JP7018703B2 - 静電チャック用の凸形の内面を有する環状エッジシール - Google Patents

静電チャック用の凸形の内面を有する環状エッジシール Download PDF

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Publication number
JP7018703B2
JP7018703B2 JP2016152437A JP2016152437A JP7018703B2 JP 7018703 B2 JP7018703 B2 JP 7018703B2 JP 2016152437 A JP2016152437 A JP 2016152437A JP 2016152437 A JP2016152437 A JP 2016152437A JP 7018703 B2 JP7018703 B2 JP 7018703B2
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Japan
Prior art keywords
radial
main body
corner
electrostatic chuck
edge seal
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JP2016152437A
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English (en)
Japanese (ja)
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JP2017041631A5 (enExample
JP2017041631A (ja
Inventor
マシュー・マイケル・リー
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Lam Research Corp
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Lam Research Corp
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16J—PISTONS; CYLINDERS; SEALINGS
    • F16J15/00—Sealings
    • F16J15/02—Sealings between relatively-stationary surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
JP2016152437A 2015-08-10 2016-08-03 静電チャック用の凸形の内面を有する環状エッジシール Active JP7018703B2 (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201562203118P 2015-08-10 2015-08-10
US62/203,118 2015-08-10
US14/836,202 2015-08-26
US14/836,202 US20170047238A1 (en) 2015-08-10 2015-08-26 Annular edge seal with convex inner surface for electrostatic chuck

Publications (3)

Publication Number Publication Date
JP2017041631A JP2017041631A (ja) 2017-02-23
JP2017041631A5 JP2017041631A5 (enExample) 2019-09-12
JP7018703B2 true JP7018703B2 (ja) 2022-02-14

Family

ID=57994425

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016152437A Active JP7018703B2 (ja) 2015-08-10 2016-08-03 静電チャック用の凸形の内面を有する環状エッジシール

Country Status (6)

Country Link
US (1) US20170047238A1 (enExample)
JP (1) JP7018703B2 (enExample)
KR (1) KR102689596B1 (enExample)
CN (1) CN106449504B (enExample)
SG (2) SG10202001170TA (enExample)
TW (1) TWI716430B (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11127619B2 (en) 2016-06-07 2021-09-21 Applied Materials, Inc. Workpiece carrier for high power with enhanced edge sealing
CN107195578B (zh) * 2017-07-17 2019-11-29 北京北方华创微电子装备有限公司 静电卡盘
CN109881184B (zh) * 2019-03-29 2022-03-25 拓荆科技股份有限公司 具有静电力抑制的基板承载装置
WO2024059276A1 (en) * 2022-09-16 2024-03-21 Lam Research Corporation Spring-loaded seal cover band for protecting a substrate support
KR20250064814A (ko) * 2023-11-03 2025-05-12 피에스케이 주식회사 기판 지지 유닛 및 기판 처리 장치

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005529361A (ja) 2002-06-10 2005-09-29 イー−インク コーポレイション 電気光学表示装置を形成および検査するための構成部品および方法
JP2006080389A (ja) 2004-09-10 2006-03-23 Kyocera Corp ウェハ支持部材
JP2009024712A (ja) 2007-07-17 2009-02-05 Nok Corp 密封装置
US20100027188A1 (en) 2008-07-30 2010-02-04 Hsi-Shui Liu Replaceable Electrostatic Chuck Sidewall Shield
CN201973238U (zh) 2010-09-26 2011-09-14 北京北方微电子基地设备工艺研究中心有限责任公司 密封圈及应用该密封圈的等离子体加工设备
JP2015501538A (ja) 2011-10-20 2015-01-15 ラム リサーチ コーポレーションＬａｍ Ｒｅｓｅａｒｃｈ Ｃｏｒｐｏｒａｔｉｏｎ 下方電極アセンブリのためのエッジシール
US20150187614A1 (en) 2013-12-26 2015-07-02 Lam Research Corporation Edge seal for lower electrode assembly
JP2016152414A (ja) 2015-02-16 2016-08-22 麥豐密封科技股▲分▼有限公司 静電チャックのためのバリアシール

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW406346B (en) * 1996-08-26 2000-09-21 Applied Materials Inc Method and apparatus for cooling a workpiece using an electrostatic chuck
US8794638B2 (en) * 2009-02-27 2014-08-05 Halliburton Energy Services, Inc. Sealing array for high temperature applications
JP5920655B2 (ja) * 2011-02-25 2016-05-18 東レ株式会社 樹脂注入成形装置およびそれを用いたｒｔｍ成形方法
US9859142B2 (en) * 2011-10-20 2018-01-02 Lam Research Corporation Edge seal for lower electrode assembly

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005529361A (ja) 2002-06-10 2005-09-29 イー−インク コーポレイション 電気光学表示装置を形成および検査するための構成部品および方法
JP2006080389A (ja) 2004-09-10 2006-03-23 Kyocera Corp ウェハ支持部材
JP2009024712A (ja) 2007-07-17 2009-02-05 Nok Corp 密封装置
US20100027188A1 (en) 2008-07-30 2010-02-04 Hsi-Shui Liu Replaceable Electrostatic Chuck Sidewall Shield
CN201973238U (zh) 2010-09-26 2011-09-14 北京北方微电子基地设备工艺研究中心有限责任公司 密封圈及应用该密封圈的等离子体加工设备
JP2015501538A (ja) 2011-10-20 2015-01-15 ラム リサーチ コーポレーションＬａｍ Ｒｅｓｅａｒｃｈ Ｃｏｒｐｏｒａｔｉｏｎ 下方電極アセンブリのためのエッジシール
US20150187614A1 (en) 2013-12-26 2015-07-02 Lam Research Corporation Edge seal for lower electrode assembly
JP2016152414A (ja) 2015-02-16 2016-08-22 麥豐密封科技股▲分▼有限公司 静電チャックのためのバリアシール

Also Published As

Publication number Publication date
TWI716430B (zh) 2021-01-21
CN106449504A (zh) 2017-02-22
SG10202001170TA (en) 2020-03-30
KR102689596B1 (ko) 2024-07-29
SG10201606452RA (en) 2017-03-30
CN106449504B (zh) 2021-04-06
US20170047238A1 (en) 2017-02-16
KR20170018779A (ko) 2017-02-20
TW201724339A (zh) 2017-07-01
JP2017041631A (ja) 2017-02-23

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