KR102948025B1 - 마스크 블랭크, 전사용 마스크, 및 반도체 디바이스의 제조 방법 - Google Patents

마스크 블랭크, 전사용 마스크, 및 반도체 디바이스의 제조 방법

Info

Publication number
KR102948025B1
KR102948025B1 KR1020227030750A KR20227030750A KR102948025B1 KR 102948025 B1 KR102948025 B1 KR 102948025B1 KR 1020227030750 A KR1020227030750 A KR 1020227030750A KR 20227030750 A KR20227030750 A KR 20227030750A KR 102948025 B1 KR102948025 B1 KR 102948025B1
Authority
KR
South Korea
Prior art keywords
light
film
mask
thin film
mask blank
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020227030750A
Other languages
English (en)
Korean (ko)
Other versions
KR20220156818A (ko
Inventor
오사무 노자와
케이시 아키야마
탁 림 혹
후이 준 탐
Original Assignee
호야 가부시키가이샤
호야 일렉트로닉스 싱가포르 프라이빗 리미티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 호야 가부시키가이샤, 호야 일렉트로닉스 싱가포르 프라이빗 리미티드 filed Critical 호야 가부시키가이샤
Publication of KR20220156818A publication Critical patent/KR20220156818A/ko
Application granted granted Critical
Publication of KR102948025B1 publication Critical patent/KR102948025B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/26Phase shift masks [PSM]; PSM blanks; Preparation thereof
    • G03F1/32Attenuating PSM [att-PSM], e.g. halftone PSM or PSM having semi-transparent phase shift portion; Preparation thereof
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/22Masks or mask blanks for imaging by radiation of 100nm or shorter wavelength, e.g. X-ray masks, extreme ultraviolet [EUV] masks; Preparation thereof
    • G03F1/24Reflection masks; Preparation thereof
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/54Absorbers, e.g. of opaque materials
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/60Substrates
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/80Etching

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
KR1020227030750A 2020-03-19 2021-03-08 마스크 블랭크, 전사용 마스크, 및 반도체 디바이스의 제조 방법 Active KR102948025B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2020-049162 2020-03-19
JP2020049162A JP7354032B2 (ja) 2020-03-19 2020-03-19 マスクブランク、転写用マスク、及び半導体デバイスの製造方法
PCT/JP2021/008915 WO2021187189A1 (ja) 2020-03-19 2021-03-08 マスクブランク、転写用マスク、及び半導体デバイスの製造方法

Publications (2)

Publication Number Publication Date
KR20220156818A KR20220156818A (ko) 2022-11-28
KR102948025B1 true KR102948025B1 (ko) 2026-04-06

Family

ID=77771232

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020227030750A Active KR102948025B1 (ko) 2020-03-19 2021-03-08 마스크 블랭크, 전사용 마스크, 및 반도체 디바이스의 제조 방법

Country Status (6)

Country Link
US (1) US20230097280A1 (https=)
JP (1) JP7354032B2 (https=)
KR (1) KR102948025B1 (https=)
CN (1) CN115280236B (https=)
TW (1) TWI899176B (https=)
WO (1) WO2021187189A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12210279B2 (en) * 2021-05-27 2025-01-28 AGC Inc. Electroconductive-film-coated substrate and reflective mask blank
JP7375065B2 (ja) * 2022-02-24 2023-11-07 Hoya株式会社 マスクブランク、転写用マスクの製造方法、及び表示装置の製造方法
KR102587396B1 (ko) * 2022-08-18 2023-10-10 에스케이엔펄스 주식회사 블랭크 마스크 및 이를 이용한 포토마스크

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006184353A (ja) 2004-12-27 2006-07-13 Hoya Corp ハーフトーン型位相シフトマスクブランク及びハーフトーン型位相シフトマスク

