JP7444947B2 - Substrate processing equipment and substrate processing systems - Google Patents

Description

The present invention relates to a substrate processing apparatus and a substrate processing system. Substrates to be processed include, for example, semiconductor substrates, substrates for liquid crystal display devices, substrates for flat panel displays such as organic EL (Electroluminescence) display devices, substrates for optical disks, substrates for magnetic disks, substrates for magneto-optical disks, and photomasks. including solar cell substrates, ceramic substrates, and solar cell substrates.

2. Description of the Related Art There is a substrate processing apparatus that includes a plurality of processing units that can perform various processing such as cleaning and etching a substrate using a processing liquid such as a chemical solution.

Further, there is a substrate processing system that includes a plurality of substrate processing apparatuses and a management server connected to the plurality of substrate processing apparatuses via a communication line (for example, see Patent Documents 1 to 3). . These substrate processing systems are capable of, for example, copying processing recipes between substrate processing apparatuses, preventing leakage of confidential information to a communication network outside the substrate processing apparatus, or detecting processing abnormalities in the substrate processing apparatus using a management server. etc.

Japanese Patent Application Publication No. 9-153441 Japanese Patent Application Publication No. 11-215160 Patent No. 4064402 specification

Regarding substrate processing apparatuses and substrate processing systems, there is room for improvement in terms of improving the accuracy of processing in each processing unit.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a substrate processing apparatus and a substrate processing system that can improve the accuracy of processing in each processing unit.

In order to solve the above problems, a substrate processing apparatus according to a first aspect includes a plurality of processing units, a transport unit, a plurality of sensor sections, a storage section, and one or more control units. The plurality of processing units process the substrate according to a recipe that defines processing conditions. The transport unit sequentially transports a plurality of substrates in a group of substrates to the plurality of processing units. The plurality of sensor units acquire signals related to one or more types of indicators regarding the status of substrate processing in each of the processing units. The storage unit stores a database that accumulates data groups related to one or more types of indicators regarding the status of substrate processing in each of the plurality of processing units, based on the signals acquired by the plurality of sensor units. The one or more control units are configured to control the processing of at least one substrate of the group of substrates using one or more of the plurality of processing units based on the data group. Correct at least part of the recipe. The one or more control units determine one of the recipes based on the data group for processing some of the substrates of the group of substrates using some of the processing units of the plurality of processing units. Correct the part.

A substrate processing system according to a second aspect includes a plurality of substrate processing apparatuses and a server connected to the plurality of substrate processing apparatuses so as to be capable of transmitting and receiving data. Each of the substrate processing apparatuses includes a plurality of processing units, a transport unit, a plurality of sensor sections, and one or more control units. The plurality of processing units process the substrate according to a recipe that defines processing conditions. The transport unit sequentially transports a plurality of substrates in a group of substrates to the plurality of processing units. The plurality of sensor units acquire signals related to one or more types of indicators regarding the status of substrate processing in each of the processing units. The server generates a data group related to one or more types of indicators regarding the status of substrate processing in each of the plurality of processing units of each of the plurality of substrate processing apparatuses based on the signals acquired by the plurality of sensor units. It has a storage unit that stores a database that stores the information. In each of the substrate processing apparatuses, the one or more control units are configured to control the data group regarding processing of some of the substrates of the group of substrates using some of the processing units of the plurality of processing units. A portion of the recipe is corrected based on.

According to the substrate processing apparatus according to the first aspect, for example, the processing conditions for at least one substrate of a group of substrates are predetermined according to the status of substrate processing in the plurality of processing units. By correcting the recipe, it is possible to apply a process to the substrate that suits the situation. As a result, for example, the accuracy of processing in each processing unit of the substrate processing apparatus can be improved.

According to the substrate processing apparatus according to the first aspect, for example, processing conditions are set for some of the substrates in a group of substrates, taking into account the processing status in other processing units among the plurality of processing units. The prescribed recipe may be amended. Thereby, for example, the accuracy of processing in each processing unit of the substrate processing apparatus can be improved.

According to the substrate processing system according to the second aspect, for example, the server stores a data group related to one or more types of indicators regarding the status of substrate processing in each processing unit of each of the plurality of substrate processing apparatuses, By correcting the recipe based on the data group stored in the server by each substrate processing apparatus, a certain substrate processing apparatus can correct the recipe by making use of data collected in other substrate processing apparatuses. Furthermore, for example, data collected in a certain substrate processing apparatus can be used to correct a recipe in another substrate processing apparatus.

FIG. 1 is a diagram showing an example of a schematic configuration of a substrate processing system according to a first embodiment. FIG. 2 is a block diagram showing an example of an electrical configuration of a management server. FIG. 1 is a schematic plan view showing an example of a schematic configuration of a substrate processing apparatus. FIG. 2 is a diagram schematically showing a configuration example of a processing unit. FIG. 2 is a block diagram showing how each component is connected in the substrate processing apparatus. FIG. 3 is a block diagram showing an example of the electrical configuration and functional configuration of the main body control unit. FIG. 2 is a block diagram showing an example of an electrical configuration and a functional configuration of a schedule management control unit. FIG. 2 is a block diagram showing an example of an electrical configuration and a functional configuration of a partial control unit. FIG. 2 is a block diagram showing an example of an electrical configuration and a functional configuration of a liquid management control unit. FIG. 3 is a diagram illustrating an example of the contents of a data group stored in a data storage. It is a flowchart which shows an example of the operation flow concerning the 1st recipe correction. It is a flow chart which shows an example of the operation flow concerning the 2nd recipe correction. It is a flowchart which shows an example of the operation|movement flow regarding resetting of a time schedule. It is a figure showing an example of a time schedule. FIG. 2 is a diagram illustrating an example in which a problem occurs in a time schedule. It is a figure which shows an example of the time schedule after reset.

For example, there is a substrate processing apparatus that includes a plurality of processing units that can perform various processing such as cleaning and etching on various substrates such as semiconductor substrates. Further, for example, there is a substrate processing system in which a management server is connected to a plurality of substrate processing apparatuses via communication lines.

In a substrate processing apparatus having a plurality of processing units, the same type of substrate processing can be performed in parallel in the plurality of processing units. At this time, the substrate processing equipment creates a time schedule that defines the timing of transport and processing of multiple substrates to improve throughput, for example, according to a standard recipe obtained from information from a management server. However, it is conceivable to transport and process a plurality of substrates according to this time schedule.

However, for example, if a plurality of substrates are simply transported and processed according to a standard recipe, over- or under-processing may occur due to changes in various conditions related to the processing. In other words, for example, the accuracy of processing in each processing unit may decrease.

Therefore, the inventors of the present application have created a technique that can improve the accuracy of processing in each processing unit of a substrate processing apparatus and a substrate processing system. Regarding this, the first embodiment and various modified examples will be described below based on the drawings. In the drawings, parts having similar configurations and functions are designated by the same reference numerals, and redundant explanation will be omitted in the following description. Moreover, the drawings are shown schematically.

<1. First embodiment>
<1-1. Schematic configuration of substrate processing system>
FIG. 1 is a diagram showing an example of a schematic configuration of a substrate processing system 1 according to the first embodiment. As shown in FIG. 1, the substrate processing system 1 includes, for example, a management server 10, a plurality of substrate processing apparatuses 20, and a transport apparatus 30. The plurality of substrate processing apparatuses 20 include, for example, a first substrate processing apparatus 20a, a second substrate processing apparatus 20b, and a third substrate processing apparatus 20c. Here, a management server 10, a plurality of substrate processing apparatuses 20, and a transport apparatus 30 are connected via a communication line 5 so as to be able to transmit and receive data. The communication line 5 may be, for example, either a wired line or a wireless line.

<1-2. Management server configuration>
FIG. 2 is a block diagram showing an example of the electrical configuration of the management server 10. The management server 10 is a device (also referred to as a management device) for comprehensively managing the plurality of substrate processing apparatuses 20.

As shown in FIG. 2, the management server 10 is realized by, for example, a computer, and includes a communication section 11, an input section 12, an output section 13, a storage section 14, and a control section connected via a bus line Bu10. 15 and a drive 16.

The communication unit 11 functions as a transmitting unit capable of transmitting signals to each substrate processing apparatus 20 and transport apparatus 30 via the communication line 5, and also functions as a transmitter capable of transmitting signals to each substrate processing apparatus 20 and transport apparatus 30 via the communication line 5. It has a function as a receiving section that can receive signals from the device 30.

The input unit 12 can input a signal corresponding to, for example, an operation of a user who uses the management server 10. The input unit 12 may include, for example, an operation unit, a microphone, various sensors, and the like. The operation unit can input a signal according to a user's operation. The operation unit includes a mouse, a keyboard, and the like. The microphone can input a signal corresponding to the user's voice. Various sensors can input signals according to the user's movements.

The output unit 13 can output various information, for example. The output unit 13 may include, for example, a display unit and a speaker. The display unit can, for example, visually output various information in a manner that the user can recognize. This display unit may have the form of a touch panel integrated with at least a portion of the input unit 12, for example. For example, the speaker can output various types of information audibly in a manner that the user can recognize.

