DE112020002057T5 - Komponente mit niedriger Induktivität - Google Patents

Komponente mit niedriger Induktivität Download PDF

Info

Publication number
DE112020002057T5
DE112020002057T5 DE112020002057.6T DE112020002057T DE112020002057T5 DE 112020002057 T5 DE112020002057 T5 DE 112020002057T5 DE 112020002057 T DE112020002057 T DE 112020002057T DE 112020002057 T5 DE112020002057 T5 DE 112020002057T5
Authority
DE
Germany
Prior art keywords
end portion
active
component according
grounded
electrode layers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112020002057.6T
Other languages
German (de)
English (en)
Inventor
Michael W. Kirk
Marianne Berolini
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera AVX Components Corp
Original Assignee
AVX Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AVX Corp filed Critical AVX Corp
Publication of DE112020002057T5 publication Critical patent/DE112020002057T5/de
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/40—Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/38—Multiple capacitors, i.e. structural combinations of fixed capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C10/00—Adjustable resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
    • H01C7/1013—Thin film varistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/18—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material comprising a plurality of layers stacked between terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/012—Form of non-self-supporting electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/38—Multiple capacitors, i.e. structural combinations of fixed capacitors
    • H01G4/385—Single unit multiple capacitors, e.g. dual capacitor in one coil
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/60—Capacitors
    • H10D1/68—Capacitors having no potential barriers
    • H10D1/692—Electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/201—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits
    • H10D84/204—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits of combinations of diodes or capacitors or resistors
    • H10D84/212—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits of combinations of diodes or capacitors or resistors of only capacitors

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Thermistors And Varistors (AREA)
  • Ceramic Capacitors (AREA)
DE112020002057.6T 2019-04-25 2020-04-17 Komponente mit niedriger Induktivität Pending DE112020002057T5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201962838421P 2019-04-25 2019-04-25
US62/838,421 2019-04-25
PCT/US2020/028748 WO2020219359A1 (en) 2019-04-25 2020-04-17 Low inductance component

Publications (1)

Publication Number Publication Date
DE112020002057T5 true DE112020002057T5 (de) 2022-01-27

Family

ID=72916567

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112020002057.6T Pending DE112020002057T5 (de) 2019-04-25 2020-04-17 Komponente mit niedriger Induktivität

Country Status (7)

Country Link
US (2) US11621129B2 (https=)
JP (2) JP2022541973A (https=)
KR (1) KR102791694B1 (https=)
CN (2) CN116864314A (https=)
DE (1) DE112020002057T5 (https=)
TW (1) TWI853922B (https=)
WO (1) WO2020219359A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12148575B2 (en) 2019-04-25 2024-11-19 KYOCERA AVX Components Corporation Integrated component including a capacitor and discrete varistor
KR102880979B1 (ko) * 2021-12-24 2025-11-04 삼성전기주식회사 적층형 전자 부품

Family Cites Families (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2137809A (en) * 1937-07-31 1938-11-22 Bell Telephone Labor Inc Terminal connection for electrical devices
JPS55179032U (https=) * 1979-06-11 1980-12-23
US4475143A (en) 1983-01-10 1984-10-02 Rogers Corporation Decoupling capacitor and method of manufacture thereof
JPS61158940U (https=) * 1985-03-23 1986-10-02
JPS62204316U (https=) * 1986-06-16 1987-12-26
JPH0184423U (https=) * 1987-11-27 1989-06-05
US4853826A (en) 1988-08-01 1989-08-01 Rogers Corporation Low inductance decoupling capacitor
JP2795715B2 (ja) * 1989-02-21 1998-09-10 タツタ電線株式会社 プリント配線基板
JPH02240907A (ja) * 1989-03-15 1990-09-25 Nitsuko Corp メタライズドフィルムコンデンサのリード線引出し方法
JPH03187203A (ja) 1989-12-07 1991-08-15 Siemens Ag 高容量バリスタ
JPH07249541A (ja) 1994-03-11 1995-09-26 Mitsubishi Materials Corp 複合セラミックコンデンサ
US6266229B1 (en) 1997-11-10 2001-07-24 Murata Manufacturing Co., Ltd Multilayer capacitor
US5973906A (en) 1998-03-17 1999-10-26 Maxwell Energy Products, Inc. Chip capacitors and chip capacitor electromagnetic interference filters
WO2000055875A1 (en) 1999-03-16 2000-09-21 Maxwell Energy Products Low inductance four terminal capacitor lead frame
JP2000299249A (ja) * 1999-04-14 2000-10-24 Maruwa Kck:Kk 積層コンデンサおよびその製造方法
JP2001189233A (ja) * 1999-12-28 2001-07-10 Murata Mfg Co Ltd 積層コンデンサ
US8045319B2 (en) * 2007-06-13 2011-10-25 Avx Corporation Controlled ESR decoupling capacitor
JP4618348B2 (ja) * 2008-08-11 2011-01-26 Ｔｄｋ株式会社 積層コンデンサ
KR101018646B1 (ko) * 2008-12-09 2011-03-03 삼화콘덴서공업주식회사 Ｍｌｃｃ 모듈
KR101060870B1 (ko) * 2010-06-16 2011-08-31 삼성전기주식회사 적층형 필터
KR101872519B1 (ko) 2011-04-21 2018-06-29 삼성전기주식회사 Ｅｓｒ 특성 제어가능한 적층형 세라믹 커패시터
US8988857B2 (en) * 2011-12-13 2015-03-24 Kemet Electronics Corporation High aspect ratio stacked MLCC design
KR101771728B1 (ko) * 2012-07-20 2017-08-25 삼성전기주식회사 적층 세라믹 전자부품 및 이의 제조방법
JP5708586B2 (ja) * 2012-07-26 2015-04-30 株式会社村田製作所 積層セラミック電子部品およびその製造方法
KR102064013B1 (ko) * 2013-07-18 2020-01-08 삼성전기주식회사 복합 전자부품 및 그 실장 기판
KR102122932B1 (ko) * 2013-08-08 2020-06-15 삼성전기주식회사 적층 세라믹 커패시터 및 적층 세라믹 커패시터 실장 기판
US9460855B2 (en) 2013-10-01 2016-10-04 Samsung Electro-Mechanics Co., Ltd. Multilayer ceramic capacitor and board having the same
KR20140038912A (ko) * 2013-10-01 2014-03-31 삼성전기주식회사 적층 세라믹 커패시터 및 그 실장 기판
KR101630031B1 (ko) * 2014-04-02 2016-06-13 삼성전기주식회사 적층 칩 전자부품 및 그 실장 기판
JP6137047B2 (ja) * 2014-05-09 2017-05-31 株式会社村田製作所 積層コンデンサ及びその使用方法
EP2947757A1 (en) * 2014-05-21 2015-11-25 Keko-Varicon d.o.o. Electronic component with stacked elements
JP2017117865A (ja) * 2015-12-22 2017-06-29 株式会社村田製作所 コンデンサ及びコンデンサ内蔵基板
JP6728697B2 (ja) * 2016-01-15 2020-07-22 株式会社村田製作所 複合電子部品およびこれを備えた実装体
CN105914036A (zh) 2016-06-08 2016-08-31 福建火炬电子科技股份有限公司 一种低esl的多层陶瓷电容器
WO2018043397A1 (ja) * 2016-08-29 2018-03-08 京セラ株式会社 積層型コンデンサ
US10504655B2 (en) * 2016-12-22 2019-12-10 Samsung Electro-Mechanics Co., Ltd. Composite electronic component and board having the same
US10607777B2 (en) 2017-02-06 2020-03-31 Avx Corporation Integrated capacitor filter and integrated capacitor filter with varistor function
JP2018206813A (ja) * 2017-05-30 2018-12-27 株式会社村田製作所 積層セラミック電子部品