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6039047U (ja) * 1983-08-24 1985-03-18 凸版印刷株式会社 マスクブランク板
JP2002090977A (ja) 2000-09-12 2002-03-27 Hoya Corp 位相シフトマスクブランク、フォトマスクブランク、並びにそれらの製造装置及び製造方法
TW578034B (en) * 2001-09-28 2004-03-01 Hoya Corp Method of manufacturing a mask blank and a mask, the mask blank and the mask, and useless film removing method and apparatus
WO2004051369A1 (ja) * 2002-12-03 2004-06-17 Hoya Corporation フォトマスクブランク、及びフォトマスク
TWI259329B (en) * 2003-04-09 2006-08-01 Hoya Corp Method of manufacturing a photomask, and photomask blank
JP4339214B2 (ja) * 2004-09-13 2009-10-07 Hoya株式会社 マスクブランク用透明基板とその製造方法及びマスクブランクとその製造方法
US7632609B2 (en) * 2005-10-24 2009-12-15 Shin-Etsu Chemical Co., Ltd. Fabrication method of photomask-blank
JP5015537B2 (ja) 2006-09-26 2012-08-29 Hoya株式会社 フォトマスクの製造方法及びパターンの転写方法
JP5086714B2 (ja) * 2007-07-13 2012-11-28 Hoya株式会社 マスクブランクの製造方法及びフォトマスクの製造方法
KR101295235B1 (ko) * 2008-08-15 2013-08-12 신에쓰 가가꾸 고교 가부시끼가이샤 그레이톤 마스크 블랭크, 그레이톤 마스크, 및 제품 가공 표지 또는 제품 정보 표지의 형성방법
KR101670351B1 (ko) * 2010-11-26 2016-10-31 주식회사 에스앤에스텍 마스크 블랭크의 제조 방법 및 마스크 블랭크
WO2013146488A1 (ja) * 2012-03-28 2013-10-03 Hoya株式会社 多層反射膜付き基板の製造方法、反射型マスクブランクの製造方法、及び反射型マスクの製造方法
US9377679B2 (en) * 2012-07-31 2016-06-28 Hoya Corporation Reflective mask blank and method for manufacturing same, method for manufacturing reflective mask, and method for manufacturing semiconductor device
JP2014209200A (ja) 2013-03-22 2014-11-06 Hoya株式会社 マスクブランクの製造方法および転写用マスクの製造方法
JP5868905B2 (ja) * 2013-07-03 2016-02-24 信越化学工業株式会社 フォトマスクブランクの製造方法およびフォトマスクブランク
DE102014216121A1 (de) * 2014-08-13 2016-02-18 Carl Zeiss Smt Gmbh Maske für die EUV-Lithographie, EUV-Lithographieanlage und Verfahren zum Bestimmen eines durch DUV-Strahlung hervorgerufenen Kontrastanteils
US20160266482A1 (en) * 2015-03-10 2016-09-15 Asahi Glass Company, Limited Glass substrate for mask blank
JP6428400B2 (ja) 2015-03-13 2018-11-28 信越化学工業株式会社 マスクブランクス及びその製造方法
JP6418035B2 (ja) * 2015-03-31 2018-11-07 信越化学工業株式会社 位相シフトマスクブランクス及び位相シフトマスク
KR102368405B1 (ko) * 2015-11-06 2022-02-28 호야 가부시키가이샤 마스크 블랭크, 위상 시프트 마스크의 제조 방법 및 반도체 디바이스의 제조 방법
KR102254035B1 (ko) * 2016-08-26 2021-05-20 호야 가부시키가이샤 마스크 블랭크, 전사용 마스크 및 반도체 디바이스의 제조 방법
JP6400763B2 (ja) * 2017-03-16 2018-10-03 Hoya株式会社 マスクブランク、転写用マスクおよび半導体デバイスの製造方法
US11281088B2 (en) * 2017-04-17 2022-03-22 AGC Inc. Reflective mask blank for EUV exposure, and reflective mask
CN110770652B (zh) 2017-06-14 2023-03-21 Hoya株式会社 掩模坯料、相移掩模及半导体器件的制造方法
KR102688948B1 (ko) * 2017-09-21 2024-07-29 호야 가부시키가이샤 마스크 블랭크, 전사용 마스크, 및 반도체 디바이스의 제조 방법
JP7370943B2 (ja) * 2020-07-15 2023-10-30 Hoya株式会社 マスクブランク、転写用マスクの製造方法及び半導体デバイスの製造方法
JP7581107B2 (ja) * 2021-03-29 2024-11-12 Hoya株式会社 反射型マスクブランク、反射型マスク、反射型マスクの製造方法、及び半導体装置の製造方法
JP7346527B2 (ja) * 2021-11-25 2023-09-19 Hoya株式会社 マスクブランク、転写用マスク、マスクブランクの製造方法、転写用マスクの製造方法、及び表示装置の製造方法
KR102587396B1 (ko) * 2022-08-18 2023-10-10 에스케이엔펄스 주식회사 블랭크 마스크 및 이를 이용한 포토마스크

