KR102927254B1 - β-Ga2O3/β-Ga2O3 적층체의 제조 방법 - Google Patents
β-Ga2O3/β-Ga2O3 적층체의 제조 방법Info
- Publication number
- KR102927254B1 KR102927254B1 KR1020247008343A KR20247008343A KR102927254B1 KR 102927254 B1 KR102927254 B1 KR 102927254B1 KR 1020247008343 A KR1020247008343 A KR 1020247008343A KR 20247008343 A KR20247008343 A KR 20247008343A KR 102927254 B1 KR102927254 B1 KR 102927254B1
- Authority
- KR
- South Korea
- Prior art keywords
- pbo
- laminate
- mol
- growth
- solvent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B19/00—Liquid-phase epitaxial-layer growth
- C30B19/02—Liquid-phase epitaxial-layer growth using molten solvents, e.g. flux
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B19/00—Liquid-phase epitaxial-layer growth
- C30B19/12—Liquid-phase epitaxial-layer growth characterised by the substrate
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/16—Oxides
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/26—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using liquid deposition
- H10P14/263—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using liquid deposition using melted materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/26—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using liquid deposition
- H10P14/265—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using liquid deposition using solutions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/29—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
- H10P14/2901—Materials
- H10P14/2918—Materials being semiconductor metal oxides
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/34—Deposited materials, e.g. layers
- H10P14/3402—Deposited materials, e.g. layers characterised by the chemical composition
- H10P14/3434—Deposited materials, e.g. layers characterised by the chemical composition being oxide semiconductor materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/34—Deposited materials, e.g. layers
- H10P14/3438—Doping during depositing
- H10P14/3441—Conductivity type
- H10P14/3442—N-type
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/34—Deposited materials, e.g. layers
- H10P14/3438—Doping during depositing
- H10P14/3441—Conductivity type
- H10P14/3444—P-type
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/34—Deposited materials, e.g. layers
- H10P14/3438—Doping during depositing
- H10P14/3441—Conductivity type
- H10P14/3446—Transition metal elements; Rare earth elements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
- H10P14/6302—Non-deposition formation processes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/69—Inorganic materials
- H10P14/692—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses
- H10P14/6938—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses the material containing at least one metal element, e.g. metal oxides, metal oxynitrides or metal oxycarbides
- H10P14/6939—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses the material containing at least one metal element, e.g. metal oxides, metal oxynitrides or metal oxycarbides characterised by the metal
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/32—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by intermediate layers between substrates and deposited layers
- H10P14/3202—Materials thereof
- H10P14/3234—Materials thereof being oxide semiconducting materials
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
- Recrystallisation Techniques (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2021-178650 | 2021-11-01 | ||
| JP2021178650 | 2021-11-01 | ||
| PCT/JP2022/040309 WO2023074836A1 (ja) | 2021-11-01 | 2022-10-28 | β-Ga2O3/β-Ga2O3積層体の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20240045295A KR20240045295A (ko) | 2024-04-05 |
| KR102927254B1 true KR102927254B1 (ko) | 2026-02-12 |
Family
ID=86159992
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020247008343A Active KR102927254B1 (ko) | 2021-11-01 | 2022-10-28 | β-Ga2O3/β-Ga2O3 적층체의 제조 방법 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20240417881A1 (https=) |
| EP (1) | EP4411028B1 (https=) |
| JP (2) | JP7380948B2 (https=) |
| KR (1) | KR102927254B1 (https=) |
| CN (1) | CN118159694A (https=) |
| TW (1) | TW202328516A (https=) |
| WO (1) | WO2023074836A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2025177952A1 (https=) * | 2024-02-22 | 2025-08-28 | ||
| CN119041012B (zh) * | 2024-10-30 | 2025-01-28 | 安徽科瑞思创晶体材料有限责任公司 | 一种利用液相外延制备稀土掺杂铁石榴石薄膜的方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014015366A (ja) * | 2012-07-11 | 2014-01-30 | Shin Etsu Chem Co Ltd | β−Ga2O3単結晶膜付基板及びその製造方法 |
| JP2017109902A (ja) * | 2015-12-16 | 2017-06-22 | 株式会社タムラ製作所 | 半導体基板、並びにエピタキシャルウエハ及びその製造方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3679097B2 (ja) * | 2002-05-31 | 2005-08-03 | 株式会社光波 | 発光素子 |
