KR102793530B1 - 기판 처리 장치 - Google Patents

기판 처리 장치 Download PDF

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Publication number
KR102793530B1
KR102793530B1 KR1020240083456A KR20240083456A KR102793530B1 KR 102793530 B1 KR102793530 B1 KR 102793530B1 KR 1020240083456 A KR1020240083456 A KR 1020240083456A KR 20240083456 A KR20240083456 A KR 20240083456A KR 102793530 B1 KR102793530 B1 KR 102793530B1
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KR
South Korea
Prior art keywords
substrate
clamp pin
axis
base member
rotation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020240083456A
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English (en)
Korean (ko)
Other versions
KR20250003332A (ko
Inventor
유지 나가시마
요타로 후쿠오카
다쿠야 하세
가린 미야모토
Original Assignee
시바우라 메카트로닉스 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 시바우라 메카트로닉스 가부시끼가이샤 filed Critical 시바우라 메카트로닉스 가부시끼가이샤
Publication of KR20250003332A publication Critical patent/KR20250003332A/ko
Application granted granted Critical
Publication of KR102793530B1 publication Critical patent/KR102793530B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7614—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • H01L21/6875—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0422—Apparatus for fluid treatment for etching for wet etching
    • H10P72/0424—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • H01L21/67051—
    • H01L21/6708—
    • H01L21/68728—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0408—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7608—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7626—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020240083456A 2023-06-30 2024-06-26 기판 처리 장치 Active KR102793530B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023108562A JP2025007277A (ja) 2023-06-30 2023-06-30 基板処理装置
JPJP-P-2023-108562 2023-06-30

Publications (2)

Publication Number Publication Date
KR20250003332A KR20250003332A (ko) 2025-01-07
KR102793530B1 true KR102793530B1 (ko) 2025-04-11

Family

ID=94044343

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020240083456A Active KR102793530B1 (ko) 2023-06-30 2024-06-26 기판 처리 장치

Country Status (4)

Country Link
JP (1) JP2025007277A (https=)
KR (1) KR102793530B1 (https=)
CN (1) CN119230446A (https=)
TW (1) TWI884798B (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003060013A (ja) 2001-08-13 2003-02-28 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP2004079637A (ja) 2002-08-12 2004-03-11 Toshiba Corp 板状部材の把持装置、把持方法、及びスピン処理装置
JP2009239026A (ja) 2008-03-27 2009-10-15 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP2014241390A (ja) 2013-05-13 2014-12-25 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6091060B2 (ja) * 2011-12-02 2017-03-08 芝浦メカトロニクス株式会社 スピン処理装置
TWI569349B (zh) * 2013-09-27 2017-02-01 斯克林集團公司 基板處理裝置及基板處理方法
US10276425B2 (en) * 2014-11-21 2019-04-30 Tokyo Electron Limited Substrate processing system
JP6777985B2 (ja) * 2015-11-19 2020-10-28 株式会社荏原製作所 基板保持装置
JP6836913B2 (ja) * 2017-01-17 2021-03-03 東京エレクトロン株式会社 基板処理装置、基板処理方法、及び記憶媒体
JP6892774B2 (ja) * 2017-03-24 2021-06-23 株式会社Ｓｃｒｅｅｎホールディングス 基板保持回転装置およびそれを備えた基板処理装置、ならびに基板処理方法
JP2018181889A (ja) 2017-04-03 2018-11-15 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP6967922B2 (ja) * 2017-09-22 2021-11-17 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003060013A (ja) 2001-08-13 2003-02-28 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP2004079637A (ja) 2002-08-12 2004-03-11 Toshiba Corp 板状部材の把持装置、把持方法、及びスピン処理装置
JP2009239026A (ja) 2008-03-27 2009-10-15 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP2014241390A (ja) 2013-05-13 2014-12-25 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置

Also Published As

Publication number Publication date
CN119230446A (zh) 2024-12-31
KR20250003332A (ko) 2025-01-07
JP2025007277A (ja) 2025-01-17
TWI884798B (zh) 2025-05-21
TW202503876A (zh) 2025-01-16

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