HUE065228T2 - Alacsony ezüsttartalmú ónalapú alternatív forrasztóötvözet a szabványos sac ötvözetekhez, nagy megbízhatóságú alkalmazásokhoz - Google Patents

Alacsony ezüsttartalmú ónalapú alternatív forrasztóötvözet a szabványos sac ötvözetekhez, nagy megbízhatóságú alkalmazásokhoz

Info

Publication number
HUE065228T2
HUE065228T2 HUE18804799A HUE18804799A HUE065228T2 HU E065228 T2 HUE065228 T2 HU E065228T2 HU E18804799 A HUE18804799 A HU E18804799A HU E18804799 A HUE18804799 A HU E18804799A HU E065228 T2 HUE065228 T2 HU E065228T2
Authority
HU
Hungary
Prior art keywords
low
high reliability
solder alloy
tin based
silver tin
Prior art date
Application number
HUE18804799A
Other languages
English (en)
Hungarian (hu)
Inventor
Hasnine, Md
Original Assignee
Alpha Assembly Solutions Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alpha Assembly Solutions Inc filed Critical Alpha Assembly Solutions Inc
Publication of HUE065228T2 publication Critical patent/HUE065228T2/hu

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0227—Rods or wires
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams or slurries
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Glass Compositions (AREA)
  • Conductive Materials (AREA)
HUE18804799A 2017-11-09 2018-10-31 Alacsony ezüsttartalmú ónalapú alternatív forrasztóötvözet a szabványos sac ötvözetekhez, nagy megbízhatóságú alkalmazásokhoz HUE065228T2 (hu)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201762583934P 2017-11-09 2017-11-09
US16/022,337 US11577343B2 (en) 2017-11-09 2018-06-28 Low-silver alternative to standard SAC alloys for high reliability applications

Publications (1)

Publication Number Publication Date
HUE065228T2 true HUE065228T2 (hu) 2024-05-28

Family

ID=66326662

Family Applications (1)

Application Number Title Priority Date Filing Date
HUE18804799A HUE065228T2 (hu) 2017-11-09 2018-10-31 Alacsony ezüsttartalmú ónalapú alternatív forrasztóötvözet a szabványos sac ötvözetekhez, nagy megbízhatóságú alkalmazásokhoz

Country Status (9)

Country Link
US (1) US11577343B2 (https=)
EP (2) EP3707285B1 (https=)
JP (1) JP2021502259A (https=)
KR (1) KR102667732B1 (https=)
CN (1) CN111542624A (https=)
HU (1) HUE065228T2 (https=)
SG (1) SG11202004067UA (https=)
TW (1) TWI782134B (https=)
WO (1) WO2019094242A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
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KR102187085B1 (ko) * 2019-01-24 2020-12-04 주식회사 경동엠텍 고온 및 진동환경에 적합한 무연솔더 합금 조성물 및 그 제조방법
TWI814081B (zh) 2019-09-02 2023-09-01 美商阿爾發金屬化工公司 高溫超高可靠性合金、其製造方法及其應用
WO2024034689A1 (ja) * 2022-08-12 2024-02-15 千住金属工業株式会社 はんだ合金、はんだペースト及びはんだ継手
CN117798544B (zh) * 2023-11-10 2024-09-20 苏州优诺电子材料科技有限公司 一种高强抗热疲劳无铅焊料合金及其制备方法
WO2025131329A1 (en) 2023-12-20 2025-06-26 Alpha Assembly Solutions Inc. Solder joint comprising a tin alloy and an encapsulant comprising silica particles in an epoxy resin, and electronic device
JP2026051939A (ja) * 2024-09-10 2026-03-23 株式会社タムラ製作所 はんだ合金、ソルダペースト、プリント回路基板および電子制御装置
CN119525811B (zh) * 2025-01-20 2025-04-08 深圳市唯特偶新材料股份有限公司 一种防枝晶高可靠锡膏及其制备方法