Also Published As

Publication number Publication date
TWI853922B (zh) 2024-09-01
CN113711323A (zh) 2021-11-26
US12051548B2 (en) 2024-07-30
WO2020219359A1 (en) 2020-10-29
KR20210146321A (ko) 2021-12-03
TW202109579A (zh) 2021-03-01
JP2024073627A (ja) 2024-05-29
JP2022541973A (ja) 2022-09-29
US20200343050A1 (en) 2020-10-29
KR102791694B1 (ko) 2025-04-07
CN116864314A (zh) 2023-10-10
US11621129B2 (en) 2023-04-04
US20230238186A1 (en) 2023-07-27

Similar Documents

Publication Publication Date Title
EP2534661B1 (de) Keramisches vielschichtbauelement
DE112020002054T5 (de) Integrierte komponente, einen kondensator und einen eigenständigen varistor aufweisend
EP1606831B1 (de) Elektrisches vielschichtbauelement
EP1350257B1 (de) Elektrisches vielschichtbauelement und entstörschaltung mit dem bauelement
DE102007020783A1 (de) Elektrisches Vielschichtbauelement
DE4008507A1 (de) Laminiertes lc-filter
DE112016005613T5 (de) Spannungsabhängig abstimmbarer mehrschichtiger Kondensator
EP2306470B1 (de) Elektrisches Bauelement
EP1369880B1 (de) Elektrisches Vielschichtbauelement und Schaltungsanordnung
EP1425762B1 (de) Elektrisches vielschichtbauelement
DE102009014542B3 (de) Mehrschichtbauelement und Verfahren zur Herstellung
DE112018005239T5 (de) Abstimmbarer Mehrschichtkondensator mit hoher Kapazität und Array
DE112020002057T5 (de) Komponente mit niedriger Induktivität
DE102020118857B4 (de) Vielschichtkondensator
DE102010036270A1 (de) Keramisches Bauelement und Verfahren zur Herstellung eines keramischen Bauelements
EP1369881B1 (de) Elektrisches Vielschichtbauelement
EP2191483B1 (de) Elektrisches vielschichtbauelement
DE102007046607A1 (de) Elektrisches Vielschichtbauelement sowie Verfahren zur Herstellung eines elektrischen Vielschichtbauelements
DE102019111989B3 (de) Keramisches Bauelement und Verfahren zur Herstellung des keramischen Bauelements
EP1560235B1 (de) Elektrisches Vielschichtbauelement
DE10134751C1 (de) Elektrokeramisches Bauelement
DE112021006016T5 (de) System und Verfahren zum Mischen von Radiofrequenzsignalen
EP1911052B1 (de) Elektrisches bauelement
DE102025106368A1 (de) Elektronisches bauteil
DE102013110978A1 (de) Keramischer Vielschichtkondensator

Legal Events

Date Code Title Description
R081 Change of applicant/patentee

Owner name: KYOCERA AVX COMPONENTS CORPORATION (N. D. GES., US

Free format text: FORMER OWNER: AVX CORPORATION, FOUNTAIN INN, SC, US