The storage unit 14 can store information, for example. This storage unit 14 may be configured with a nonvolatile storage medium such as a hard disk or flash memory, for example. The configuration of the storage unit 14 may be, for example, a configuration having one storage medium, a configuration having two or more storage media integrally, or a configuration having two or more storage media divided into two or more parts. It may be. The storage unit 14 can store various information such as a program 14pg, processing plan information 14pc, and a database 14db. The storage unit 14 may include, for example, a memory 15b described later. The processing plan information 14pc indicates, for each substrate processing apparatus 20, the timing at which a plurality of consecutive substrate processes related to a plurality of substrate groups are executed in N processing units 21 (N is a natural number) (see FIG. 3, etc.), which will be described later. etc. The substrate group is composed of, for example, a plurality of substrates W (see FIG. 3, etc.) constituting one lot. The database 14db may include, for example, information on each substrate W, information on each substrate processing apparatus 20, and the like. The information on each substrate W may include, for example, information indicating the slot number in which the substrate W is held in the carrier C, the form of the substrate W, and the processing performed on the substrate W. The information indicating the form of the substrate W may include, for example, the thickness (also referred to as film thickness) of one or more types of films on the substrate W, the distribution of film thickness, and the like. The film thickness may be, for example, an average value, a minimum value, or a maximum value of the film thickness. The information on each substrate processing apparatus 20 may include, for example, data related to one or more types of indicators regarding the status of processing (also referred to as substrate processing) on the substrate W in each of the plurality of processing units 21 of each substrate processing apparatus 20. . In other words, the storage unit 14 stores, for example, a database 14db that accumulates data groups related to one or more types of indicators regarding the status of substrate processing in the plurality of processing units 21 of each of the plurality of substrate processing apparatuses 20. The data group includes a plurality of data related to one or more types of indicators.

The control unit 15 includes, for example, an arithmetic processing unit 15a that functions as a processor, a memory 15b that temporarily stores information, and the like. For example, an electric circuit such as a central processing unit (CPU) may be applied to the calculation processing unit 15a. For example, a random access memory (RAM) may be applied to the memory 15b. The arithmetic processing unit 15a can realize the functions of the management server 10, for example, by reading and executing the program 14pg stored in the storage unit 14. Various information temporarily obtained by various information processing in the control unit 15 may be stored in the memory 15b or the like as appropriate. Here, for example, at least a part of the functions realized by the arithmetic processing section 15a may be realized by a dedicated electronic circuit.

The drive 16 is, for example, a portion to which a portable storage medium RM10 can be attached and detached. For example, the drive 16 can transmit and receive data between the storage medium RM10 and the control unit 15 in a state where the storage medium RM10 is attached. Here, for example, the storage medium RM10 storing the program 14pg may be attached to the drive 16, and the program 14Pg may be read into the storage unit 14 from the storage medium RM10 and stored.

<1-3. Configuration of substrate processing equipment>
FIG. 3 is a schematic plan view showing an example of a schematic configuration of the substrate processing apparatus 20. As shown in FIG. The substrate processing apparatus 20 is, for example, a single-wafer type apparatus that can perform various processes by supplying a processing liquid to the surface of the substrate W. Here, as an example of the substrate W, a semiconductor substrate (wafer) is used. The various treatments include, for example, a chemical treatment in which etching is performed using a chemical solution, a cleaning treatment in which foreign matter or an object to be removed is removed with a liquid, a rinsing treatment in which the object is washed away with water, and a coating treatment in which a resist or the like is applied.

The substrate processing apparatus 20 includes a plurality of load ports LP, a transport unit 24, a liquid storage unit 23, and a plurality of processing units 21. Further, the substrate processing apparatus 20 includes, for example, a main body control unit PC0, a schedule management control unit PC1, a plurality of partial control units PC2, a liquid management control unit PC3, and a data storage NA1.

<1-3-1. Load port>
The plurality of load ports LP are mechanisms (also referred to as container holding mechanisms) that can each hold a plurality of carriers (also referred to as FOUPs) C as containers. In the example of FIG. 3, there are first to fourth load ports LP1 to LP4 as the plurality of load ports LP. The first to fourth load ports LP1 to LP4 function as parts (also referred to as loading/unloading sections) for loading and unloading a plurality of substrate groups between the substrate processing apparatus 20 and the outside of the substrate processing apparatus 20. have In the example of FIG. 3, the first to fourth load ports LP1 to LP4 and each processing unit 21 are arranged at intervals in the horizontal direction. Further, the first to fourth load ports LP1 to LP4 are arranged along a first direction DR1 that is horizontal when viewed from above.

Here, the carrier C is transported by the transport device 30 from within the carrier storage area 40 and placed in the first to fourth load ports LP1 to LP4, for example. The carrier C can accommodate, for example, a plurality of (25 in the first embodiment) substrates W as a group of substrates W. The operation of the transport device 30 may be controlled by the management server 10, for example. Here, for example, the transport device 30 may be able to transport the carrier C between a plurality of substrate processing apparatuses 20. In the example of FIG. 3, the transport device 30 is movable, for example, along a first direction DR1 and a horizontal second direction DR2 orthogonal to the first direction DR1. Therefore, for example, carriers C each accommodating a plurality of substrates W constituting one substrate group can be transported from within the carrier storage area 40 and placed on any of the first to fourth load ports LP1 to LP4. In the first to fourth load ports LP1 to LP4, the plurality of carriers C may be arranged along the first direction DR1.

<1-3-2. Transport unit>
The transport unit 24 can, for example, sequentially transport a plurality of substrates W in a group of substrates W accommodated in a carrier C held at a load port LP toward a plurality of processing units 21 . In the first embodiment, the transport unit 24 includes an indexer robot IR and a center robot CR. The indexer robot IR can, for example, transport the substrate W between the first to fourth load ports LP1 to LP4 and the center robot CR. The center robot CR can transport the substrate W between the indexer robot IR and each processing unit 21, for example.

Specifically, the indexer robot IR can, for example, transport multiple substrates W one by one from the carrier C to the center robot CR, and can transport multiple substrates W one by one from the center robot CR to the carrier C. It can be transported individually. Similarly, the center robot CR can, for example, transport a plurality of substrates W one by one from the indexer robot IR to each processing unit 21, and also transport a plurality of substrates W from each processing unit 21 to the indexer robot IR. Can be transported one by one. Further, for example, the central robot CR can transport the substrate W between the plurality of processing units 21 as necessary.

In the example of FIG. 3, the indexer robot IR has two hands H that are U-shaped in plan view. The two hands H are placed at different heights. Each hand H can support a substrate W in a horizontal position. The indexer robot IR can move the hand H in the horizontal and vertical directions. Furthermore, the indexer robot IR can change the direction of the hand H by rotating (rotating) about an axis along the vertical direction. The indexer robot IR moves along the first direction DR1 on a path 201 passing through the delivery position (the position where the indexer robot IR is drawn in FIG. 3). The delivery position is a position where the indexer robot IR and the center robot CR face each other in a direction perpendicular to the first direction DR1 when viewed from above. The indexer robot IR can have a hand H facing an arbitrary carrier C and a center robot CR. Here, for example, by moving the hand H, the indexer robot IR can perform a carry-in operation of carrying the substrate W into the carrier C and a carry-out operation of carrying the substrate W out of the carrier C. Further, for example, the indexer robot IR can cooperate with the center robot CR to perform a transfer operation of moving the substrate W from one of the indexer robot IR and the center robot CR to the other at the transfer position.

In the example of FIG. 3, the center robot CR has two hands H that are U-shaped in plan view, similar to the indexer robot IR. The two hands H are placed at different heights. Each hand H can support a substrate W in a horizontal position. The central robot CR can move each hand H in the horizontal and vertical directions. Furthermore, the central robot CR can change the direction of the hand H by rotating (rotating) about an axis along the vertical direction. The center robot CR is surrounded by a plurality of processing units 21 when viewed from above. The center robot CR can have a hand H facing either an arbitrary processing unit 21 or an indexer robot IR. Here, for example, by moving the hand H, the center robot CR can perform a loading operation of loading the substrate W into each processing unit 21 and an unloading operation of loading the substrate W from each processing unit 21. can. Here, each processing unit 21 has an openable/closable shutter that shields it from the center robot CR. This shutter is opened when the central robot CR carries in the substrate W to the processing unit 21 and carries out the substrate W from the processing unit 21. Further, for example, the center robot CR can cooperate with the indexer robot IR to perform a transfer operation of moving the substrate W from one of the indexer robot IR and the center robot CR to the other.

In addition, the internal space Sc0 of the box in which the plurality of processing units 21 and the center robot CR are located includes a portion (also referred to as a gas supply portion) 22a that supplies gas (for example, air) to the internal space Sc0, and an internal space Sc0. A portion (also referred to as a sensor portion) 22s that detects an index (for example, temperature) indicating the state of the atmosphere of Sc0 is provided. The sensor unit 22s may detect the amount of gas supplied to the internal space Sc0 by the gas supply portion 22a as one index indicating the state of the atmosphere in the internal space Sc0. Here, the state of the atmosphere in the internal space Sc0 affects the substrate processing in the processing unit 21. Therefore, the sensor section 22s can acquire signals related to one or more types of indicators regarding the status of substrate processing in the processing unit 21.

<1-3-3. Liquid storage unit>
The liquid storage unit 23 can store, for example, the processing liquid L1 (see FIG. 4, etc.) used by the plurality of processing units 21. The liquid storage unit 23 includes, for example, one or more storage tanks 23t capable of storing the processing liquid L1. In the example of FIG. 3, the liquid storage unit 23 includes three storage tanks 23t including a first storage tank 23ta, a second storage tank 23tb, and a third storage tank 23tc. Each storage tank 23t is provided with, for example, a sensor section 23s and a heating section 23h. The sensor section 23s is a section for measuring physical quantities indicating the state (for example, concentration, hydrogen ion index (pH), temperature, etc.) of the processing liquid L1 in the storage tank 23t. This processing liquid L1 is used for processing the substrate W in the processing unit 21. The treatment liquid L1 may deteriorate over time and depending on the degree of use, for example. Therefore, the state of the processing liquid L1 affects substrate processing in the processing unit 21. That is, the sensor section 23s can acquire signals related to one or more types of indicators regarding the status of substrate processing in the processing unit 21. The heating part 23h is a part that includes a heating element for adjusting the temperature of the processing liquid L1 in the storage tank 23t. As a heating method for the heating element, for example, a radiation heating method using a halogen lamp, an indirect heating method that does not touch the liquid directly, a radiation heating method using near-infrared light, etc. are adopted. In the example of FIG. 3, the first sensor section 23sa and the first heating section 23ha are located in the first storage tank 23ta, and the second sensor section 23sb and the second heating section 23hb are located in the second storage tank 23tb. A third sensor section 23sc and a third heating section 23hc are located in the third storage tank 23tc. Here, each storage tank 23t may include, for example, a mechanism for stirring the processing liquid L1. Further, for example, one or more storage tanks 23t are connected to each processing unit 21 in such a manner that they can supply the processing liquid L1. Here, each storage tank 23t may be connected to all of the processing units 21 among the plurality of processing units 21, or may be connected to some of the processing units 21 among the plurality of processing units 21. Good too. Further, the same type of processing liquid L1 may be stored in the three storage tanks 23t, or different types of processing liquid L1 may be stored in the three storage tanks 23t. In other words, the same type of processing liquid L1 may be stored between the first storage tank 23ta, the second storage tank 23tb, and the third storage tank 23tc, or mutually different types of processing liquids L1 may be stored. It may be stored.

