KR102761499B1 - 열전도성 시트 - Google Patents

열전도성 시트 Download PDF

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Publication number
KR102761499B1
KR102761499B1 KR1020217008305A KR20217008305A KR102761499B1 KR 102761499 B1 KR102761499 B1 KR 102761499B1 KR 1020217008305 A KR1020217008305 A KR 1020217008305A KR 20217008305 A KR20217008305 A KR 20217008305A KR 102761499 B1 KR102761499 B1 KR 102761499B1
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South Korea
Prior art keywords
thermally conductive
conductive sheet
anisotropic filler
filler
anisotropic
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KR1020217008305A
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English (en)
Korean (ko)
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KR20210063339A (ko
Inventor
히로미치 이와자키
Original Assignee
세키수이 폴리머텍 가부시키가이샤
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C08K3/042—Graphene or derivatives, e.g. graphene oxides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20472—Sheet interfaces
    • H05K7/20481—Sheet interfaces characterised by the material composition exhibiting specific thermal properties
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/251—Organics
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C08L101/16—Compositions of unspecified macromolecular compounds the macromolecular compounds being biodegradable
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H01L23/3733—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/257—Arrangements for cooling characterised by their materials having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh or porous structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0812—Aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/06—Elements
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/08—Oxygen-containing compounds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/259—Ceramics or glasses

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
KR1020217008305A 2018-09-26 2019-09-25 열전도성 시트 Active KR102761499B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018180192 2018-09-26
JPJP-P-2018-180192 2018-09-26
PCT/JP2019/037554 WO2020067141A1 (ja) 2018-09-26 2019-09-25 熱伝導性シート

Publications (2)

Publication Number Publication Date
KR20210063339A KR20210063339A (ko) 2021-06-01
KR102761499B1 true KR102761499B1 (ko) 2025-02-04

Family

ID=69949643

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020217008305A Active KR102761499B1 (ko) 2018-09-26 2019-09-25 열전도성 시트

Country Status (7)

Country Link
US (1) US11987687B2 (https=)
EP (1) EP3860321B1 (https=)
JP (2) JP7618954B2 (https=)
KR (1) KR102761499B1 (https=)
CN (1) CN112715059B (https=)
TW (1) TWI856026B (https=)
WO (1) WO2020067141A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12595399B2 (en) * 2020-01-22 2026-04-07 3M Innovative Properties Company Electrically conductive adhesive layer
US12581949B2 (en) * 2020-01-22 2026-03-17 3M Innovative Properties Company Thermal interface layer
CN116096792B (zh) * 2020-09-30 2025-02-25 积水保力马科技株式会社 导热性片
JP6989675B1 (ja) * 2020-10-21 2022-01-05 デクセリアルズ株式会社 熱伝導性シート及び熱伝導性シートの製造方法
CN116888017B (zh) * 2021-02-05 2025-10-28 旭化成株式会社 气囊用多层复合体
JP2022126535A (ja) * 2021-02-18 2022-08-30 デクセリアルズ株式会社 熱伝導性シートの製造方法及び熱伝導性シート
WO2022210419A1 (ja) * 2021-03-31 2022-10-06 積水ポリマテック株式会社 熱伝導性シートの製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060234056A1 (en) 2005-04-14 2006-10-19 Tsinghua University Thermal interface material and method for making the same
JP2007326976A (ja) * 2006-06-08 2007-12-20 Polymatech Co Ltd 熱伝導性成形体及びその製造方法
WO2017179318A1 (ja) 2016-04-11 2017-10-19 ポリマテック・ジャパン株式会社 熱伝導性シート

