KR102689596B1 - 정전 척용 볼록 내측 표면을 갖는 환형 에지 시일부 - Google Patents

정전 척용 볼록 내측 표면을 갖는 환형 에지 시일부 Download PDF

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Publication number
KR102689596B1
KR102689596B1 KR1020160099788A KR20160099788A KR102689596B1 KR 102689596 B1 KR102689596 B1 KR 102689596B1 KR 1020160099788 A KR1020160099788 A KR 1020160099788A KR 20160099788 A KR20160099788 A KR 20160099788A KR 102689596 B1 KR102689596 B1 KR 102689596B1
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KR
South Korea
Prior art keywords
radially
edge
adhesive bonding
layer
top surface
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Application number
KR1020160099788A
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English (en)
Korean (ko)
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KR20170018779A (ko
Inventor
매튜 마이클 리
Original Assignee
램 리써치 코포레이션
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Publication of KR20170018779A publication Critical patent/KR20170018779A/ko
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Publication of KR102689596B1 publication Critical patent/KR102689596B1/ko
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Classifications

    • H01L21/6833—
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16J—PISTONS; CYLINDERS; SEALINGS
    • F16J15/00—Sealings
    • F16J15/02—Sealings between relatively-stationary surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • H01L21/6831—
    • H01L21/6835—
    • H01L21/68721—
    • H01L21/68735—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0441—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7606—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7611—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
KR1020160099788A 2015-08-10 2016-08-05 정전 척용 볼록 내측 표면을 갖는 환형 에지 시일부 Active KR102689596B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201562203118P 2015-08-10 2015-08-10
US62/203,118 2015-08-10
US14/836,202 2015-08-26
US14/836,202 US20170047238A1 (en) 2015-08-10 2015-08-26 Annular edge seal with convex inner surface for electrostatic chuck

Publications (2)

Publication Number Publication Date
KR20170018779A KR20170018779A (ko) 2017-02-20
KR102689596B1 true KR102689596B1 (ko) 2024-07-29

Family

ID=57994425

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020160099788A Active KR102689596B1 (ko) 2015-08-10 2016-08-05 정전 척용 볼록 내측 표면을 갖는 환형 에지 시일부

Country Status (6)

Country Link
US (1) US20170047238A1 (enExample)
JP (1) JP7018703B2 (enExample)
KR (1) KR102689596B1 (enExample)
CN (1) CN106449504B (enExample)
SG (2) SG10201606452RA (enExample)
TW (1) TWI716430B (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11127619B2 (en) 2016-06-07 2021-09-21 Applied Materials, Inc. Workpiece carrier for high power with enhanced edge sealing
CN107195578B (zh) * 2017-07-17 2019-11-29 北京北方华创微电子装备有限公司 静电卡盘
CN109881184B (zh) * 2019-03-29 2022-03-25 拓荆科技股份有限公司 具有静电力抑制的基板承载装置
KR20250069594A (ko) * 2022-09-16 2025-05-19 램 리써치 코포레이션 기판 지지부를 보호하는 스프링 로딩된 시일 커버 밴드
KR20250064814A (ko) * 2023-11-03 2025-05-12 피에스케이 주식회사 기판 지지 유닛 및 기판 처리 장치

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100027188A1 (en) * 2008-07-30 2010-02-04 Hsi-Shui Liu Replaceable Electrostatic Chuck Sidewall Shield
CN201973238U (zh) * 2010-09-26 2011-09-14 北京北方微电子基地设备工艺研究中心有限责任公司 密封圈及应用该密封圈的等离子体加工设备
JP2012187923A (ja) * 2011-02-25 2012-10-04 Toray Ind Inc 樹脂注入成形装置およびそれを用いたｒｔｍ成形方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19980018986A (ko) * 1996-08-26 1998-06-05 조셉 제이. 스위니 정전기 척을 사용하여 제품을 냉각하기 위한 방법 및 장치(method and apparatus for cooling a workpiece using an electrostatic chuck)
US6982178B2 (en) 2002-06-10 2006-01-03 E Ink Corporation Components and methods for use in electro-optic displays
JP4458995B2 (ja) 2004-09-10 2010-04-28 京セラ株式会社 ウェハ支持部材
JP2009024712A (ja) 2007-07-17 2009-02-05 Nok Corp 密封装置
US8794638B2 (en) * 2009-02-27 2014-08-05 Halliburton Energy Services, Inc. Sealing array for high temperature applications
US9859142B2 (en) * 2011-10-20 2018-01-02 Lam Research Corporation Edge seal for lower electrode assembly
US9869392B2 (en) 2011-10-20 2018-01-16 Lam Research Corporation Edge seal for lower electrode assembly
US10090211B2 (en) 2013-12-26 2018-10-02 Lam Research Corporation Edge seal for lower electrode assembly
TWI613753B (zh) 2015-02-16 2018-02-01 麥豐密封科技股份有限公司 靜電吸附承盤側壁之改良密封件

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100027188A1 (en) * 2008-07-30 2010-02-04 Hsi-Shui Liu Replaceable Electrostatic Chuck Sidewall Shield
CN201973238U (zh) * 2010-09-26 2011-09-14 北京北方微电子基地设备工艺研究中心有限责任公司 密封圈及应用该密封圈的等离子体加工设备
JP2012187923A (ja) * 2011-02-25 2012-10-04 Toray Ind Inc 樹脂注入成形装置およびそれを用いたｒｔｍ成形方法

Also Published As

Publication number Publication date
SG10202001170TA (en) 2020-03-30
US20170047238A1 (en) 2017-02-16
CN106449504B (zh) 2021-04-06
TWI716430B (zh) 2021-01-21
JP2017041631A (ja) 2017-02-23
CN106449504A (zh) 2017-02-22
SG10201606452RA (en) 2017-03-30
KR20170018779A (ko) 2017-02-20
TW201724339A (zh) 2017-07-01
JP7018703B2 (ja) 2022-02-14

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