KR20230048571A - Substrate processing apparatus and substrate processing system - Google Patents

Abstract

An object of the present invention is to improve processing accuracy in each processing unit of a substrate processing apparatus and a substrate processing system.
To achieve this object, the substrate processing apparatus includes a plurality of processing units, a conveyance unit, a plurality of sensor units, a storage unit, and one or more control units. A plurality of processing units process the substrate according to a recipe that defines processing conditions. The conveying unit sequentially conveys a plurality of substrates in a group of substrates to a plurality of processing units. The plurality of sensor units acquire signals related to one or more types of indicators of substrate processing conditions in each processing unit. The storage unit stores data groups related to one or more types of indicators of the state of substrate processing in each processing unit, based on signals acquired from a plurality of sensor units. The one or more control units corrects a part of the recipe based on the data group for processing of some substrates of a group of substrates using some of the plurality of processing units.

Description

Substrate processing device and substrate processing system {SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING SYSTEM}

The present invention relates to a substrate processing apparatus and a substrate processing system. Substrates to be processed include, for example, semiconductor substrates, substrates for liquid crystal display devices, substrates for flat panel displays such as organic EL (electroluminescence) display devices, substrates for optical disks, substrates for magnetic disks, substrates for magneto-optical disks, It includes a substrate for a photomask, a ceramic substrate, a substrate for a solar cell, and the like.

There is a substrate processing apparatus having a plurality of processing units capable of performing various processing such as cleaning and etching of a substrate using a processing liquid such as a chemical liquid.

In addition, there is a substrate processing system having a plurality of substrate processing apparatuses and a server for management connected to the plurality of substrate processing apparatuses via a communication line (for example, see Patent Documents 1 to 3). These substrate processing systems are, for example, copying of processing recipes between substrate processing apparatuses, prevention of leakage of confidential information to a communication network outside substrate processing apparatuses, or substrate processing apparatuses by a server for management. Detection of processing abnormalities and the like can be performed.

Japanese Unexamined Patent Publication No. 9-153441 Japanese Unexamined Patent Publication No. 11-215160 Japanese Patent No. 4064402 Specification

Regarding the substrate processing apparatus and the substrate processing system, there is room for improvement in improving the processing accuracy in each processing unit.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a substrate processing apparatus and a substrate processing system capable of improving processing accuracy in each processing unit.

In order to solve the above problem, the substrate processing apparatus according to the first aspect includes a plurality of processing units, a conveyance unit, a plurality of sensor units, a storage unit, and one or more control units. The plurality of processing units process the substrate according to a recipe that defines processing conditions. The conveying unit sequentially conveys a plurality of substrates in a group of substrates to the plurality of processing units. The plurality of sensor units acquire signals related to one or more types of indicators of substrate processing conditions in each of the processing units. The storage unit stores data groups related to one or more types of indicators of substrate processing conditions in each of the plurality of processing units, based on signals acquired by the plurality of sensor units. The one or more control units correct at least a part of the recipe based on the data group for processing of at least one or more substrates among the group of substrates using one or more processing units among the plurality of processing units. do.

A substrate processing apparatus according to a second aspect is the substrate processing apparatus according to the first aspect, wherein the at least one control unit controls the data group for processing of the group of substrates using the plurality of processing units. Based on the above, a first recipe correction for collectively correcting the recipe is performed.

A substrate processing apparatus according to a third aspect is the substrate processing apparatus according to a second aspect, wherein the one or more control units are configured to perform the plurality of processes by the transfer unit according to the recipe after the first recipe correction has been performed. A time schedule is set which prescribes the timing of sequentially conveying the substrates to the plurality of processing units and the timing of performing processing on the plurality of substrates in the plurality of processing units.

A substrate processing apparatus according to a fourth aspect is the substrate processing apparatus according to any one of the first to third aspects, wherein the one or more control units are used for processing the group using some processing units among the plurality of processing units. Regarding the processing of a part of the substrates, a second recipe correction for correcting a part of the recipe based on the data group is performed.

A substrate processing apparatus according to a fifth aspect is the substrate processing apparatus according to a third aspect, wherein the at least one control unit is a substrate processing apparatus of some of the group of substrates using some processing units of the plurality of processing units. Regarding the processing for , a second recipe correction for correcting part of the recipe based on the data group is performed, and the time schedule is reset according to the recipe after the second recipe correction is performed.

A substrate processing apparatus according to a sixth aspect is the substrate processing apparatus according to the second or third aspect, wherein the one or more control units include: a first control unit configured to correct the first recipe; and a second control unit that performs second recipe correction for correcting a part of the recipe based on the data group for processing of some substrates of the group of substrates using some of the processing units of the units.

A substrate processing system according to a seventh aspect includes a plurality of substrate processing apparatuses and a server connected to the plurality of substrate processing apparatuses to enable transmission and reception of data. Each substrate processing apparatus has a plurality of processing units, a conveyance unit, a plurality of sensor units, and one or more control units. The plurality of processing units process the substrate according to a recipe that defines processing conditions. The conveying unit sequentially conveys a plurality of substrates in a group of substrates to the plurality of processing units. The plurality of sensor units acquire signals related to one or more types of indicators of substrate processing conditions in each of the processing units. The server, based on the signals acquired by the plurality of sensor units, sets a data group related to one or more indicators of substrate processing conditions in each of the plurality of processing units of the plurality of substrate processing apparatuses. It has a memory to remember. In each of the substrate processing apparatuses, the one or more control units, for processing of at least one or more substrates among the group of substrates using at least one or more processing units among the plurality of processing units, to the data group. Based on this, at least a part of the recipe is corrected.

According to the substrate processing apparatus according to the first aspect, for example, with respect to at least one or more substrates among a group of substrates, processing conditions applied to the substrate are set according to substrate processing conditions in a plurality of processing units. By correcting a predetermined recipe, it is possible to perform a process suitable for the situation on the substrate. As a result, for example, processing precision in each processing unit of the substrate processing apparatus can be improved.

According to the substrate processing apparatus according to the second aspect, for example, according to the conditions of substrate processing in a plurality of processing units, a recipe for determining processing conditions for a group of substrates is collectively corrected, thereby Processing on conforming substrates can be easily performed. As a result, for example, processing precision in each processing unit of the substrate processing apparatus can be easily improved.

According to the substrate processing apparatus according to the third aspect, for example, after correcting a recipe for a group of substrates, a time schedule for transporting and processing a plurality of substrates in the group of substrates according to the corrected recipe is set. By setting, transport and processing of a group of substrates in the substrate processing apparatus can be performed efficiently. As a result, for example, throughput in the substrate processing apparatus can be improved.

According to the substrate processing apparatus according to the fourth aspect, for example, a recipe for prescribing processing conditions for some substrates of a group of substrates, taking into account processing conditions in other processing units among a plurality of processing units can be corrected. Thereby, the processing precision in each processing unit of a substrate processing apparatus can be improved, for example. Further, for example, after the recipe is collectively corrected for a group of substrates by the first recipe correction, the recipes are further corrected for some of the substrates in the group by the second recipe correction, thereby Multi-step corrections can be performed, including a batch correction of recipes for , and corrections of recipes for some substrates. By this, it can be easily performed, for example, to apply processing with high precision suitable for the situation to the substrate.

According to the substrate processing apparatus according to the fifth aspect, the time schedule of transport and processing is reset according to, for example, the second recipe correction, thereby sequentially transporting the plurality of substrates W to the plurality of processing units, , problems that may arise when processing is sequentially performed on a plurality of substrates in a plurality of processing units is prevented.

According to the substrate processing apparatus according to the sixth aspect, for example, the number of the plurality of processing units is large, and the first control unit for controlling the operation in a wide range of configurations of the substrate processing apparatus and the individual of the substrate processing apparatus When there is a second control unit that controls the operation in a narrow-range configuration, such as a processing unit or some processing units, the first control unit performs the first recipe correction, and the second control unit performs the second control unit. By performing recipe correction, hierarchical control of operations in the substrate processing apparatus can be easily realized. As a result, multi-step corrections including, for example, batch correction of a recipe for a group of substrates to a certain degree and recipe correction in a near real-time state for a portion of substrates can be efficiently performed. Thereby, high-precision processing for substrates suitable for circumstances can be efficiently performed, for example.

According to the substrate processing system according to the seventh aspect, for example, a data group related to one or more types of indicators for substrate processing conditions in each processing unit of a plurality of substrate processing apparatuses is stored in the server, When each substrate processing apparatus corrects a recipe based on a data group stored in a server, a certain substrate processing apparatus can correct a recipe by making use of data collected in another substrate processing apparatus. Further, for example, data collected in a certain substrate processing apparatus can be utilized for recipe correction in another substrate processing apparatus.

1 is a diagram showing an example of a schematic configuration of a substrate processing system according to a first embodiment.
Fig. 2 is a block diagram showing an example of the electrical configuration of the server for management.
3 is a schematic plan view showing an example of a schematic configuration of a substrate processing apparatus.
4 is a diagram schematically illustrating an example of a configuration of a processing unit.
5 is a block diagram showing a connection mode of each component in the substrate processing apparatus.
Fig. 6 is a block diagram showing an example of the electrical configuration and functional configuration of the main body control unit.
Fig. 7 is a block diagram showing an example of the electrical configuration and functional configuration of a control unit for schedule management.
Fig. 8 is a block diagram showing an example of the electrical configuration and functional configuration of the partial control unit.
9 is a block diagram showing an example of the electrical configuration and functional configuration of the liquid management control unit.
Fig. 10 is a diagram showing an example of the contents of a data group stored in the data storage.
11 is a flowchart showing an example of an operation flow related to first recipe correction.
12 is a flowchart showing an example of an operation flow related to the second recipe correction.
Fig. 13 is a flowchart showing an example of an operation flow related to resetting the time schedule.
Fig. 14 is a diagram showing an example of a time schedule.
Fig. 15 is a diagram showing an example in which a problem occurs in the time schedule.
Fig. 16 is a diagram showing an example of a time schedule after resetting.