<1-3-4. Processing unit>
Each of the plurality of processing units 21 can process the substrate W. In the example of FIG. 3, three sets of processing units 21, each consisting of four processing units 21 arranged in a planar manner, are positioned so as to be stacked in the vertical direction. As a result, there are 12 processing units 21 in total. The plurality of processing units 21 include two or more processing units 21 that can perform the same type of substrate processing on the substrate W. Thereby, the plurality of processing units 21 can perform the same type of substrate processing on the substrate W in parallel.

FIG. 4 is a diagram schematically showing a configuration example of the processing unit 21. As shown in FIG. The processing unit 21 can process the substrate W using the processing liquid L1. The processing unit 21 performs various processes on the upper surface Us1 of the substrate W, for example, by supplying the processing liquid L1 onto one main surface (also referred to as the upper surface) Us1 of the substrate W rotating within a plane. I can do it. As the processing liquid L1, for example, a general liquid used for processing a fluidized substrate such as water or a chemical solution with a relatively low viscosity is applied. As the chemical solution, an etching solution or a cleaning chemical solution is applied. More specifically, chemical solutions include sulfuric acid, acetic acid, nitric acid, hydrochloric acid, hydrofluoric acid, fluoronitric acid, aqueous ammonia, aqueous hydrogen peroxide, organic acids (e.g. citric acid, oxalic acid, etc.), organic alkalis (e.g. TMAH: tetra (such as methyl ammonium hydroxide), isopropyl alcohol (IPA), a surfactant, and a corrosion inhibitor.

As shown in FIG. 4, the processing unit 21 includes, for example, a holding section 211, a rotation mechanism 212, a processing liquid supply system 213, and a sensor section 214.

For example, the holding unit 211 can hold and rotate the substrate W in a substantially horizontal position. The holding unit 211 includes, for example, a vacuum chuck having an upper surface 211u capable of vacuum suctioning another main surface (also referred to as a lower surface) Bs1 opposite to the upper surface Us1 of the substrate W, or a plurality of vacuum chucks capable of clamping the peripheral edge of the substrate W. A clamping type chuck having several chuck pins is used.

The rotation mechanism 212 can rotate the holding part 211, for example. The rotation mechanism 212 has, for example, a rotation support shaft 212s and a rotation drive section 212m. The rotation support shaft 212s has, for example, a holding portion 211 connected to its upper end and extends along the vertical direction. The rotation drive unit 212m includes, for example, a motor that can rotate the rotation support shaft 212s about a virtual rotation axis Ax1 along the vertical direction. Here, for example, the rotation drive unit 212m rotates the rotation support shaft 212s about the rotation axis Ax1, so that the holding unit 211 rotates while maintaining its posture along the horizontal plane. Thereby, for example, the substrate W held on the holding part 211 rotates around the rotation axis Ax1. Here, for example, if the upper surface Us1 and the lower surface Bs1 of the substrate W are approximately circular, the rotation axis Ax1 passes through the center of the upper surface Us1 and the lower surface Bs1 of the substrate W.

The processing liquid supply system 213 can discharge one or more types of processing liquid L1 toward the substrate W, for example. In the example of FIG. 4, the processing liquid supply system 213 includes a first processing liquid supply section 213a, a second processing liquid supply section 213b, and a third processing liquid supply section 213c.

The first processing liquid supply section 213a includes, for example, a nozzle Nz1, a piping section Pp1, a movable piping section At1, a discharge valve Vv1, and a liquid supply section Su1. The nozzle Nz1 can, for example, discharge the first processing liquid L11, which is one of the processing liquids L1, toward the substrate W held by the holding part 211. The piping section Pp1 connects the liquid supply section Su1 and the nozzle Nz1, and forms a path through which the first processing liquid L11 flows. Moreover, the movable piping part At1 is located in the middle of the piping part Pp1, and supports the part of the piping part Pp1 on the nozzle Nz1 side so as to be rotatable about an axis along the vertical direction. For example, the driving force of a drive unit such as a motor causes a state in which the nozzle Nz1 is located on the substrate W (also referred to as a state in which liquid can be ejected) and a state in which the nozzle Nz1 is not located on the substrate W (evacuation state). (also referred to as state) can be switched. In the example of FIG. 4, the first processing liquid supply unit 213a is in a liquid ejecting state, and the nozzle Nz1 can eject the first processing liquid L11 from directly above the substrate W toward the upper surface Us1 of the substrate W. The discharge valve Vv1 is disposed, for example, in the middle of the piping section Pp1, and can be opened and closed in response to a signal from the partial control unit PC2. Here, for example, by opening the discharge valve Vv1, the liquid supply section Su1 and the nozzle Nz1 are brought into communication. Further, for example, when the discharge valve Vv1 is closed, the liquid supply section Su1 and the nozzle Nz1 are not in communication with each other. The liquid supply unit Su1 supplies the first processing liquid L11 from the liquid storage unit 23 (here, the first storage tank 23ta) to the piping section in response to, for example, a signal from the main body control unit PC0 or the partial control unit PC2. It can be fed towards Pp1. For example, a pump is applied to the liquid supply unit Su1.

The second processing liquid supply section 213b has a similar configuration to the first processing liquid supply section 213a. Specifically, the second processing liquid supply section 213b includes, for example, a nozzle Nz2, a piping section Pp2, a movable piping section At2, a discharge valve Vv2, and a liquid supply section Su2. The nozzle Nz2 can, for example, discharge the second processing liquid L12, which is one of the processing liquids L1, toward the substrate W held by the holding part 211. The piping section Pp2 connects the liquid supply section Su2 and the nozzle Nz2, and forms a path through which the second processing liquid L12 flows. Moreover, the movable piping part At2 is located in the middle of the piping part Pp2, and supports the part of the piping part Pp2 on the nozzle Nz2 side so as to be rotatable about an axis along the vertical direction. For example, the driving force of a drive unit such as a motor causes a state in which the nozzle Nz2 is located on the substrate W (liquid ejection possible state) and a state in which the nozzle Nz2 is not located on the substrate W (retracted state). and can be switched. In the example of FIG. 4, the second processing liquid supply unit 213b is in a liquid ejecting state, and the nozzle Nz2 can eject the second processing liquid L12 from directly above the substrate W toward the upper surface Us1 of the substrate W. The discharge valve Vv2 is disposed, for example, in the middle of the piping section Pp2, and can be opened and closed in response to a signal from the partial control unit PC2. Here, for example, by opening the discharge valve Vv2, the liquid supply section Su2 and the nozzle Nz2 are brought into communication. Further, for example, by closing the discharge valve Vv2, the liquid supply section Su2 and the nozzle Nz2 are in a state of not communicating with each other. The liquid supply unit Su2 supplies the second processing liquid L12 from the liquid storage unit 23 (here, the second storage tank 23tb) to the piping unit Pp2 in response to a signal from the main control unit PC0 or the partial control unit PC2, for example. It can be sent towards. For example, a pump is applied to the liquid supply unit Su2.

Although FIG. 4 depicts a case where both the first processing liquid supply section 213a and the second processing liquid supply section 213b are in a liquid ejectable state, in reality, the first processing liquid supply section 213a and the second processing liquid supply section 213b From the state in which both of the two processing liquid supply sections 213b are in the retracted state, one of the first processing liquid supply section 213a and the second processing liquid supply section 213b is alternatively switched to a state in which liquid can be discharged. Furthermore, in FIG. 4, the first processing liquid supply section 213a and the second processing liquid supply section 213b have a vertically shifted relationship so as not to interfere with each other, but the first processing liquid supply section 213a and the second processing liquid supply section 213b If the switching operation between the retracted state and the liquid ejectable state of the second processing liquid supply section 213b is properly synchronized, the first processing liquid supply section 213a and the second processing liquid supply section 213b are vertically shifted. Even if they are not related, they do not interfere with each other.

The third processing liquid supply section 213c includes, for example, a nozzle Nz3, a piping section Pp3, a discharge valve Vv3, and a liquid supply section Su3. The nozzle Nz3 can, for example, discharge the third processing liquid L13, which is one of the processing liquids L1, toward the substrate W held by the holding part 211. In the example of FIG. 4, the nozzle Nz3 can discharge the third processing liquid L13 toward the upper surface Us1 of the substrate W from diagonally above the substrate W. The piping section Pp3 connects the liquid supply section Su3 and the nozzle Nz3, and forms a path through which the third processing liquid L13 flows. The discharge valve Vv3 is disposed, for example, in the middle of the piping section Pp3, and can be opened and closed in response to a signal from the partial control unit PC2. Here, for example, by opening the discharge valve Vv3, the liquid supply section Su3 and the nozzle Nz3 are brought into communication. Further, for example, by closing the discharge valve Vv3, the liquid supply section Su3 and the nozzle Nz3 are in a state of not communicating with each other. The liquid supply section Su3 supplies the third processing liquid L13 from the liquid storage unit 23 (here, the third storage tank 23tc) to the piping section Pp3 in response to a signal from the main control unit PC0 or the partial control unit PC2, for example. It can be sent towards. For example, a pump is applied to the liquid supply unit Su3.

