KR102658644B1 - Substrate processing apparatus and substrate processing system - Google Patents

Abstract

The purpose is to improve processing precision in each processing unit of a substrate processing apparatus and a substrate processing system.
To achieve this purpose, the substrate processing apparatus includes a plurality of processing units, a transfer unit, a plurality of sensor units, a storage unit, and one or more control units. A plurality of processing units process the substrate according to a recipe that specifies processing conditions. The transfer unit sequentially transfers a plurality of substrates in a group of substrates to a plurality of processing units. The plurality of sensor units acquire signals related to one or more types of indicators regarding the status of substrate processing in each processing unit. The storage unit stores a data group related to one or more types of indicators regarding the status of substrate processing in each processing unit based on signals acquired from the plurality of sensor units. One or more control units correct a part of the recipe based on the data group for processing of some of the substrates in the group of substrates using some of the processing units among the plurality of processing units.

Description

Substrate processing device and substrate processing system {SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING SYSTEM}

The present invention relates to a substrate processing apparatus and a substrate processing system. Substrates to be processed include, for example, semiconductor substrates, substrates for liquid crystal displays, substrates for flat panel displays such as organic EL (Electroluminescence) displays, substrates for optical disks, substrates for magnetic disks, substrates for magneto-optical disks, Includes port mask substrates, ceramic substrates, solar cell substrates, etc.

There is a substrate processing apparatus having a plurality of processing units that can perform various treatments such as cleaning and etching of the substrate using a processing liquid such as a chemical solution.

Additionally, there is a substrate processing system having a plurality of substrate processing devices and a management server connected to the plurality of substrate processing devices via a communication line (for example, refer to Patent Documents 1 to 3, etc.). These substrate processing systems include, for example, copying of processing recipes between substrate processing devices, preventing leakage of confidential information to a communication network outside the substrate processing device, or controlling the processing in the substrate processing device by a management server. Detection of processing abnormalities, etc. can be performed.

Japanese Patent Publication No. 9-153441 Japanese Patent Publication No. 11-215160 Japanese Patent No. 4064402 Specification

There is room for improvement in substrate processing devices and substrate processing systems in terms of improving processing precision in each processing unit.

The present invention has been made in view of the above problems, and its purpose is to provide a substrate processing apparatus and a substrate processing system capable of improving processing precision in each processing unit.

In order to solve the above problem, the substrate processing apparatus according to the first aspect includes a plurality of processing units, a transfer unit, a plurality of sensor units, a storage unit, and one or more control units. The plurality of processing units process the substrate according to a recipe that specifies processing conditions. The transfer unit sequentially transfers a plurality of substrates from a group of substrates to the plurality of processing units. The plurality of sensor units acquire signals related to one or more types of indicators regarding the status of substrate processing in each of the processing units. The storage unit stores a data group related to one or more types of indicators regarding the status of substrate processing in each of the plurality of processing units, based on signals acquired by the plurality of sensor units. The one or more control units correct at least a part of the recipe based on the data group for processing of at least one or more substrates of the group of substrates using one or more processing units among the plurality of processing units. do.

A substrate processing apparatus according to a second aspect is a substrate processing apparatus according to the first aspect, wherein the at least one control unit controls the data group for processing of the group of substrates using the plurality of processing units. Based on this, a first recipe correction is performed to collectively correct the recipes.

The substrate processing apparatus according to the third aspect is the substrate processing apparatus according to the second aspect, wherein the one or more control units perform the plurality of operations by the transfer unit according to the recipe after the first recipe correction is performed. A time schedule is set that defines timing for sequentially transferring the substrates to the plurality of processing units and timing for processing the plurality of substrates in the plurality of processing units.

The substrate processing apparatus according to the fourth aspect is the substrate processing apparatus according to any one of the first to third aspects, wherein the one or more control units are configured to control the group of processing units using some of the processing units among the plurality of processing units. For processing of some of the substrates, a second recipe correction is performed to correct a part of the recipe based on the data group.

The substrate processing apparatus according to the fifth aspect is the substrate processing apparatus according to the third aspect, wherein the one or more control units are configured to control a portion of the group of substrates using a portion of the plurality of processing units. Regarding the processing, a second recipe correction is performed to correct a part of the recipe based on the data group, and the time schedule is reset according to the recipe after the second recipe correction is performed.

The substrate processing apparatus according to the sixth aspect is the substrate processing apparatus according to the second or third aspect, wherein the one or more control units include a first control unit that performs the first recipe correction, and the plurality of processes. and a second control unit that performs a second recipe correction for correcting a part of the recipe based on the data group for processing of a part of the group of substrates using a part of the processing unit.

A substrate processing system according to the seventh aspect includes a plurality of substrate processing devices and a server connected to enable transmission and reception of data to the plurality of substrate processing devices. Each of the substrate processing devices has a plurality of processing units, a transfer unit, a plurality of sensor units, and one or more control units. The plurality of processing units process the substrate according to a recipe that specifies processing conditions. The transfer unit sequentially transfers a plurality of substrates from a group of substrates to the plurality of processing units. The plurality of sensor units acquire signals related to one or more types of indicators regarding the status of substrate processing in each of the processing units. The server, based on the signals acquired by the plurality of sensor units, generates a data group related to one or more types of indicators regarding the status of substrate processing in each of the plurality of processing units of the plurality of substrate processing apparatuses. It has a memory that remembers. In each of the substrate processing devices, the one or more control units provide information to the data group for processing of at least one substrate from the group of substrates using at least one processing unit among the plurality of processing units. Correct at least part of the recipe based on the above.

According to the substrate processing apparatus according to the first aspect, processing conditions to be performed on at least one substrate among a group of substrates, for example, according to the status of substrate processing in a plurality of processing units. By correcting the predefined recipe, processing appropriate to the situation can be performed on the substrate. As a result, for example, the precision of processing in each processing unit of the substrate processing apparatus can be improved.

According to the substrate processing apparatus according to the second aspect, for example, according to the situation of substrate processing in a plurality of processing units, recipes that define processing conditions for a group of substrates are collectively corrected, thereby adjusting the situation to the situation. Processing of the matching substrate can be easily performed. As a result, for example, the precision of processing in each processing unit of the substrate processing apparatus can be easily improved.

According to the substrate processing apparatus according to the third aspect, for example, after correcting the recipe for a group of substrates, a time schedule is set for transporting and processing a plurality of substrates in the group of substrates according to the corrected recipe. By setting this, transport and processing of a group of substrates within the substrate processing apparatus can be performed efficiently. As a result, for example, throughput in a substrate processing apparatus can be improved.

According to the substrate processing apparatus according to the fourth aspect, for example, a recipe that specifies processing conditions for a portion of a group of substrates, taking into account processing conditions in other processing units among a plurality of processing units. can be corrected. By this, for example, processing precision in each processing unit of the substrate processing apparatus can be improved. In addition, for example, after the recipe is collectively corrected for a group of substrates by the first recipe correction, the recipe is additionally corrected for some of the substrates of the group of substrates by the second recipe correction, so that the group of substrates A multi-step correction can be performed, including a certain degree of overall correction of the recipe and correction of the recipe for some of the substrates. As a result, for example, high-precision processing suited to the situation can be easily performed on the substrate.

According to the substrate processing apparatus according to the fifth aspect, for example, the time schedule for transport and processing is reset according to the second recipe correction, thereby sequentially transporting the plurality of substrates W to the plurality of processing units. , problems that may arise when sequential processing is performed on a plurality of substrates in a plurality of processing units are prevented.

According to the substrate processing apparatus according to the sixth aspect, for example, the number of a plurality of processing units is large, a first control unit that controls operations in a wide range of configurations of the substrate processing apparatus, and an individual of the substrate processing apparatus. When there is a second control unit that controls operations in a narrow range of configurations, such as a processing unit or part of a processing unit, the first control unit performs the first recipe correction, and the second control unit performs the second By performing recipe correction, hierarchical operation control can be easily realized in the substrate processing apparatus. As a result, multi-step corrections including, for example, a certain amount of correction of recipes for a group of substrates collectively and correction of recipes in a near real-time state for some substrates can be performed efficiently. By this, for example, high-precision processing of a substrate suitable for the situation can be performed efficiently.

According to the substrate processing system according to the seventh aspect, for example, a server stores a data group related to one or more types of indicators regarding the status of substrate processing in each processing unit of a plurality of substrate processing apparatuses, Each substrate processing apparatus corrects the recipe based on the data group stored in the server, so that one substrate processing apparatus can correct the recipe by taking advantage of the data collected by the other substrate processing apparatus. Additionally, for example, data collected in one substrate processing apparatus can be used to correct recipes in another substrate processing apparatus.

1 is a diagram showing an example of the schematic configuration of a substrate processing system according to the first embodiment.
Figure 2 is a block diagram showing an example of the electrical configuration of a management server.
Figure 3 is a schematic plan view showing an example of the schematic configuration of a substrate processing apparatus.
FIG. 4 is a diagram schematically showing an example of the configuration of a processing unit.
Fig. 5 is a block diagram showing the connection mode of each component in the substrate processing apparatus.
Fig. 6 is a block diagram showing an example of the electrical configuration and functional configuration of the main body control unit.
Fig. 7 is a block diagram showing an example of the electrical configuration and functional configuration of the schedule management control unit.
Fig. 8 is a block diagram showing an example of the electrical configuration and functional configuration of the partial control unit.
Fig. 9 is a block diagram showing an example of the electrical configuration and functional configuration of the liquid management control unit.
Fig. 10 is a diagram showing an example of the contents of a data group stored in data storage.
Fig. 11 is a flowchart showing an example of an operation flow related to first recipe correction.
Fig. 12 is a flowchart showing an example of an operation flow related to second recipe correction.
Fig. 13 is a flowchart showing an example of an operation flow related to resetting the time schedule.
Figure 14 is a diagram showing an example of a time schedule.
Figure 15 is a diagram showing an example in which a problem occurs in the time schedule.
Fig. 16 is a diagram showing an example of a time schedule after reset.

For example, there is a substrate processing apparatus having a plurality of processing units that can perform various processes such as cleaning and etching on various substrates such as semiconductor substrates. Also, for example, there is a substrate processing system in which a management server is connected to a plurality of substrate processing devices via a communication line.

In a substrate processing apparatus having multiple processing units, the same type of substrate processing can be performed in parallel in the multiple processing units. At this time, the substrate processing device creates a time schedule that specifies the timing of transport and processing of a plurality of substrates to improve throughput, for example, according to a standard recipe obtained by information from a management server. , it is conceivable to carry out transport and processing of a plurality of substrates according to this time schedule.