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006184353A (ja) 2004-12-27 2006-07-13 Hoya Corp ハーフトーン型位相シフトマスクブランク及びハーフトーン型位相シフトマスク

Also Published As

Publication number Publication date
CN115280236A (zh) 2022-11-01
US20230097280A1 (en) 2023-03-30
KR20220156818A (ko) 2022-11-28
TWI899176B (zh) 2025-10-01
JP2021148968A (ja) 2021-09-27
TW202201117A (zh) 2022-01-01
CN115280236B (zh) 2025-07-01
WO2021187189A1 (ja) 2021-09-23
JP7354032B2 (ja) 2023-10-02

Similar Documents

Publication Publication Date Title
JP6920775B2 (ja) マスクブランク、転写用マスクの製造方法、及び半導体デバイスの製造方法
US11048160B2 (en) Mask blank, phase shift mask and method for manufacturing semiconductor device
JP6720139B2 (ja) マスクブランク、位相シフトマスク、位相シフトマスクの製造方法および半導体デバイスの製造方法
JP6502143B2 (ja) マスクブランク、位相シフトマスク、位相シフトマスクの製造方法および半導体デバイスの製造方法
US11442357B2 (en) Mask blank, phase-shift mask, and method of manufacturing semiconductor device
JP6430155B2 (ja) マスクブランク、位相シフトマスク、位相シフトマスクの製造方法および半導体デバイスの製造方法
KR20190021454A (ko) 마스크 블랭크, 전사용 마스크 및 반도체 디바이스의 제조 방법
KR102948025B1 (ko) 마스크 블랭크, 전사용 마스크, 및 반도체 디바이스의 제조 방법
US12326656B2 (en) Mask blank and method of manufacturing photomask
TWI791837B (zh) 遮罩基底、相移遮罩及半導體元件之製造方法
JP7163505B2 (ja) マスクブランク、位相シフトマスク及び半導体デバイスの製造方法
KR102844825B1 (ko) 마스크 블랭크, 전사용 마스크의 제조 방법 및 반도체 디바이스의 제조 방법
US12529953B2 (en) Mask blank, phase shift mask, and method of manufacturing semiconductor device
US20230142180A1 (en) Mask blank, transfer mask, and method of manufacturing semiconductor device
US20240361683A1 (en) Mask blank and phase shift mask

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11 Administrative time limit extension requested

Free format text: ST27 STATUS EVENT CODE: U-3-3-T10-T11-OTH-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

P11 Amendment of application requested

Free format text: ST27 STATUS EVENT CODE: A-2-2-P10-P11-NAP-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

D22 Grant of ip right intended

Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D22-EXM-PE0701 (AS PROVIDED BY THE NATIONAL OFFICE)

PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

F11 Ip right granted following substantive examination

Free format text: ST27 STATUS EVENT CODE: A-2-4-F10-F11-EXM-PR0701 (AS PROVIDED BY THE NATIONAL OFFICE)

PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

U12 Designation fee paid

Free format text: ST27 STATUS EVENT CODE: A-2-2-U10-U12-OTH-PR1002 (AS PROVIDED BY THE NATIONAL OFFICE)

Year of fee payment: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

Q13 Ip right document published

Free format text: ST27 STATUS EVENT CODE: A-4-4-Q10-Q13-NAP-PG1601 (AS PROVIDED BY THE NATIONAL OFFICE)