for a capacitor |
| KR100593125B1 (en) * | 2000-06-30 | 2006-06-26 | 주식회사 하이닉스반도체 | Method of forming a contact plug in a semiconductor device |
| US7521357B2 (en) | 2004-02-24 | 2009-04-21 | Samsung Electronics Co., Ltd. | Methods of forming metal wiring in semiconductor devices using etch stop layers |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100709467B1 (en) | 2005-04-11 | 2007-04-18 | 주식회사 하이닉스반도체 | Method for fabricating semiconductor device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5421974A (en) * | 1993-04-01 | 1995-06-06 | Advanced Micro Devices, Inc. | Integrated circuit having silicide-nitride based multi-layer metallization |
| JP3219909B2 (en) * | 1993-07-09 | 2001-10-15 | 株式会社東芝 | Method for manufacturing semiconductor device |
| JP2713165B2 (en) * | 1994-05-19 | 1998-02-16 | 日本電気株式会社 | Method for manufacturing semiconductor device |
| KR100355220B1 (en) * | 1995-02-07 | 2002-12-28 | 삼성전자 주식회사 | Method for contacting polycide with polycide |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20000011910A (en) * | 1998-07-24 | 2000-02-25 | 니시무로 타이죠 | A semiconductor device and a method of making thereof |
| KR100546938B1 (en) * | 1999-06-28 | 2006-01-26 | 주식회사 하이닉스반도체 | Method of forming a storage node for a capacitor |
| KR100593125B1 (en) * | 2000-06-30 | 2006-06-26 | 주식회사 하이닉스반도체 | Method of forming a contact plug in a semiconductor device |
| KR20020011479A (en) * | 2000-08-02 | 2002-02-09 | 박종섭 | The method of fabricating metal-line in semiconductor device |
| US7521357B2 (en) | 2004-02-24 | 2009-04-21 | Samsung Electronics Co., Ltd. | Methods of forming metal wiring in semiconductor devices using etch stop layers |
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| KR100430687B1 (en) | 2004-08-02 |
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