TWI782134B - 用於高信賴度應用的標準sac合金之低銀替代方案 - Google Patents

用於高信賴度應用的標準sac合金之低銀替代方案 Download PDF

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Publication number
TWI782134B
TWI782134B TW107139607A TW107139607A TWI782134B TW I782134 B TWI782134 B TW I782134B TW 107139607 A TW107139607 A TW 107139607A TW 107139607 A TW107139607 A TW 107139607A TW I782134 B TWI782134 B TW I782134B
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TW
Taiwan
Prior art keywords
alloy
solder
alloys
sac305
silver
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TW107139607A
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English (en)
Chinese (zh)
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TW201923103A (zh
Inventor
姆德 哈斯耐
力偉 郭
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美商阿爾發金屬化工公司
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Application filed by 美商阿爾發金屬化工公司 filed Critical 美商阿爾發金屬化工公司
Publication of TW201923103A publication Critical patent/TW201923103A/zh
Application granted granted Critical
Publication of TWI782134B publication Critical patent/TWI782134B/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0227—Rods or wires
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams or slurries
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Glass Compositions (AREA)
  • Conductive Materials (AREA)
TW107139607A 2017-11-09 2018-11-08 用於高信賴度應用的標準sac合金之低銀替代方案 TWI782134B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201762583934P 2017-11-09 2017-11-09
US62/583,934 2017-11-09
US16/022,337 2018-06-28
US16/022,337 US11577343B2 (en) 2017-11-09 2018-06-28 Low-silver alternative to standard SAC alloys for high reliability applications

Publications (2)

Publication Number Publication Date
TW201923103A TW201923103A (zh) 2019-06-16
TWI782134B true TWI782134B (zh) 2022-11-01

Family

ID=66326662

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107139607A TWI782134B (zh) 2017-11-09 2018-11-08 用於高信賴度應用的標準sac合金之低銀替代方案

Country Status (9)

Country Link
US (1) US11577343B2 (https=)
EP (2) EP3707285B1 (https=)
JP (1) JP2021502259A (https=)
KR (1) KR102667732B1 (https=)
CN (1) CN111542624A (https=)
HU (1) HUE065228T2 (https=)
SG (1) SG11202004067UA (https=)
TW (1) TWI782134B (https=)
WO (1) WO2019094242A1 (https=)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102187085B1 (ko) * 2019-01-24 2020-12-04 주식회사 경동엠텍 고온 및 진동환경에 적합한 무연솔더 합금 조성물 및 그 제조방법
TWI814081B (zh) 2019-09-02 2023-09-01 美商阿爾發金屬化工公司 高溫超高可靠性合金、其製造方法及其應用
WO2024034689A1 (ja) * 2022-08-12 2024-02-15 千住金属工業株式会社 はんだ合金、はんだペースト及びはんだ継手
CN117798544B (zh) * 2023-11-10 2024-09-20 苏州优诺电子材料科技有限公司 一种高强抗热疲劳无铅焊料合金及其制备方法
WO2025131329A1 (en) 2023-12-20 2025-06-26 Alpha Assembly Solutions Inc. Solder joint comprising a tin alloy and an encapsulant comprising silica particles in an epoxy resin, and electronic device
JP2026051939A (ja) * 2024-09-10 2026-03-23 株式会社タムラ製作所 はんだ合金、ソルダペースト、プリント回路基板および電子制御装置
CN119525811B (zh) * 2025-01-20 2025-04-08 深圳市唯特偶新材料股份有限公司 一种防枝晶高可靠锡膏及其制备方法

Citations (4)

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TW527438B (en) * 2000-12-11 2003-04-11 Nec Toppan Circuit Solutions Solder, method for processing surface of printed wiring board, and method for mounting electronic part
JP2011251310A (ja) * 2010-06-02 2011-12-15 Nippon Genma:Kk 鉛フリーはんだ合金
CN106001978A (zh) * 2015-03-24 2016-10-12 株式会社田村制作所 无铅软钎料合金、电子电路基板和电子控制装置
TWI586811B (zh) * 2012-07-27 2017-06-11 新日鐵住金高新材料股份有限公司 Lead - free solder bump joint construction

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US8216395B2 (en) * 2001-06-28 2012-07-10 Senju Metal Industry Co., Ltd. Lead-free solder alloy
JP2004141910A (ja) * 2002-10-23 2004-05-20 Senju Metal Ind Co Ltd 鉛フリーはんだ合金
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WO2006129713A1 (ja) * 2005-06-03 2006-12-07 Senju Metal Industry Co., Ltd. 鉛フリーはんだ合金
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WO2011102034A1 (ja) * 2010-02-16 2011-08-25 株式会社タムラ製作所 鉛フリーはんだ合金と、これを用いたソルダペースト及び実装品
JP5413926B2 (ja) * 2010-08-18 2014-02-12 新日鉄住金マテリアルズ株式会社 半導体実装用半田ボール及び電子部材
WO2012127642A1 (ja) * 2011-03-23 2012-09-27 千住金属工業株式会社 鉛フリーはんだ合金
BR112014032941A2 (pt) * 2012-06-30 2017-06-27 Senju Metal Industry Co bola de solda sem chumbo
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JP6145164B2 (ja) * 2013-09-11 2017-06-07 千住金属工業株式会社 鉛フリーはんだ、鉛フリーはんだボール、この鉛フリーはんだを使用したはんだ継手およびこのはんだ継手を有する半導体回路
JP2016019992A (ja) 2014-07-14 2016-02-04 株式会社日本スペリア社 アルミニウム用はんだ及びはんだ継手
JP5723056B1 (ja) * 2014-12-15 2015-05-27 ハリマ化成株式会社 はんだ合金、ソルダペーストおよび電子回路基板
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JP6402127B2 (ja) * 2016-03-09 2018-10-10 株式会社タムラ製作所 電子部品の接合方法
BR112018068596A2 (pt) * 2016-03-22 2019-02-12 Tamura Corporation liga de soldas sem chumbo, composição de fluxo, composição de pasta de solda, placa de circuito eletrônico, e controlador eletrônico
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Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW527438B (en) * 2000-12-11 2003-04-11 Nec Toppan Circuit Solutions Solder, method for processing surface of printed wiring board, and method for mounting electronic part
JP2011251310A (ja) * 2010-06-02 2011-12-15 Nippon Genma:Kk 鉛フリーはんだ合金
TWI586811B (zh) * 2012-07-27 2017-06-11 新日鐵住金高新材料股份有限公司 Lead - free solder bump joint construction
CN106001978A (zh) * 2015-03-24 2016-10-12 株式会社田村制作所 无铅软钎料合金、电子电路基板和电子控制装置

Also Published As

Publication number Publication date
EP4299238A2 (en) 2024-01-03
WO2019094242A1 (en) 2019-05-16
JP2021502259A (ja) 2021-01-28
US11577343B2 (en) 2023-02-14
KR20200089273A (ko) 2020-07-24
KR102667732B1 (ko) 2024-05-20
CN111542624A (zh) 2020-08-14
EP4299238A3 (en) 2024-03-27
TW201923103A (zh) 2019-06-16
EP3707285B1 (en) 2023-11-29
SG11202004067UA (en) 2020-05-28
US20190134758A1 (en) 2019-05-09
EP3707285A1 (en) 2020-09-16
HUE065228T2 (hu) 2024-05-28

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