Here, for example, the first treatment liquid L11 is discharged from the nozzle Nz1 of the first treatment liquid supply section 213a toward the substrate W, and the second treatment liquid L11 is discharged toward the substrate W from the nozzle Nz2 of the second treatment liquid supply section 213b. The discharge of the third treatment liquid L12 and the discharge of the third treatment liquid L13 toward the substrate W from the nozzle Nz3 of the third treatment liquid supply section 213c may be performed in order.

Here, the processing liquid L1 discharged from each nozzle Nz1 to Nz3 toward the substrate W is collected by, for example, a cup provided from the side to the bottom of the substrate W, and is stored in a corresponding storage tank of the liquid storage unit 23. Returned to 23t. In other words, the processing liquid L1 stored in the liquid storage unit 23 is repeatedly used for substrate processing in a circulating manner. At this time, for example, the processing liquid L1 shows a tendency to gradually deteriorate. Here, when the processing liquid L1 is returned from the processing unit 21 to the liquid storage unit 23, the processing liquid L1 may be purified using a filter or the like.

Further, here, for example, the processing unit 21 may include one to two or four or more processing liquid supply sections.

The sensor unit 214 can, for example, acquire signals related to one or more types of indicators regarding the status of substrate processing in the processing unit 21. In the example of FIG. 4, the sensor unit 214 includes a film thickness meter Fm0 for detecting the state of the substrate W and an imaging unit 21sb. The film thickness meter Fm0 may be one that utilizes optical interference, for example. The imaging unit 21sb uses an imaging device such as an area sensor in which light receiving elements are arranged in a plane, for example.

The film thickness meter Fm0 is fixed to, for example, an arm part Am1 rotatably supported by a movable part At0 about an axis along the vertical direction. For example, by rotating the arm part Am1 by a driving force from a driving part such as a motor, the film thickness meter Fm0 is positioned on the substrate W (measurable state) and the film thickness meter is placed on the substrate W. The state where the thickness gauge Fm0 is not located (retracted state) can be switched. For example, the film thickness meter Fm0 may be protected by a shield for protecting it from adhesion of the processing liquid L1 in the retracted state. Here, by rotating the arm part Am1 while appropriately rotating the substrate W with the rotation mechanism 212, the film thickness meter Fm0 measures the thickness of various films located over a wide range on the substrate W (film thickness meter Fm0). (also called thickness) can be measured. Here again, the film thickness may be, for example, any of the average value, minimum value, and maximum value of the film thickness. Here, as the film located on the substrate W, various films such as an oxide film, a silicon single crystal layer, a silicon polycrystalline layer, an amorphous silicon layer, a resist film, etc. can be employed. The film thickness meter Fm0 can measure the film thickness of the film on the substrate W, for example, before and after the processing of the substrate W with the processing liquid L1 in the processing unit 21. Thereby, it is possible to obtain a signal related to the film thickness as one index regarding the status of substrate processing in the processing unit 21. For example, the film thickness meter Fm0 sends the obtained signal to the partial control unit PC2. In FIG. 4, the distance between the upper surface Us1 of the substrate W and the film thickness meter Fm0 is illustrated for convenience in the measurable state, but in reality, the distance between the upper surface Us1 of the substrate W and the film thickness meter Fm0 is The film thickness is measured in a state close to the upper surface Us1.

For example, the imaging unit 21sb captures an image of the situation on the substrate W before and after the processing of the substrate W with the processing liquid L1 in the processing unit 21, thereby obtaining an image of the substrate W as an index of the state of substrate processing in the processing unit 21. An image signal related to the state of the upper surface Us1 can be acquired. The imaging unit 21sb, for example, sends the obtained image signal to the partial control unit PC2.

The sensor unit 214 includes, for example, a flow meter that detects the discharge amount of the processing liquid L1 discharged from each nozzle Nz1 to Nz3, and a position (also referred to as a discharge position) at which each nozzle Nz1 and Nz2 discharges the processing liquid L1. The sensor may also include a sensor (for example, an angle sensor, etc.).

<1-3-5. Main body control unit>
The main body control unit PC0 can control, for example, the transmission and reception of data with the management server 10 and the operation of each part of the substrate processing apparatus 20.

FIG. 5 is a block diagram showing how the control system and data transmission/reception system in the substrate processing apparatus 20 are connected. Here, the main body control unit PC0, the schedule management control unit PC1, the plurality of partial control units PC2, and the liquid management control unit PC3 mutually exchange various control signals via the control communication line L0c. The connection is such that it is possible to send and receive data. In addition, the main body control unit PC0, the schedule management control unit PC1, the plurality of partial control units PC2, the liquid management control unit PC3, and the data storage NA1 communicate with each other via the data communication line L0d. Connected so that data can be sent and received. The control communication line L0c and the data communication line L0d may be either wired lines or wireless lines.

FIG. 6(a) is a block diagram showing an example of the electrical configuration of the main body control unit PC0. As shown in FIG. 6(a), the main body control unit PC0 is realized by, for example, a computer, and includes a communication section P01, an input section P02, an output section P03, and a storage section P04 connected via a bus line Bu0. , a control unit P05, and a drive P06.

The communication unit P01, for example, transmits and receives signals between the schedule management control unit PC1, the plurality of partial control units PC2, and the liquid management control unit PC3 via the control communication line L0c, and the communication line for data. It has a function as a transmitting unit and a receiving unit capable of transmitting and receiving data between the schedule management control unit PC1, the plurality of partial control units PC2, the liquid management control unit PC3, and the data storage NA1 via L0d. Furthermore, the communication unit P01 has a function as a receiving unit capable of receiving signals from the management server 10 via the communication line 5, for example.

The input unit P02 can input a signal corresponding to, for example, an operation of a user using the substrate processing apparatus 20. Here, the input unit P02 may include, for example, like the input unit 12, an operation unit, a microphone, various sensors, and the like. For example, the input unit P02 may be capable of inputting a signal instructing manual correction of recipe information.

The output unit P03 can output various information, for example. Here, the output unit P03 may include, for example, a display unit, a speaker, etc., similar to the output unit 13 described above. This display unit may have the form of a touch panel integrated with at least a portion of the input unit P02.

The storage unit P04 can store information, for example. This storage unit P04 may be configured with a nonvolatile storage medium such as a hard disk or flash memory, for example. The storage unit P04 adopts, for example, a configuration having one storage medium, a configuration having two or more storage media integrally, or a configuration having two or more storage media divided into two or more parts. may be done. The storage unit P04 stores, for example, a program Pg0, various information Dt0, and a database Db0. The storage unit P04 may include a memory P05b, which will be described later. The database Db0 may include, for example, information on each substrate W as a processing target in the substrate processing apparatus 20 and data related to one or more types of indicators regarding the status of substrate processing in each of the plurality of processing units 21. In other words, the storage unit P04 stores one or more types of indicators regarding the status of substrate processing in each of the plurality of processing units 21 based on the signals acquired by the plurality of sensor units 22s, 23s, and 214, for example. A database Db0 storing data groups can be stored. The information on each substrate W may include, for example, information indicating the form of the substrate W and the processing performed on the substrate W. The information indicating the form of the substrate W may include, for example, one or more types of film thickness and film thickness distribution on the substrate W.

The control unit P05 includes, for example, an arithmetic processing unit P05a that functions as a processor, a memory P05b that temporarily stores information, and the like. As the arithmetic processing unit P05a, for example, an electronic circuit such as a CPU may be employed, and as the memory P05b, for example, a RAM or the like may be employed. The arithmetic processing unit P05a can realize the functions of the main body control unit PC0, for example, by reading and executing the program Pg0 stored in the storage unit P04. Various information temporarily obtained by various information processing in the control unit P05 may be stored in the memory P05b or the like as appropriate.

The drive P06 is, for example, a portion to which a portable storage medium RM0 can be attached and detached. For example, the drive P06 can transmit and receive data between the storage medium RM0 and the control unit P05 in a state where the storage medium RM0 is attached. Further, the drive P06 may read the program Pg0 from the storage medium RM0 into the storage unit P04 and store the program Pg0 in a state where the storage medium RM0 storing the program Pg0 is attached to the drive P06.

FIG. 6(b) is a block diagram illustrating an example of a functional configuration realized by the arithmetic processing unit P05a. As shown in FIG. 6(b), the arithmetic processing unit P05a includes, for example, an information acquisition unit F01, an instruction unit F02, a storage control unit F03, an output control unit F04, and a transmission control unit. It has F05. For example, the memory P05b is used as a work space for processing in each of these units. Here, for example, at least a part of the functions realized by the arithmetic processing unit P05a may be realized by a dedicated electronic circuit.

The information acquisition unit F01 can obtain various information from the management server 10, for example. For example, the information acquisition unit F01 can acquire information about a group of substrates W stored in a carrier C placed on the load port LP from the management server 10. Here, the information about the group of substrates W includes, for example, the number of substrates W, job, film thickness information, recipe information, and the like. Here, the film thickness information includes, for example, at least one of the following: average film thickness, minimum film thickness, maximum film thickness, film thickness distribution, and the like. The recipe information includes, for example, a flow recipe that defines the flow of substrate processing, a process recipe that defines conditions for processing to be performed on the substrate W, and information on a correction formula that defines recipe correction rules. Further, the information acquisition section F01 can obtain, for example, data based on signals related to various indicators obtained by the respective sensor sections 22s, 23s, and 214 via the partial control unit PC2.

