JPWO2025041221A1 - - Google Patents
Info
- Publication number
- JPWO2025041221A1 JPWO2025041221A1 JP2024510644A JP2024510644A JPWO2025041221A1 JP WO2025041221 A1 JPWO2025041221 A1 JP WO2025041221A1 JP 2024510644 A JP2024510644 A JP 2024510644A JP 2024510644 A JP2024510644 A JP 2024510644A JP WO2025041221 A1 JPWO2025041221 A1 JP WO2025041221A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
- H01J37/32724—Temperature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32623—Mechanical discharge control means
- H01J37/32642—Focus rings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7606—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/332—Coating
- H01J2237/3321—CVD [Chemical Vapor Deposition]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/334—Etching
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Drying Of Semiconductors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2023/029982 WO2025041221A1 (ja) | 2023-08-21 | 2023-08-21 | 半導体製造装置用部材 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2025041221A1 true JPWO2025041221A1 (https=) | 2025-02-27 |
| JP7671918B1 JP7671918B1 (ja) | 2025-05-02 |
| JPWO2025041221A5 JPWO2025041221A5 (https=) | 2025-07-30 |
Family
ID=94689171
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024510644A Active JP7671918B1 (ja) | 2023-08-21 | 2023-08-21 | 半導体製造装置用部材 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US12463023B2 (https=) |
| JP (1) | JP7671918B1 (https=) |
| KR (2) | KR102934502B1 (https=) |
| CN (1) | CN121753530A (https=) |
| TW (1) | TW202510091A (https=) |
| WO (1) | WO2025041221A1 (https=) |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3173693B2 (ja) * | 1993-10-04 | 2001-06-04 | 東京エレクトロン株式会社 | プラズマ処理装置及びその方法 |
| US5529657A (en) | 1993-10-04 | 1996-06-25 | Tokyo Electron Limited | Plasma processing apparatus |
| KR100292410B1 (ko) * | 1998-09-23 | 2001-06-01 | 윤종용 | 불순물 오염이 억제된 반도체 제조용 반응 챔버 |
| JP4119551B2 (ja) * | 1998-12-01 | 2008-07-16 | 東京エレクトロン株式会社 | 基板保持台、及びプラズマ処理装置 |
| US6494955B1 (en) * | 2000-02-15 | 2002-12-17 | Applied Materials, Inc. | Ceramic substrate support |
| JP5088483B2 (ja) * | 2007-12-18 | 2012-12-05 | 三菱マテリアル株式会社 | ウエハを支持するためのプラズマエッチング装置用複合シリコンリング |
| WO2011065965A2 (en) * | 2009-11-30 | 2011-06-03 | Lam Research Corporation | An electrostatic chuck with an angled sidewall |
| US20160289827A1 (en) * | 2015-03-31 | 2016-10-06 | Lam Research Corporation | Plasma processing systems and structures having sloped confinement rings |
| JP6530228B2 (ja) * | 2015-04-28 | 2019-06-12 | 日本特殊陶業株式会社 | 静電チャック |
| JP2018107433A (ja) * | 2016-12-27 | 2018-07-05 | 東京エレクトロン株式会社 | フォーカスリング及び基板処理装置 |
| US20180182635A1 (en) | 2016-12-27 | 2018-06-28 | Tokyo Electron Limited | Focus ring and substrate processing apparatus |
| JP7071908B2 (ja) * | 2018-03-22 | 2022-05-19 | Ｓｐｐテクノロジーズ株式会社 | フォーカスリング及びこれを備えたプラズマ処理装置 |
| JP2024516149A (ja) * | 2021-04-21 | 2024-04-12 | ラム リサーチ コーポレーション | 基板への裏面堆積防止 |
| JP7429208B2 (ja) | 2021-08-17 | 2024-02-07 | 日本碍子株式会社 | ウエハ載置台 |
| KR102904705B1 (ko) * | 2021-11-09 | 2025-12-29 | 삼성전자주식회사 | 포커스 링, 이를 포함하는 기판 처리 장치 및 이를 이용한 기판 처리 방법 |
-
2023
- 2023-08-21 KR KR1020247008757A patent/KR102934502B1/ko active Active
- 2023-08-21 KR KR1020267006364A patent/KR20260038955A/ko active Pending
- 2023-08-21 JP JP2024510644A patent/JP7671918B1/ja active Active
- 2023-08-21 CN CN202380012896.2A patent/CN121753530A/zh active Pending
- 2023-08-21 WO PCT/JP2023/029982 patent/WO2025041221A1/ja active Pending
-
2024
- 2024-02-22 US US18/584,006 patent/US12463023B2/en active Active
- 2024-04-16 TW TW113114105A patent/TW202510091A/zh unknown
-
2025
- 2025-09-18 US US19/332,181 patent/US20260018393A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| US12463023B2 (en) | 2025-11-04 |
| JP7671918B1 (ja) | 2025-05-02 |
| KR20250029010A (ko) | 2025-03-04 |
| US20250069865A1 (en) | 2025-02-27 |
| CN121753530A (zh) | 2026-03-27 |
| US20260018393A1 (en) | 2026-01-15 |
| WO2025041221A1 (ja) | 2025-02-27 |
| KR102934502B1 (ko) | 2026-03-06 |
| KR20260038955A (ko) | 2026-03-19 |
| TW202510091A (zh) | 2025-03-01 |
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