However, for example, if the transport and processing of a plurality of substrates is simply performed according to a standard recipe, processing overload or deficiency may occur due to changes in various situations related to processing. In other words, for example, there are cases where the processing precision in each processing unit deteriorates.

Therefore, the present inventor has created a technology that can improve the processing precision in each processing unit of the substrate processing apparatus and substrate processing system. Regarding this, the first embodiment and various modifications will be described below based on the drawings. In the drawings, parts having the same structure and function are given the same reference numerals, and duplicate descriptions are omitted in the following description. Additionally, the drawings are schematically shown.

<1. First embodiment>

＜1-1. Schematic configuration of the substrate processing system>

FIG. 1 is a diagram showing an example of the schematic configuration of the substrate processing system 1 according to the first embodiment. As shown in FIG. 1 , the substrate processing system 1 includes, for example, a management server 10, a plurality of substrate processing devices 20, and a transfer device 30. The plurality of substrate processing devices 20 includes, for example, a first substrate processing device 20a, a second substrate processing device 20b, and a third substrate processing device 20c. Here, the management server 10, the plurality of substrate processing devices 20, and the transfer device 30 are connected through a communication line 5 to enable transmission and reception of data. The communication line 5 may be, for example, a wired line or a wireless line.

<1-2. Configuration of management server>

FIG. 2 is a block diagram showing an example of the electrical configuration of the management server 10. The management server 10 is a device (also referred to as a management device) for comprehensively managing the plurality of substrate processing devices 20 .

As shown in FIG. 2, the management server 10 is realized by, for example, a computer, etc., and includes a communication unit 11, an input unit 12, an output unit 13, and connected via a bus line Bu10. It has a storage unit 14, a control unit 15, and a drive 16.

The communication unit 11 functions, for example, as a transmission unit capable of transmitting a signal to each substrate processing device 20 and the transfer device 30 through the communication line 5, and to each substrate through the communication line 5. It has a function as a receiving unit capable of receiving signals from the processing device 20 and the conveying device 30.

For example, the input unit 12 may input a signal according to the operation of a user using the management server 10. The input unit 12 may include, for example, a manipulation unit, a microphone, and various sensors. The control unit can input a signal according to the user's operation. The operation unit includes a mouse, a keyboard, etc. The microphone can input a signal according to the user's voice. Various sensors can input signals according to the user's movements.

The output unit 13 can output various types of information, for example. The output unit 13 may include, for example, a display unit and a speaker. For example, the display unit can visually output various information in a manner that can be recognized by the user. For example, this display unit may have the form of a touch panel integrated with at least a part of the input unit 12. For example, a speaker can audibly output various information in a manner that can be recognized by the user.

The storage unit 14 can store information, for example. This storage unit 14 may be composed of a non-volatile storage medium such as a hard disk or flash memory, for example. The configuration of the storage unit 14 is, for example, one of the following: a configuration having one storage medium, a configuration having two or more storage media integrally, and a configuration having two or more storage media divided into two or more parts. It can be anything. The storage unit 14 can store various types of information, such as a program 14pg, processing plan information 14pc, and a database 14db, for example. The storage unit 14 may include, for example, a memory 15b described later. The processing plan information 14pc is, for each substrate processing apparatus 20, a plurality of information related to a plurality of substrate groups in N processing units 21 (N is a natural number) (see FIG. 3, etc.) described later. Indicates the timing for executing continuous substrate processing, etc. The substrate group is composed of, for example, a plurality of substrates W (see FIG. 3, etc.) constituting one lot. The database 14db may include, for example, information on each substrate W and information on each substrate processing device 20. The information on each substrate W includes, for example, the number of the slot in the carrier C where the substrate W is held, the shape of the substrate W, and information indicating the processing performed on the substrate W. can do. Information indicating the shape of the substrate W may include, for example, the thickness of one or more types of films (also referred to as film thickness) and distribution of film thicknesses in the substrate W, etc. The film thickness may be, for example, any of the average, minimum, and maximum film thickness values. Information on each substrate processing device 20 includes, for example, the status of processing (also referred to as substrate processing) on the substrate W in each of the plurality of processing units 21 of each substrate processing device 20. It may include data related to one or more types of indicators. In other words, the storage unit 14 stores, for example, a group of data related to one or more types of indicators regarding the status of substrate processing in each of the plurality of processing units 21 of the plurality of substrate processing devices 20. Remembers the accumulated database (14db). A data group includes a plurality of data related to one or more types of indicators.

The control unit 15 includes, for example, an arithmetic processing unit 15a that acts as a processor and a memory 15b that temporarily stores information. For example, an electric circuit such as a central processing unit (CPU) may be applied to the calculation processing unit 15a. For example, random access memory (RAM) may be applied to the memory 15b. The arithmetic processing unit 15a can realize the function of the management server 10 by, for example, reading and executing the program 14pg stored in the storage unit 14. Various information temporarily obtained through various information processing in the control unit 15 can be appropriately stored in the memory 15b or the like. Here, for example, at least part of the functions realized in the arithmetic processing unit 15a may be realized in a dedicated electronic circuit.

The drive 16 is, for example, a removable part of the portable storage medium RM10. For example, the drive 16 can exchange data between the storage medium RM10 and the control unit 15 while the storage medium RM10 is mounted. Here, for example, the storage medium RM10 storing the program 14pg may be mounted on the drive 16, and the program 14Pg may be read and stored in the storage unit 14 from the storage medium RM10.

<1-3. Configuration of substrate processing equipment>

FIG. 3 is a schematic plan view showing an example of the schematic configuration of the substrate processing apparatus 20. The substrate processing apparatus 20 is, for example, a single-wafer type apparatus that can perform various processes by supplying a processing liquid to the surface of the substrate W. Here, a semiconductor substrate (wafer) is used as an example of the substrate W. Various treatments include, for example, a chemical treatment in which etching is performed with a chemical solution, a cleaning treatment in which foreign substances or objects to be removed are removed with a liquid, a rinse treatment in which water is used to wash away the material, and a coating treatment in which a resist is applied, etc.

The substrate processing apparatus 20 includes a plurality of load ports LP, a transfer unit 24, a liquid storage unit 23, and a plurality of processing units 21. In addition, the substrate processing apparatus 20 includes, for example, a main body control unit (PC0), a schedule management control unit (PC1), a plurality of partial control units (PC2), a liquid management control unit (PC3), and a data storage ( Includes NA1).

＜1-3-1. Load port>

The plurality of load ports LP are each a mechanism (also referred to as a receptor holding mechanism) capable of holding a plurality of carriers (also referred to as FOUPs) C as receptors. In the example of FIG. 3, the first to fourth load ports LP1 to LP4 exist as a plurality of load ports LP. The first to fourth load ports LP1 to LP4 are parts for loading and unloading a plurality of substrate groups between the substrate processing apparatus 20 and the outside of the substrate processing apparatus 20 (also referred to as loading/unloading parts). ) has the function of In the example of FIG. 3, the first to fourth load ports LP1 to LP4 and each processing unit 21 are arranged at intervals in the horizontal direction. Additionally, the first to fourth load ports LP1 to LP4 are arranged along the first horizontal direction DR1 when viewed from the top.

Here, the carrier C is conveyed and placed in the first to fourth load ports LP1 to LP4, for example, by the conveyance device 30 from within the carrier storage 40. The carrier C can accommodate, for example, a plurality of substrates W (25 in the first embodiment) as a group. The operation of the transfer device 30 can be controlled by the management server 10, for example. Here, for example, the transport device 30 may transport the carrier C between the plurality of substrate processing devices 20 . In the example of FIG. 3, the conveyance apparatus 30 can move along 1st direction DR1 and the horizontal 2nd direction DR2 orthogonal to this 1st direction DR1, for example. For this reason, for example, the carrier C, which each accommodates a plurality of substrates W forming one substrate group, is transported from the carrier storage area 40 to one of the first to fourth load ports LP1 to LP4. You can be witty about either one. And, in the first to fourth load ports LP1 to LP4, the plurality of carriers C may be arranged along the first direction DR1.

<1-3-2. Transfer unit>

For example, the transfer unit 24 transfers a plurality of substrates W from a group of substrates W accommodated in a carrier C held at the load port LP toward the plurality of processing units 21. It can be returned in order. In the first embodiment, the transfer unit 24 includes an indexer robot (IR) and a center robot (CR). For example, the indexer robot IR can transport the substrate W between the first to fourth load ports LP1 to LP4 and the center robot CR. The center robot CR can transport the substrate W between the indexer robot IR and each processing unit 21, for example.

Specifically, the indexer robot IR can, for example, transport a plurality of substrates W one by one from the carrier C to the center robot CR, and can also transfer a plurality of substrates W from the center robot CR to the carrier ( A plurality of substrates W can be transported one by one to C). Likewise, the center robot CR can, for example, load a plurality of substrates W into each processing unit 21 from the indexer robot IR, and can also transfer the indexer from each processing unit 21. A plurality of substrates W can be transported one by one to the robot IR. Also, for example, the center robot CR can transport the substrate W between the plurality of processing units 21 as needed.

In the example of FIG. 3, the indexer robot IR has two hands H that are U-shaped when viewed from the top. The two hands H are arranged at different heights. Each hand H can support the substrate W in a horizontal position. The indexer robot IR can move the hand H in the horizontal and vertical directions. Additionally, the indexer robot IR can change the direction of the hand H by rotating (rotating) around an axis along the vertical direction. The indexer robot IR moves along the first direction DR1 on the path 201 passing through the receiving position (the position where the indexer robot IR is drawn in FIG. 3). The capital position is a position where the indexer robot IR and the center robot CR face each other in a direction perpendicular to the first direction DR1 when viewed from the top. The indexer robot (IR) can oppose the hand (H) to an arbitrary carrier (C) and center robot (CR), respectively. Here, for example, the indexer robot IR performs a loading operation of loading the substrate W into the carrier C by moving the hand H, and a loading operation of loading the substrate W from the carrier C. Actions can be performed. Also, for example, the indexer robot (IR) cooperates with the center robot (CR) to move the substrate W from one side of the indexer robot (IR) and the center robot (CR) to the other side. It can be done in

In the example of FIG. 3, the center robot CR, like the indexer robot IR, has two hands H that are U-shaped when viewed from the top. The two hands H are arranged at different heights. Each hand H can support the substrate W in a horizontal position. The center robot CR can move each hand H in the horizontal and vertical directions. Additionally, the center robot CR can change the direction of the hand H by rotating (rotating) around an axis along the vertical direction. The center robot CR is surrounded by a plurality of processing units 21 when viewed from the top. The center robot CR can oppose the hand H to any one of the processing unit 21 and the indexer robot IR. Here, for example, the center robot CR performs a loading operation to load the substrate W into each processing unit 21 by moving the hand H, and transfers the substrate W from each processing unit 21. An export operation can be performed to export . Here, each processing unit 21 has an openable shutter that shields it from the center robot CR. This shutter is opened when the substrate W is loaded into and unloaded from the processing unit 21 by the center robot CR. Also, for example, the center robot (CR), in cooperation with the indexer robot (IR), can perform an operation to move the substrate W from one side of the indexer robot (IR) and the center robot (CR) to the other side. there is.

