JPWO2025041221A1 - - Google Patents

Info

Publication number
JPWO2025041221A1
JPWO2025041221A1 JP2024510644A JP2024510644A JPWO2025041221A1 JP WO2025041221 A1 JPWO2025041221 A1 JP WO2025041221A1 JP 2024510644 A JP2024510644 A JP 2024510644A JP 2024510644 A JP2024510644 A JP 2024510644A JP WO2025041221 A1 JPWO2025041221 A1 JP WO2025041221A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2024510644A
Other versions
JP7671918B1 (ja
JPWO2025041221A5 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2025041221A1 publication Critical patent/JPWO2025041221A1/ja
Application granted granted Critical
Publication of JP7671918B1 publication Critical patent/JP7671918B1/ja
Publication of JPWO2025041221A5 publication Critical patent/JPWO2025041221A5/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • H01J37/32724—Temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H01J37/32642—Focus rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/332—Coating
    • H01J2237/3321—CVD [Chemical Vapor Deposition]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/334—Etching

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
JP2024510644A 2023-08-21 2023-08-21 半導体製造装置用部材 Active JP7671918B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/029982 WO2025041221A1 (ja) 2023-08-21 2023-08-21 半導体製造装置用部材

Publications (3)

Publication Number Publication Date
JPWO2025041221A1 true JPWO2025041221A1 (ja) 2025-02-27
JP7671918B1 JP7671918B1 (ja) 2025-05-02
JPWO2025041221A5 JPWO2025041221A5 (ja) 2025-07-30

Family

ID=94689171

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024510644A Active JP7671918B1 (ja) 2023-08-21 2023-08-21 半導体製造装置用部材

Country Status (5)

Country Link
US (1) US12463023B2 (ja)
JP (1) JP7671918B1 (ja)
KR (1) KR20250029010A (ja)
TW (1) TW202510091A (ja)
WO (1) WO2025041221A1 (ja)

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5529657A (en) 1993-10-04 1996-06-25 Tokyo Electron Limited Plasma processing apparatus
JP3173693B2 (ja) * 1993-10-04 2001-06-04 東京エレクトロン株式会社 プラズマ処理装置及びその方法
KR100292410B1 (ko) * 1998-09-23 2001-06-01 윤종용 불순물 오염이 억제된 반도체 제조용 반응 챔버
JP4119551B2 (ja) * 1998-12-01 2008-07-16 東京エレクトロン株式会社 基板保持台、及びプラズマ処理装置
US6494955B1 (en) 2000-02-15 2002-12-17 Applied Materials, Inc. Ceramic substrate support
JP5088483B2 (ja) * 2007-12-18 2012-12-05 三菱マテリアル株式会社 ウエハを支持するためのプラズマエッチング装置用複合シリコンリング
JP5808750B2 (ja) * 2009-11-30 2015-11-10 ラム リサーチ コーポレーションＬａｍ Ｒｅｓｅａｒｃｈ Ｃｏｒｐｏｒａｔｉｏｎ 傾斜側壁を備える静電チャック
US20160289827A1 (en) * 2015-03-31 2016-10-06 Lam Research Corporation Plasma processing systems and structures having sloped confinement rings
JP6530228B2 (ja) * 2015-04-28 2019-06-12 日本特殊陶業株式会社 静電チャック
JP2018107433A (ja) * 2016-12-27 2018-07-05 東京エレクトロン株式会社 フォーカスリング及び基板処理装置
US20180182635A1 (en) 2016-12-27 2018-06-28 Tokyo Electron Limited Focus ring and substrate processing apparatus
JP7071908B2 (ja) * 2018-03-22 2022-05-19 Ｓｐｐテクノロジーズ株式会社 フォーカスリング及びこれを備えたプラズマ処理装置
WO2022225797A1 (en) * 2021-04-21 2022-10-27 Lam Research Corporation Backside deposition prevention on substrates
JP7429208B2 (ja) 2021-08-17 2024-02-07 日本碍子株式会社 ウエハ載置台
US20230143327A1 (en) * 2021-11-09 2023-05-11 Samsung Electronics Co., Ltd. Focus ring, substrate processing apparatus including the same, and substrate processing method using the same

Also Published As

Publication number Publication date
KR20250029010A (ko) 2025-03-04
JP7671918B1 (ja) 2025-05-02
US20250069865A1 (en) 2025-02-27
WO2025041221A1 (ja) 2025-02-27
TW202510091A (zh) 2025-03-01
US12463023B2 (en) 2025-11-04

Similar Documents

Publication Publication Date Title
JPWO2025041221A1 (ja)
BR102023014872A2 (ja)
BR102023010976A2 (ja)
BR102023009641A2 (ja)
BR102023008688A2 (ja)
BR102023007252A2 (ja)
BR202022009269U2 (ja)
BR202022005961U2 (ja)
BR202022001779U2 (ja)
BR202022000931U2 (ja)
BY13167U (ja)
BY13162U (ja)
CN307047168S (ja)
CN307046055S (ja)
CN307045503S (ja)
CN307045370S (ja)
CN307045012S (ja)
CN307045002S (ja)
CN307044631S (ja)
CN307044442S (ja)
BY13172U (ja)
BY13171U (ja)
BY13169U (ja)
BY13168U (ja)
BY13170U (ja)

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20240221

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20240221

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20250415

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20250421

R150 Certificate of patent or registration of utility model

Ref document number: 7671918

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150