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JPS6178389U (https=) 1984-10-29 1986-05-26
JP2001156227A (ja) * 1999-11-30 2001-06-08 Polymatech Co Ltd 異方性熱伝導性シート
JP4814550B2 (ja) 2005-06-03 2011-11-16 ポリマテック株式会社 熱伝導性成形体の製造方法
JP5140302B2 (ja) * 2007-03-29 2013-02-06 ポリマテック株式会社 熱伝導性シート
JP5254870B2 (ja) 2009-04-22 2013-08-07 ポリマテック株式会社 熱伝導性シート及びその製造方法
JP5416174B2 (ja) * 2011-07-08 2014-02-12 ポリマテック株式会社 熱伝導性成形体
JP5953160B2 (ja) 2012-07-27 2016-07-20 ポリマテック・ジャパン株式会社 熱伝導性成形体の製造方法
JP2015073067A (ja) 2013-09-06 2015-04-16 バンドー化学株式会社 熱伝導性樹脂成形品
JP6397229B2 (ja) 2014-06-12 2018-09-26 国立研究開発法人産業技術総合研究所 厚み方向に高い熱伝導率を有する熱伝導性部材及び積層体
JP6178389B2 (ja) 2014-12-25 2017-08-09 デクセリアルズ株式会社 熱伝導シートの製造方法、熱伝導シート、及び半導体装置
US10591229B2 (en) 2015-06-25 2020-03-17 Sekisui Polymatech Co., Ltd. Thermally conductive sheet
EP3315277B1 (en) * 2015-06-25 2021-03-10 Konica Minolta, Inc. Forming mold, optical element, and method for producing optical element
JP6524831B2 (ja) 2015-07-16 2019-06-05 富士ゼロックス株式会社 情報処理装置及びプログラム
WO2017018232A1 (ja) 2015-07-29 2017-02-02 三井金属鉱業株式会社 粗化処理銅箔、銅張積層板及びプリント配線板
JP2017135137A (ja) 2016-01-25 2017-08-03 東洋紡株式会社 絶縁高熱伝導性シート、およびその製法、および積層体
JP6945523B2 (ja) 2016-04-14 2021-10-06 三井金属鉱業株式会社 表面処理銅箔、キャリア付銅箔、並びにそれらを用いた銅張積層板及びプリント配線板の製造方法
US10495788B2 (en) * 2016-05-17 2019-12-03 Canon Kabushiki Kaisha Resin molded product, interchangeable lens for camera, and method of manufacturing resin molded product
JP2018056315A (ja) 2016-09-28 2018-04-05 デクセリアルズ株式会社 電磁波吸収熱伝導シート、電磁波吸収熱伝導シートの製造方法及び半導体装置
JPWO2018123012A1 (ja) * 2016-12-28 2019-10-31 日立化成株式会社 熱伝導シート、熱伝導シートの製造方法及び放熱装置
CN108407425A (zh) * 2018-02-11 2018-08-17 东莞市明骏智能科技有限公司 一种石墨烯-碳纳米管纤维基导热垫片及其制备方法
CN112368826A (zh) * 2018-06-22 2021-02-12 积水保力马科技株式会社 热传导性片
WO2021065522A1 (ja) * 2019-09-30 2021-04-08 積水ポリマテック株式会社 熱伝導性シート及びその製造方法
US11618247B2 (en) * 2019-11-01 2023-04-04 Sekisui Polymatech Co., Ltd. Thermally conductive sheet and production method for same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060234056A1 (en) 2005-04-14 2006-10-19 Tsinghua University Thermal interface material and method for making the same
JP2007326976A (ja) * 2006-06-08 2007-12-20 Polymatech Co Ltd 熱伝導性成形体及びその製造方法
WO2017179318A1 (ja) 2016-04-11 2017-10-19 ポリマテック・ジャパン株式会社 熱伝導性シート

Also Published As

Publication number Publication date
KR20210063339A (ko) 2021-06-01
EP3860321A4 (en) 2022-06-29
CN112715059B (zh) 2024-09-06
TW202036816A (zh) 2020-10-01
WO2020067141A1 (ja) 2020-04-02
TWI856026B (zh) 2024-09-21
US11987687B2 (en) 2024-05-21
JP2023181341A (ja) 2023-12-21
JP7618954B2 (ja) 2025-01-22
EP3860321A1 (en) 2021-08-04
CN112715059A (zh) 2021-04-27
US20210388175A1 (en) 2021-12-16
JPWO2020067141A1 (ja) 2021-09-30
EP3860321B1 (en) 2024-10-02

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