In addition, in the inner space Sc0 of the box where the plurality of processing units 21 and the center robot CR are located, there is a part (also called a gas supply part) that supplies gas (e.g. air) to the inner space Sc0. ) 22a and a portion (also referred to as a sensor portion) 22s that detects an indicator (for example, temperature, etc.) indicating the state of the atmosphere of the internal space Sc0 are provided. The sensor unit 22s may detect the amount of gas supplied to the internal space Sc0 by the gas supply portion 22a as an indicator indicating the state of the atmosphere of the internal space Sc0. Here, the state of the atmosphere of the internal space Sc0 affects substrate processing in the processing unit 21. For this reason, the sensor unit 22s can acquire signals related to one or more types of indicators regarding the status of substrate processing in the processing unit 21.

<1-3-3. Liquid storage unit>

The liquid storage unit 23 can store, for example, the processing liquid L1 (see FIG. 4 , etc.) used in the plurality of processing units 21 . This liquid storage unit 23 includes, for example, one or more storage tanks 23t capable of storing the treatment liquid L1. In the example of FIG. 3, the liquid storage unit 23 has three storage tanks 23t including a first storage tank 23ta, a second storage tank 23tb, and a third storage tank 23tc. For example, a sensor unit 23s and a heating unit 23h are installed in each storage tank 23t. The sensor unit 23s is a part for measuring physical quantities representing the state (e.g., concentration, hydrogen ion index (pH), temperature, etc.) of the treatment liquid L1 in the storage tank 23t. This processing liquid L1 is used to process the substrate W in the processing unit 21. In addition, the treatment liquid L1 may deteriorate depending on the passage of time and the degree of use, for example. For this reason, the state of the processing liquid L1 affects the substrate processing in the processing unit 21. That is, the sensor unit 23s can acquire signals related to one or more types of indicators regarding the status of substrate processing in the processing unit 21. The heating unit 23h is a part containing a heating element for adjusting the temperature of the treatment liquid L1 in the storage tank 23t. As a heating method for the heating element, for example, a radiation heating method using a halogen lamp, an indirect heating method without direct contact with the liquid, or a radiation heating method using near-infrared light are adopted. In the example of FIG. 3, the first sensor unit 23sa and the first heating unit 23ha are located in the first storage tank 23ta, and the second sensor unit 23sb and the second heating unit are located in the second storage tank 23tb. (23hb) is located, and the third sensor unit 23sc and the third heating unit 23hc are located in the third storage tank 23tc. Here, for example, a mechanism for stirring the treatment liquid L1 may be present in each storage tank 23t. In addition, for example, one or more storage tanks 23t are connected to each processing unit 21 in a state in which the processing liquid L1 can be supplied. Here, each storage tank 23t may be connected to all of the processing units 21 among the plurality of processing units 21, or may be connected to some of the processing units 21 among the plurality of processing units 21. In addition, here, the same type of processing liquid L1 may be stored in the three storage tanks 23t, or different types of processing liquid L1 may be stored. In other words, the same type of treatment liquid L1 may be stored between the first storage tank 23ta, the second storage tank 23tb, and the third storage tank 23tc, or different types of treatment liquid L1 may be stored. This may be stored.

<1-3-4. Processing unit>

The plurality of processing units 21 can each process the substrate W. In the example of FIG. 3, three sets of processing units 21, each composed of four processing units 21 arranged in a planar manner, are positioned so as to be stacked in the vertical direction. As a result, there are a total of 12 processing units 21. The plurality of processing units 21 includes two or more processing units 21 capable of performing the same type of substrate processing on the substrate W. As a result, the plurality of processing units 21 can process the same type of substrate on the substrate W in parallel.

FIG. 4 is a diagram schematically showing an example of the configuration of the processing unit 21. The processing unit 21 can process the substrate W using the processing liquid L1. In the processing unit 21, for example, by supplying the processing liquid L1 onto one main surface (also referred to as the upper surface) Us1 of the substrate W rotating in a plane, the upper surface of the substrate W ( Various processes can be performed on Us1). For the processing liquid L1, a general liquid for use in processing a substrate having fluidity, such as water or a chemical liquid with a relatively low viscosity, is applied. As the chemical solution, an etching solution or a cleaning chemical solution is applied. More specifically, the chemical liquid includes sulfuric acid, acetic acid, nitric acid, hydrochloric acid, hydrofluoric acid, hydronitric acid, aqueous ammonia, aqueous hydrogen peroxide, organic acids (e.g. citric acid, oxalic acid, etc.), organic alkalis (e.g. TMAH: tetramethylammonium) A liquid containing one or more of hydroxide, etc.), isopropyl alcohol (IPA), a surfactant, and a corrosion inhibitor may be employed.

As shown in FIG. 4 , the processing unit 21 includes, for example, a holding portion 211, a rotation mechanism 212, a processing liquid supply system 213, and a sensor portion 214.

For example, the holding unit 211 may maintain the substrate W in a substantially horizontal position and rotate it. The holding portion 211 includes, for example, a vacuum chuck having an upper surface 211u capable of vacuum adsorbing another main surface (also referred to as a lower surface) Bs1 opposite to the upper surface Us1 of the substrate W, or a substrate ( A clamp-type chuck having a plurality of chuck pins capable of clamping the peripheral portion of W) is applied.

The rotation mechanism 212 can rotate the holding portion 211, for example. The configuration of the rotation mechanism 212 includes, for example, a rotation axis 212s and a rotation drive unit 212m. The rotation axis 212s, for example, has a holding portion 211 connected to its upper end and extends along the vertical direction. The rotation drive unit 212m has, for example, a motor capable of rotating the rotation axis 212s about the virtual rotation axis Ax1 along the vertical direction. Here, for example, the rotation drive unit 212m rotates the rotation axis 212s around the rotation axis Ax1, so that the holding unit 211 rotates while maintaining its posture along the horizontal plane. As a result, for example, the substrate W held on the holding portion 211 rotates around the rotation axis Ax1. Here, for example, if the upper surface Us1 and the lower surface Bs1 of the substrate W are approximately circular, the rotation axis Ax1 passes through the centers of the upper surface Us1 and the lower surface Bs1 of the substrate W. .

The processing liquid supply system 213 can discharge one or more types of processing liquid L1 toward the substrate W, for example. In the example of FIG. 4 , the processing liquid supply system 213 includes a first processing liquid supply unit 213a, a second processing liquid supply unit 213b, and a third processing liquid supply unit 213c.

The first processing liquid supply unit 213a has, for example, a nozzle Nz1, a piping unit Pp1, a movable piping unit At1, a discharge valve Vv1, and a liquid supply unit Su1. For example, the nozzle Nz1 can discharge the first processing liquid L11, which is one of the processing liquids L1, toward the substrate W held in the holding portion 211. The piping portion Pp1 connects the liquid supply portion Su1 and the nozzle Nz1, and forms a path through which the first processing liquid L11 flows. Moreover, the movable piping part At1 is located in the middle of the piping part Pp1, and supports the part of the piping part Pp1 on the nozzle Nz1 side so that it can rotate around an axis along the vertical direction. And, for example, a state in which the nozzle Nz1 is positioned on the substrate W (also referred to as a state in which liquid discharge is possible) and a state in which the nozzle Nz1 is positioned on the substrate W by driving force from a driving unit such as a motor. This state of not being located (also called the retreat state) can be switched. In the example of FIG. 4 , the first processing liquid supply unit 213a is in a state capable of discharging liquid, and the nozzle Nz1 performs the first processing from directly above the substrate W toward the upper surface Us1 of the substrate W. Liquid (L11) can be discharged. The discharge valve Vv1 is disposed, for example, in the middle of the piping section Pp1 and can be opened and closed in response to a signal from the partial control unit PC2. Here, for example, when the discharge valve Vv1 is opened, the liquid supply unit Su1 and the nozzle Nz1 are in a state of communication. Also, for example, when the discharge valve Vv1 is closed, the liquid supply unit Su1 and the nozzle Nz1 are in a state where they are not in communication. The liquid supply unit Su1 operates, for example, in response to a signal from the main body control unit PC0 or the partial control unit PC2, for example, to the liquid storage unit 23 (here, the first storage tank 23ta). )), the first treatment liquid L11 can be supplied toward the piping portion Pp1. For example, a pump is applied to the liquid supply unit Su1.

The second processing liquid supply unit 213b has a similar configuration to the first processing liquid supply unit 213a. Specifically, the second processing liquid supply unit 213b includes, for example, a nozzle Nz2, a piping unit Pp2, a movable piping unit At2, a discharge valve Vv2, and a liquid supply unit Su2. ) has. For example, the nozzle Nz2 can discharge the second processing liquid L12, which is one of the processing liquids L1, toward the substrate W held in the holding portion 211. The piping portion Pp2 connects the liquid supply portion Su2 and the nozzle Nz2, and forms a path through which the second processing liquid L12 flows. Moreover, the movable piping part At2 is located in the middle of the piping part Pp2, and supports the part of the piping part Pp2 on the nozzle Nz2 side so that it can rotate around an axis along the vertical direction. And, for example, the nozzle Nz2 is positioned on the substrate W (liquid discharge possible state) by the driving force from the driving unit such as a motor, and the nozzle Nz2 is positioned on the substrate W. The state of not being present (escape state) can be converted. In the example of FIG. 4 , the second processing liquid supply unit 213b is in a state capable of discharging liquid, and the nozzle Nz2 performs the second processing from directly above the substrate W toward the upper surface Us1 of the substrate W. Liquid (L12) can be discharged. The discharge valve Vv2 is, for example, disposed in the middle of the piping portion Pp2 and can be opened and closed in response to a signal from the partial control unit PC2. Here, for example, when the discharge valve Vv2 is opened, the liquid supply unit Su2 and the nozzle Nz2 are in a state of communication. Also, for example, when the discharge valve Vv2 is closed, the liquid supply unit Su2 and the nozzle Nz2 are in a state where they are not in communication. For example, the liquid supply unit Su2 supplies liquid from the liquid storage unit 23 (here, the second storage tank 23tb) in response to a signal from the main body control unit PC0 or the partial control unit PC2. 2 The treatment liquid (L12) can be supplied toward the piping section (Pp2). For example, a pump is applied to the liquid supply unit Su2.