The instruction unit F02 can issue various instructions to the schedule management control unit PC1, the plurality of partial control units PC2, and the liquid management control unit PC3, for example. For example, the instruction unit F02 instructs the schedule management control unit PC1 to set a time schedule for transporting and processing a group of substrates W in the substrate processing apparatus 20, and performs operations according to a recipe and a time schedule. It is possible to instruct the plurality of partial control units PC2 to perform such operations, and to instruct the liquid management control unit PC3 to perform temperature control, replacement, monitoring, etc. of the processing liquid L1. The time schedule defines, for example, the timing for transporting the substrate W by the transport unit 24, the timing for processing the substrate W by the plurality of processing units 21, and the like. Thereby, for example, the plurality of processing units 21 can process the substrate W according to a recipe that defines the conditions for the process to be performed on the substrate W. In the first embodiment, for example, two or more of the plurality of processing units 21 can perform the same type of processing on the substrate W in parallel according to the same process recipe. Here, the same type of processing means a process in which the substrate W is processed in the same procedure using the same one or more types of processing liquid L1 within the processing unit 21. For example, even if the processing time for the substrate W using the processing liquid L1 increases or decreases due to recipe correction to be described later, the substrate W may be processed using the same one or more types of processing liquid L1 in the processing unit 21 in the same procedure. If the processing is performed on the same type of processing, it can be said to be the same type of processing.

For example, the storage control unit F03 can cause the storage unit P04 to store the information obtained by the information acquisition unit F01. As a result, in the storage unit P04, for example, recipe information and time schedule information constitute various information Dt0, and data related to various indicators obtained by each sensor unit 22s, 23s, 214 is accumulated. A database Db0 is constructed. In the database Db0, for example, information on the location and timing at which various indicators were obtained, information on the substrate W that was the processing target when the various indicators were obtained, etc. are stored in a state in which they are associated with data related to the indicators. Ru.

The output control unit F04 can, for example, cause the output unit P03 to visually or audibly output information about the state of the substrate processing apparatus 20.

The transmission control unit F05 can, for example, cause the communication unit P01 to transmit various types of information to the management server 10. Here, the various types of information may include, for example, information related to the results of processing on a group of substrates W in each carrier C in the substrate processing apparatus 20, and data related to various indicators stored in the database Db0. Further, the transmission control unit F05 can, for example, cause the communication unit P01 to transmit recipe information to the plurality of partial control units PC2.

<1-3-6. Schedule management control unit>
The schedule management control unit PC1 can, for example, correct a recipe and set a time schedule according to the recipe for a group of substrates W stored in the carrier C in response to an instruction from the main body control unit PC0. . The time schedule includes, for example, the timing for sequentially transporting a plurality of substrates W constituting a group of substrates W stored in a carrier C by the transport unit 24 to a plurality of processing units 21, and the timing for processing these plurality of substrates W. Specify the timing and.

FIG. 7A is a block diagram showing an example of the electrical configuration of the schedule management control unit PC1. As shown in FIG. 7A, the schedule management control unit PC1 is realized by, for example, a computer, and includes a communication section P11, a storage section P14, and a control section P15, which are connected via a bus line Bu1. .

The communication unit P11, for example, transmits and receives signals with the main body control unit PC0 etc. via the control communication line L0c, and with the main body control unit PC0 and data storage NA1 via the data communication line L0d. It functions as a transmitter and a receiver capable of transmitting and receiving data between the two.

The storage unit P14 can store information, for example. This storage unit P14 may be configured with a nonvolatile storage medium such as a hard disk or flash memory, for example. The storage unit P14 adopts, for example, a configuration having one storage medium, a configuration having two or more storage media integrally, or a configuration having two or more storage media divided into two or more parts. may be done. The storage unit P14 stores, for example, a program Pg1 and various information Dt1. The storage unit P14 may include a memory P15b, which will be described later.

The control unit P15 includes, for example, an arithmetic processing unit P15a that functions as a processor, a memory P15b that temporarily stores information, and the like. As the arithmetic processing unit P15a, for example, an electronic circuit such as a CPU may be employed, and as the memory P15b, for example, a RAM or the like may be employed. The arithmetic processing unit P15a can realize the functions of the schedule management control unit PC1, for example, by reading and executing the program Pg1 stored in the storage unit P14. Various information temporarily obtained by various information processing in the control unit P15 may be stored in the memory P15b or the like as appropriate.

FIG. 7(b) is a block diagram showing an example of a functional configuration realized by the arithmetic processing unit P15a. As shown in FIG. 7B, the arithmetic processing unit P15a includes, for example, a recipe acquisition unit F11, an information acquisition unit F12, a first correction unit F13, a schedule setting unit F14, and a transmission unit F14 as a functional configuration to be realized. It has a control section F15. For example, the memory P15b is used as a work space for processing in each of these parts. Here, for example, at least a part of the functions realized by the arithmetic processing unit P15a may be realized by a dedicated electronic circuit.

For example, in response to an instruction from the main body control unit PC0, the recipe acquisition unit F11 acquires recipe information for a group of substrates W stored in the carrier C placed on the load port LP from the main body control unit PC0. be able to.

The information acquisition unit F12 can obtain, for example, a data group related to one or more types of indicators regarding the status of substrate processing in each of the plurality of processing units 21 from the data storage NA1. Further, the information acquisition unit F12 may obtain information on each substrate W in a group of substrates W stored in the carrier C from the main body control unit PC0, for example. Note that the information acquisition unit F12 may obtain, for example, a data group related to one or more types of indicators regarding the status of substrate processing in each of the plurality of processing units 21 from the main body control unit PC0.

For example, the first correction unit F13 is configured to perform processing on a group of substrates W using a plurality of processing units 21 based on a data group related to one or more types of indicators regarding the status of substrate processing in each of the plurality of processing units 21. Accordingly, the first recipe correction can be performed to correct the recipes all at once. Thereby, for example, recipes can be similarly corrected for a plurality of substrates W subjected to the same type of processing in a plurality of processing units 21.

Here, the first correction unit F13 can correct the recipe, for example, by applying numerical values related to one or more types of indicators to a correction formula accompanying the recipe. The numerical values related to one or more types of indicators include, for example, the numerical values of the index indicating the state of the atmosphere in the internal space Sc0 (atmosphere temperature, gas supply amount), the numerical values of the index indicating the state of the processing liquid L1 (for example, concentration, pH, temperature, etc.), numerical values of indicators indicating the state of the substrate W (for example, film thickness before and after treatment, etching rate, degree of unevenness on the substrate surface), and the like. For example, a mode can be considered in which the processing time, which is one of the conditions for processing the substrate W specified in the process recipe, is multiplied by a coefficient corresponding to the numerical value of one or more types of indicators. Specifically, for example, when the standard processing time specified in the process recipe is 100, a coefficient is added to the processing time 100 in the first recipe correction in response to a decrease in the concentration or temperature of the processing liquid L1. A possible example is that the processing time is multiplied by 1.1 and the processing time is set to 110 (=100×1.1). At this time, for example, the correction formula may include a prediction of a change in the state of the processing liquid L1.

Here, the first correction unit F13 is based on, for example, a data group related to one or more types of indicators and information on each substrate W in the group of substrates W stored in the carrier C obtained from the main body control unit PC0. You may also correct the recipe.

The schedule setting unit F14 can set a time schedule according to a recipe, for example. Here, for example, if the recipe is corrected by the first correction unit F13, the schedule setting unit F14 will, according to the recipe after the recipe correction (first recipe correction) is performed by the first correction unit F13, Configure time schedule settings. Thereby, for example, the group of substrates W within the substrate processing apparatus 20 can be efficiently transported and processed. As a result, for example, the throughput in the substrate processing apparatus 20 can be improved.

The transmission control unit F15 can, for example, cause the communication unit P11 to transmit various types of information to the main body control unit PC0. Here, the various types of information may include, for example, information on a corrected recipe corrected by the first correction unit F13.

<1-3-7. Partial control unit>
The plurality of partial control units PC2 can control the operations of the plurality of processing units 21 and transport units 24, for example, in accordance with instructions from the main body control unit PC0. In the first embodiment, a dedicated partial control unit PC2 is provided for each processing unit 21, and a dedicated partial control unit PC2 is also provided for the transport unit 24. The partial control unit PC2 of the processing unit 21 can control the operation of each part of the processing unit 21 while appropriately monitoring the operation and state of each part of the processing unit 21, for example. The partial control unit PC2 of the transport unit 24 can control the operation of each part of the transport unit 24 while appropriately monitoring the operation and state of each part of the transport unit 24, for example. Note that, for example, one partial control unit PC2 may be provided for two or more processing units 21, or the operation of the transport unit 24 may be controlled by the main body control unit PC0.

FIG. 8(a) is a block diagram showing an example of the electrical configuration of the partial control unit PC2. As shown in FIG. 8A, the partial control unit PC2 is realized by, for example, a computer, and includes a communication section P21, a storage section P24, and a control section P25, which are connected via a bus line Bu2.

The communication unit P21, for example, transmits and receives signals with the main body control unit PC0 etc. via the control communication line L0c, and with the main body control unit PC0 and data storage NA1 via the data communication line L0d. It functions as a transmitter and a receiver capable of transmitting and receiving data between the two.

The storage unit P24 can store information, for example. This storage unit P24 may be configured with a nonvolatile storage medium such as a hard disk or flash memory, for example. The storage unit P24 adopts, for example, a configuration having one storage medium, a configuration having two or more storage media integrally, or a configuration having two or more storage media divided into two or more parts. may be done. The storage unit P24 stores, for example, a program Pg2 and various information Dt2. The storage unit P24 may include a memory P25b, which will be described later.

The control unit P25 includes, for example, an arithmetic processing unit P25a that functions as a processor, a memory P25b that temporarily stores information, and the like. As the arithmetic processing unit P25a, for example, an electronic circuit such as a CPU may be employed, and as the memory P25b, for example, a RAM or the like may be employed. The arithmetic processing unit P25a can realize the functions of the partial control unit PC2, for example, by reading and executing the program Pg2 stored in the storage unit P24. Various information temporarily obtained by various information processing in the control unit P25 may be stored in the memory P25b or the like as appropriate.

