KR102791694B1 - 저 인덕턴스 컴포넌트 - Google Patents
저 인덕턴스 컴포넌트 Download PDFInfo
- Publication number
- KR102791694B1 KR102791694B1 KR1020217032360A KR20217032360A KR102791694B1 KR 102791694 B1 KR102791694 B1 KR 102791694B1 KR 1020217032360 A KR1020217032360 A KR 1020217032360A KR 20217032360 A KR20217032360 A KR 20217032360A KR 102791694 B1 KR102791694 B1 KR 102791694B1
- Authority
- KR
- South Korea
- Prior art keywords
- electrode
- lead
- active
- terminal
- inductance component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C10/00—Adjustable resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
- H01C7/1013—Thin film varistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/18—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material comprising a plurality of layers stacked between terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/012—Form of non-self-supporting electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/38—Multiple capacitors, i.e. structural combinations of fixed capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/38—Multiple capacitors, i.e. structural combinations of fixed capacitors
- H01G4/385—Single unit multiple capacitors, e.g. dual capacitor in one coil
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/40—Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D1/00—Resistors, capacitors or inductors
- H10D1/60—Capacitors
- H10D1/68—Capacitors having no potential barriers
- H10D1/692—Electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/201—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits
- H10D84/204—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits of combinations of diodes or capacitors or resistors
- H10D84/212—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits of combinations of diodes or capacitors or resistors of only capacitors
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Thermistors And Varistors (AREA)
- Ceramic Capacitors (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201962838421P | 2019-04-25 | 2019-04-25 | |
| US62/838,421 | 2019-04-25 | ||
| PCT/US2020/028748 WO2020219359A1 (en) | 2019-04-25 | 2020-04-17 | Low inductance component |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20210146321A KR20210146321A (ko) | 2021-12-03 |
| KR102791694B1 true KR102791694B1 (ko) | 2025-04-07 |
Family
ID=72916567
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020217032360A Active KR102791694B1 (ko) | 2019-04-25 | 2020-04-17 | 저 인덕턴스 컴포넌트 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US11621129B2 (https=) |
| JP (2) | JP2022541973A (https=) |
| KR (1) | KR102791694B1 (https=) |
| CN (2) | CN116864314A (https=) |
| DE (1) | DE112020002057T5 (https=) |
| TW (1) | TWI853922B (https=) |
| WO (1) | WO2020219359A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12148575B2 (en) | 2019-04-25 | 2024-11-19 | KYOCERA AVX Components Corporation | Integrated component including a capacitor and discrete varistor |
| KR102880979B1 (ko) * | 2021-12-24 | 2025-11-04 | 삼성전기주식회사 | 적층형 전자 부품 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018043397A1 (ja) * | 2016-08-29 | 2018-03-08 | 京セラ株式会社 | 積層型コンデンサ |
| WO2018144987A1 (en) * | 2017-02-06 | 2018-08-09 | Avx Corporation | Integrated capacitor filter and integrated capacitor filter with varistor function |
Family Cites Families (36)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2137809A (en) * | 1937-07-31 | 1938-11-22 | Bell Telephone Labor Inc | Terminal connection for electrical devices |
| JPS55179032U (https=) * | 1979-06-11 | 1980-12-23 | ||
| US4475143A (en) | 1983-01-10 | 1984-10-02 | Rogers Corporation | Decoupling capacitor and method of manufacture thereof |
| JPS61158940U (https=) * | 1985-03-23 | 1986-10-02 | ||
| JPS62204316U (https=) * | 1986-06-16 | 1987-12-26 | ||
| JPH0184423U (https=) * | 1987-11-27 | 1989-06-05 | ||
| US4853826A (en) | 1988-08-01 | 1989-08-01 | Rogers Corporation | Low inductance decoupling capacitor |
| JP2795715B2 (ja) * | 1989-02-21 | 1998-09-10 | タツタ電線株式会社 | プリント配線基板 |
| JPH02240907A (ja) * | 1989-03-15 | 1990-09-25 | Nitsuko Corp | メタライズドフィルムコンデンサのリード線引出し方法 |
| JPH03187203A (ja) | 1989-12-07 | 1991-08-15 | Siemens Ag | 高容量バリスタ |
| JPH07249541A (ja) | 1994-03-11 | 1995-09-26 | Mitsubishi Materials Corp | 複合セラミックコンデンサ |
| US6266229B1 (en) | 1997-11-10 | 2001-07-24 | Murata Manufacturing Co., Ltd | Multilayer capacitor |
| US5973906A (en) | 1998-03-17 | 1999-10-26 | Maxwell Energy Products, Inc. | Chip capacitors and chip capacitor electromagnetic interference filters |