For example, there is a substrate processing apparatus having a plurality of processing units capable of performing various types of processing such as cleaning and etching on various types of substrates such as semiconductor substrates. Further, for example, there is a substrate processing system in which a server for management is connected to a plurality of substrate processing apparatuses via a communication line.

In a substrate processing apparatus having a plurality of processing units, the same type of substrate processing can be performed in parallel in the plurality of processing units. At this time, the substrate processing apparatus creates a time schedule for prescribing the timing of transportation and processing of a plurality of substrates so as to improve throughput according to a standard recipe obtained from information from a management server, for example. , It is conceivable to transport and process a plurality of substrates according to this time schedule.

However, if transport and processing of a plurality of substrates are simply carried out according to, for example, a standard recipe, excessive or insufficient processing may occur due to changes in various circumstances related to the processing. In other words, there are cases where, for example, the processing precision in each processing unit is lowered.

Then, the inventor of this application created a technique capable of improving the processing precision in each processing unit of a substrate processing apparatus and a substrate processing system. About this, 1st Embodiment and various modified examples are demonstrated based on drawing below. In the drawings, the same reference numerals are attached to parts having the same configuration and function, and redundant description is omitted in the following description. In addition, the drawing is shown schematically.

<1. First Embodiment>

<1-1. Outline configuration of substrate processing system>

1 is a diagram showing an example of a schematic configuration of a substrate processing system 1 according to the first embodiment. As shown in FIG. 1 , the substrate processing system 1 includes, for example, a management server 10 , a plurality of substrate processing devices 20 , and a transfer device 30 . The plurality of substrate processing apparatuses 20 include, for example, a first substrate processing apparatus 20a, a second substrate processing apparatus 20b, and a third substrate processing apparatus 20c. Here, the server 10 for management, the plurality of substrate processing devices 20, and the conveying device 30 are connected via a communication line 5 so that transmission and reception of data is possible. The communication line 5 may be any of a wired line and a wireless line, for example.

<1-2. Configuration of server for management>

2 is a block diagram showing an example of the electrical configuration of the server 10 for management. The server 10 for management is a device (also referred to as a management device) for collectively managing a plurality of substrate processing devices 20 .

As shown in Fig. 2, the server for management 10 is realized, for example, in a computer or the like, and includes a communication unit 11, an input unit 12, an output unit 13, It has a storage unit 14, a control unit 15 and a drive 16.

The communication unit 11 functions as a transmission unit capable of transmitting signals to each substrate processing device 20 and the conveying device 30 through the communication line 5, and each substrate through the communication line 5, for example. It has a function as a receiving unit capable of receiving signals from the processing device 20 and the conveying device 30.

The input unit 12 may input a signal according to an operation of a user using the server 10 for management, for example. The input unit 12 may include, for example, a manipulation unit, a microphone, and various sensors. The manipulation unit may input a signal according to a user's manipulation. The operation unit includes a mouse, a keyboard, and the like. The microphone may input a signal according to the user's voice. Various sensors may input signals according to the user's movement.

The output unit 13 can output various kinds of information, for example. The output unit 13 may include, for example, a display unit and a speaker. The display unit, for example, can visually output various types of information in an aspect recognizable by a user. This display unit may have the form of a touch panel integrated with at least a part of the input unit 12, for example. The speaker, for example, can audibly output various types of information in an aspect recognizable by a user.

The storage unit 14 can store information, for example. This storage unit 14 may be constituted by, for example, a non-volatile storage medium such as a hard disk or flash memory. The configuration of the storage unit 14 is any one of, for example, a configuration having one storage medium, a configuration having two or more storage media integrally, and a configuration having two or more storage media divided into two or more parts. It could be anything. The storage unit 14 can store various kinds of information such as the program 14pg, processing plan information 14pc, and database 14db, for example. The storage unit 14 may also include, for example, a memory 15b described later. The processing plan information 14pc is related to a plurality of substrate groups in the processing units 21 (refer to FIG. 3 and the like) of N units (N is a natural number) to be described later for each substrate processing apparatus 20. Indicates the timing of performing the continuous substrate processing of The substrate group is constituted by, for example, a plurality of substrates W constituting one lot (see FIG. 3 and the like). The database 14db may include, for example, information of each substrate W and information of each substrate processing apparatus 20 . The information of each substrate W includes, for example, the number of slots in the carrier C where the substrate W is held, the shape of the substrate W, and information indicating the processing applied to the substrate W. can do. The information indicating the shape of the substrate W may include, for example, the thickness (also referred to as film thickness) of one or more types of films on the substrate W, distribution of the film thickness, and the like. The film thickness may be, for example, any of an average value, a minimum value, and a maximum value of the film thickness. The information of each substrate processing apparatus 20 is, for example, the state of processing for the substrate W in each of the plurality of processing units 21 of each substrate processing apparatus 20 (also referred to as substrate processing). It may include data related to one or more types of indicators for In other words, the storage unit 14 stores, for example, a data group related to one or more types of indicators of substrate processing conditions in each of the plurality of processing units 21 of the plurality of substrate processing apparatuses 20. Stores the accumulated database (14db). A data group contains a plurality of data related to one or more types of indicators.

The control unit 15 includes, for example, an arithmetic processing unit 15a acting as a processor, a memory 15b for temporarily storing information, and the like. An electric circuit such as, for example, a central processing unit (CPU) may be applied to the arithmetic processing unit 15a. For the memory 15b, for example, random access memory (RAM) or the like can be applied. The arithmetic processing unit 15a can realize the functions of the management server 10 by reading and executing the program 14pg stored in the storage unit 14, for example. Various types of information temporarily obtained by various types of information processing in the control unit 15 can be appropriately stored in the memory 15b or the like. Here, for example, at least a part of the functions realized by the arithmetic processing unit 15a may be realized by a dedicated electronic circuit.

The drive 16 is a detachable part of the portable storage medium RM10, for example. The drive 16 can, for example, transfer data between the storage medium RM10 and the control unit 15 in a state where the storage medium RM10 is mounted. Here, for example, the storage medium RM10 storing the program 14pg may be loaded into the drive 16, and the program 14Pg may be read from the storage medium RM10 into the storage unit 14 and stored therein.

<1-3. Configuration of Substrate Processing Equipment>

3 is a schematic plan view showing an example of a schematic configuration of the substrate processing apparatus 20 . The substrate processing apparatus 20 is a single wafer type apparatus capable of performing various types of processing by supplying a processing liquid to the surface of the substrate W, for example. Here, as an example of the substrate W, a semiconductor substrate (wafer) is used. Various treatments include, for example, a chemical treatment for etching with a chemical solution, a cleaning treatment for removing foreign substances or objects to be removed with a liquid, a rinse treatment for washing with water, and a coating treatment for applying a resist or the like.

The substrate processing apparatus 20 includes a plurality of load ports LP, a transfer unit 24, a liquid storage unit 23, and a plurality of processing units 21. In addition, the substrate processing apparatus 20 includes, for example, a main body control unit PC0, a schedule management control unit PC1, a plurality of partial control units PC2, a liquid management control unit PC3, and a data storage ( NA1).

<1-3-1. load port>

The plurality of load ports LP are mechanisms (also referred to as container holding mechanisms) capable of holding a plurality of carriers (also referred to as FOUPs) C as receptors, respectively. In the example of FIG. 3 , first to fourth load ports LP1 to LP4 exist as a plurality of load ports LP. The first to fourth load ports LP1 to LP4 are portions for carrying in and out of a plurality of substrate groups between the substrate processing apparatus 20 and the outside of the substrate processing apparatus 20 (also referred to as a carry-in/out portion). ) has a function as In the example of FIG. 3 , the first to fourth load ports LP1 to LP4 and each processing unit 21 are horizontally arranged at intervals. In addition, the first to fourth load ports LP1 to LP4 are arranged along the horizontal first direction DR1 when viewed from above.

Here, the carrier C is transported and placed in the first to fourth load ports LP1 to LP4 by the transport device 30 from within the carrier storage 40, for example. The carrier C can accommodate a plurality of (25 in the first embodiment) substrates W as a group of substrates W, for example. The operation of the transport device 30 can be controlled by the server 10 for management, for example. Here, for example, the conveying device 30 may be capable of conveying the carrier C between the plurality of substrate processing devices 20 . In the example of FIG. 3 , the transport device 30 is movable along the first direction DR1 and the horizontal second direction DR2 orthogonal to the first direction DR1, for example. For this reason, for example, the carriers C each accommodating a plurality of substrates W constituting one substrate group are transported from the inside of the carrier storage area 40 to the first to fourth load ports LP1 to LP4. can be placed in either one. Also, in the first to fourth load ports LP1 to LP4, the plurality of carriers C may be arranged along the first direction DR1.

<1-3-2. Conveyance Unit>

The transport unit 24, for example, transports a plurality of substrates W from a group of substrates W accommodated in a carrier C held in a load port LP toward a plurality of processing units 21. You can return them in order. In the first embodiment, the conveyance unit 24 includes an indexer robot IR and a center robot CR. The indexer robot IR can convey the substrate W between the first to fourth load ports LP1 to LP4 and the center robot CR, for example. The center robot CR can convey the substrate W between the indexer robot IR and each processing unit 21, for example.

