KR102667732B1 - 고 신뢰성 응용을 위한 표준 sac 합금에 대한 저은 주석계 대안 땜납 합금 - Google Patents

고 신뢰성 응용을 위한 표준 sac 합금에 대한 저은 주석계 대안 땜납 합금 Download PDF

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KR102667732B1
KR102667732B1 KR1020207015369A KR20207015369A KR102667732B1 KR 102667732 B1 KR102667732 B1 KR 102667732B1 KR 1020207015369 A KR1020207015369 A KR 1020207015369A KR 20207015369 A KR20207015369 A KR 20207015369A KR 102667732 B1 KR102667732 B1 KR 102667732B1
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alloy
solder
weight percent
sac305
art
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KR20200089273A (ko
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엠디 하스나인
릭 와이 크오
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알파 어셈블리 솔루션스 인크.
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0227—Rods or wires
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams or slurries
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Glass Compositions (AREA)
  • Conductive Materials (AREA)
KR1020207015369A 2017-11-09 2018-10-31 고 신뢰성 응용을 위한 표준 sac 합금에 대한 저은 주석계 대안 땜납 합금 Active KR102667732B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201762583934P 2017-11-09 2017-11-09
US62/583,934 2017-11-09
US16/022,337 2018-06-28
US16/022,337 US11577343B2 (en) 2017-11-09 2018-06-28 Low-silver alternative to standard SAC alloys for high reliability applications
PCT/US2018/058463 WO2019094242A1 (en) 2017-11-09 2018-10-31 Low-silver tin based alternative solder alloy to standard sac alloys for high reliability applications

Publications (2)

Publication Number Publication Date
KR20200089273A KR20200089273A (ko) 2020-07-24
KR102667732B1 true KR102667732B1 (ko) 2024-05-20

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020207015369A Active KR102667732B1 (ko) 2017-11-09 2018-10-31 고 신뢰성 응용을 위한 표준 sac 합금에 대한 저은 주석계 대안 땜납 합금

Country Status (9)

Country Link
US (1) US11577343B2 (https=)
EP (2) EP3707285B1 (https=)
JP (1) JP2021502259A (https=)
KR (1) KR102667732B1 (https=)
CN (1) CN111542624A (https=)
HU (1) HUE065228T2 (https=)
SG (1) SG11202004067UA (https=)
TW (1) TWI782134B (https=)
WO (1) WO2019094242A1 (https=)

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KR102187085B1 (ko) * 2019-01-24 2020-12-04 주식회사 경동엠텍 고온 및 진동환경에 적합한 무연솔더 합금 조성물 및 그 제조방법
TWI814081B (zh) 2019-09-02 2023-09-01 美商阿爾發金屬化工公司 高溫超高可靠性合金、其製造方法及其應用
WO2024034689A1 (ja) * 2022-08-12 2024-02-15 千住金属工業株式会社 はんだ合金、はんだペースト及びはんだ継手
CN117798544B (zh) * 2023-11-10 2024-09-20 苏州优诺电子材料科技有限公司 一种高强抗热疲劳无铅焊料合金及其制备方法
WO2025131329A1 (en) 2023-12-20 2025-06-26 Alpha Assembly Solutions Inc. Solder joint comprising a tin alloy and an encapsulant comprising silica particles in an epoxy resin, and electronic device
JP2026051939A (ja) * 2024-09-10 2026-03-23 株式会社タムラ製作所 はんだ合金、ソルダペースト、プリント回路基板および電子制御装置
CN119525811B (zh) * 2025-01-20 2025-04-08 深圳市唯特偶新材料股份有限公司 一种防枝晶高可靠锡膏及其制备方法

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JP2004141910A (ja) * 2002-10-23 2004-05-20 Senju Metal Ind Co Ltd 鉛フリーはんだ合金
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WO2006129713A1 (ja) * 2005-06-03 2006-12-07 Senju Metal Industry Co., Ltd. 鉛フリーはんだ合金
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WO2011102034A1 (ja) * 2010-02-16 2011-08-25 株式会社タムラ製作所 鉛フリーはんだ合金と、これを用いたソルダペースト及び実装品
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JP5413926B2 (ja) * 2010-08-18 2014-02-12 新日鉄住金マテリアルズ株式会社 半導体実装用半田ボール及び電子部材
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US20020117539A1 (en) * 2000-12-11 2002-08-29 Nec Corporation Solder, method for processing surface of printed wiring board, and method for mounting electronic part
JP2002246742A (ja) 2000-12-11 2002-08-30 Nec Toyama Ltd はんだ、それを使用したプリント配線基板の表面処理方法及びそれを使用した電子部品の実装方法

Also Published As

Publication number Publication date
EP4299238A2 (en) 2024-01-03
WO2019094242A1 (en) 2019-05-16
JP2021502259A (ja) 2021-01-28
US11577343B2 (en) 2023-02-14
KR20200089273A (ko) 2020-07-24
CN111542624A (zh) 2020-08-14
EP4299238A3 (en) 2024-03-27
TW201923103A (zh) 2019-06-16
EP3707285B1 (en) 2023-11-29
SG11202004067UA (en) 2020-05-28
US20190134758A1 (en) 2019-05-09
EP3707285A1 (en) 2020-09-16
TWI782134B (zh) 2022-11-01
HUE065228T2 (hu) 2024-05-28

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