KR102934502B1 - 반도체 제조 장치용 부재 - Google Patents

반도체 제조 장치용 부재

Info

Publication number
KR102934502B1
KR102934502B1 KR1020247008757A KR20247008757A KR102934502B1 KR 102934502 B1 KR102934502 B1 KR 102934502B1 KR 1020247008757 A KR1020247008757 A KR 1020247008757A KR 20247008757 A KR20247008757 A KR 20247008757A KR 102934502 B1 KR102934502 B1 KR 102934502B1
Authority
KR
South Korea
Prior art keywords
loading surface
wafer
focus ring
semiconductor manufacturing
wafer loading
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020247008757A
Other languages
English (en)
Korean (ko)
Other versions
KR20250029010A (ko
Inventor
다츠야 구노
세이야 이노우에
Original Assignee
엔지케이 인슐레이터 엘티디
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엔지케이 인슐레이터 엘티디 filed Critical 엔지케이 인슐레이터 엘티디
Priority to KR1020267006364A priority Critical patent/KR20260038955A/ko
Publication of KR20250029010A publication Critical patent/KR20250029010A/ko
Application granted granted Critical
Publication of KR102934502B1 publication Critical patent/KR102934502B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • H01J37/32724—Temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H01J37/32642—Focus rings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7606—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/332—Coating
    • H01J2237/3321—CVD [Chemical Vapor Deposition]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/334—Etching

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
KR1020247008757A 2023-08-21 2023-08-21 반도체 제조 장치용 부재 Active KR102934502B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020267006364A KR20260038955A (ko) 2023-08-21 2023-08-21 반도체 제조 장치용 부재

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/029982 WO2025041221A1 (ja) 2023-08-21 2023-08-21 半導体製造装置用部材

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020267006364A Division KR20260038955A (ko) 2023-08-21 2023-08-21 반도체 제조 장치용 부재

Publications (2)

Publication Number Publication Date
KR20250029010A KR20250029010A (ko) 2025-03-04
KR102934502B1 true KR102934502B1 (ko) 2026-03-06

Family

ID=94689171

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020247008757A Active KR102934502B1 (ko) 2023-08-21 2023-08-21 반도체 제조 장치용 부재
KR1020267006364A Pending KR20260038955A (ko) 2023-08-21 2023-08-21 반도체 제조 장치용 부재

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020267006364A Pending KR20260038955A (ko) 2023-08-21 2023-08-21 반도체 제조 장치용 부재

Country Status (6)

Country Link
US (2) US12463023B2 (https=)
JP (1) JP7671918B1 (https=)
KR (2) KR102934502B1 (https=)
CN (1) CN121753530A (https=)
TW (1) TW202510091A (https=)
WO (1) WO2025041221A1 (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016207979A (ja) * 2015-04-28 2016-12-08 日本特殊陶業株式会社 静電チャック

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3173693B2 (ja) * 1993-10-04 2001-06-04 東京エレクトロン株式会社 プラズマ処理装置及びその方法
US5529657A (en) 1993-10-04 1996-06-25 Tokyo Electron Limited Plasma processing apparatus
KR100292410B1 (ko) * 1998-09-23 2001-06-01 윤종용 불순물 오염이 억제된 반도체 제조용 반응 챔버
JP4119551B2 (ja) * 1998-12-01 2008-07-16 東京エレクトロン株式会社 基板保持台、及びプラズマ処理装置
US6494955B1 (en) * 2000-02-15 2002-12-17 Applied Materials, Inc. Ceramic substrate support
JP5088483B2 (ja) * 2007-12-18 2012-12-05 三菱マテリアル株式会社 ウエハを支持するためのプラズマエッチング装置用複合シリコンリング
WO2011065965A2 (en) * 2009-11-30 2011-06-03 Lam Research Corporation An electrostatic chuck with an angled sidewall
US20160289827A1 (en) * 2015-03-31 2016-10-06 Lam Research Corporation Plasma processing systems and structures having sloped confinement rings
JP2018107433A (ja) * 2016-12-27 2018-07-05 東京エレクトロン株式会社 フォーカスリング及び基板処理装置
US20180182635A1 (en) 2016-12-27 2018-06-28 Tokyo Electron Limited Focus ring and substrate processing apparatus
JP7071908B2 (ja) * 2018-03-22 2022-05-19 Ｓｐｐテクノロジーズ株式会社 フォーカスリング及びこれを備えたプラズマ処理装置
JP2024516149A (ja) * 2021-04-21 2024-04-12 ラム リサーチ コーポレーション 基板への裏面堆積防止
JP7429208B2 (ja) 2021-08-17 2024-02-07 日本碍子株式会社 ウエハ載置台
KR102904705B1 (ko) * 2021-11-09 2025-12-29 삼성전자주식회사 포커스 링, 이를 포함하는 기판 처리 장치 및 이를 이용한 기판 처리 방법

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016207979A (ja) * 2015-04-28 2016-12-08 日本特殊陶業株式会社 静電チャック

Also Published As

Publication number Publication date
US12463023B2 (en) 2025-11-04
JPWO2025041221A1 (https=) 2025-02-27
JP7671918B1 (ja) 2025-05-02
KR20250029010A (ko) 2025-03-04
US20250069865A1 (en) 2025-02-27
CN121753530A (zh) 2026-03-27
US20260018393A1 (en) 2026-01-15
WO2025041221A1 (ja) 2025-02-27
KR20260038955A (ko) 2026-03-19
TW202510091A (zh) 2025-03-01

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