Specifically, the indexer robot IR can convey a plurality of substrates W one by one from the carrier C to the center robot CR, and from the center robot CR to the carrier ( A plurality of substrates W can be transferred to C) one by one. Similarly, while being able to carry in several board|substrates W one by one from the indexer robot IR to each processing unit 21, center robot CR can carry in the indexer from each processing unit 21 similarly, for example. A plurality of substrates W can be conveyed to the robot IR one by one. Moreover, for example, center robot CR can convey the board|substrate W between the some process unit 21 as needed.

In the example of FIG. 3 , the indexer robot IR has two hands H of a U shape when viewed from above. The two hands H are arranged at different heights. Each hand H can support the substrate W in a horizontal posture. The indexer robot IR can move the hand H horizontally and vertically. In addition, the indexer robot IR can change the direction of the hand H by rotating (rotating) about an axis along the vertical direction. The indexer robot IR moves along the first direction DR1 in the path 201 passing through the capital position (the position where the indexer robot IR is drawn in FIG. 3 ). The capital position is a position in which the indexer robot IR and the center robot CR face each other in a direction orthogonal to the first direction DR1 when viewed from above. The indexer robot IR can oppose the hand H to the arbitrary carrier C and the center robot CR, respectively. Here, for example, the indexer robot IR moves the hand H to perform a carrying-in operation of carrying the substrate W into the carrier C and a carrying-out operation of carrying the substrate W out of the carrier C. action can be performed. Further, for example, the indexer robot IR cooperates with the center robot CR to move the substrate W from one side of the indexer robot IR and the center robot CR to the other side. can be done in

In the example of FIG. 3 , the center robot CR has two U-shaped hands H when viewed from above, similarly to the indexer robot IR. The two hands H are arranged at different heights. Each hand H can support the substrate W in a horizontal posture. The center robot CR can move each hand H horizontally and vertically. In addition, the center robot CR can change the direction of the hand H by rotating (rotating) around an axis along the vertical direction. The center robot CR is surrounded by a plurality of processing units 21 in planar view. The center robot CR can make the hand H oppose any one of the arbitrary processing unit 21 and the indexer robot IR. Here, for example, the center robot CR moves the hand H to perform a carrying operation of carrying the substrate W into each processing unit 21, and the substrate W from each processing unit 21. It is possible to carry out an export operation for exporting. Here, each processing unit 21 has an opening/closing shutter that shields between it and the center robot CR. This shutter is opened when the center robot CR carries in the substrate W to the processing unit 21 and carries the substrate W out of the processing unit 21 . Further, for example, the center robot CR can perform a water transfer operation of moving the substrate W from one side of the indexer robot IR and the center robot CR to the other side in cooperation with the indexer robot IR. there is.

Further, in the inner space Sc0 of the box in which the plurality of processing units 21 and the center robot CR are located, a part for supplying gas (eg air) to the inner space Sc0 (also referred to as a gas supply part) ) 22a, and a portion (also referred to as a sensor portion) 22s for detecting an index (for example, temperature, etc.) indicating the state of the atmosphere of the interior space Sc0 is provided. The sensor part 22s may detect the supply amount of the gas to the interior space Sc0 by the gas supply part 22a as one index which shows the state of the atmosphere of the interior space Sc0. Here, the state of the atmosphere of the inner space Sc0 affects the substrate processing in the processing unit 21 . For this reason, the sensor unit 22s can acquire signals related to one or more types of indicators of the state of substrate processing in the processing unit 21 .

<1-3-3. liquid storage unit>

The liquid storage unit 23 can store, for example, the processing liquid L1 used in the plurality of processing units 21 (see FIG. 4 and the like). This liquid storage unit 23 includes one or more storage tanks 23t capable of storing the processing liquid L1, for example. In the example of FIG. 3 , the liquid storage unit 23 includes three storage tanks 23t including a first storage tank 23ta, a second storage tank 23tb, and a third storage tank 23tc. Each storage tank 23t is provided with, for example, a sensor unit 23s and a heating unit 23h. The sensor unit 23s is a unit for measuring a physical quantity representing the state (for example, concentration, hydrogen ion index (pH), temperature, etc.) of the treatment liquid L1 in the storage tank 23t. This processing liquid L1 is used for processing the substrate W in the processing unit 21 . Also, the treatment liquid L1 may deteriorate with the passage of time and degree of use, for example. For this reason, the state of the processing liquid L1 affects the substrate processing in the processing unit 21 . That is, the sensor unit 23s can acquire signals related to one or more types of indicators of the state of substrate processing in the processing unit 21 . The heating part 23h is a part including a heating element for adjusting the temperature of the processing liquid L1 in the storage tank 23t. As the heating method of the heating element, a radiant heating method using a halogen lamp, an indirect heating method without direct contact with the liquid, or a radiant heating method using near-infrared rays are employed, for example. In the example of FIG. 3 , the first sensor unit 23sa and the first heating unit 23ha are located in the first storage tank 23ta, and the second sensor unit 23sb and the second heating unit are located in the second storage tank 23tb. 23hb is located, and the third sensor unit 23sc and the third heating unit 23hc are located in the third storage tank 23tc. Here, a mechanism for stirring the treatment liquid L1 may be present in each storage tank 23t, for example. Further, for example, one or more storage tanks 23t are connected to each processing unit 21 in a state in which the processing liquid L1 can be supplied. Here, each storage tank 23t may be connected to all the processing units 21 among the plurality of processing units 21, or may be connected to some processing units 21 among the plurality of processing units 21. In addition, here, the same type of processing liquid L1 may be stored in the three storage tanks 23t, or different types of processing liquid L1 may be stored. In other words, between the first storage tank 23ta, the second storage tank 23tb, and the third storage tank 23tc, the same type of treatment liquid L1 may be stored, and different types of treatment liquids L1 may be stored.

<1-3-4. processing unit>

The plurality of processing units 21 can process the substrate W, respectively. In the example of FIG. 3 , three sets of processing units 21 each composed of four processing units 21 arranged in a plane are positioned so as to be stacked in the vertical direction. Thereby, 12 processing units 21 exist in total. The plurality of processing units 21 includes two or more processing units 21 capable of performing the same kind of substrate processing on the substrate W. Thus, in the plurality of processing units 21 , the same type of substrate processing can be performed on the substrate W in parallel.

FIG. 4 is a diagram schematically showing an example of a configuration of the processing unit 21. As shown in FIG. The processing unit 21 can perform processing on the substrate W using the processing liquid L1. In the processing unit 21, for example, by supplying the processing liquid L1 onto one main surface (also referred to as an upper surface) Us1 of the substrate W rotating in a plane, the upper surface ( Various processes can be performed on Us1). As the treatment liquid L1, a general liquid for use in processing a substrate having fluidity, such as water or a chemical liquid having a relatively low viscosity, for example, is applied. As the chemical solution, an etching solution or a cleaning chemical solution is applied. More specifically, as a chemical solution, sulfuric acid, acetic acid, nitric acid, hydrochloric acid, hydrofluoric acid, hydrofluoric acid, aqueous ammonia, aqueous hydrogen peroxide, organic acids (eg citric acid, oxalic acid, etc.), organic alkalis (eg TMAH: tetramethylammonium) Hydroxide, etc.), isopropyl alcohol (IPA), a liquid containing one or more of a surfactant and a corrosion inhibitor may be employed.

As shown in FIG. 4 , the processing unit 21 includes, for example, a holding unit 211 , a rotating mechanism 212 , a processing liquid supply system 213 , and a sensor unit 214 .

The holding unit 211 can rotate the substrate W while holding it in a substantially horizontal position, for example. The holder 211 includes, for example, a vacuum chuck having an upper surface 211u capable of vacuum adsorbing the other main surface (also referred to as a lower surface) Bs1 opposite to the upper surface Us1 of the substrate W, or a substrate ( A clamping type chuck or the like having a plurality of chuck pins capable of clamping the periphery of W) is applied.

The rotation mechanism 212 can rotate the holding part 211, for example. For the structure of the rotation mechanism 212, the structure which has 212 s of rotation support shafts and the rotation drive part 212m is applied, for example. The rotation support shaft 212s has, for example, a holding part 211 connected to the upper end thereof, and extends along the vertical direction. The rotation drive unit 212m has, for example, a motor capable of rotating the rotation support shaft 212s around a virtual rotation axis Ax1 along the vertical direction. Here, the rotation driving unit 212m rotates the rotation support shaft 212s around the rotation shaft Ax1, for example, so that the holding unit 211 rotates while maintaining the posture along the horizontal plane. By this, for example, the substrate W held on the holder 211 is rotated around the rotation axis Ax1. Here, for example, if the upper surface Us1 and the lower surface Bs1 of the substrate W are substantially circular, the rotation axis Ax1 passes through the center of the upper surface Us1 and the lower surface Bs1 of the substrate W. .

The processing liquid supply system 213 can discharge one or more types of processing liquids L1 toward the substrate W, for example. In the example of FIG. 4 , the processing liquid supply system 213 includes a first processing liquid supply unit 213a, a second processing liquid supply unit 213b, and a third processing liquid supply unit 213c.