FIG. 8(b) is a block diagram showing an example of a functional configuration realized by the arithmetic processing unit P25a. As shown in FIG. 8(b), the arithmetic processing unit P25a includes, for example, a recipe acquisition unit F21, an information acquisition unit F22, a second correction unit F23, a unit control unit F24, and a transmission unit It has a control section F25. For example, the memory P25b is used as a work space for processing in each of these parts. Here, for example, at least a part of the functions realized by the arithmetic processing unit P25a may be realized by a dedicated electronic circuit.

The recipe acquisition unit F21 can acquire a recipe from the main body control unit PC0, for example. The recipe acquired here may be a process recipe or a flow recipe, for example.

The information acquisition unit F22 can obtain, for example, a data group related to one or more types of indicators regarding the status of substrate processing in each of the plurality of processing units 21 from the data storage NA1.

The second correction unit F23, for example, uses the information acquisition unit F22 to determine the processing for at least one substrate W out of a group of substrates W using one or more processing units 21 among the plurality of processing units 21. At least part of the recipe can be corrected (also referred to as second recipe correction) based on the obtained data group related to one or more types of indicators regarding the status of substrate processing in each of the plurality of processing units 21. . Here, for example, the second correction unit F23 performs processing using some of the processing units 21 among the plurality of processing units 21 on some of the substrates W of the group of substrates W. A part of the recipe can be corrected based on a data group related to one or more types of indicators regarding the status of substrate processing in each of the above. In the first embodiment, for example, some of the processing units 21 of the plurality of processing units 21 are one processing unit 21, and some of the substrates W of the group of substrates W are one substrate. W is fine. Further, the timing at which the second recipe correction is performed is, for example, after the first recipe correction is performed on a group of substrates W, and one process is performed on one substrate W of the group of substrates W. It is sufficient as long as it is before processing using the unit 21 is performed. For example, a mode in which the second recipe correction is executed in response to completion of processing on one substrate W using one processing unit 21 immediately before one substrate W out of a group of substrates W. is possible. Thereby, for example, when two or more processing units 21 sequentially perform the same type of processing on the substrate W in parallel, the recipe can be corrected for each substrate W in a state close to real time.

Here, in the second correction unit F23, for example, similarly to the first correction unit F13, the recipe can be corrected by applying the numerical values of one or more types of indexes to the correction formula accompanying the recipe. The numerical value of the index applied here may be based on the latest index acquired by each sensor unit 22s, 23s, 214, etc. before the second recipe correction is performed, for example. Here, for example, when two or more processing units 21 perform the same type of processing on the substrate W in parallel, one type of substrate processing status in the processing unit 21 that most recently completed processing on the substrate W is used. Part of the recipe may be corrected based on the data group related to the above indicators. Specifically, in the second recipe correction by the second correction unit F23, for example, when the processing time specified in the process recipe after the first recipe correction is 110, the processing time of the processing liquid L1 is In response to a decrease in concentration or temperature, in the second recipe correction, the processing time 110 is multiplied by a coefficient 1.1, making the processing time 121 (=110 x 1.1). It will be done.

By such second recipe correction, for example, taking into account the status of substrate processing in other processing units 21 among the plurality of processing units 21, the wafer The recipe that defines the conditions for the treatment to be applied can be amended. Thereby, for example, the accuracy of substrate processing in each processing unit 21 of the substrate processing apparatus 20 can be improved. Further, for example, after the recipe is collectively corrected for a group of substrates W by the first recipe correction, the recipe is further corrected for some of the substrates W of the group of substrates W by the second recipe correction. Ru. For this reason, for example, two methods including batch correction of a certain degree of recipe for a group of substrates W (first recipe correction) and correction of a recipe in a state close to real time for some substrates W (second recipe correction) are performed. Corrections to the step recipe may be made. Thereby, for example, it is possible to easily perform highly accurate processing on the substrate in accordance with the situation.

The unit control section F24 can cause the processing unit 21 to perform processing on the substrate W, for example, based on the process recipe after the second recipe correction has been performed by the second correction section F23. In the processing unit 21, the unit control section F24 can control the operation of the sensor section 214, for example. Further, the unit control section F24 of the transport unit 24 can, for example, control the operation of the sensor section 22s. The operating conditions of the sensor section 214 and the sensor section 22s may be defined by a recipe, for example. Thereby, the sensor section 214 and the sensor section 22s can acquire signals related to one or more types of indicators regarding the status of substrate processing in the processing unit 21. At this time, the unit control section F24 can acquire signals related to one or more types of indicators from the sensor section 214 and the sensor section 22s, for example. Here, the unit control section F24 may calculate the etching rate as a numerical value based on a signal related to one or more types of indicators, for example, from the film thickness before and after processing and the processing time. At this time, the film thickness before processing may be, for example, the film thickness of the substrate W obtained by the sensor unit 214, or the film thickness of the substrate W obtained by the main body control unit PC0 from the management server 10. Good too. For example, the main body control unit PC0 performs image processing on the image signal obtained from the sensor unit 214 to generate numerical values based on signals related to one or more types of indicators, such as the degree of unevenness on the surface of the substrate W. You may also calculate a numerical value indicating .

The transmission control unit F25 can, for example, cause the communication unit P21 to transmit various types of information to the main body control unit PC0 and data storage NA1. Here, various types of information sent to the main body control unit PC0 include, for example, information that the substrate processing has been completed, a history (process log) of the processing actually performed on the substrate W, and the information corrected by the second correction unit F23. It may include corrected recipe information and data related to one or more types of indicators acquired using the sensor units 22s and 214. Further, various types of information transmitted to the data storage NA1 may include, for example, data related to one or more types of indicators acquired using the sensor sections 22s and 214.

<1-3-8. Liquid management control unit>
The liquid management control unit PC3 can manage the state of the processing liquid L1 in the liquid storage unit 23, for example, by controlling the operation of each part included in the liquid storage unit 23.

FIG. 9A is a block diagram showing an example of the electrical configuration of the liquid management control unit PC3. As shown in FIG. 9A, the liquid management control unit PC3 is realized by, for example, a computer, and includes a communication section P31, a storage section P34, and a control section P35, which are connected via a bus line Bu3.

The communication unit P31, for example, transmits and receives signals with the main body control unit PC0 etc. via the control communication line L0c, and with the main body control unit PC0 and data storage NA1 via the data communication line L0d. It functions as a transmitter and a receiver capable of transmitting and receiving data between the two.

The storage unit P34 can store information, for example. This storage unit P34 may be configured with a nonvolatile storage medium such as a hard disk or flash memory, for example. The storage unit P34 adopts, for example, a configuration having one storage medium, a configuration having two or more storage media integrally, or a configuration having two or more storage media divided into two or more parts. may be done. The storage unit P34 stores, for example, a program Pg3 and various information Dt3. The storage unit P34 may include a memory P35b, which will be described later.

The control unit P35 includes, for example, an arithmetic processing unit P35a that functions as a processor, a memory P35b that temporarily stores information, and the like. As the arithmetic processing unit P35a, for example, an electronic circuit such as a CPU may be employed, and as the memory P35b, for example, a RAM or the like may be employed. The arithmetic processing unit P35a can realize the functions of the liquid management control unit PC3, for example, by reading and executing the program Pg3 stored in the storage unit P34. Various information temporarily obtained by various information processing in the control unit P35 may be stored in the memory P35b or the like as appropriate.

FIG. 9(b) is a block diagram showing an example of a functional configuration realized by the arithmetic processing unit P35a. As shown in FIG. 9(b), the arithmetic processing unit P35a includes, for example, an information acquisition unit F31, a unit control unit F32, and a transmission control unit F33 as functional configurations to be realized. For example, the memory P35b is used as a work space for processing in each of these parts. Here, for example, at least a part of the functions realized by the arithmetic processing unit P35a may be realized by a dedicated electronic circuit.

The information acquisition unit F31 can acquire various instructions from the main body control unit PC0, for example. The various instructions include, for example, instructions to control the temperature of the processing liquid L1, replace it, monitor it, and the like.

The unit control section F32 can control the operation in the liquid storage unit 23, for example. For example, the unit control section F32 can cause the sensor section 23s of each storage tank 23t to acquire a signal related to a physical quantity indicating the state of the processing liquid L1. Thereby, the sensor section 23s can acquire signals related to one or more types of indicators regarding the status of substrate processing in the processing unit 21. Moreover, the unit control part F32 can heat the processing liquid L1 in each storage tank 23t by the heating part HR, for example. Note that, for example, when each storage tank 23t has a liquid exchange section that automatically exchanges the processing liquid L1, the unit control section F32 causes the liquid exchange section to exchange the processing liquid L1 in each storage tank 23t. I can do it.

The transmission control unit F33 can, for example, cause the communication unit P31 to transmit various types of information to the main body control unit PC0 and data storage NA1. Here, various types of information transmitted to the main body control unit PC0 include, for example, information related to one or more types of indicators acquired using the sensor section 23s, the elapsed time since the liquid exchange in each storage tank 23t, and the processing liquid. Contains information such as the number of times L1 has been used. The various types of information transmitted to the data storage NA1 include, for example, information related to one or more types of indicators acquired using the sensor unit 23s.

<1-3-9. Data storage>
The data storage NA1 stores data groups related to one or more types of indicators regarding the status of substrate processing in each of the plurality of processing units 21, for example, based on signals acquired by the respective sensor units 22s, 23s, 214, etc. can do. For example, a nonvolatile storage medium such as a hard disk or a flash memory may be applied to the data storage NA1, or a volatile storage medium such as a RAM may be applied.