In FIG. 4 , a case is depicted in which both the first processing liquid supply unit 213a and the second processing liquid supply unit 213b are in a state in which liquid can be discharged. However, in reality, the first processing liquid supply unit 213a and the second processing liquid supply unit 213b are in a state in which liquid can be discharged. From the state in which both sides of the liquid supply unit 213b are in a retracted state, one of the first processing liquid supply unit 213a and the second processing liquid supply unit 213b is alternatively switched to a state in which liquid can be discharged. Additionally, in FIG. 4 , the first processing liquid supply unit 213a and the second processing liquid supply unit 213b are vertically offset so as not to interfere with each other. However, the first processing liquid supply unit 213a and the second processing liquid supply unit 213b If the switching operation between the retracted state and the liquid discharge enabled state of the supply unit 213b is appropriately synchronized, the first processing liquid supply unit 213a and the second processing liquid supply unit 213b do not interfere with each other even if they do not have a vertically misaligned relationship. I never do that.

The third processing liquid supply unit 213c has, for example, a nozzle Nz3, a pipe unit Pp3, a discharge valve Vv3, and a liquid supply unit Su3. For example, the nozzle Nz3 can discharge the third processing liquid L13, which is one of the processing liquids L1, toward the substrate W held in the holding portion 211. In the example of FIG. 4 , the nozzle Nz3 can discharge the third processing liquid L13 from obliquely above the substrate W toward the upper surface Us1 of the substrate W. The piping portion Pp3 connects the liquid supply portion Su3 and the nozzle Nz3, and forms a path through which the third processing liquid L13 flows. The discharge valve Vv3 is disposed, for example, in the middle of the piping section Pp3 and can be opened and closed in response to a signal from the partial control unit PC2. Here, for example, by opening the discharge valve Vv3, the liquid supply unit Su3 and the nozzle Nz3 are in a state of communication. Also, for example, when the discharge valve Vv3 is closed, the liquid supply unit Su3 and the nozzle Nz3 are in a state where they are not in communication. For example, the liquid supply unit Su3 supplies liquid from the liquid storage unit 23 (here, the third storage tank 23tc) in response to a signal from the main body control unit PC0 or the partial control unit PC2. 3 The treatment liquid (L13) can be supplied toward the piping section (Pp3). For example, a pump is applied to the liquid supply unit Su3.

Here, for example, the discharge of the first processing liquid L11 from the nozzle Nz1 of the first processing liquid supply unit 213a toward the substrate W and the nozzle Nz2 of the second processing liquid supply unit 213b ), discharge of the second processing liquid L12 toward the substrate W, and discharge of the third processing liquid L13 from the nozzle Nz3 of the third processing liquid supply unit 213c toward the substrate W in this order. It can be done as is.

Here, the processing liquid L1 discharged from each nozzle Nz1 to Nz3 toward the substrate W is collected, for example, in a cup provided downward from the side of the substrate W, and stored in the liquid storage unit 23. ) is returned to the corresponding storage tank 23t. In other words, the processing liquid L1 stored in the liquid storage unit 23 is repeatedly circulated and used for substrate processing. At this time, for example, the treatment liquid L1 shows a tendency to gradually deteriorate. Here, when the processing liquid L1 is returned from the processing unit 21 to the liquid storage unit 23, the processing liquid L1 may be purified by a filter or the like.

Also, here, for example, one to two or four or more processing liquid supply units may exist in the processing unit 21.

For example, the sensor unit 214 can acquire signals related to one or more types of indicators regarding the status of substrate processing in the processing unit 21. In the example of FIG. 4 , the sensor unit 214 has a film thickness gauge Fm0 for detecting the state of the substrate W and an imaging unit 21sb. For the film thickness meter Fm0, for example, one using light interference can be applied. For example, the imaging unit 21sb uses an imaging element such as an area sensor in which light-receiving elements are arranged in a planar manner.

The film thickness gauge Fm0 is fixed to an arm portion Am1 rotatably supported about an axis along the vertical direction by, for example, a movable portion At0. Then, for example, the arm portion Am1 rotates due to the driving force from a driving portion such as a motor, thereby forming a state in which the film thickness gauge Fm0 is positioned on the substrate W (measurable state) and the substrate ( The state in which the film thickness gauge Fm0 is not located on W (evacuation state) can be switched. For example, the film thickness gauge Fm0 may be protected by a shield to protect it from adhesion of the processing liquid L1 in the retraction state. Here, by appropriately rotating the substrate W with the rotation mechanism 212 and rotating the arm portion Am1, the film thickness gauge Fm0 measures the thickness of various films located in a wide range on the substrate W ( (also called film thickness) can be measured. Here too, the film thickness may be, for example, any of the average, minimum, and maximum film thickness values. Here, as the film located on the substrate W, for example, various films such as an oxide film, a silicon single crystal layer, a silicon polycrystalline layer, an amorphous silicon layer, and a resist film can be employed. The film thickness meter Fm0 can measure the film thickness of the film on the substrate W, for example, before and after processing the substrate W with the processing liquid L1 in the processing unit 21. . As a result, it is possible to obtain a signal related to the film thickness as an indicator of the status of substrate processing in the processing unit 21. For example, the film thickness meter Fm0 transmits the obtained signal to the partial control unit PC2. In FIG. 4 , the distance between the upper surface Us1 of the substrate W and the film thickness meter Fm0 is drawn for convenience in a measurable state. However, in reality, the film thickness meter Fm0 is located at a distance between the upper surface Us1 of the substrate W and the film thickness meter Fm0. ), the film thickness is measured while approaching the upper surface (Us1).

For example, the imaging unit 21sb captures the situation on the substrate W before and after processing the substrate W with the processing liquid L1 in the processing unit 21, thereby capturing the image of the processing unit 21. It is possible to acquire an image signal related to the state of the upper surface Us1 of the substrate W as an indicator of the state of substrate processing in ). For example, the imaging unit 21sb transmits the obtained image signal to the partial control unit PC2.

The sensor unit 214 includes, for example, a flow meter that detects the discharge amount of the processing liquid L1 discharged from each nozzle Nz1 to Nz3, and a flow meter that detects the discharge amount of the processing liquid L1 discharged from each nozzle Nz1 to Nz2. A sensor (for example, an angle sensor, etc.) that detects the position (also referred to as the discharge position) may be included.

<1-3-5. Main control unit>

The main body control unit PC0 can control, for example, transmission and reception of data with the management server 10 and operations of each part of the substrate processing apparatus 20.

FIG. 5 is a block diagram showing the connection mode of the control system and data transmission/reception system in the substrate processing apparatus 20. Here, the main body control unit (PC0), the schedule management control unit (PC1), the plurality of partial control units (PC2), and the liquid management control unit (PC3) communicate with each other in various ways through the control communication line (L0c). It is connected so that transmission and reception of control signals is possible. In addition, the main body control unit (PC0), the schedule management control unit (PC1), the plurality of partial control units (PC2), the liquid management control unit (PC3), and the data storage (NA1) are communication lines for data. They are connected to each other through (L0d) to enable transmission and reception of various data. The communication line L0c for control and the communication line L0d for data may be either a wired line or a wireless line, respectively.

FIG. 6(a) is a block diagram showing an example of the electrical configuration of the main body control unit PC0. As shown in FIG. 6(a), the main body control unit PC0 is realized by, for example, a computer, etc., and includes a communication unit P01, an input unit P02, and an output unit ( P03), a memory unit (P04), a control unit (P05), and a drive (P06).

The communication unit P01 is connected, for example, with the schedule management control unit PC1, the plurality of partial control units PC2, and the liquid management control unit PC3 via the control communication line L0c. transmission and reception of signals, and between the schedule management control unit (PC1), the plurality of partial control units (PC2), the liquid management control unit (PC3) and the data storage (NA1) via the data communication line (L0d). It has functions as a transmitter and receiver capable of transmitting and receiving data. In addition, the communication unit P01 has a function as a reception unit capable of receiving a signal from the management server 10 through the communication line 5, for example.

For example, the input unit P02 may input a signal according to the user's operation of the substrate processing apparatus 20. Here, the input unit P02 may include, for example, a manipulation unit, a microphone, and various sensors, similar to the input unit 12. In the input unit P02, for example, a signal instructing manual correction of recipe information may be input.

The output unit P03 can output various types of information, for example. Here, the output unit P03 may include, for example, a display unit and a speaker, similar to the output unit 13. This display unit may have the form of a touch panel integrated with at least a part of the input unit P02.

The storage unit P04 can store information, for example. This storage unit P04 may be composed of a non-volatile storage medium such as a hard disk or flash memory, for example. In the storage unit P04, for example, one of a configuration having one storage medium, a configuration having two or more storage media integrally, and a configuration having two or more storage media divided into two or more parts. You may be hired. The storage unit P04 stores, for example, a program (Pg0), various information (Dt0), and a database (Db0). The memory P04 may include a memory P05b, which will be described later. The database Db0 contains, for example, information on each substrate W as the object of processing in the substrate processing apparatus 20 and the status of substrate processing in each of the plurality of processing units 21. It may include data related to more than one type of indicator. In other words, the storage unit P04 records the status of substrate processing in each of the plurality of processing units 21, for example, based on signals acquired by the plurality of sensor parts 22s, 23s, and 214. A database (Db0) that accumulates a group of data related to one or more types of indicators can be remembered. Information on each substrate W may include, for example, information indicating the shape of the substrate W and the processing performed on the substrate W. Information indicating the shape of the substrate W may include, for example, one or more types of film thickness and film thickness distribution in the substrate W, etc.

The control unit P05 includes, for example, an arithmetic processing unit P05a that acts as a processor and a memory P05b that temporarily stores information. As the arithmetic processing unit P05a, for example, an electronic circuit such as a CPU may be employed, and as the memory P05b, for example, RAM or the like may be employed. The arithmetic processing unit P05a can realize the functions of the main body control unit PC0 by, for example, reading and executing the program Pg0 stored in the storage unit P04. Various information temporarily obtained through various information processing in the control unit P05 can be appropriately stored in the memory P05b or the like.