The first processing liquid supply part 213a has, for example, a nozzle Nz1, a pipe part Pp1, a movable pipe part At1, a discharge valve Vv1, and a liquid supply part Su1. The nozzle Nz1 can discharge, for example, the first processing liquid L11, which is one of the processing liquids L1, toward the substrate W held by the holding part 211 . The pipe part Pp1 connects the liquid supply part Su1 and the nozzle Nz1, and forms a path through which the first processing liquid L11 flows. Moreover, the movable piping part At1 is located in the middle of the piping part Pp1, and supports the part by the side of the nozzle Nz1 among the piping part Pp1 so that rotation is possible around the axis along the vertical direction. Then, for example, a state in which the nozzle Nz1 is positioned on the substrate W by a driving force of a driving unit such as a motor (also referred to as a liquid ejection possible state), and a state in which the nozzle Nz1 is positioned on the substrate W This non-located state (also referred to as an evacuation state) can be switched. In the example of FIG. 4 , the first processing liquid supply unit 213a is in a state capable of discharging the liquid, and the nozzle Nz1 is directed from directly above the substrate W to the upper surface Us1 of the substrate W for the first processing. The liquid L11 can be discharged. The discharge valve Vv1 is disposed in the middle of the pipe portion Pp1, for example, and can be opened and closed according to a signal from the partial control unit PC2. Here, for example, when the discharge valve Vv1 is opened, the liquid supply unit Su1 and the nozzle Nz1 are in a state of communicating with each other. Further, for example, when the discharge valve Vv1 is closed, the liquid supply unit Su1 and the nozzle Nz1 are not in communication with each other. The liquid supply unit Su1, for example, according to a signal from the main body control unit PC0 or the partial control unit PC2 or the like, for example, the liquid storage unit 23 (here, the first storage tank 23ta )), the first processing liquid L11 can be supplied toward the pipe portion Pp1. A pump is applied to the liquid supply unit Su1, for example.

The second processing liquid supply unit 213b has a configuration similar to that of the first processing liquid supply unit 213a. Specifically, the second processing liquid supply unit 213b includes, for example, a nozzle Nz2, a piping unit Pp2, a movable piping unit At2, a discharge valve Vv2, and a liquid supply unit Su2. ) has The nozzle Nz2 can discharge the second processing liquid L12, which is one of the processing liquids L1, toward the substrate W held by the holding part 211, for example. The pipe part Pp2 connects the liquid supply part Su2 and the nozzle Nz2, and forms a path through which the second processing liquid L12 flows. Moreover, the movable piping part At2 is located in the middle of the piping part Pp2, and supports the part by the side of the nozzle Nz2 among the piping part Pp2 centering on the axis along the vertical direction so that rotation is possible. Further, for example, a state in which the nozzle Nz2 is positioned on the substrate W (liquid ejection possible state) by a driving force of a driving unit such as a motor, and a state in which the nozzle Nz2 is positioned on the substrate W A non-existing state (evacuation state) can be switched. In the example of FIG. 4 , the second processing liquid supply unit 213b is in a state capable of discharging the liquid, and the nozzle Nz2 is directed from directly above the substrate W to the upper surface Us1 of the substrate W for the second processing. The liquid L12 can be discharged. The discharge valve Vv2 is disposed in the middle of the pipe portion Pp2, for example, and can be opened and closed according to a signal from the partial control unit PC2. Here, for example, when the discharge valve Vv2 is opened, the liquid supply unit Su2 and the nozzle Nz2 are in a state of communicating with each other. Further, for example, when the discharge valve Vv2 is closed, the liquid supply unit Su2 and the nozzle Nz2 are not in communication with each other. The liquid supply unit Su2 is discharged from the liquid storage unit 23 (here, the second storage tank 23tb) in accordance with a signal from the main body control unit PC0 or the partial control unit PC2 or the like. 2 The processing liquid L12 can be supplied toward the piping part Pp2. A pump is applied to the liquid supply unit Su2, for example.

Although FIG. 4 depicts a case where both the first processing liquid supply unit 213a and the second processing liquid supply unit 213b are in a liquid discharge possible state, in reality, the first processing liquid supply unit 213a and the second processing liquid supply unit 213a and the second processing liquid supply unit 213a From the state in which both liquid supply units 213b are in the retracted state, one of the first processing liquid supply unit 213a and the second processing liquid supply unit 213b is switched to a state in which liquid can be discharged alternatively. In FIG. 4 , the first processing liquid supply unit 213a and the second processing liquid supply unit 213b have a vertically shifted relationship so as not to interfere with each other, but the first processing liquid supply unit 213a and the second processing liquid supply unit 213a If the switching operation between the retracted state and the liquid discharge enabled state of the supply unit 213b is appropriately synchronized, even if the first processing liquid supply unit 213a and the second processing liquid supply unit 213b do not have a vertically misaligned relationship, they interfere with each other. I never do that.

The third processing liquid supply unit 213c includes, for example, a nozzle Nz3, a piping unit Pp3, a discharge valve Vv3, and a liquid supply unit Su3. The nozzle Nz3 can discharge the third processing liquid L13, which is one of the processing liquids L1, toward the substrate W held by the holding part 211, for example. In the example of FIG. 4 , the nozzle Nz3 can discharge the third processing liquid L13 from an oblique top of the substrate W toward the upper surface Us1 of the substrate W. The pipe part Pp3 connects the liquid supply part Su3 and the nozzle Nz3, and forms a path through which the third processing liquid L13 flows. The discharge valve Vv3 is disposed, for example, in the middle of the pipe portion Pp3, and can be opened and closed according to a signal from the partial control unit PC2. Here, the discharge valve Vv3 is opened, for example, so that the liquid supply unit Su3 and the nozzle Nz3 communicate with each other. Further, for example, when the discharge valve Vv3 is closed, the liquid supply unit Su3 and the nozzle Nz3 are not in communication with each other. The liquid supply unit Su3 is removed from the liquid storage unit 23 (here, the third storage tank 23tc) in accordance with a signal from the main body control unit PC0 or the partial control unit PC2 or the like, for example. 3 The processing liquid L13 can be supplied toward the piping part Pp3. A pump is applied to the liquid supply unit Su3, for example.

Here, for example, the discharge of the first processing liquid L11 from the nozzle Nz1 of the first processing liquid supply unit 213a toward the substrate W and the nozzle Nz2 of the second processing liquid supply unit 213b ) toward the substrate W, and discharge of the third processing liquid L13 toward the substrate W from the nozzle Nz3 of the third processing liquid supply unit 213c in this order. can be done as

Here, the processing liquid L1 discharged from each of the nozzles Nz1 to Nz3 toward the substrate W is collected, for example, in a cup or the like provided from the side of the substrate W to the lower side, and the liquid storage unit 23 ) is returned to the corresponding storage tank 23t. In other words, the processing liquid L1 stored in the liquid storage unit 23 is repeatedly used for substrate processing so as to be circulated. At this time, for example, the treatment liquid L1 tends to deteriorate gradually. Here, when the processing liquid L1 is returned from the processing unit 21 to the liquid storage unit 23, the processing liquid L1 may be purified by a filter or the like.

In addition, here, for example, one or two or four or more processing liquid supply units may be present in the processing unit 21 .

The sensor unit 214 can acquire signals related to one or more types of indicators of the state of substrate processing in the processing unit 21 , for example. In the example of FIG. 4 , the sensor unit 214 has a film thickness gauge Fm0 for detecting the state of the substrate W and an imaging unit 21sb. For the film thickness gauge Fm0, for example, one using light interference can be applied. For the imaging unit 21sb, for example, one using an imaging element such as an area sensor in which light receiving elements are arranged flat is applied.

The film thickness gauge Fm0 is fixed to the arm part Am1 rotatably supported about the axis along the vertical direction by the movable part At0, for example. Then, for example, when the arm portion Am1 is rotated by a driving force of a drive unit such as a motor, a state in which the film thickness meter Fm0 is positioned on the substrate W (a measurable state) and a substrate ( A state in which the film thickness gauge Fm0 is not positioned on W) (evacuation state) can be switched. The film thickness gauge Fm0 may be protected, for example, by a shield to protect the treatment liquid L1 from adhering in the evacuation state. Here, the arm portion Am1 is rotated while the substrate W is appropriately rotated by the rotation mechanism 212, so that the film thickness gauge Fm0 is set to the thickness of various films positioned on the substrate W in a wide range ( Also referred to as film thickness) can be measured. Also here, the film thickness may be, for example, any of an average value, a minimum value, and a maximum value of the film thickness. Here, as the film positioned on the substrate W, for example, various films such as an oxide film, a silicon single crystal layer, a silicon polycrystal layer, an amorphous silicon layer, and a resist film can be employed. The film thickness meter Fm0 can measure the film thickness of the film on the substrate W before and after the processing of the substrate W by the processing liquid L1 in the processing unit 21, for example. . Thereby, a signal related to the film thickness as one index for the state of substrate processing in the processing unit 21 can be obtained. The film thickness meter Fm0 sends the obtained signal to the portion control unit PC2, for example. In FIG. 4 , in a measurable state, the distance between the upper surface Us1 of the substrate W and the film thickness gauge Fm0 is drawn for convenience, but in reality, the film thickness gauge Fm0 is the substrate W ), the film thickness is measured in a state of being close to the upper surface (Us1).

The imaging unit 21sb captures images of the state on the substrate W before and after the processing of the substrate W by the processing liquid L1 in the processing unit 21, for example, so that the processing unit 21 ), an image signal related to the state of the upper surface Us1 of the substrate W as one index for the state of substrate processing in ) can be obtained. The imaging unit 21sb sends out, for example, the obtained image signal to the section control unit PC2.

The sensor unit 214 includes, for example, a flow meter for detecting the discharge amount of the treatment liquid L1 discharged from each of the nozzles Nz1 to Nz3, and a flow meter that detects the discharge amount of the treatment liquid L1 from each of the nozzles Nz1 and Nz2. A sensor (for example, an angle sensor or the like) that detects a position (also referred to as a discharge position) or the like may be included.

<1-3-5. Main body control unit>

Main body control unit PC0 can control transmission/reception of data with the server 10 for management, operation of each part of substrate processing apparatus 20, etc., for example.