FIG. 10 is a diagram showing an example of the contents of the data group DG1 stored in the data storage NA1. As shown in FIG. 10, the data group DG1 includes, for example, numerical values of indicators indicating the state of the atmosphere in the internal space Sc0 (for example, the temperature of the atmosphere, the amount of gas supplied, etc.), and the values of indicators indicating the state of the processing liquid L1. It may include numerical values (for example, concentration, pH, temperature, etc.), numerical values of indicators indicating the state of the substrate W (for example, film thickness before and after processing, etching rate, degree of unevenness on the substrate surface), and the like. Furthermore, the data group DG1 may include, for example, numerical values of indicators (ejection amount, ejection position, etc.) indicating the ejection state of the processing liquid L1. Here, in the data storage NA1, for example, various data included in the data group DG1 are overwritten to become data related to the latest index.

<1-4. Recipe correction operation>
FIG. 11 is a flowchart showing an example of the operation flow related to the first recipe correction. Here, for example, the program Pg0 is executed by the arithmetic processing unit P05a of the main body control unit PC0, and the program Pg1 is executed by the arithmetic processing unit P15a of the schedule management control unit PC1, so that the main body control unit PC0 and the schedule management In cooperation with the control unit PC1, an operation flow regarding the operation related to the first recipe correction is realized.

First, in step Sp1 of FIG. 11, the information acquisition unit F01 of the main body control unit PC0 determines whether or not the job has been acquired from the management server 10. Here, for example, in response to the carrier C storing a group of substrates W being placed on the load port LP, the information acquisition unit F01 sends a group of substrates storing the carrier C from the management server 10. The determination in step Sp1 is repeated until a job for W is obtained. Then, if the information acquisition unit F01 obtains the job, the process proceeds to step Sp2.

In step Sp2, the information acquisition unit F01 of the main body control unit PC0 acquires information about the group of substrates W including the recipe corresponding to the job obtained in step Sp1 from the management server 10. At this time, the recipe acquisition unit F11 of the schedule management control unit PC1 acquires information about the group of substrates W.

In step Sp3, the information acquisition unit F12 of the schedule management control unit PC1 acquires a data group related to one or more types of indicators regarding the status of substrate processing in each of the plurality of processing units 21 from the data storage NA1.

In step Sp4, the first correction unit F13 of the schedule management control unit PC1 uses one or more types of indicators regarding the substrate processing status in each of the plurality of processing units 21 obtained in step Sp3 for the group of substrates W. A first recipe correction is performed based on the data group. Here, the first correction unit F13 calculates a data group related to one or more types of indicators regarding the status of substrate processing in each of the plurality of processing units 21 regarding processing on a group of substrates W using the plurality of processing units 21. Based on this, the recipes are corrected all at once. Thereby, for example, recipes can be similarly corrected for a plurality of substrates W that are subjected to the same type of processing in two or more processing units 21.

In step Sp5, the schedule setting section F14 of the schedule management control unit PC1 sets a time schedule according to the recipe. Here, in step Sp4, if the recipe has been corrected by the first recipe correction, the schedule setting unit F14 sets a time schedule according to the recipe after the first recipe correction has been performed in step Sp4. .

In step Sp6, the transmission control unit F15 of the schedule management control unit PC1 transmits information such as the corrected recipe corrected in step Sp4 and the time schedule set in step Sp5 to the main body control unit PC0.

In step Sp7, the instruction section F02 of the main control unit PC0 instructs the plurality of partial control units PC2 to perform operations according to the recipe and time schedule. Thereby, the substrate W can be processed in the plurality of processing units 21 according to the recipe after the first recipe correction and the time schedule according to this recipe.

FIG. 12 is a flowchart showing an example of the operation flow related to the second recipe correction. Here, for example, the arithmetic processing section P25a in the partial control unit PC2 of the processing unit 21 executes the program Pg2 to realize the operation flow related to the second recipe correction.

First, in step Sp11 of FIG. 12, the unit control section F24 of the partial control unit PC2 determines whether or not the processing of the substrate W in the processing unit 21 has ended. Here, the unit control unit F24 repeats the determination in step Sp11 until the processing of the substrate W according to the process recipe in the processing unit 21 is completed. Then, when the processing of the substrate W according to the process recipe in the processing unit 21 is completed, the unit control section F24 proceeds to step Sp12.

In step Sp12, the information acquisition unit F22 of the partial control unit PC2 acquires a data group related to one or more types of indicators regarding the status of substrate processing in each of the plurality of processing units 21 from the data storage NA1.

In step Sp13, the second correction unit F23 of the partial control unit PC2 performs a correction process on the substrate W to be processed in the processing unit 21 next to the substrate W that has been processed in the processing unit 21 in step Sp11. The second recipe correction is performed based on a data group related to one or more types of indicators regarding the status of substrate processing in each of the plurality of processing units 21. Thereby, for example, when two or more processing units 21 sequentially perform the same type of processing on the substrate W in parallel, the recipe can be corrected for each substrate W in a state close to real time.

In step Sp14, the unit control section F24 of the partial control unit PC2 in the processing unit 21 causes the processing unit 21 to execute an operation according to the recipe. Here, if the recipe has been corrected by the second recipe correction in step Sp13, the unit control section F24 controls the operation of the processing unit 21 according to the recipe after the second recipe correction has been performed in step Sp13. Control.

<1-5. Summary of the first embodiment>
As described above, in the substrate processing system 1 according to the first embodiment, for example, in the substrate processing apparatus 20, based on a data group related to one or more types of indicators regarding the status of substrate processing in each of the plurality of processing units 21, Then, at least a portion of the recipe is corrected for processing on at least one substrate W of the group of substrates W using at least one processing unit 21 of the plurality of processing units 21. Thereby, for example, it is possible to correct the recipe that defines the conditions for processing to be performed on the substrate W according to the status of substrate processing in the plurality of processing units 21, and it is possible to perform processing on the substrate W that is appropriate to the situation. . As a result, for example, the accuracy of substrate processing in each processing unit 21 of the substrate processing apparatus 20 can be improved.

<2. Others>
The present invention is not limited to the first embodiment described above, and various changes and improvements can be made without departing from the gist of the present invention.

In the first embodiment, for example, if some problem occurs in the time schedule due to the second recipe correction, the time schedule may be reset. In this case, for example, the schedule management control unit PC1 may reset the time schedule according to the recipe after the second recipe correction. This prevents problems that may occur when, for example, a plurality of substrates W are sequentially transported to a plurality of processing units 21 and the plurality of substrates W are sequentially processed in the plurality of processing units 21 .

FIG. 13 is a flowchart illustrating an example of an operation flow related to resetting a time schedule. Here, for example, the program Pg0 is executed by the arithmetic processing unit P05a of the main body control unit PC0, and the program Pg1 is executed by the arithmetic processing unit P15a of the schedule management control unit PC1. In cooperation with the control unit PC1, an operation flow related to resetting the time schedule is realized. This operation flow is executed, for example, every time the second recipe correction is performed.

In step Sp21 of FIG. 13, the arithmetic processing unit P15a of the schedule management control unit PC1 determines whether or not there is a problem with the time schedule. Here, the schedule management control unit PC1 determines whether a problem will occur if the recipe after the second recipe correction for some of the processing units 21 is applied to the current time schedule.

FIG. 14 is a diagram showing an example of a time schedule. FIG. 15 is a diagram illustrating an example in which a problem occurs in the time schedule. FIG. 16 is a diagram showing an example of a time schedule after resetting. In FIGS. 14 to 16, the horizontal axis indicates the passage of time, and from the top, the timing of transporting the substrate W from the carrier C to the center robot CR by the indexer robot IR, and the timing of transporting the substrate W to the processing unit 21 by the center robot CR. transport timing, the timing at which the substrate W is processed by the first processing unit 21, the timing at which the substrate W is processed by the second processing unit 21, and the timing at which the substrate W is processed from the liquid storage unit 23 to the first processing unit 21 and The timing at which the first processing liquid L11 is supplied to the second processing unit 21 is shown.

According to the time schedule shown in FIG. 14, for example, the indexer robot IR unloads the first substrate W from the carrier C at time t0, and the indexer robot IR transports the first substrate W from time t0 to t1. , at time t1, the indexer robot IR delivers the first substrate W to the center robot CR. The central robot CR transports the first substrate W from time t1 to t2, and the central robot CR delivers the first substrate W to the first processing unit 21 at time t2. Then, the first processing unit 21 processes the first substrate W from time t2 to t8. At this time, the liquid storage unit 23 supplies the first processing liquid L11 to the first processing unit 21 from time t3 to t6. On the other hand, at time t3, the indexer robot IR transports the second substrate W from the carrier C, from time t3 to t4, the indexer robot IR transports the second substrate W, and at time t4, the indexer robot IR transports the second substrate W from the carrier C. The substrate W is delivered to the center robot CR. The central robot CR transports the second substrate W from time t4 to t5, and the central robot CR delivers the second substrate W to the second processing unit 21 at time t5. Then, the second processing unit 21 processes the second substrate W from time t5 to t11. At this time, the liquid storage unit 23 supplies the first processing liquid L11 to the second processing unit 21 from time t6 to time t9.

Here, for example, as shown in FIG. 15, based on the time schedule shown in FIG. 14, the period during which the first processing unit 21 processes the first substrate W is from time t2 to time t8. The period from which the liquid storage unit 23 supplies the first processing liquid L11 to the first processing unit 21 is extended from the period from time t3 to t6 to the period from time t3 to t7. Assume that the second recipe correction is performed so that the time period is extended. In this case, during the period from time t6 to t7, the liquid storage unit 23 supplies the first processing liquid L11 to the first processing unit 21 (time t3 to t7), and the liquid storage unit 23 supplies the first processing liquid L11 to the first processing unit 21 (time t3 to t7). This overlaps with the period (times t6 to t9) during which the first processing liquid L11 is supplied to the processing unit 21. Here, for example, if the liquid storage unit 23 is configured to be able to supply the first processing liquid L11 to only one processing unit 21, the time schedule shown in FIG. 15 is an impossible time schedule. Become. In other words, there is a problem with the time schedule.

In step Sp21, if the arithmetic processing unit P15a of the schedule management control unit PC1 determines that there is a problem with the time schedule, the process proceeds to step Sp22, and if it determines that there is no problem with the time schedule, this operation flow is continued. finish.