The drive P06 is, for example, a removable part of the portable storage medium RM0. For example, the drive P06 can transfer data between the storage medium RM0 and the control unit P05 while the storage medium RM0 is mounted. Additionally, the drive P06 reads the program Pg0 from the storage medium RM0 into the storage unit P04 while the storage medium RM0 storing the program Pg0 is mounted on the drive P06. You can remember it.

FIG. 6(b) is a block diagram showing an example of the functional configuration realized in the calculation processing unit P05a. As shown in FIG. 6(b), the arithmetic processing unit P05a is a functional configuration realized, for example, an information acquisition unit F01, an instruction unit F02, a storage control unit F03, and an output control unit F04. ) and a transmission control unit (F05). As a work space for processing in each of these units, for example, memory P05b is used. Here, for example, at least part of the functions realized by the calculation processing unit P05a may be realized by a dedicated electronic circuit.

The information acquisition unit F01 can obtain various types of information from the management server 10, for example. For example, the information acquisition unit F01 can obtain information about the group of substrates W stored in the carrier C placed on the load port LP from the management server 10. Here, the information about the group of substrates W includes, for example, the number of substrates W, job, film thickness information, recipe information, etc. Here, the film thickness information includes at least one of, for example, average film thickness, minimum film thickness, maximum film thickness, and film thickness distribution. The recipe information includes, for example, a flow recipe that specifies the flow of substrate processing, a process recipe that specifies the conditions for processing to be performed on the substrate W, and information on a correction formula that specifies recipe correction rules. . In addition, the information acquisition unit F01 can obtain, for example, data based on signals related to various indicators obtained from each sensor unit 22s, 23s, and 214 via the partial control unit PC2, etc. there is.

The instruction unit F02 can give various instructions to, for example, the schedule management control unit PC1, the plurality of partial control units PC2, and the liquid management control unit PC3. The instruction unit F02 instructs the schedule management control unit PC1 to set, for example, a time schedule for transport and processing of a group of substrates W in the substrate processing apparatus 20; Instructions are given to the plurality of partial control units (PC2) to perform operations according to the recipe and time schedule, and instructions are given to the liquid management control unit (PC3) to perform temperature control, exchange, and monitoring of the processing liquid (L1). It is possible to do it. The time schedule specifies, for example, the transfer timing of the substrate W by the transfer unit 24 and the processing timing of the substrate W by the plurality of processing units 21, etc. As a result, for example, the plurality of processing units 21 can process the substrate W according to a recipe that prescribes the conditions for processing to be performed on the substrate W. In the first embodiment, for example, the same type of processing can be performed on the substrate W in parallel in two or more of the plurality of processing units 21 according to the same process recipe. Here, the same type of processing means processing the substrate W in the same order using the same one or more types of processing liquid L1 in the processing unit 21. For example, even if the processing time for the substrate W using the processing liquid L1 increases or decreases due to correction of the recipe described later, the same one or more types of processing liquid L1 are used in the processing unit 21. So, if the processing is performed on the substrate W in the same order, it can be said to be the same type of processing.

For example, the storage control unit F03 can cause the storage unit P04 to store the information obtained in the information acquisition unit F01. As a result, in the storage unit P04, for example, recipe information, time schedule information, etc. constitute various information Dt0, and various indicators obtained from each sensor unit 22s, 23s, and 214 are used. A database (Db0) is constructed by accumulating related data. In the database Db0, for example, the location and timing at which various indicators were obtained, information on the substrate W that was the target of processing when the various indicators were obtained, etc. are stored in a state associated with data related to the indicators. .

For example, the output control unit F04 can visually or audibly output information about the state of the substrate processing device 20 to the output unit P03.

The transmission control unit F05 can cause the communication unit P01 to transmit various types of information to the management server 10, for example. Here, various types of information include, for example, information related to the results of processing for a group of substrates W of each carrier C in the substrate processing apparatus 20, and various types of information stored in the database Db0. Data related to indicators may be included. Additionally, the transmission control unit F05 can cause the communication unit P01 to transmit recipe information to a plurality of partial control units PC2, for example.

<1-3-6. Control unit for scheduled management>

For example, the schedule management control unit PC1 corrects the recipe for the group of substrates W stored in the carrier C according to instructions from the main body control unit PC0 and sets the time according to the recipe. You can set a schedule. The time schedule, for example, sequentially transfers a plurality of substrates W constituting a group of substrates W stored in the carrier C by the transfer unit 24 to the plurality of processing units 21. The timing and the timing at which processing is performed on these plurality of substrates W are defined.

Fig. 7(a) is a block diagram showing an example of the electrical configuration of the schedule management control unit PC1. As shown in FIG. 7(a), the schedule management control unit PC1 is realized by, for example, a computer or the like, and includes a communication unit P11, a storage unit P14, and a communication unit P11 connected via the bus line Bu1. It has a control unit (P15).

The communication unit P11, for example, transmits and receives signals between the main body control unit PC0 and the like through the control communication line L0c, and main body control through the data communication line L0d. It has functions as a transmitting unit and a receiving unit capable of transmitting and receiving data between the unit PC0 and the data storage NA1.

The storage unit P14 can store information, for example. This storage unit P14 may be composed of a non-volatile storage medium such as a hard disk or flash memory, for example. In the storage unit P14, for example, one of a configuration having one storage medium, a configuration having two or more storage media integrally, and a configuration having two or more storage media divided into two or more parts. You may be hired. The storage unit P14 stores, for example, a program Pg1 and various information Dt1. The storage unit P14 may include a memory P15b, which will be described later.

The control unit P15 includes, for example, an arithmetic processing unit P15a that acts as a processor and a memory P15b that temporarily stores information. As the arithmetic processing unit P15a, for example, an electronic circuit such as a CPU may be employed, and as the memory P15b, for example, RAM, etc. may be employed. The calculation processing unit P15a can realize the function of the schedule management control unit PC1 by, for example, reading and executing the program Pg1 stored in the storage unit P14. Various information temporarily obtained through various information processing in the control unit P15 can be appropriately stored in the memory P15b or the like.

FIG. 7(b) is a block diagram showing an example of the functional configuration realized in the calculation processing unit P15a. As shown in FIG. 7(b), the calculation processing unit P15a is a functional configuration realized by, for example, a recipe acquisition unit F11, an information acquisition unit F12, a first correction unit F13, It has a schedule setting unit (F14) and a transmission control unit (F15). As a work space for processing in each of these units, for example, the memory P15b is used. Here, for example, at least part of the functions realized by the calculation processing unit P15a may be realized by a dedicated electronic circuit.

For example, in response to an instruction from the main body control unit PC0, the recipe acquisition unit F11 selects a group of substrates stored in the carrier C placed on the load port LP from the main body control unit PC0. You can obtain recipe information for (W).

For example, the information acquisition unit F12 can obtain, from the data storage NA1, a group of data related to one or more types of indicators regarding the status of substrate processing in each of the plurality of processing units 21. Additionally, the information acquisition unit F12 may obtain information on each substrate W in the group of substrates W stored in the carrier C from, for example, the main body control unit PC0. Additionally, the information acquisition unit F12 obtains, for example, a data group related to one or more types of indicators regarding the status of substrate processing in each of the plurality of processing units 21 from the main body control unit PC0. It's okay too.

For example, with respect to processing of a group of substrates W using a plurality of processing units 21, the first correction unit F13 monitors the status of substrate processing in each of the plurality of processing units 21. A first recipe correction in which recipes are collectively corrected can be performed based on a data group related to one or more types of indicators. By this, for example, the recipe can be equally corrected for multiple substrates W on which the same type of processing is performed in the multiple processing units 21 .

Here, the first correction unit F13 can correct the recipe by, for example, applying numerical values related to one or more types of indicators to a correction equation accompanying the recipe. Numerical values related to one or more types of indicators include, for example, the numerical value of the indicator indicating the state of the atmosphere in the internal space Sc0 (atmospheric temperature, gas supply amount), and the numerical value of the indicator indicating the state of the processing liquid L1. It may include numerical values (e.g. concentration, pH and temperature, etc.), numerical values of indicators indicating the state of the substrate W (e.g. film thickness before and after processing, etching speed, degree of unevenness of the substrate surface), etc. You can. For example, it is conceivable that the processing time, which is one of the conditions for processing performed on the substrate W specified in the process recipe, is multiplied by a coefficient based on the numerical value of one or more types of indicators. Specifically, for example, when the standard processing time specified in the process recipe is 100, as the concentration or temperature of the processing liquid L1 decreases, in the first recipe correction, the processing time is calculated as 100. It is conceivable that the processing time is multiplied by 1.1 to become 110 (=100×1.1). At this time, for example, the correction equation may be an equation that also includes prediction of changes in the state of the processing liquid L1.

Here, the first correction unit F13, for example, calculates the data group related to one or more types of indicators and each of the groups of substrates W stored in the carrier C obtained from the main body control unit PC0. The recipe may be corrected based on the information on the substrate W.

The schedule setting unit F14 can set a time schedule according to a recipe, for example. Here, for example, when the recipe is corrected in the first correction unit F13, the schedule setting unit F14 follows the recipe after the recipe correction (first recipe correction) is performed in the first correction unit F13. , Set the time schedule. By this, for example, transport and processing of a group of substrates W within the substrate processing apparatus 20 can be carried out efficiently. As a result, for example, throughput in the substrate processing apparatus 20 can be improved.

For example, the transmission control unit F15 can cause the communication unit P11 to transmit various types of information to the main body control unit PC0. Here, various types of information may include, for example, information on the recipe after correction corrected in the first correction unit F13.

<1-3-7. Partial control unit>

The plurality of partial control units PC2 can control the operation of the plurality of processing units 21 and the transfer unit 24 according to instructions from the main body control unit PC0, for example. In the first embodiment, a dedicated partial control unit (PC2) is installed in each processing unit 21, and a dedicated partial control unit (PC2) is also installed in the transfer unit 24. The partial control unit PC2 of the processing unit 21 can control the operation of each part of the processing unit 21, for example, while appropriately monitoring the operation and status of each part of the processing unit 21. For example, the partial control unit PC2 of the transfer unit 24 can control the operation of each part of the transfer unit 24 while appropriately monitoring the operation and status of each part of the transfer unit 24. Additionally, for example, one partial control unit PC2 may be installed in two or more processing units 21, and the operation of the transfer unit 24 may be controlled by the main body control unit PC0.

