KR102886784B1 - 몰리브덴 산화물을 함유하는 층을 제조하기 위한 스퍼터링 타겟 - Google Patents

몰리브덴 산화물을 함유하는 층을 제조하기 위한 스퍼터링 타겟

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Publication number
KR102886784B1
KR102886784B1 KR1020217033119A KR20217033119A KR102886784B1 KR 102886784 B1 KR102886784 B1 KR 102886784B1 KR 1020217033119 A KR1020217033119 A KR 1020217033119A KR 20217033119 A KR20217033119 A KR 20217033119A KR 102886784 B1 KR102886784 B1 KR 102886784B1
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KR
South Korea
Prior art keywords
target material
oxide
sputtering
target
phase
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
KR1020217033119A
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English (en)
Korean (ko)
Other versions
KR20210145172A (ko
Inventor
미하엘 오'설리반
외르크 빈클러
엔리코 프란츠케
크리스티안 린케
토마스 쉐러
Original Assignee
플란제 에스이
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Publication of KR20210145172A publication Critical patent/KR20210145172A/ko
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Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08Oxides
    • C23C14/083Oxides of refractory metals or yttrium
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • C23C14/3407Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/34Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411Constructional aspects of the reactor
    • H01J37/3414Targets
    • H01J37/3426Material
    • H01J37/3429Plural materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Physical Vapour Deposition (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Inorganic Compounds Of Heavy Metals (AREA)
KR1020217033119A 2019-03-29 2020-03-03 몰리브덴 산화물을 함유하는 층을 제조하기 위한 스퍼터링 타겟 Active KR102886784B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP19166312.9A EP3715496B1 (de) 2019-03-29 2019-03-29 Sputteringtarget zur herstellung molybdänoxidhaltiger schichten
EP19166312.9 2019-03-29
PCT/EP2020/055481 WO2020200605A1 (de) 2019-03-29 2020-03-03 Sputteringtarget zur herstellung molybdänoxidhaltiger schichten

Publications (2)

Publication Number Publication Date
KR20210145172A KR20210145172A (ko) 2021-12-01
KR102886784B1 true KR102886784B1 (ko) 2025-11-14

Family

ID=66041301

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020217033119A Active KR102886784B1 (ko) 2019-03-29 2020-03-03 몰리브덴 산화물을 함유하는 층을 제조하기 위한 스퍼터링 타겟

Country Status (6)

Country Link
EP (1) EP3715496B1 (https=)
JP (1) JP7580390B2 (https=)
KR (1) KR102886784B1 (https=)
CN (1) CN113614278B (https=)
TW (1) TWI819205B (https=)
WO (1) WO2020200605A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022014783A (ja) * 2020-07-07 2022-01-20 三菱マテリアル株式会社 酸化モリブデンスパッタリングターゲット、および、酸化モリブデンスパッタリングターゲットの製造方法
CN114916228B (zh) * 2020-12-10 2023-08-15 Lt金属株式会社 以钼氧化物为主成分的金属氧化物烧结体及包含其的溅射靶材
KR102646917B1 (ko) * 2021-09-16 2024-03-13 엘티메탈 주식회사 몰리브덴 산화물계 소결체, 상기 소결체를 이용한 박막, 상기 박막을 포함하는 박막트랜지스터 및 디스플레이 장치
TWI839845B (zh) * 2021-10-06 2024-04-21 南韓商Lt金屬股份有限公司 氧化鉬基燒結體、濺鍍靶材、使用燒結體的氧化物薄膜、包含薄膜的薄膜電晶體及顯示裝置
KR102917229B1 (ko) 2021-10-14 2026-01-28 엘티메탈 주식회사 몰리브덴 산화물계 소결체, 이를 포함하는 스퍼터링 타겟 및 산화물 박막

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007500661A (ja) * 2003-07-22 2007-01-18 ハー ツェー シュタルク インコーポレイテッド MoO2粉末の製造法、MoO2粉末から製造された製品、MoO2薄膜の付着およびこのような材料の使用方法
DE102012112739A1 (de) * 2012-10-23 2014-04-24 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Licht absorbierendes Schichtsystem und dessen Herstellung sowie dafür geeignetes Sputtertarget
DE102014111935A1 (de) 2014-08-20 2016-02-25 Heraeus Deutschland GmbH & Co. KG Zweilagiges Schichtsystem mit teilabsorbierender Schicht sowie Verfahren und Sputtertarget zur Herstellung dieser Schicht

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0852266B1 (en) 1995-08-23 2004-10-13 Asahi Glass Ceramics Co., Ltd. Target, process for production thereof, and method of forming highly refractive film
US7754185B2 (en) * 2004-06-29 2010-07-13 H.C. Starck Inc. Method of making MoO2 powders, products made from MoO2 powders, deposition of MoO2 thin films, and methods of using such materials
US20070071985A1 (en) * 2005-09-29 2007-03-29 Prabhat Kumar Sputtering target, low resistivity, transparent conductive film, method for producing such film and composition for use therein
CN102105619B (zh) * 2008-06-06 2014-01-22 出光兴产株式会社 氧化物薄膜用溅射靶及其制造方法
JP2013020347A (ja) 2011-07-08 2013-01-31 Toppan Printing Co Ltd タッチパネルおよびタッチパネルの製造方法
DE102013103679A1 (de) * 2013-04-11 2014-10-30 Heraeus Materials Technology Gmbh & Co. Kg Licht absorbierende Schicht und die Schicht enthaltendes Schichtsystem, Verfahren zur dessen Herstellung und dafür geeignetes Sputtertarget
KR102316360B1 (ko) * 2013-10-29 2021-10-22 플란제 에스이 스퍼터링 타깃 및 제조방법

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007500661A (ja) * 2003-07-22 2007-01-18 ハー ツェー シュタルク インコーポレイテッド MoO2粉末の製造法、MoO2粉末から製造された製品、MoO2薄膜の付着およびこのような材料の使用方法
DE102012112739A1 (de) * 2012-10-23 2014-04-24 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Licht absorbierendes Schichtsystem und dessen Herstellung sowie dafür geeignetes Sputtertarget
DE102014111935A1 (de) 2014-08-20 2016-02-25 Heraeus Deutschland GmbH & Co. KG Zweilagiges Schichtsystem mit teilabsorbierender Schicht sowie Verfahren und Sputtertarget zur Herstellung dieser Schicht

Also Published As

Publication number Publication date
KR20210145172A (ko) 2021-12-01
CN113614278B (zh) 2024-01-30
EP3715496B1 (de) 2024-07-17
JP2022526163A (ja) 2022-05-23
TW202104623A (zh) 2021-02-01
TWI819205B (zh) 2023-10-21
WO2020200605A1 (de) 2020-10-08
JP7580390B2 (ja) 2024-11-11
EP3715496A1 (de) 2020-09-30
CN113614278A (zh) 2021-11-05

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