5 is a block diagram showing a connection mode of a control system and a data transmission/reception system in the substrate processing apparatus 20 . Here, the main body control unit PC0, the schedule management control unit PC1, a plurality of part control units PC2, and the liquid management control unit PC3 communicate with each other via a communication line L0c for control in various ways. are connected so that transmission and reception of signals for control of the Further, the main body control unit PC0, the schedule management control unit PC1, the plurality of partial control units PC2, the liquid management control unit PC3, and the data storage NA1 are communication lines for data. Through (L0d), they are connected to each other enabling transmission and reception of various types of data. The communication line L0c for control and the communication line L0d for data may be either a wired line or a wireless line, respectively.

Fig. 6(a) is a block diagram showing an example of the electrical configuration of the main body control unit PC0. As shown in Fig. 6(a), the main body control unit PC0 is realized, for example, by a computer or the like, and includes a communication unit P01, an input unit P02, and an output unit ( P03), a storage unit P04, a control unit P05 and a drive P06.

The communication unit P01 communicates with the schedule management control unit PC1, the plurality of partial control units PC2, and the liquid management control unit PC3 via, for example, the communication line L0c for control. transmission/reception of signals, and between schedule management control unit PC1, plurality of partial control units PC2, liquid management control unit PC3 and data storage NA1 via data communication line L0d. It has functions as a transmission unit and a reception unit capable of transmitting and receiving data in . In addition, the communication unit P01 has a function as a reception unit capable of receiving a signal from the management server 10 via the communication line 5, for example.

The input unit P02 may input a signal according to a user's motion using the substrate processing apparatus 20 , for example. Here, the input unit P02 may include, for example, a manipulation unit, a microphone, various sensors, and the like, similar to the input unit 12 . In the input part P02, you may input the signal which instructs manual correction with respect to recipe information, for example.

The output unit P03 can output various types of information, for example. Here, the output unit P03 may include, for example, a display unit and a speaker similarly to the output unit 13 . This display unit may have the form of a touch panel integrated with at least a part of the input unit P02.

The storage unit P04 can store information, for example. This storage unit P04 may be constituted by a non-volatile storage medium such as a hard disk or flash memory, for example. In the storage unit P04, for example, any one of a configuration having one storage medium, a configuration having two or more storage media integrally, and a configuration having two or more storage media divided into two or more parts is selected. may be employed. The storage unit P04 stores, for example, a program Pg0, various types of information Dt0, and a database Db0. The storage unit P04 may include a memory P05b described later. The database Db0 includes, for example, information on each substrate W as a target of processing in the substrate processing apparatus 20 and information about substrate processing conditions in each of the plurality of processing units 21 . It can contain data related to more than one kind of indicators. In other words, the storage unit P04, based on signals acquired by the plurality of sensor units 22s, 23s, and 214, for example, determines the status of substrate processing in each of the plurality of processing units 21. It is possible to store a database Db0 in which data groups related to one or more types of indices are accumulated. The information of each substrate W may include, for example, information indicating the shape of the substrate W and the processing performed on the substrate W. The information indicating the shape of the substrate W may include, for example, one or more types of film thicknesses and distribution of the film thicknesses in the substrate W.

The control unit P05 includes, for example, an arithmetic processing unit P05a acting as a processor, a memory P05b for temporarily storing information, and the like. As the arithmetic processing unit P05a, for example, an electronic circuit such as a CPU may be employed, and as the memory P05b, for example, a RAM or the like may be employed. The arithmetic processing unit P05a can realize the functions of the main body control unit PC0 by, for example, reading and executing the program Pg0 stored in the storage unit P04. Various types of information temporarily obtained by various types of information processing in the control unit P05 can be appropriately stored in the memory P05b or the like.

The drive P06 is a detachable part of the portable storage medium RM0, for example. The drive P06 can, for example, transfer data between the storage medium RM0 and the control unit P05 in a state where the storage medium RM0 is mounted. Further, the drive P06 reads the program Pg0 into the storage unit P04 from the storage medium RM0 in a state where the storage medium RM0 storing the program Pg0 is loaded in the drive P06. you can remember it.

Fig. 6(b) is a block diagram showing an example of a functional configuration realized in the arithmetic processing unit P05a. As shown in Fig. 6(b) , the arithmetic processing unit P05a is a functional configuration to be realized, and includes, for example, an information acquisition unit F01, an instruction unit F02, a storage control unit F03, and an output control unit F04. ) and a transmission control unit F05. As a work space for processing in each of these units, a memory P05b is used, for example. Here, for example, at least a part of the functions realized by the arithmetic processing unit P05a may be realized by a dedicated electronic circuit.

The information acquisition unit F01 can obtain various types of information from the server 10 for management, for example. For example, the information acquisition unit F01 can obtain information on a group of substrates W stored in the carrier C placed in the load port LP from the server 10 for management. Here, the information on the group of substrates W includes, for example, the number of substrates W, job, film thickness information, and recipe information. Here, the film thickness information includes, for example, at least one of average film thickness, minimum film thickness, maximum film thickness, and film thickness distribution. Recipe information includes, for example, a flow recipe that defines the flow of substrate processing, a process recipe that determines conditions for processing to be performed on the substrate W, and correction formula information that defines recipe correction rules. . Further, the information acquisition unit F01 can obtain, for example, data based on signals related to various indicators obtained from the respective sensor units 22s, 23s, and 214 via the part control unit PC2 or the like. there is.

The instruction unit F02 can give various instructions to the schedule management control unit PC1, the plurality of portion control units PC2, and the liquid management control unit PC3, for example. The instruction unit F02 instructs the schedule management control unit PC1 to set a time schedule for transport and processing of a group of substrates W in the substrate processing apparatus 20, for example; Instructing a plurality of portion control units PC2 to perform operations according to recipes and time schedules, and instructing liquid management control unit PC3 to perform temperature control, exchange, and monitoring of the treatment liquid L1 it is possible to do The time schedule defines, for example, the timing of conveying the substrate W by the conveying unit 24 and the processing timing of the substrate W by the plurality of processing units 21 . In this way, for example, the plurality of processing units 21 can process the substrate W according to a recipe that specifies conditions for the processing to be performed on the substrate W. In the first embodiment, for example, in two or more processing units 21 among the plurality of processing units 21, the same type of processing can be performed on the substrate W in parallel according to the same process recipe. Here, the same type of processing means a process in which the substrate W is processed in the same order using the same one or more types of processing liquids L1 in the processing unit 21 . For example, even if the processing time for the substrate W using the processing liquid L1 is increased or decreased by correction of a recipe described later, the same one or more types of processing liquids L1 are used in the processing unit 21. If the processing is performed on the substrate W in the same order, it can be said to be the same type of processing.

The storage control unit F03 can cause the storage unit P04 to store, for example, the information obtained in the information acquisition unit F01. In this way, in the storage unit P04, for example, recipe information, time schedule information, etc. constitute various kinds of information Dt0, and various indicators obtained by the respective sensor units 22s, 23s, and 214 are A database Db0 is constructed by accumulating related data. In the database Db0, for example, the location and timing at which various indices were obtained, information on the substrate W that was the processing target when the various indices were obtained, etc. are stored in a state associated with data related to the indices. .

The output controller F04 may visually or audibly output information about the state of the substrate processing apparatus 20 to the output unit P03, for example.

The transmission control unit F05 can cause the communication unit P01 to transmit various kinds of information to the management server 10, for example. Here, various types of information include, for example, information related to a result of processing of a group of substrates W of each carrier C in the substrate processing apparatus 20, and various types of information stored in the database Db0. Data related to indicators may be included. In addition, the transmission control unit F05 can cause the communication unit P01 to transmit recipe information to a plurality of portion control units PC2, for example.

<1-3-6. Control unit for scheduled management>

Control unit PC1 for schedule management corrects the recipe and time according to the recipe with respect to a group of substrates W stored in the carrier C, for example, in accordance with instructions from the main body control unit PC0. A schedule can be set. The time schedule is, for example, conveying the plurality of substrates W constituting the group of substrates W stored in the carrier C by the conveying unit 24 to the plurality of processing units 21 in order. The timing and the timing for performing processing on these plurality of substrates W are defined.

Fig.7 (a) is a block diagram which shows an example of the electrical structure of control unit PC1 for schedule management. As shown in Fig. 7(a), the control unit for schedule management PC1 is implemented, for example, in a computer or the like, and includes a communication unit P11, a storage unit P14, and a communication unit P11 connected via a bus line Bu1. It has a control unit P15.

The communication unit P11, for example, transmits/receives signals between the main body control unit PC0 and the like via the communication line L0c for control, and controls the main body via the communication line L0d for data. It has functions as a transmission unit and a reception unit capable of transmitting and receiving data between the unit PC0 and the data storage NA1.

The storage unit P14 can store information, for example. This storage unit P14 may be constituted by a non-volatile storage medium such as a hard disk or flash memory, for example. In the storage unit P14, for example, any one of a configuration having one storage medium, a configuration having two or more storage media integrally, and a configuration having two or more storage media divided into two or more parts is selected. may be employed. The storage unit P14 stores, for example, the program Pg1 and various types of information Dt1. The storage unit P14 may include a memory P15b described later.

The control unit P15 includes, for example, an arithmetic processing unit P15a acting as a processor, a memory P15b for temporarily storing information, and the like. As the arithmetic processing unit P15a, for example, an electronic circuit such as a CPU is employed, and as the memory P15b, a RAM or the like, for example, can be employed. The arithmetic processing unit P15a can realize the function of the control unit PC1 for schedule management, for example, by reading and executing the program Pg1 stored in the storage unit P14. Various types of information temporarily obtained by various types of information processing in the control unit P15 can be appropriately stored in the memory P15b or the like.