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US6176947B1 (en) 1998-12-31 2001-01-23 H-Technologies Group, Incorporated Lead-free solders
SG98429A1 (en) * 1999-10-12 2003-09-19 Singapore Asahi Chemical & Solder Ind Pte Ltd Lead-free solders
JP3599101B2 (ja) * 2000-12-11 2004-12-08 株式会社トッパンＮｅｃサーキットソリューションズ はんだ、それを使用したプリント配線基板の表面処理方法及びそれを使用した電子部品の実装方法
US8216395B2 (en) * 2001-06-28 2012-07-10 Senju Metal Industry Co., Ltd. Lead-free solder alloy
JP2004141910A (ja) * 2002-10-23 2004-05-20 Senju Metal Ind Co Ltd 鉛フリーはんだ合金
GB2419137A (en) * 2004-10-15 2006-04-19 Alpha Fry Ltd Solder alloy
WO2006129713A1 (ja) * 2005-06-03 2006-12-07 Senju Metal Industry Co., Ltd. 鉛フリーはんだ合金
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KR101243410B1 (ko) * 2007-07-13 2013-03-13 센주긴조쿠고교 가부시키가이샤 차재 실장용 무납 땜납과 차재 전자 회로
DE202009019184U1 (de) * 2009-08-29 2017-11-14 Umicore Ag & Co. Kg Lotlegierung
WO2011102034A1 (ja) * 2010-02-16 2011-08-25 株式会社タムラ製作所 鉛フリーはんだ合金と、これを用いたソルダペースト及び実装品
JP2011251310A (ja) 2010-06-02 2011-12-15 Nippon Genma:Kk 鉛フリーはんだ合金
JP5413926B2 (ja) * 2010-08-18 2014-02-12 新日鉄住金マテリアルズ株式会社 半導体実装用半田ボール及び電子部材
WO2012127642A1 (ja) * 2011-03-23 2012-09-27 千住金属工業株式会社 鉛フリーはんだ合金
BR112014032941A2 (pt) * 2012-06-30 2017-06-27 Senju Metal Industry Co bola de solda sem chumbo
JP5893528B2 (ja) * 2012-07-27 2016-03-23 新日鉄住金マテリアルズ株式会社 無鉛はんだバンプ接合構造
US20150266137A1 (en) 2012-10-09 2015-09-24 Alpha Metals, Inc. Lead-free and antimony-free tin solder reliable at high temperatures
JP2015077601A (ja) 2013-04-02 2015-04-23 千住金属工業株式会社 鉛フリーはんだ合金
JP5730354B2 (ja) 2013-07-17 2015-06-10 ハリマ化成株式会社 はんだ組成物、ソルダペーストおよび電子回路基板
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JP6145164B2 (ja) * 2013-09-11 2017-06-07 千住金属工業株式会社 鉛フリーはんだ、鉛フリーはんだボール、この鉛フリーはんだを使用したはんだ継手およびこのはんだ継手を有する半導体回路
JP2016019992A (ja) 2014-07-14 2016-02-04 株式会社日本スペリア社 アルミニウム用はんだ及びはんだ継手
JP5723056B1 (ja) * 2014-12-15 2015-05-27 ハリマ化成株式会社 はんだ合金、ソルダペーストおよび電子回路基板
US20160279741A1 (en) 2015-03-24 2016-09-29 Tamura Corporation Lead-free solder alloy, electronic circuit board, and electronic control device
US10518362B2 (en) * 2015-07-24 2019-12-31 Harima Chemicals, Incorporated Solder alloy, solder paste, and electronic circuit board
US10195698B2 (en) 2015-09-03 2019-02-05 AIM Metals & Alloys Inc. Lead-free high reliability solder alloys
JP6402127B2 (ja) * 2016-03-09 2018-10-10 株式会社タムラ製作所 電子部品の接合方法
BR112018068596A2 (pt) * 2016-03-22 2019-02-12 Tamura Corporation liga de soldas sem chumbo, composição de fluxo, composição de pasta de solda, placa de circuito eletrônico, e controlador eletrônico
US20180102464A1 (en) * 2016-10-06 2018-04-12 Alpha Assembly Solutions Inc. Advanced Solder Alloys For Electronic Interconnects

Also Published As

Publication number Publication date
EP4299238A2 (en) 2024-01-03
WO2019094242A1 (en) 2019-05-16
JP2021502259A (ja) 2021-01-28
US11577343B2 (en) 2023-02-14
KR20200089273A (ko) 2020-07-24
KR102667732B1 (ko) 2024-05-20
CN111542624A (zh) 2020-08-14
EP4299238A3 (en) 2024-03-27
TW201923103A (zh) 2019-06-16
EP3707285B1 (en) 2023-11-29
SG11202004067UA (en) 2020-05-28
US20190134758A1 (en) 2019-05-09
EP3707285A1 (en) 2020-09-16
TWI782134B (zh) 2022-11-01

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