FIG. 8(a) is a block diagram showing an example of the electrical configuration of the partial control unit PC2. As shown in FIG. 8(a), the partial control unit PC2 is realized, for example, in a computer, etc., and includes a communication unit P21, a storage unit P24, and a control unit ( P25).

The communication unit P21, for example, transmits and receives signals between the main body control unit PC0 and the like through the control communication line L0c, and main body control through the data communication line L0d. It has functions as a transmitting unit and a receiving unit capable of transmitting and receiving data between the unit PC0 and the data storage NA1.

The storage unit P24 can store information, for example. This storage unit P24 may be composed of a non-volatile storage medium such as a hard disk or flash memory, for example. In the storage unit P24, for example, one of a configuration having one storage medium, a configuration having two or more storage media integrally, and a configuration having two or more storage media divided into two or more parts. You may be hired. The storage unit P24 stores, for example, a program Pg2 and various information Dt2. The storage unit P24 may include a memory P25b, which will be described later.

The control unit P25 includes, for example, an arithmetic processing unit P25a that acts as a processor and a memory P25b that temporarily stores information. As the arithmetic processing unit P25a, for example, an electronic circuit such as a CPU may be employed, and as the memory P25b, for example, RAM or the like may be employed. The arithmetic processing unit P25a can realize the function of the partial control unit PC2 by, for example, reading and executing the program Pg2 stored in the storage unit P24. Various information temporarily obtained through various information processing in the control unit P25 can be appropriately stored in the memory P25b or the like.

FIG. 8(b) is a block diagram showing an example of the functional configuration realized in the calculation processing unit P25a. As shown in FIG. 8(b), the calculation processing unit P25a is a functional configuration realized, for example, a recipe acquisition unit F21, an information acquisition unit F22, a second correction unit F23, It has a unit control unit (F24) and a transmission control unit (F25). As a work space for processing in each of these units, for example, the memory P25b is used. Here, for example, at least part of the functions realized by the calculation processing unit P25a may be realized by a dedicated electronic circuit.

The recipe acquisition unit F21 can acquire a recipe from the main body control unit PC0, for example. The recipe acquired here may be, for example, a process recipe or a flow recipe.

For example, the information acquisition unit F22 can obtain, from the data storage NA1, a group of data related to one or more types of indicators regarding the status of substrate processing in each of the plurality of processing units 21.

For example, the second correction unit F23 processes at least one substrate W among a group of substrates W using one or more processing units 21 among the plurality of processing units 21. In contrast, correction of at least part of the recipe (second recipe) based on a data group related to one or more types of indicators for the status of substrate processing in each of the plurality of processing units 21 obtained by the information acquisition unit F22 (also called correction) can be performed. Here, the second correction unit F23 is used, for example, to process some of the substrates W among the group of substrates W using some of the processing units 21 among the plurality of processing units 21. In contrast, a part of the recipe can be corrected based on a data group related to one or more types of indicators regarding the status of substrate processing in each of the plurality of processing units 21. In the first embodiment, for example, some of the processing units 21 among the plurality of processing units 21 are one processing unit 21, and some of the substrates W among the group of substrates W are , one board (W) is sufficient. In addition, the timing at which the second recipe correction is performed is, for example, after the first recipe correction is performed on the group of substrates W, and one substrate W among the group of substrates W is All that is required is before processing is performed using the processing unit 21. For example, in response to completion of processing for one substrate W using one processing unit 21 just before one substrate W among a group of substrates W, the second recipe correction is performed. I think it's going to happen. As a result, for example, when two or more processing units 21 sequentially perform the same processing on the substrate W in parallel, the recipe for each substrate W can be corrected in close to real time. there is.

Here, in the second correction unit F23, for example, like the first correction unit F13, the recipe can be corrected by applying the values of one or more types of indices to the correction equation accompanying the recipe. The numerical value of the index applied here may be, for example, based on the latest index acquired by each sensor unit 22s, 23s, 214, etc. before the second recipe correction is performed. Here, for example, when two or more processing units 21 perform the same type of processing on the substrate W in parallel, the processing unit 21 that has most recently completed processing on the substrate W is A part of the recipe may be corrected based on a data group related to one or more types of indicators about the state of substrate processing in the recipe. And, in the second recipe correction by the second correction unit F23, specifically, for example, when the processing time specified in the process recipe after the first recipe correction is performed is 110, the processing liquid L1 As the concentration or temperature decreases, in the second recipe correction, the processing time 110 is multiplied by a coefficient of 1.1, so that the processing time becomes 121 (=110 × 1.1).

By such second recipe correction, for example, considering the situation of substrate processing in other processing units 21 among the plurality of processing units 21, some substrates W of the group of substrates W ), the recipe that specifies the conditions of processing to be performed on the substrate W can be corrected. By this, for example, the precision of substrate processing in each processing unit 21 of the substrate processing apparatus 20 can be improved. Also, for example, after the recipe is collectively corrected for the group of substrates W by the first recipe correction, the recipe is modified for some of the substrates W among the group of substrates W by the second recipe correction. is further corrected. For this reason, for example, a certain degree of correction of the recipe for a group of substrates W (first recipe correction) and correction of the recipe in a near real-time state for some of the substrates W (second recipe correction) Correction of the two-step recipe including recipe correction) can be performed. As a result, for example, high-precision processing suited to the situation can be easily performed on the substrate.

For example, the unit control unit F24 executes processing on the substrate W by the processing unit 21 based on the process recipe after the second recipe correction has been performed by the second correction unit F23. You can do it. In the processing unit 21, the unit control unit F24 can control the operation of the sensor unit 214, for example. Additionally, the unit control unit F24 of the transfer unit 24 can control the operation of the sensor unit 22s, for example. The operating conditions of the sensor unit 214 and the sensor unit 22s may be specified in, for example, a recipe. As a result, the sensor unit 214 and the sensor unit 22s can acquire signals related to one or more types of indicators regarding the status of substrate processing in the processing unit 21. At this time, the unit control unit F24 can acquire signals related to one or more types of indices from the sensor unit 214 and the sensor unit 22s, for example. Here, the unit control unit F24 may calculate the etching rate as a numerical value based on signals related to one or more types of indices, for example, from the film thickness before and after processing and the processing time. At this time, the film thickness before processing may be, for example, the film thickness of the substrate W obtained from the sensor unit 214, and the main body control unit PC0 may be the film thickness of the substrate W obtained from the management server 10. It can be just as thick. In addition, for example, the main body control unit PC0 performs image processing on the image signal obtained from the sensor unit 214 to determine the surface of the substrate W as a numerical value based on a signal related to one or more types of indicators. A numerical value representing the degree of unevenness, etc. may be calculated.

The transmission control unit F25 can cause the communication unit P21 to transmit various types of information to the main body control unit PC0 and the data storage NA1, for example. Here, various types of information transmitted to the main body control unit PC0 include, for example, information indicating that substrate processing has been completed, a history (process log) of processing actually performed on the substrate W, and the second correction unit F23. ) may include information on the recipe after correction and data related to one or more types of indicators acquired using the sensor unit (22s, 214). In addition, various types of information transmitted to the data storage NA1 may include, for example, data related to one or more types of indicators acquired using the sensor units 22s and 214.

＜1-3-8. Liquid management control unit>

The liquid management control unit PC3 can manage the state of the processing liquid L1 in the liquid storage unit 23, for example, by controlling the operation of each part included in the liquid storage unit 23.

FIG. 9(a) is a block diagram showing an example of the electrical configuration of the liquid management control unit PC3. As shown in FIG. 9(a), the liquid management control unit PC3 is realized by, for example, a computer, etc., and includes a communication unit P31, a storage unit P34, and a control unit connected via a bus line Bu3. It has (P35).

The communication unit P31, for example, transmits and receives signals between the main body control unit PC0 and the like through the control communication line L0c, and main body control through the data communication line L0d. It has functions as a transmitting unit and a receiving unit capable of transmitting and receiving data between the unit PC0 and the data storage NA1.

The storage unit P34 can store information, for example. This storage unit P34 may be composed of a non-volatile storage medium such as a hard disk or flash memory, for example. In the storage unit P34, for example, one of a configuration having one storage medium, a configuration having two or more storage media integrally, and a configuration having two or more storage media divided into two or more parts. You may be hired. The storage unit P34 stores, for example, a program Pg3 and various information Dt3. The storage unit P34 may include a memory P35b, which will be described later.

The control unit P35 includes, for example, an arithmetic processing unit P35a that acts as a processor and a memory P35b that temporarily stores information. As the arithmetic processing unit P35a, for example, an electronic circuit such as CPU may be employed, and as the memory P35b, for example, RAM or the like may be employed. The arithmetic processing unit P35a can realize the function of the liquid management control unit PC3 by, for example, reading and executing the program Pg3 stored in the storage unit P34. Various information temporarily obtained through various information processing in the control unit P35 can be appropriately stored in the memory P35b or the like.

Fig. 9(b) is a block diagram showing an example of the functional configuration realized in the calculation processing unit P35a. As shown in Fig. 9(b), the arithmetic processing unit P35a has, for example, an information acquisition unit F31, a unit control unit F32, and a transmission control unit F33 as functional structures to be realized. As a work space for processing in each of these units, for example, the memory P35b is used. Here, for example, at least part of the functions realized by the calculation processing unit P35a may be realized by a dedicated electronic circuit.

The information acquisition unit F31 can acquire various instructions from the main body control unit PC0, for example. Various instructions include, for example, instructions for temperature control, exchange, and monitoring of the treatment liquid L1.

The unit control unit F32 can control the operation of the liquid storage unit 23, for example. For example, the unit control unit F32 can cause the sensor unit 23s of each storage tank 23t to acquire a signal related to a physical quantity indicating the state of the treatment liquid L1. As a result, the sensor unit 23s can acquire signals related to one or more types of indicators regarding the status of substrate processing in the processing unit 21. Additionally, the unit control unit F32 can, for example, heat the processing liquid L1 in each storage tank 23t by the heating unit HR. Additionally, for example, when each storage tank 23t has a liquid exchange unit that automatically exchanges the treatment liquid L1, the unit control unit F32 controls the treatment liquid in each storage tank 23t by the liquid exchange unit. (L1) can be exchanged.

The transmission control unit F33 can cause the communication unit P31 to transmit various types of information to the main body control unit PC0 and the data storage NA1, for example. Here, various types of information transmitted to the main body control unit PC0 include, for example, information related to one or more types of indicators acquired using the sensor unit 23s, and liquid exchange in each storage tank 23t. It includes information on the elapsed time and number of uses of the treatment liquid (L1). The various types of information transmitted to the data storage NA1 include, for example, information related to one or more types of indicators acquired using the sensor unit 23s.