| EP1997941B1 (en) * | 2006-03-01 | 2014-12-17 | Mitsubishi Gas Chemical Company, Inc. | PROCESS FOR PRODUCING ZnO SINGLE CRYSTAL ACCORDING TO METHOD OF LIQUID PHASE GROWTH |
| JP2010280533A (ja) * | 2009-06-04 | 2010-12-16 | Mitsubishi Gas Chemical Co Inc | 液相エピタキシャル成長法による励起子発光型ZnOシンチレータの製造方法 |
| JP5747110B1 (ja) * | 2014-06-30 | 2015-07-08 | 株式会社タムラ製作所 | Ga2O3系単結晶基板 |
| JP6714760B2 (ja) * | 2019-07-31 | 2020-06-24 | 株式会社タムラ製作所 | Ga2O3系単結晶基板 |
-
2022
- 2022-10-28 KR KR1020247008343A patent/KR102927254B1/ko active Active
- 2022-10-28 US US18/703,762 patent/US20240417881A1/en active Pending
- 2022-10-28 JP JP2023512692A patent/JP7380948B2/ja active Active
- 2022-10-28 WO PCT/JP2022/040309 patent/WO2023074836A1/ja not_active Ceased
- 2022-10-28 CN CN202280071198.5A patent/CN118159694A/zh active Pending
- 2022-10-28 EP EP22887161.2A patent/EP4411028B1/en active Active
- 2022-10-31 TW TW111141303A patent/TW202328516A/zh unknown
-
2023
- 2023-07-05 JP JP2023110746A patent/JP2023134567A/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014015366A (ja) * | 2012-07-11 | 2014-01-30 | Shin Etsu Chem Co Ltd | β−Ga2O3単結晶膜付基板及びその製造方法 |
| JP2017109902A (ja) * | 2015-12-16 | 2017-06-22 | 株式会社タムラ製作所 | 半導体基板、並びにエピタキシャルウエハ及びその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202328516A (zh) | 2023-07-16 |
| EP4411028A1 (en) | 2024-08-07 |
| US20240417881A1 (en) | 2024-12-19 |
| EP4411028B1 (en) | 2026-02-25 |
| EP4411028A4 (en) | 2024-12-04 |
| WO2023074836A1 (ja) | 2023-05-04 |
| KR20240045295A (ko) | 2024-04-05 |
| JP2023134567A (ja) | 2023-09-27 |
| CN118159694A (zh) | 2024-06-07 |
| EP4411028C0 (en) | 2026-02-25 |
| JPWO2023074836A1 (https=) | 2023-05-04 |
| JP7380948B2 (ja) | 2023-11-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101451995B1 (ko) | 액상 성장법에 의한 ZnO 단결정의 제조방법 | |
| KR101979130B1 (ko) | 금속 도가니에 담겨진 용융물로부터 베타 상의 산화 갈륨 단결정을 성장시키는 방법 | |
| Mu et al. | Solid–liquid interface optimization and properties of ultra-wide bandgap β-Ga 2 O 3 grown by Czochralski and EFG methods | |
| KR102927254B1 (ko) | β-Ga2O3/β-Ga2O3 적층체의 제조 방법 | |
| EP2982781B1 (en) | Ga2o3 single crystal substrate | |
| Li et al. | Investigation of the crack extending downward along the seed of the β-Ga 2 O 3 crystal grown by the EFG method | |
| KR20100015670A (ko) | Mg 함유 ZnO계 혼정 단결정, 그의 적층체 및 그들의 제조방법 | |
| Huang et al. | Growth of gallium oxide bulk crystals: a review | |
| KR20260004303A (ko) | β-Ga2O3/β-Ga2O3 적층체의 제조 방법 및 그 제조 방법에 의해 얻어진 적층체 | |
| KR102929178B1 (ko) | 전기 도전성 벌크 β-Ga2O3 단결정 및 전기 도전성 벌크 β-Ga2O3 단결정을 생성하는 방법 및 장치 | |
| CN105696081B (zh) | 锑化铝材料的制备方法 | |
| KR20110003346A (ko) | ZnO 단결정의 제조방법, 그것에 의해 얻어진 자립 ZnO 단결정 웨이퍼, 및 자립 Mg함유 ZnO계 혼정 단결정 웨이퍼 및 그것에 사용하는 Mg함유 ZnO계 혼정 단결정의 제조방법 | |
| JP5419116B2 (ja) | バルク結晶の成長方法 | |
| TW202600920A (zh) | β-Ga2O3/β-Ga2O3疊層體之製造方法、利用該製造方法而得到的疊層體、及含有該疊層體之半導體裝置 | |
| TW202432918A (zh) | 熔融生長塊狀β-(AlxGa-x)O單晶及用於製造塊狀β-(AlxGa-x)O單晶的方法 | |
| JP4936829B2 (ja) | 酸化亜鉛結晶の成長方法 | |
| CN119932692A (zh) | 一种通过碲掺杂精确调控导电性能的锑化镓单晶及其制备方法 | |
| CN116716662A (zh) | 一种自助熔剂法生长锑化镓单晶的方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
St.27 status event code: A-0-1-A10-A15-nap-PA0105 |
|
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
|
| E601 | Decision to refuse application | ||
| PE0601 | Decision on rejection of patent |
St.27 status event code: N-2-6-B10-B15-exm-PE0601 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |
|
| E13-X000 | Pre-grant limitation requested |
St.27 status event code: A-2-3-E10-E13-lim-X000 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| F13 | Ip right granted in full following pre-grant review |
Free format text: ST27 STATUS EVENT CODE: A-3-4-F10-F13-REX-PX0701 (AS PROVIDED BY THE NATIONAL OFFICE) |
|
| PX0701 | Decision of registration after re-examination |
St.27 status event code: A-3-4-F10-F13-rex-PX0701 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-2-2-P10-P22-nap-X000 |
|
| F11 | Ip right granted following substantive examination |
Free format text: ST27 STATUS EVENT CODE: A-2-4-F10-F11-EXM-PR0701 (AS PROVIDED BY THE NATIONAL OFFICE) |
|
| PR0701 | Registration of establishment |
St.27 status event code: A-2-4-F10-F11-exm-PR0701 |
|
| PR1002 | Payment of registration fee |
St.27 status event code: A-2-2-U10-U12-oth-PR1002 Fee payment year number: 1 |
|
| U12 | Designation fee paid |
Free format text: ST27 STATUS EVENT CODE: A-2-2-U10-U12-OTH-PR1002 (AS PROVIDED BY THE NATIONAL OFFICE) Year of fee payment: 1 |
|
| PG1601 | Publication of registration |
St.27 status event code: A-4-4-Q10-Q13-nap-PG1601 |
|
| Q13 | Ip right document published |
Free format text: ST27 STATUS EVENT CODE: A-4-4-Q10-Q13-NAP-PG1601 (AS PROVIDED BY THE NATIONAL OFFICE) |