| WO2000055875A1 (en) | 1999-03-16 | 2000-09-21 | Maxwell Energy Products | Low inductance four terminal capacitor lead frame |
| JP2000299249A (ja) * | 1999-04-14 | 2000-10-24 | Maruwa Kck:Kk | 積層コンデンサおよびその製造方法 |
| JP2001189233A (ja) * | 1999-12-28 | 2001-07-10 | Murata Mfg Co Ltd | 積層コンデンサ |
| US8045319B2 (en) * | 2007-06-13 | 2011-10-25 | Avx Corporation | Controlled ESR decoupling capacitor |
| JP4618348B2 (ja) * | 2008-08-11 | 2011-01-26 | Tdk株式会社 | 積層コンデンサ |
| KR101018646B1 (ko) * | 2008-12-09 | 2011-03-03 | 삼화콘덴서공업주식회사 | Mlcc 모듈 |
| KR101060870B1 (ko) * | 2010-06-16 | 2011-08-31 | 삼성전기주식회사 | 적층형 필터 |
| KR101872519B1 (ko) | 2011-04-21 | 2018-06-29 | 삼성전기주식회사 | Esr 특성 제어가능한 적층형 세라믹 커패시터 |
| US8988857B2 (en) * | 2011-12-13 | 2015-03-24 | Kemet Electronics Corporation | High aspect ratio stacked MLCC design |
| KR101771728B1 (ko) * | 2012-07-20 | 2017-08-25 | 삼성전기주식회사 | 적층 세라믹 전자부품 및 이의 제조방법 |
| JP5708586B2 (ja) * | 2012-07-26 | 2015-04-30 | 株式会社村田製作所 | 積層セラミック電子部品およびその製造方法 |
| KR102064013B1 (ko) * | 2013-07-18 | 2020-01-08 | 삼성전기주식회사 | 복합 전자부품 및 그 실장 기판 |
| KR102122932B1 (ko) * | 2013-08-08 | 2020-06-15 | 삼성전기주식회사 | 적층 세라믹 커패시터 및 적층 세라믹 커패시터 실장 기판 |
| US9460855B2 (en) | 2013-10-01 | 2016-10-04 | Samsung Electro-Mechanics Co., Ltd. | Multilayer ceramic capacitor and board having the same |
| KR20140038912A (ko) * | 2013-10-01 | 2014-03-31 | 삼성전기주식회사 | 적층 세라믹 커패시터 및 그 실장 기판 |
| KR101630031B1 (ko) * | 2014-04-02 | 2016-06-13 | 삼성전기주식회사 | 적층 칩 전자부품 및 그 실장 기판 |
| JP6137047B2 (ja) * | 2014-05-09 | 2017-05-31 | 株式会社村田製作所 | 積層コンデンサ及びその使用方法 |
| EP2947757A1 (en) * | 2014-05-21 | 2015-11-25 | Keko-Varicon d.o.o. | Electronic component with stacked elements |
| JP2017117865A (ja) * | 2015-12-22 | 2017-06-29 | 株式会社村田製作所 | コンデンサ及びコンデンサ内蔵基板 |
| JP6728697B2 (ja) * | 2016-01-15 | 2020-07-22 | 株式会社村田製作所 | 複合電子部品およびこれを備えた実装体 |
| CN105914036A (zh) | 2016-06-08 | 2016-08-31 | 福建火炬电子科技股份有限公司 | 一种低esl的多层陶瓷电容器 |
| US10504655B2 (en) * | 2016-12-22 | 2019-12-10 | Samsung Electro-Mechanics Co., Ltd. | Composite electronic component and board having the same |
| JP2018206813A (ja) * | 2017-05-30 | 2018-12-27 | 株式会社村田製作所 | 積層セラミック電子部品 |
-
2020
- 2020-04-16 US US16/850,153 patent/US11621129B2/en active Active
- 2020-04-17 CN CN202310827669.7A patent/CN116864314A/zh active Pending
- 2020-04-17 CN CN202080030095.5A patent/CN113711323A/zh active Pending
- 2020-04-17 WO PCT/US2020/028748 patent/WO2020219359A1/en not_active Ceased
- 2020-04-17 DE DE112020002057.6T patent/DE112020002057T5/de active Pending
- 2020-04-17 KR KR1020217032360A patent/KR102791694B1/ko active Active
- 2020-04-17 JP JP2021563204A patent/JP2022541973A/ja active Pending
- 2020-04-24 TW TW109113742A patent/TWI853922B/zh active
-
2023
- 2023-04-03 US US18/194,675 patent/US12051548B2/en active Active
-
2024
- 2024-03-19 JP JP2024043893A patent/JP2024073627A/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018043397A1 (ja) * | 2016-08-29 | 2018-03-08 | 京セラ株式会社 | 積層型コンデンサ |
| WO2018144987A1 (en) * | 2017-02-06 | 2018-08-09 | Avx Corporation | Integrated capacitor filter and integrated capacitor filter with varistor function |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI853922B (zh) | 2024-09-01 |
| CN113711323A (zh) | 2021-11-26 |
| US12051548B2 (en) | 2024-07-30 |
| WO2020219359A1 (en) | 2020-10-29 |
| KR20210146321A (ko) | 2021-12-03 |
| TW202109579A (zh) | 2021-03-01 |
| JP2024073627A (ja) | 2024-05-29 |
| JP2022541973A (ja) | 2022-09-29 |
| US20200343050A1 (en) | 2020-10-29 |
| CN116864314A (zh) | 2023-10-10 |
| US11621129B2 (en) | 2023-04-04 |
| US20230238186A1 (en) | 2023-07-27 |
| DE112020002057T5 (de) | 2022-01-27 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
Patent event date: 20211007 Patent event code: PA01051R01D Comment text: International Patent Application |
|
| PG1501 | Laying open of application | ||
| A201 | Request for examination | ||
| PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20220429 Comment text: Request for Examination of Application |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20240708 Patent event code: PE09021S01D |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 20250217 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
Comment text: Registration of Establishment Patent event date: 20250401 Patent event code: PR07011E01D |
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| PR1002 | Payment of registration fee |
Payment date: 20250402 End annual number: 3 Start annual number: 1 |
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| PG1601 | Publication of registration |