＜1-3-9. Data storage>

The data storage NA1 stores, for example, one type of substrate processing status in each of the plurality of processing units 21 based on signals acquired by each sensor unit 22s, 23s, 214, etc. Data groups related to the above indicators can be memorized. For the data storage NA1, for example, a non-volatile storage medium such as a hard disk or flash memory may be used, or a volatile storage medium such as RAM may be used.

FIG. 10 is a diagram showing an example of the contents of the data group DG1 stored in the data storage NA1. As shown in FIG. 10, the data group DG1 is, for example, numerical values of indicators indicating the state of the atmosphere in the internal space Sc0 (e.g., temperature of the atmosphere, supply amount of gas, etc.), processing Numerical values of indicators representing the state of the liquid L1 (e.g. concentration, pH and temperature, etc.), numerical values of indicators representing the state of the substrate W (e.g. film thickness before and after processing, etching speed, substrate degree of surface unevenness), etc. Additionally, the data group DG1 may include, for example, numerical values of indicators (discharge amount, discharge position, etc.) indicating the discharge state of the processing liquid L1. Here, in the data storage NA1, for example, various data included in the data group DG1 are overwritten to become data related to the latest index.

<1-4. Recipe correction operation>

Fig. 11 is a flowchart showing an example of an operation flow related to first recipe correction. Here, for example, the program Pg0 is executed in the calculation processing unit P05a of the main control unit PC0, and the program Pg1 is executed in the calculation processing unit P15a of the schedule management control unit PC1. , the main body control unit PC0 and the schedule management control unit PC1 cooperate to realize an operation flow for operations related to the first recipe correction.

First, in step Sp1 in FIG. 11, the information acquisition unit F01 of the main body control unit PC0 determines whether or not a job has been acquired from the management server 10. Here, for example, the information acquisition unit F01 receives a carrier ( The determination of step Sp1 is repeated until the operation for the group of substrates W stored in C) is obtained. Then, if the information acquisition unit F01 obtains the job, the process proceeds to step Sp2.

In step Sp2, the information acquisition unit F01 of the main body control unit PC0 acquires from the management server 10 information about a group of substrates W including a recipe according to the job obtained in step Sp1. At this time, the recipe acquisition unit F11 of the schedule management control unit PC1 acquires information about the group of substrates W.

In step Sp3, the information acquisition unit F12 of the schedule management control unit PC1 selects a group of data related to one or more types of indicators regarding the status of substrate processing in each of the plurality of processing units 21. Obtained from storage (NA1).

In step Sp4, the first correction unit F13 of the schedule management control unit PC1 determines the substrate processing in each of the plurality of processing units 21 obtained in step Sp3 with respect to the group of substrates W. A first recipe correction is performed based on a data group related to one or more types of indicators for the situation. Here, the first correction unit F13 determines the status of substrate processing in each of the plurality of processing units 21 with respect to processing of a group of substrates W using the plurality of processing units 21. Recipe is collectively corrected based on a data group related to one or more types of indicators. As a result, the recipe can be equally corrected for, for example, a plurality of substrates W on which the same type of processing is performed in two or more processing units 21 .

In step Sp5, the schedule setting unit F14 of the schedule management control unit PC1 sets a time schedule according to the recipe. Here, if the recipe has been corrected by the first recipe correction in step Sp4, the schedule setting unit F14 sets the time schedule according to the recipe after the first recipe correction has been performed in step Sp4.

In step Sp6, the transmission control unit F15 of the schedule management control unit PC1 transmits information such as the corrected recipe corrected in step Sp4 and the time schedule set in step Sp5 to the main control unit PC0. .

In step Sp7, the instruction unit F02 of the main body control unit PC0 instructs the plurality of partial control units PC2 to perform operations according to the recipe and time schedule. As a result, processing can be performed on the substrate W in the plurality of processing units 21 according to the recipe after the first recipe correction has been performed and the time schedule according to this recipe.

Fig. 12 is a flowchart showing an example of an operation flow related to second recipe correction. Here, for example, the calculation processing unit P25a in the partial control unit PC2 of the processing unit 21 executes the program Pg2 to realize the operation flow related to the second recipe correction.

First, in step Sp11 of FIG. 12 , the unit control unit F24 of the partial control unit PC2 determines whether the processing of the substrate W in the processing unit 21 has been completed. Here, the unit control unit F24 repeats the determination of step Sp11 until processing of the substrate W according to the process recipe in the processing unit 21 is completed. Then, the unit control unit F24 proceeds to step Sp12 when processing of the substrate W according to the process recipe is completed in the processing unit 21.

In step Sp12, the information acquisition unit F22 of the partial control unit PC2 stores a data group related to one or more types of indicators regarding the status of substrate processing in each of the plurality of processing units 21 in data storage ( Obtained from NA1).

In step Sp13, the second correction unit F23 of the partial control unit PC2 processes the substrate W in the processing unit 21 after the processing in the processing unit 21 has been completed in step Sp11. For the substrate W being used, a second recipe correction is performed based on a data group related to one or more types of indicators regarding the status of substrate processing in each of the plurality of processing units 21 obtained in step Sp12. As a result, for example, when two or more processing units 21 sequentially perform the same processing on the substrate W in parallel, the recipe for each substrate W can be corrected in close to real time. there is.

In step Sp14, the unit control unit F24 of the partial control unit PC2 in the processing unit 21 causes the processing unit 21 to execute an operation according to the recipe. Here, if the recipe has been corrected by the second recipe correction in step Sp13, the unit control unit F24 controls the operation of the processing unit 21 according to the recipe after the second recipe correction has been performed in step Sp13. .

<1-5. Summary of the first embodiment>

As described above, in the substrate processing system 1 according to the first embodiment, for example, in the substrate processing apparatus 20, there is one information regarding the status of substrate processing in each of the plurality of processing units 21. Regarding processing of at least one substrate W out of a group of substrates W using at least one processing unit 21 among the plurality of processing units 21, based on a data group related to one or more types of indicators. , correct at least part of the recipe. As a result, for example, it is possible to correct the recipe that defines the conditions for processing to be performed on the substrate W according to the status of substrate processing in the plurality of processing units 21, and perform processing appropriate to the situation. It can be performed on the substrate (W). As a result, for example, the precision of substrate processing in each processing unit 21 of the substrate processing apparatus 20 can be improved.

＜2. Others>

The present invention is not limited to the above-described first embodiment, and various changes and improvements can be made without departing from the gist of the present invention.

In the first embodiment, for example, if any problem occurs in the time schedule due to the second recipe correction, the time schedule may be reset. In this case, for example, the schedule management control unit PC1 may reset the time schedule according to the recipe after the second recipe correction has been performed. By this, for example, the plurality of substrates W are sequentially conveyed to the plurality of processing units 21, and the plurality of substrates W are processed in order in the plurality of processing units 21. Problems that may arise in this case are prevented.

Fig. 13 is a flowchart showing an example of an operation flow related to resetting the time schedule. Here, for example, the program Pg0 is executed in the calculation processing unit P05a of the main control unit PC0, and the program Pg1 is executed in the calculation processing unit P15a of the schedule management control unit PC1. , the main body control unit (PC0) and the schedule management control unit (PC1) cooperate to realize an operation flow related to resetting the time schedule. This operation flow is executed, for example, each time the second recipe correction is performed.

In step Sp21 of FIG. 13, the calculation processing unit P15a of the schedule management control unit PC1 determines whether or not there is a problem with the time schedule. Here, the schedule management control unit PC1 determines whether or not a problem occurs when the recipe after the second recipe correction for some of the processing units 21 is applied to the current time schedule.

Figure 14 is a diagram showing an example of a time schedule. Figure 15 is a diagram showing an example in which a problem occurs in the time schedule. Fig. 16 is a diagram showing an example of a time schedule after reset. 14 to 16, the horizontal axis represents the passage of time, and in order from the top, the transfer timing of the substrate W from the carrier C by the indexer robot IR to the center robot CR, and the center robot ( Timing of transfer of the substrate W to the processing unit 21 by CR), timing of processing of the substrate W by the first processing unit 21, timing of processing by the second processing unit 21 The timing at which processing is performed on the substrate W and the timing at which the first processing liquid L11 is supplied from the liquid storage unit 23 to the first processing unit 21 and the second processing unit 21 are shown. there is.

According to the time schedule shown in FIG. 14, for example, at time t0, the indexer robot IR unloads the first substrate W from the carrier C, and at times t0 to t1, the indexer robot IR carries out the first substrate W. The first substrate W is transported, and at time t1, the indexer robot IR transfers the first substrate W to the center robot CR. At times t1 to t2, the center robot CR conveys the first substrate W, and at time t2 the center robot CR transfers the first substrate W to the first processing unit 21. . Then, from time t2 to t8, the first processing unit 21 processes the first substrate W. At this time, the liquid storage unit 23 supplies the first processing liquid L11 to the first processing unit 21 from time t3 to t6. Meanwhile, at time t3, the indexer robot IR carries out the second substrate W from the carrier C, and at times t3 to t4, the indexer robot IR conveys the second substrate W, and At t4, the indexer robot (IR) transfers the second board (W) to the center robot (CR). From time t4 to t5, the center robot CR transfers the second substrate W, and at time t5, the center robot CR transfers the second substrate W to the second processing unit 21. . Then, the second processing unit 21 processes the second substrate W from time t5 to t11. At this time, from time t6 to t9, the liquid storage unit 23 supplies the first processing liquid L11 to the second processing unit 21.

Here, for example, as shown in FIG. 15, based on the time schedule shown in FIG. 14, the period during which the first processing unit 21 processes the first substrate W is time t2. From the period to t8, it extends to the period from time t2 to t9, and the period during which the liquid storage unit 23 supplies the first processing liquid L11 to the first processing unit 21 is from time t3 to t6. It is assumed that the second recipe correction is performed so that the period extends to the period from time t3 to t7. In this case, in the period from time t6 to t7, the period during which the liquid storage unit 23 supplies the first processing liquid L11 to the first processing unit 21 (time t3 to t7), and the liquid storage unit 23 The period during which the unit 23 supplies the first processing liquid L11 to the second processing unit 21 (times t6 to t9) overlaps. Here, for example, if the liquid storage unit 23 is configured to supply the first processing liquid L11 to only one processing unit 21, the time schedule shown in FIG. 15 becomes an unrealizable time schedule. . In other words, a problem is occurring with the time schedule.