Fig. 7(b) is a block diagram showing an example of a functional configuration realized in the arithmetic processing unit P15a. As shown in Fig. 7(b), the arithmetic processing unit P15a is a functional configuration realized, for example, a recipe acquisition unit F11, an information acquisition unit F12, a first correction unit F13, It has a schedule setting unit (F14) and a transmission control unit (F15). As a work space for processing in each of these units, a memory P15b is used, for example. Here, for example, at least a part of the functions realized by the arithmetic processing unit P15a may be realized by a dedicated electronic circuit.

The recipe acquisition unit F11 responds to, for example, an instruction from the main body control unit PC0, and a group of substrates stored in the carrier C placed in the load port LP from the main body control unit PC0. Recipe information for (W) can be acquired.

The information acquisition unit F12 can obtain, from the data storage NA1, a data group related to one or more types of indices about the state of substrate processing in each of the plurality of processing units 21, for example. Further, the information acquisition unit F12 may obtain, for example, information on each substrate W in a group of substrates W stored in the carrier C from the main body control unit PC0. Further, the information acquisition unit F12 obtains, for example, from the main body control unit PC0 a data group related to one or more types of indicators of substrate processing conditions in each of the plurality of processing units 21. can also

The first correction unit F13 determines, for example, the state of substrate processing in each of the plurality of processing units 21 with respect to the processing of a group of substrates W using the plurality of processing units 21. Based on a data group related to one or more types of indices for , a first recipe correction in which recipes are collectively corrected can be performed. In this way, the recipe can be corrected in the same way for a plurality of substrates W subjected to the same type of processing in the plurality of processing units 21 , for example.

Here, in the 1st correction|amendment part F13, a recipe can be corrected by, for example, applying the numerical value related to one or more types of indicators to the correction expression accompanying a recipe. Numerical values related to one or more types of indices include, for example, numerical values of indices representing the state of the atmosphere in the interior space Sc0 (temperature of the atmosphere, supply amount of gas), and values of indices representing the state of the treatment liquid L1. Numerical values (eg, concentration, pH, temperature, etc.), numerical values of indicators representing the state of the substrate W (eg, film thickness before and after treatment, etching rate, degree of non-uniformity on the surface of the substrate), etc. can For example, a mode in which the processing time, which is one of the conditions for the processing to be performed on the substrate W specified in the process recipe, is multiplied by a coefficient corresponding to the numerical value of one or more types of indices is considered. Specifically, for example, when the standard processing time defined in the process recipe is 100, the processing time is counted as 100 in the first recipe correction as the concentration or temperature of the processing liquid L1 decreases. An aspect in which 1.1 is multiplied and the processing time becomes 110 (= 100 x 1.1) is conceivable. At this time, for example, the correction equation may also include a prediction of a change in the state of the processing liquid L1.

Here, the first correction unit F13, for example, sets each of the data group related to one or more types of indices and the group of substrates W stored in the carrier C obtained from the main body control unit PC0. The recipe may be corrected based on the information of the substrate W.

The schedule setting unit F14 can set a time schedule according to a recipe, for example. Here, for example, when the recipe is corrected by the first correction unit F13, the schedule setting unit F14 is configured according to the recipe after recipe correction (first recipe correction) by the first correction unit F13. , the time schedule is set. By this, for example, conveyance and processing of a group of substrates W in the substrate processing apparatus 20 can be performed efficiently. As a result, for example, throughput in the substrate processing apparatus 20 can be improved.

The transmission control unit F15 can cause the communication unit P11 to transmit various kinds of information to the main body control unit PC0, for example. Here, various types of information may include, for example, information on a recipe after correction corrected by the first correction unit F13.

<1-3-7. Partial control unit>

The plurality of partial control units PC2 can control the operations of the plurality of processing units 21 and the conveyance unit 24 according to instructions from the main body control unit PC0, for example. In the first embodiment, a dedicated partial control unit PC2 is provided for each processing unit 21, and a dedicated partial control unit PC2 is also installed in the conveyance unit 24. The part control unit PC2 of the processing unit 21 can control the operation of each unit of the processing unit 21 while appropriately monitoring the operation and state of each unit of the processing unit 21, for example. The part control unit PC2 of the conveyance unit 24 can control the operation of each part of the conveyance unit 24 while appropriately monitoring the operation and state of each part of the conveyance unit 24, for example. In addition, for example, one partial control unit PC2 may be provided in two or more processing units 21, and the operation of the transfer unit 24 may be controlled by the main body control unit PC0.

Fig. 8 (a) is a block diagram showing an example of the electrical configuration of the partial control unit PC2. As shown in Fig. 8(a), the partial control unit PC2 is implemented, for example, in a computer or the like, and includes a communication unit P21, a storage unit P24, and a control unit ( P25).

The communication unit P21, for example, transmits/receives signals between the main body control unit PC0 and the like via the communication line L0c for control, and controls the main body via the communication line L0d for data. It has functions as a transmission unit and a reception unit capable of transmitting and receiving data between the unit PC0 and the data storage NA1.

The storage unit P24 can store information, for example. This storage unit P24 can be constituted by, for example, a non-volatile storage medium such as a hard disk or flash memory. In the storage unit P24, for example, any one of a configuration having one storage medium, a configuration having two or more storage media integrally, and a configuration having two or more storage media divided into two or more parts is selected. may be employed. The storage unit P24 stores, for example, a program Pg2 and various types of information Dt2. The storage unit P24 may include a memory P25b described later.

The control unit P25 includes, for example, an arithmetic processing unit P25a acting as a processor, a memory P25b for temporarily storing information, and the like. As the arithmetic processing unit P25a, for example, an electronic circuit such as a CPU is employed, and as the memory P25b, for example, a RAM or the like can be employed. The arithmetic processing unit P25a can realize the function of the partial control unit PC2 by, for example, reading and executing the program Pg2 stored in the storage unit P24. Various types of information temporarily obtained by various types of information processing in the control unit P25 can be appropriately stored in the memory P25b or the like.

Fig. 8(b) is a block diagram showing an example of a functional configuration realized in the arithmetic processing unit P25a. As shown in Fig. 8(b), the arithmetic processing unit P25a is a functional configuration realized, for example, a recipe acquisition unit F21, an information acquisition unit F22, a second correction unit F23, It has a unit control section F24 and a transmission control section F25. As a work space for processing in each of these units, a memory P25b is used, for example. Here, for example, at least a part of the functions realized by the arithmetic processing unit P25a may be realized by a dedicated electronic circuit.

The recipe acquisition unit F21 can acquire a recipe from the main body control unit PC0, for example. The recipe acquired here may be a process recipe or a flow recipe, for example.

The information acquisition unit F22 can obtain, from the data storage NA1, a data group related to one or more types of indicators of substrate processing conditions in each of the plurality of processing units 21, for example.

The second correction unit F23 is, for example, used for processing at least one substrate W among a group of substrates W using one or more processing units 21 among a plurality of processing units 21. , correction of at least a part of the recipe (second recipe Also referred to as correction) can be performed. Here, the second correction unit F23 is, for example, involved in the processing of some of the substrates W among a group of substrates W using some of the processing units 21 among the plurality of processing units 21 . For this, a part of the recipe can be corrected based on a data group related to one or more types of indices of the state of substrate processing in each of the plurality of processing units 21 . In the first embodiment, for example, some processing units 21 among a plurality of processing units 21 are one processing unit 21, and some substrates W among a group of substrates W , one substrate W may be used. In addition, the timing at which the second recipe correction is performed is, for example, after the first recipe correction is performed on the group of substrates W, and one substrate W out of the group of substrates W This may be done before performing processing using the processing unit 21 . For example, in response to completion of processing of one substrate W using one processing unit 21 immediately before one substrate W among a group of substrates W, the second recipe correction is executed. The pattern of becoming is considered. Thereby, for example, when two or more processing units 21 sequentially perform the same type of processing on the substrates W in parallel, the recipe for each substrate W can be corrected in a state close to real time. there is.

Here, in the second correction unit F23, for example, similarly to the first correction unit F13, the recipe can be corrected by applying numerical values of one or more types of indicators to the correction equation accompanying the recipe. The numerical value of the index applied here may be based on the latest index acquired by each sensor unit 22s, 23s, 214 or the like before the second recipe correction is performed, for example. Here, for example, when two or more processing units 21 perform the same type of processing on the substrate W in parallel, the processing unit 21 that has completed the processing on the substrate W most recently A part of the recipe may be corrected based on a data group related to one or more types of indices of the state of substrate processing in the process. And, specifically, in the second recipe correction by the second correction unit F23, for example, when the processing time specified in the process recipe after the first recipe correction is performed is 110, the processing liquid L1 As the concentration or temperature of is lowered, in the second recipe correction, the processing time 110 is multiplied by the coefficient 1.1, and the processing time becomes 121 (= 110 × 1.1).

By such second recipe correction, for example, taking into account the conditions of substrate processing in other processing units 21 among the plurality of processing units 21, some substrates W of a group of substrates W ), a recipe that defines the conditions of processing applied to the substrate W can be corrected. Thereby, the precision of substrate processing in each processing unit 21 of the substrate processing apparatus 20 can be improved, for example. Further, for example, after the recipes are collectively corrected for the group of substrates W by the first recipe correction, the recipes for some of the substrates W among the group of substrates W by the second recipe correction. is further corrected. For this reason, for example, a batch correction of recipes for a group of substrates W to a certain extent (first recipe correction), and recipe correction in a state close to real time for some substrates W (second recipe correction), for example. Recipe correction in two stages including recipe correction) may be performed. By this, it can be easily performed, for example, to apply processing with high precision suitable for the situation to the substrate.