In step Sp22, the schedule setting unit F14 of the schedule management control unit PC1 resets the time schedule, taking into account the recipe after the second recipe correction. For example, if a problem with the time schedule shown in FIG. 15 occurs, the time at which the second substrate W is transported and processed may be shifted slightly later, as shown in FIG. 16. , Reset the time schedule so that the problem with the time schedule is resolved. Specifically, at time t4, the indexer robot IR carries out the second substrate W from the carrier C, from time t4 to t5, the indexer robot IR carries the second substrate W, and at time 5, the indexer robot IR carries out the second substrate W from the carrier C. The second substrate W is delivered to the center robot CR. The central robot CR transports the second substrate W from time t5 to t6, and the central robot CR delivers the second substrate W to the second processing unit 21 at time t6. Then, the second processing unit 21 processes the second substrate W from time t6 to time t12. At this time, the liquid storage unit 23 supplies the first processing liquid L11 to the second processing unit 21 from time t7 to t10. As a result, the period when the liquid storage unit 23 supplies the first processing liquid L11 to the first processing unit 21 (time t3 to t7) and the period when the liquid storage unit 23 supplies the first processing liquid L11 to the second processing unit 21 are changed. The supply period (time t7 to t10) does not overlap.

In step Sp23, the transmission control unit F15 of the schedule management control unit PC1 transmits the time schedule information reset in step Sp22 to the main body control unit PC0.

In step Sp24, the instruction section F02 of the main control unit PC0 instructs the plurality of partial control units PC2 to perform operations according to the reset time schedule. Thereby, the substrates W can be processed in the plurality of processing units 21 according to the time schedule that matches the recipe after the second recipe correction. Thereby, for example, problems that may occur when two or more substrates W are processed in parallel in two or more processing units 21 can be prevented.

In the first embodiment, for example, each substrate processing apparatus 20 may correct at least a portion of the recipe based on the data group stored in the storage unit 14 of the management server 10. In this case, in each substrate processing apparatus 20, the schedule management control unit PC1 may perform the first recipe correction based on the data group stored in the storage unit 14 of the management server 10. In the partial control unit PC2, the second recipe correction may be performed based on the data group stored in the storage unit 14 of the management server 10. In this way, for example, the management server 10 stores data groups related to one or more types of indicators regarding the status of substrate processing in each processing unit 21 of each of the plurality of substrate processing apparatuses 20, and By correcting the recipe based on the data group stored in the management server 10 by the apparatus 20, a certain substrate processing apparatus 20 can correct the recipe by utilizing data collected in another substrate processing apparatus 20. I can do it. Further, for example, data collected in a certain substrate processing apparatus 20 can be utilized for recipe correction in another substrate processing apparatus 20.

In the first embodiment, for example, the data group DG1 stored in the data storage NA1 may be stored in at least one of the storage unit P04 of the main body control unit PC0 and the storage unit P14 of the schedule management control unit, or It may be stored in the storage unit 14 of the management server 10. In this case, for example, apart from the management server 10, a server storing the database 14db and the data group DG1 is connected to each substrate processing apparatus 20 via the communication line 5 so as to be able to send and receive data. Good too.

In the first embodiment, for example, the first recipe correction may be performed in the main body control unit PC0. In this case, for example, the arithmetic processing section P05a of the main body control unit PC0 may have a function related to the first recipe correction of the arithmetic processing section P15a of the schedule management control unit PC1. Further, the first recipe correction may be performed, for example, by at least one control unit of the main body control unit PC0 and the schedule management control unit PC1, or by the cooperation of the main body control unit PC0 and the schedule management control unit PC1. May be done. Further, for example, the functions of the main body control unit PC0 and the schedule management control unit PC1 may be realized by one control unit. In other words, the functions of the arithmetic processing section P05a of the main body control unit PC0 and the functions of the arithmetic processing section P15a of the schedule management control unit PC1 may be appropriately distributed to one or more control units.

Further, for example, the substrate processing apparatus 20 includes, for example, a control unit (also referred to as a first control unit) that performs a first recipe correction, and a partial control unit PC2 as a second control unit that performs a second recipe correction. It may have two or more control units. If such a configuration is adopted, for example, the number of the plurality of processing units 21 is large, and the first control unit that controls operations in a wide range of configurations of the substrate processing apparatus 20 and the individual or a part of the processing units 21, the first control unit performs the first recipe correction, and the second control unit performs the first recipe correction. By performing the second recipe correction, hierarchical operation control can be easily realized in the substrate processing apparatus 20. As a result, for example, a certain degree of batch correction of the recipe for a group of substrates W (first recipe correction) and correction of the recipe in near real time for some substrates W of the group of substrates W (second recipe correction) are performed. Recipe correction) can be efficiently performed in two stages. Thereby, for example, highly accurate substrate processing can be efficiently performed in accordance with the situation.

In the first embodiment, for example, the first recipe correction and the second recipe correction may be performed by one control unit. That is, the first recipe correction and the second recipe correction may be performed by one or more control units. In this case, for example, the function related to the first recipe correction in the calculation processing section P15a of the schedule management control unit PC1, and the function related to the second recipe correction in the calculation processing section P25a of the plurality of partial control units PC2, It may be distributed to one or more control units as appropriate.

In the first embodiment, for example, while the substrate W is being processed in the processing unit 21, the second recipe correction is performed on the recipe that defines the processing of the substrate W in the processing unit 21. good. As a result, real-time recipe correction for some of the substrates W among the group of substrates W can be realized, for example.

In the first embodiment, for example, of the first recipe correction and the second recipe correction, only the first recipe correction may be performed, or only the second recipe correction may be performed. That is, at least one of the first recipe correction and the second recipe correction may be performed. In other words, regarding the processing of at least one substrate W out of a group of substrates W using one or more processing units 21 among the plurality of processing units 21, the substrate processing in each of the plurality of processing units 21 is performed. The recipe may be corrected based on a data group related to one or more types of indicators regarding the situation. Here, for example, in a configuration in which the first recipe correction is performed and the second recipe correction is not performed, the plurality of processing units 21 can easily process the substrate W in accordance with the situation. As a result, for example, the accuracy of processing the substrate W in each processing unit 21 of the substrate processing apparatus 20 can be easily improved.

In the first embodiment, for example, in the first recipe correction and the second recipe correction, among the one or more types of indicators constituting the data group, weighting is performed in advance according to the degree of influence on the processing performed on the substrate W. A correction formula that defines recipe correction rules may be set so that the recipe is corrected. For example, in the case of the second recipe correction, the correction is weighted to increase the influence of data related to one or more types of indicators for the processing unit 21 that performs processing according to the recipe targeted for correction. A formula may be set. In addition, for example, in the second recipe correction, data regarding processing units 21 other than the processing unit 21 that performs processing according to the recipe targeted for correction is basically not employed, and multiple processing Data related to the numerical value of an index indicating the state of the processing liquid L1 that is common among the units 21 may be adopted.

In the first embodiment, for example, in the first recipe correction and the second recipe correction, in addition to increasing or decreasing the processing time, other processing conditions such as the condition of the position at which the processing liquid L1 is ejected to the substrate W are changed. You may modify the recipe as follows. For example, if one or more types of indicators include film thickness distribution, degree of unevenness on the substrate surface, etc., the processing liquid L1 is discharged to the substrate W based on data related to these indicators. The recipe may be corrected so that the conditions of the position are changed.

It goes without saying that all or part of the first embodiment and the various modifications described above can be combined as appropriate to the extent that they do not contradict each other.

1 Substrate processing system 10 Management server 14, P04, P14, P24, P34 Storage unit 14db, Db0 Database 15, P05, P15, P25, P35 Control unit 15a, P05a, P15a, P25a, P35a Arithmetic processing unit 20 Substrate processing device 21 Processing unit 21sb Imaging section 23 Liquid storage unit 24 Transport unit 214, 22s, 23s Sensor section DG1 Data group F13 First correction section F14 Schedule setting section F23 Second correction section F24, F32 Unit control section Fm0 Film thickness meter L1 Processing liquid NA1 Data storage PC0 Main control unit PC1 Schedule management control unit PC2 Partial control unit PC3 Liquid management control unit W Board

Claims (2)

a plurality of processing units that process the substrate according to a recipe that defines processing conditions;
a transport unit that sequentially transports a plurality of substrates in a group of substrates to the plurality of processing units;
a plurality of sensor units that acquire signals related to one or more types of indicators regarding the status of substrate processing in each of the processing units;
a storage unit that stores a database storing a data group related to one or more types of indicators regarding the status of substrate processing in each of the plurality of processing units based on the signals acquired by the plurality of sensor units;
1. correcting at least a portion of the recipe based on the data group for processing on at least one substrate of the group of substrates using one or more processing units of the plurality of processing units; comprising one or more control units;
The one or more control units determine one of the recipes based on the data group for processing some of the substrates of the group of substrates using some of the processing units of the plurality of processing units. Substrate processing equipment that corrects parts. multiple substrate processing devices;
a server connected to the plurality of substrate processing apparatuses so as to be able to transmit and receive data;
Each of the substrate processing apparatuses includes:
a plurality of processing units that process the substrate according to a recipe that defines processing conditions;
a transport unit that sequentially transports a plurality of substrates in a group of substrates to the plurality of processing units;
a plurality of sensor units that acquire signals related to one or more types of indicators regarding the status of substrate processing in each of the processing units;
one or more control units;
The server is
A database that accumulates data groups related to one or more types of indicators regarding the status of substrate processing in each of the plurality of processing units of each of the plurality of substrate processing apparatuses based on the signals acquired by the plurality of sensor units. has a storage unit that stores
In each of the substrate processing apparatuses, the one or more control units are configured to control the data group regarding processing of some of the substrates of the group of substrates using some of the processing units of the plurality of processing units. A substrate processing system that corrects a portion of the recipe based on.

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