In step Sp21, if the calculation processing unit P15a of the schedule management control unit PC1 determines that there is a problem with the time schedule, the process proceeds to step Sp22, and if it determines that there is no problem in the time schedule, this operation flow is continued. Quit.

In step Sp22, the schedule setting unit F14 of the schedule management control unit PC1 resets the time schedule by taking into account the recipe after the second recipe correction has been performed. For example, when a problem with the time schedule shown in FIG. 15 occurs, the time schedule at which the transfer and processing of the second substrate W is slightly delayed is delayed, as shown in FIG. 16. To resolve the problem, reset the time schedule. Specifically, at time t4, the indexer robot IR carries out the second substrate W from the carrier C, and at times t4 to t5, the indexer robot IR conveys the second substrate W, , at time 5, the indexer robot (IR) transfers the second board (W) to the center robot (CR). From time t5 to t6, the center robot CR transfers the second substrate W, and at time t6, the center robot CR transfers the second substrate W to the second processing unit 21. . Then, from time t6 to t12, the second processing unit 21 processes the second substrate W. At this time, from time t7 to t10, the liquid storage unit 23 supplies the first processing liquid L11 to the second processing unit 21. As a result, during the period (time t3 to t7) during which the liquid storage unit 23 supplies the first processing liquid L11 to the first processing unit 21, the liquid storage unit 23 supplies the first processing liquid L11 to the first processing unit 21. The period for supplying the first processing liquid L11 to the unit 21 (times t7 to t10) does not overlap.

In step Sp23, the transmission control unit F15 of the schedule management control unit PC1 transmits the time schedule information reset in step Sp22 to the main body control unit PC0.

In step Sp24, the instruction unit F02 of the main control unit PC0 instructs the plurality of partial control units PC2 to perform an operation according to the reset time schedule. As a result, the substrate W can be processed in the plurality of processing units 21 according to a time schedule tailored to the recipe after the second recipe correction. By this, for example, problems that may occur when two or more substrates W are processed in parallel in two or more processing units 21 can be prevented.

In the first embodiment, for example, each substrate processing device 20 may correct at least a part of the recipe based on the data group stored in the storage unit 14 of the management server 10. In this case, in each substrate processing device 20, the first recipe correction is performed in the schedule management control unit PC1 based on the data group stored in the storage unit 14 of the management server 10. Alternatively, in each partial control unit PC2, the second recipe correction may be performed based on the data group stored in the storage unit 14 of the management server 10. In this way, for example, a group of data related to one or more types of indicators regarding the status of substrate processing in each processing unit 21 of the plurality of substrate processing devices 20 is stored in the management server 10. By storing and correcting the recipe based on the data group that each substrate processing device 20 stores in the management server 10, one substrate processing device 20 can operate on another substrate processing device 20. The recipe can be corrected using the collected data. Additionally, for example, data collected in one substrate processing apparatus 20 can be used to correct a recipe in another substrate processing apparatus 20.

In the first embodiment, for example, the data group DG1 stored in the data storage NA1 is stored in the storage unit P04 of the main body control unit PC0 and the storage unit P14 of the schedule management control unit. ) may be stored in at least one of the following, or may be stored in the storage unit 14 of the management server 10. In this case, for example, separately from the management server 10, a server storing the database 14db and the data group DG1 communicates the data with each substrate processing device 20 through the communication line 5. may be connected to enable transmission and reception.

In the first embodiment, for example, the first recipe correction may be performed in the main body control unit PC0. In this case, for example, the calculation processing unit P05a of the main body control unit PC0 may have a function related to the first recipe correction of the calculation processing unit P15a of the schedule management control unit PC1. In addition, the first recipe correction may be performed by, for example, at least one of the main body control unit PC0 and the schedule management control unit PC1, and the main body control unit PC0 and the schedule management control unit It may be done with the cooperation of (PC1). In addition, for example, the functions of the main body control unit PC0 and the schedule management control unit PC1 may be realized by one control unit. In other words, the functions of the calculation processing unit P05a of the main body control unit PC0 and the functions of the calculation processing unit P15a of the schedule management control unit PC1 may be appropriately distributed to one or more control units.

In addition, for example, the substrate processing apparatus 20 includes, for example, a control unit (also referred to as a first control unit) that performs first recipe correction, and a partial control unit as a second control unit that performs second recipe correction. You may have two or more control units including (PC2). If such a configuration is adopted, for example, the number of the plurality of processing units 21 is large, the first control unit for controlling operations in a wide range of configurations of the substrate processing device 20, and the substrate processing device ( 20) In the case where there is a second control unit that controls the operation in a narrow configuration such as an individual processing unit 21 or some processing units 21, the first control unit performs the first recipe correction. By performing and the second control unit performs the second recipe correction, hierarchical operation control can be easily realized in the substrate processing apparatus 20. As a result, for example, a certain degree of correction (first recipe correction) of the recipe for a group of substrates W and a near real-time state for some of the substrates W among the group of substrates W Correction of the recipe (second recipe correction) can be efficiently performed in two steps. By this, for example, high-precision substrate processing suited to the situation can be efficiently performed.

In the first embodiment, for example, the first recipe correction and the second recipe correction may be performed by one control unit. That is, the first recipe correction and the second recipe correction may be performed with one or more control units. In this case, for example, the function related to the first recipe correction in the calculation processing unit P15a of the schedule management control unit PC1 and the calculation processing unit P25a of the plurality of partial control units PC2 The functions related to the second recipe correction may be appropriately distributed to one or more control units.

In the first embodiment, for example, a recipe that specifies processing of the substrate W in the processing unit 21 while processing is being performed on the substrate W in the processing unit 21. A second recipe correction may be performed for . By this, for example, real-time recipe correction for some of the substrates W among the group of substrates W can be realized.

In the first embodiment, for example, among the first recipe correction and the second recipe correction, only the first recipe correction may be performed and only the second recipe correction may be performed. That is, at least one of the first recipe correction and the second recipe correction may be performed. In other words, with respect to processing of at least one substrate W among a group of substrates W using one or more processing units 21 among the plurality of processing units 21, the processing of the plurality of processing units 21 Recipe correction may be performed based on a data group related to one or more types of indicators for each substrate processing situation. Here, for example, in a configuration in which the first recipe correction is performed and the second recipe correction is not performed, processing on the substrate W appropriate to the situation can be easily performed in the plurality of processing units 21. . As a result, for example, the precision of processing the substrate W in each processing unit 21 of the substrate processing apparatus 20 can be easily improved.

In the first embodiment, for example, in the first recipe correction and the second recipe correction, among one or more types of indicators constituting the data group, depending on the degree of influence given to the process performed on the substrate W, , a correction equation specifying the correction rules of the recipe may be set so that weighting is performed in advance. For example, in the case of second recipe correction, even if a weighted correction equation is set so that the influence of data related to one or more types of indicators on the processing unit 21 where processing according to the recipe that is the target of correction is performed increases, do. In addition, for example, in the second recipe correction, data for processing units 21 other than the processing unit 21 in which processing according to the recipe that is the target of correction is performed is basically not adopted, Data related to the numerical value of an indicator indicating the state of the processing liquid L1 common among the plurality of processing units 21 may be employed.

In the first embodiment, for example, in the first recipe correction and the second recipe correction, in addition to the increase or decrease in the processing time, other conditions such as the condition of the position at which the processing liquid L1 is discharged with respect to the substrate W The recipe may be modified to change the processing conditions. For example, when one or more types of indicators include the distribution of film thickness and the degree of unevenness of the substrate surface, the processing liquid L1 is applied to the substrate W based on the data related to these indicators. The recipe may be corrected so that the conditions at the dispensing location change.

It goes without saying that all or part of the above-described first embodiment and various modifications can be appropriately combined within a non-contradictory range.

1: Substrate processing system 10: Management server
14, P04, P14, P24, P34: memory 14db, Db0: database
15, P05, P15, P25, P35: Control unit
15a, P05a, P15a, P25a, P35a: Operation processing unit
20: substrate processing device 21: processing unit
21sb: imaging unit 23: liquid storage unit
24: transfer unit 214, 22s, 23s: sensor unit
DG1: Data group F13: First correction unit
F14: Schedule setting unit F23: Second correction unit
F24, F32: Unit control unit Fm0: Film thickness meter
L1: Processing liquid NA1: Data storage
PC0: Main body control unit PC1: Control unit for scheduled management
PC2: Partial control unit PC3: Liquid management control unit
W: substrate

Claims (2)

a plurality of processing units that process a substrate according to a recipe that specifies processing conditions;
a transfer unit that sequentially transfers a plurality of substrates in a group of substrates to the plurality of processing units;
a plurality of sensor units that acquire signals related to one or more types of indicators regarding the status of substrate processing in each of the processing units;
a storage unit that stores a database storing a data group related to one or more types of indicators for a state of substrate processing in each of the plurality of processing units, based on signals acquired by the plurality of sensor units;
For processing of at least one substrate from the group of substrates using one or more processing units among the plurality of processing units, one or more control units are provided to correct at least a portion of the recipe based on the data group. do,
The one or more control units may control at least some of the plurality of processing units included in the data group with respect to processing of some of the substrates of the group of substrates using some of the plurality of processing units. A substrate processing apparatus that corrects a part of the recipe based on data related to the one or more types of indicators about a status of substrate processing in a processing unit different from the processing unit. a plurality of substrate processing devices;
A server is connected to enable transmission and reception of data to the plurality of substrate processing devices,
Each of the above substrate processing devices,
a plurality of processing units that process a substrate according to a recipe that specifies processing conditions;
a transfer unit that sequentially transfers a plurality of substrates in a group of substrates to the plurality of processing units;
a plurality of sensor units that acquire signals related to one or more types of indicators regarding the status of substrate processing in each of the processing units;
Having one or more control units,
The server is,
Based on the signals acquired by the plurality of sensor units, a data group related to one or more types of indicators for the status of substrate processing in each of the plurality of processing units of the plurality of substrate processing apparatuses is accumulated. It has a storage unit that stores a database,
In each of the above-mentioned substrate processing devices, the one or more control units are configured to process the plurality of substrates included in the data group with respect to processing of some of the substrates of the group of substrates using some of the processing units of the plurality of processing units. A substrate processing system, wherein a part of the recipe is corrected based on data related to the one or more types of indicators about a status of substrate processing in a processing unit other than at least some of the processing units among the processing units.