The unit control unit F24 executes processing on the substrate W by the processing unit 21 based on the process recipe after the second recipe correction is performed by the second correction unit F23, for example. can make it In the processing unit 21, the unit control unit F24 can control the operation of the sensor unit 214, for example. Moreover, the unit control part F24 of the conveyance unit 24 can control the operation of the sensor part 22s, for example. Conditions for the operation of the sensor unit 214 and the sensor unit 22s may be prescribed, for example, in a recipe. Thereby, the sensor unit 214 and the sensor unit 22s can acquire signals related to one or more types of indicators of the state of substrate processing in the processing unit 21 . At this time, the unit control unit F24 can acquire signals related to one or more types of indicators from the sensor unit 214 and the sensor unit 22s, for example. Here, the unit control unit F24 may calculate the etching rate as a numerical value based on a signal related to one or more types of indices from, for example, the film thickness before and after the process and the process time. At this time, the film thickness before processing may be, for example, the film thickness of the substrate W obtained by the sensor unit 214, and the main body control unit PC0 of the substrate W obtained from the management server 10 It may be thick. Further, for example, the main body control unit PC0 performs image processing on the image signal obtained from the sensor unit 214, so that the surface of the substrate W is obtained as a numerical value based on a signal related to one or more types of indices. You may calculate a numerical value representing the degree of non-uniformity of .

The transmission control unit F25 can cause the communication unit P21 to transmit various types of information to, for example, the main body control unit PC0 and the data storage NA1. Here, various kinds of information to be transmitted to the main body control unit PC0 include, for example, information indicating that the substrate processing has been completed, a history of processing actually performed on the substrate W (process log), and the second correction unit F23 ), and data related to one or more types of indicators acquired using the sensor units 22s and 214 after correction. In addition, the various types of information to be transmitted to the data storage NA1 may include, for example, data related to one or more types of indicators acquired using the sensor units 22s and 214, and the like.

<1-3-8. liquid management control unit>

The liquid management control unit PC3 can manage the state of the processing liquid L1 in the liquid storage unit 23 by controlling the operation of each unit included in the liquid storage unit 23, for example.

Fig. 9(a) is a block diagram showing an example of the electrical configuration of the liquid management control unit PC3. As shown in Fig. 9(a), the liquid management control unit PC3 is implemented, for example, in a computer or the like, and includes a communication unit P31, a storage unit P34, and a control unit connected via a bus line Bu3. (P35).

The communication unit P31, for example, transmits/receives signals between the main body control unit PC0 and the like via the communication line L0c for control, and controls the main body via the communication line L0d for data. It has functions as a transmission unit and a reception unit capable of transmitting and receiving data between the unit PC0 and the data storage NA1.

The storage unit P34 can store information, for example. This storage unit P34 may be constituted by a non-volatile storage medium such as a hard disk or flash memory, for example. In the storage unit P34, for example, any one of a configuration having one storage medium, a configuration having two or more storage media integrally, and a configuration having two or more storage media divided into two or more parts is selected. may be employed. The storage unit P34 stores, for example, the program Pg3 and various types of information Dt3. The storage unit P34 may include a memory P35b described later.

The control unit P35 includes, for example, an arithmetic processing unit P35a serving as a processor, a memory P35b for temporarily storing information, and the like. As the arithmetic processing unit P35a, for example, an electronic circuit such as a CPU is employed, and as the memory P35b, RAM or the like, for example, can be employed. The arithmetic processing unit P35a can realize the function of the liquid management control unit PC3 by, for example, reading and executing the program Pg3 stored in the storage unit P34. Various types of information temporarily obtained by various types of information processing in the control unit P35 can be appropriately stored in the memory P35b or the like.

Fig. 9(b) is a block diagram showing an example of a functional configuration realized in the arithmetic processing unit P35a. As shown in Fig. 9(b) , the arithmetic processing unit P35a has, for example, an information acquisition unit F31, a unit control unit F32, and a transmission control unit F33 as functional configurations to be realized. As a work space for processing in each of these units, a memory P35b is used, for example. Here, for example, at least a part of the functions realized by the arithmetic processing unit P35a may be realized by a dedicated electronic circuit.

The information acquisition unit F31 can acquire various instructions from, for example, the main body control unit PC0. The various instructions include, for example, instructions for adjusting the temperature of the treatment liquid L1, exchanging, monitoring, and the like.

The unit control unit F32 can control the operation of the liquid storage unit 23, for example. The unit control unit F32 can cause the sensor unit 23s of each storage tank 23t to acquire a signal related to a physical quantity indicating the state of the processing liquid L1, for example. In this way, the sensor unit 23s can acquire signals related to one or more types of indicators of the state of substrate processing in the processing unit 21 . Moreover, the unit control part F32 can heat the process liquid L1 in each storage tank 23t by the heating part HR, for example. Further, for example, when each storage tank 23t has a liquid exchange unit that automatically exchanges the treatment liquid L1, the unit control unit F32 controls the treatment liquid in each storage tank 23t by the liquid exchange unit. (L1) can be exchanged.

The transmission control unit F33 can cause the communication unit P31 to transmit various types of information to, for example, the main body control unit PC0 and the data storage NA1. Here, various types of information to be transmitted to the main body control unit PC0 are, for example, information related to one or more types of indicators acquired using the sensor unit 23s, and liquid exchange in each storage tank 23t. information on the elapsed time of and the number of times of use of the treatment liquid L1, and the like. The various types of information to be transmitted to the data storage NA1 include, for example, information related to one or more types of indicators acquired using the sensor unit 23s.

<1-3-9. Data Storage＞

The data storage NA1 is, for example, based on signals acquired by the respective sensor units 22s, 23s, 214, etc., one type of substrate processing status in each of the plurality of processing units 21. Data groups related to the above indexes can be stored. For the data storage NA1, for example, a non-volatile storage medium such as a hard disk or flash memory may be applied, or a volatile storage medium such as RAM may be applied.

Fig. 10 is a diagram showing an example of the contents of the data group DG1 stored in the data storage NA1. As shown in Fig. 10, the data group DG1 includes, for example, numerical values of indicators indicating the state of the atmosphere in the interior space Sc0 (eg, temperature of the atmosphere, supply amount of gas, etc.), processing Numeral values of indicators representing the state of the liquid L1 (eg, concentration, pH, temperature, etc.) and numerical values of indicators representing the state of the substrate W (eg, film thickness before and after treatment, etching rate, substrate degree of non-uniformity of the surface) and the like. Further, the data group DG1 may include, for example, numerical values of indicators (e.g., discharge amount and discharge position) indicating the discharge state of the treatment liquid L1. Here, in the data storage NA1, various types of data included in the data group DG1, for example, become data related to the latest index by being overwritten.

<1-4. Recipe correction operation>

11 is a flowchart showing an example of an operation flow related to first recipe correction. Here, for example, by executing the program Pg0 in the arithmetic processing unit P05a of the main body control unit PC0 and executing the program Pg1 in the arithmetic processing unit P15a of the control unit for schedule management PC1. , The main body control unit PC0 and the schedule management control unit PC1 cooperate to realize an operation flow for an operation related to the first recipe correction.

First, in step Sp1 of FIG. 11, it is determined whether the information acquisition part F01 of main body control unit PC0 acquired the job from the server 10 for management. Here, for example, the information acquisition unit F01 sends the carrier ( The determination of step Sp1 is repeated until a job for a group of substrates W stored in C) is obtained. Then, when the information acquisition unit F01 obtains the job, it proceeds to step Sp2.

At step Sp2, the information acquisition unit F01 of the main body control unit PC0 acquires from the server 10 for management the information on the group of substrates W including the recipe according to the work obtained at step Sp1. At this time, the recipe acquisition part F11 of the control unit PC1 for schedule management acquires the information about the group of board|substrates W.

In step Sp3, the information acquisition unit F12 of the control unit for schedule management PC1 converts a data group related to one or more types of indices to the state of substrate processing in each of the plurality of processing units 21 into data. It is obtained from storage NA1.

In step Sp4, the first correction unit F13 of control unit PC1 for schedule management performs substrate processing in each of a plurality of processing units 21 obtained in step Sp3 with respect to a group of substrates W. A first recipe correction is performed based on a group of data related to one or more indicators of the situation. Here, the first correction unit F13 determines the state of substrate processing in each of the plurality of processing units 21 with respect to the processing of a group of substrates W using the plurality of processing units 21 . Recipes are collectively corrected based on data groups related to one or more types of indices. In this way, for example, the recipes can be equally corrected for a plurality of substrates W on which the same type of processing is performed in two or more processing units 21 .

In step Sp5, the schedule setting part F14 of control unit PC1 for schedule management sets a time schedule according to a recipe. Here, in Step Sp4, if the recipe is corrected by the first recipe correction, the schedule setting unit F14 sets a time schedule according to the recipe after the first recipe correction is performed in Step Sp4.

In step Sp6, the transmission control unit F15 of the control unit for schedule management PC1 transmits information such as the corrected recipe corrected in step Sp4 and the time schedule set in step Sp5 to the main body control unit PC0. .

In step Sp7, the instruction unit F02 of the main body control unit PC0 instructs the plurality of part control units PC2 to perform operations according to the recipe and the time schedule. Thereby, processing can be performed on the substrate W in the plurality of processing units 21 according to the recipe after the first recipe correction and the time schedule according to this recipe.

12 is a flowchart showing an example of an operation flow related to the second recipe correction. Here, the arithmetic processing part P25a in the part control unit PC2 of the processing unit 21 implement|achieves the operation flow related to 2nd recipe correction|amendment by executing program Pg2, for example.

