JP2025007277A - 基板処理装置 - Google Patents

基板処理装置 Download PDF

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Publication number
JP2025007277A
JP2025007277A JP2023108562A JP2023108562A JP2025007277A JP 2025007277 A JP2025007277 A JP 2025007277A JP 2023108562 A JP2023108562 A JP 2023108562A JP 2023108562 A JP2023108562 A JP 2023108562A JP 2025007277 A JP2025007277 A JP 2025007277A
Authority
JP
Japan
Prior art keywords
substrate
axis
clamp pin
rotation
base member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023108562A
Other languages
English (en)
Japanese (ja)
Other versions
JP2025007277A5 (https=
Inventor
裕次 長嶋
Yuji Nagashima
洋太郎 福岡
Yotaro Fukuoka
拓哉 長谷
Takuya Hase
かりん 宮本
Karin Miyamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Mechatronics Corp
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Priority to JP2023108562A priority Critical patent/JP2025007277A/ja
Priority to CN202410714097.6A priority patent/CN119230446A/zh
Priority to TW113120804A priority patent/TWI884798B/zh
Priority to KR1020240083456A priority patent/KR102793530B1/ko
Publication of JP2025007277A publication Critical patent/JP2025007277A/ja
Publication of JP2025007277A5 publication Critical patent/JP2025007277A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7614—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0422—Apparatus for fluid treatment for etching for wet etching
    • H10P72/0424—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0408—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7608—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7626—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2023108562A 2023-06-30 2023-06-30 基板処理装置 Pending JP2025007277A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2023108562A JP2025007277A (ja) 2023-06-30 2023-06-30 基板処理装置
CN202410714097.6A CN119230446A (zh) 2023-06-30 2024-06-04 基板处理装置
TW113120804A TWI884798B (zh) 2023-06-30 2024-06-05 基板處理裝置
KR1020240083456A KR102793530B1 (ko) 2023-06-30 2024-06-26 기판 처리 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2023108562A JP2025007277A (ja) 2023-06-30 2023-06-30 基板処理装置

Publications (2)

Publication Number Publication Date
JP2025007277A true JP2025007277A (ja) 2025-01-17
JP2025007277A5 JP2025007277A5 (https=) 2025-07-08

Family

ID=94044343

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023108562A Pending JP2025007277A (ja) 2023-06-30 2023-06-30 基板処理装置

Country Status (4)

Country Link
JP (1) JP2025007277A (https=)
KR (1) KR102793530B1 (https=)
CN (1) CN119230446A (https=)
TW (1) TWI884798B (https=)

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003060013A (ja) * 2001-08-13 2003-02-28 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP2004079637A (ja) * 2002-08-12 2004-03-11 Toshiba Corp 板状部材の把持装置、把持方法、及びスピン処理装置
JP2009239026A (ja) * 2008-03-27 2009-10-15 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP6091060B2 (ja) * 2011-12-02 2017-03-08 芝浦メカトロニクス株式会社 スピン処理装置
JP6255650B2 (ja) * 2013-05-13 2018-01-10 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
TWI569349B (zh) * 2013-09-27 2017-02-01 斯克林集團公司 基板處理裝置及基板處理方法
US10276425B2 (en) * 2014-11-21 2019-04-30 Tokyo Electron Limited Substrate processing system
JP6777985B2 (ja) * 2015-11-19 2020-10-28 株式会社荏原製作所 基板保持装置
JP6836913B2 (ja) * 2017-01-17 2021-03-03 東京エレクトロン株式会社 基板処理装置、基板処理方法、及び記憶媒体
JP6892774B2 (ja) * 2017-03-24 2021-06-23 株式会社Ｓｃｒｅｅｎホールディングス 基板保持回転装置およびそれを備えた基板処理装置、ならびに基板処理方法
JP2018181889A (ja) 2017-04-03 2018-11-15 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP6967922B2 (ja) * 2017-09-22 2021-11-17 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置

Also Published As

Publication number Publication date
CN119230446A (zh) 2024-12-31
KR20250003332A (ko) 2025-01-07
TWI884798B (zh) 2025-05-21
KR102793530B1 (ko) 2025-04-11
TW202503876A (zh) 2025-01-16

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