First, in step Sp11 of FIG. 12, the unit control part F24 of the part control unit PC2 determines whether the process of the board|substrate W in the processing unit 21 is complete|finished or not. Here, the unit control unit F24 repeats the determination of step Sp11 until the processing of the substrate W according to the process recipe in the processing unit 21 is completed. Then, the unit control unit F24 proceeds to Step Sp12 when the processing of the substrate W according to the process recipe is completed in the processing unit 21 .

In step Sp12, the information acquisition unit F22 of the part control unit PC2 stores a data group related to one or more types of indicators of the state of substrate processing in each of the plurality of processing units 21 to data storage ( obtained from NA1).

In step Sp13, the second correction unit F23 of the partial control unit PC2 processes in the processing unit 21 next to the substrate W on which the processing in the processing unit 21 is completed in step Sp11. For the substrate W to be used, the second recipe correction is performed based on the data group related to one or more types of indices of the state of substrate processing in each of the plurality of processing units 21 obtained in step Sp12. Thereby, for example, when two or more processing units 21 sequentially perform the same type of processing on the substrates W in parallel, the recipe for each substrate W can be corrected in a state close to real time. there is.

In step Sp14, the unit control unit F24 of the portion control unit PC2 in the processing unit 21 causes the processing unit 21 to execute an operation according to the recipe. Here, in step Sp13, if the recipe is corrected by the second recipe correction, the unit control section F24 controls the operation of the processing unit 21 according to the recipe after the second recipe correction is performed in step Sp13. .

<1-5. Summary of the first embodiment>

As described above, in the substrate processing system 1 according to the first embodiment, for example, in the substrate processing apparatus 20, 1 for the state of substrate processing in each of the plurality of processing units 21 Regarding the processing of at least one substrate W among a group of substrates W using at least one processing unit 21 among a plurality of processing units 21 based on a data group related to an index of more than type , correct at least part of the recipe. This makes it possible to correct, for example, a recipe for prescribing processing conditions to be performed on the substrate W according to substrate processing conditions in the plurality of processing units 21, so that processing suitable for the situation can be performed. It can be applied to the substrate W. As a result, for example, the precision of substrate processing in each processing unit 21 of the substrate processing apparatus 20 can be improved.

<2. Others＞

The present invention is not limited to the first embodiment described above, and various changes, improvements, and the like are possible within a range not departing from the gist of the present invention.

In the first embodiment, the time schedule may be reset if, for example, a problem occurs in the time schedule due to correction of the second recipe. In this case, the schedule management control unit PC1 may reset the time schedule according to the recipe after the second recipe correction has been performed, for example. By this, for example, the plurality of substrates W are sequentially conveyed to the plurality of processing units 21, and the plurality of substrates W are sequentially processed in the plurality of processing units 21. problems that may occur in the case are avoided.

Fig. 13 is a flowchart showing an example of an operation flow related to resetting the time schedule. Here, for example, by executing the program Pg0 in the arithmetic processing unit P05a of the main body control unit PC0 and executing the program Pg1 in the arithmetic processing unit P15a of the control unit for schedule management PC1. , The main body control unit PC0 and the schedule management control unit PC1 cooperate to realize an operation flow related to resetting the time schedule. This operation flow is executed every time the second recipe correction is performed, for example.

In step Sp21 of FIG. 13, the arithmetic processing part P15a of control unit PC1 for schedule management determines whether there is a problem with a time schedule. Here, control unit PC1 for schedule management determines whether a problem arises or not, when the recipe after the 2nd recipe correction|amendment with respect to some processing units 21 is applied to the current time schedule.

Fig. 14 is a diagram showing an example of a time schedule. Fig. 15 is a diagram showing an example in which a problem occurs in the time schedule. Fig. 16 is a diagram showing an example of a time schedule after resetting. 14 to 16, the horizontal axis represents the passage of time, and in order from the top, the transfer timing of the substrate W from the carrier C by the indexer robot IR to the center robot CR, the center robot ( The transfer timing of the substrate W to the processing unit 21 by the CR), the timing at which the substrate W is processed by the first processing unit 21, and the second processing unit 21 The timing at which the processing is performed on the substrate W and the timing at which the first processing liquid L11 is supplied from the liquid storage unit 23 to the first processing unit 21 and the second processing unit 21 are indicated. there is.

According to the time schedule shown in FIG. 14 , for example, the indexer robot IR carries out the first substrate W from the carrier C at time t0, and the indexer robot IR removes the first substrate W from time t0 to t1. The substrate W of 1 is conveyed, and at time t1, the indexer robot IR transfers the first substrate W to the center robot CR. At time t1 to t2, the center robot CR conveys the first substrate W, and at time t2, the center robot CR transfers the first substrate W to the first processing unit 21. . Then, from time t2 to t8, the first processing unit 21 processes the first substrate W. At this time, the liquid storage unit 23 supplies the first processing liquid L11 to the first processing unit 21 from time t3 to t6. On the other hand, the indexer robot IR carries out the second substrate W from the carrier C at time t3, the indexer robot IR conveys the second substrate W at time t3 to t4, and At t4, the indexer robot IR transfers the second substrate W to the center robot CR. At time t4 to t5, the center robot CR conveys the second substrate W, and at time t5, the center robot CR transfers the second substrate W to the second processing unit 21. . Then, from time t5 to t11, the second processing unit 21 processes the second substrate W. At this time, the liquid storage unit 23 supplies the first processing liquid L11 to the second processing unit 21 from time t6 to t9.

Here, for example, as shown in FIG. 15 , based on the time schedule shown in FIG. 14 , the period during which the first processing unit 21 processes the first substrate W is time t2 From the period of ~ t8 to the period of time t2 to t9, the period in which the liquid storage unit 23 supplies the first processing liquid L11 to the first processing unit 21 is the period from time t3 to t6. It is assumed that the second recipe correction is performed so as to extend the period from time t3 to t7 in the period. In this case, in the period from time t6 to t7, the liquid storage unit 23 supplies the first processing liquid L11 to the first processing unit 21 (time t3 to t7), and the liquid storage The period during which the unit 23 supplies the first processing liquid L11 to the second processing unit 21 (time t6 to t9) overlaps. Here, for example, if the liquid storage unit 23 is configured to supply the first processing liquid L11 to only one processing unit 21, the time schedule shown in FIG. 15 becomes an unrealizable time schedule. . That is, a problem occurs in the time schedule.

In step Sp21, if the arithmetic processing unit P15a of control unit PC1 for schedule management determines that there is a problem with the time schedule, it proceeds to step Sp22, and if it is determined that there is no problem with the time schedule, this operation flow quit

In step Sp22, the schedule setting unit F14 of the control unit for schedule management PC1 resets the time schedule by taking into account the recipe after the second recipe correction has been performed. For example, when a problem with the time schedule shown in FIG. 15 occurs, as shown in FIG. 16 , by slightly delaying the time at which the second substrate W is conveyed and processed, the time schedule Reset the time schedule to resolve the problem. Specifically, at time t4, the indexer robot IR carries out the second substrate W from the carrier C, and at time t4 to t5, the indexer robot IR conveys the second substrate W, , at time 5, the indexer robot IR transfers the second substrate W to the center robot CR. At time t5 to t6, the center robot CR conveys the second substrate W, and at time t6, the center robot CR conveys the second substrate W to the second processing unit 21. . Then, the second processing unit 21 processes the second substrate W from time t6 to t12. At this time, the liquid storage unit 23 supplies the first processing liquid L11 to the second processing unit 21 from time t7 to t10. As a result, the period during which the liquid storage unit 23 supplies the first processing liquid L11 to the first processing unit 21 (time t3 to t7), and the liquid storage unit 23 performs the second processing The period for supplying the first processing liquid L11 to the unit 21 (time t7 to t10) does not overlap.

In step Sp23, the transmission control unit F15 of the control unit for schedule management PC1 transmits the information of the time schedule reset in step Sp22 to the main body control unit PC0.

In step Sp24, the instruction unit F02 of the main body control unit PC0 instructs the plurality of partial control units PC2 to perform operations according to the time schedule after resetting. Thereby, the substrate W can be processed in the plurality of processing units 21 according to the time schedule according to the recipe after the second recipe correction. This can prevent problems that may arise when, for example, two or more substrates W are processed in parallel in two or more processing units 21 .

In the first embodiment, each substrate processing apparatus 20 may correct at least a part of the recipe based on the data group stored in the storage unit 14 of the server 10 for management, for example. In this case, in each substrate processing apparatus 20, in the control unit PC1 for schedule management, based on the data group stored in the storage part 14 of the server 10 for management, a 1st recipe correction is performed, Alternatively, in each part control unit PC2, the second recipe correction may be performed based on the data group stored in the storage unit 14 of the server 10 for management. In this way, for example, a data group related to one or more types of indices of the state of substrate processing in each processing unit 21 of the plurality of substrate processing apparatuses 20 is stored in the server 10 for management. After storing, each substrate processing apparatus 20 corrects the recipe based on the data group stored in the server 10 for management, so that a certain substrate processing apparatus 20 is different from other substrate processing apparatuses 20 Recipes can be calibrated using the collected data. In addition, for example, data collected in a certain substrate processing apparatus 20 can be used for recipe correction in another substrate processing apparatus 20 .

In the first embodiment, for example, the data group DG1 stored in the data storage NA1 is stored in the storage unit P04 of the main unit control unit PC0 and the storage unit P14 of the schedule management control unit. ) may be stored in at least one of them, or may be stored in the storage unit 14 of the server 10 for management. In this case, for example, a server in which the database 14db and the data group DG1 are stored separately from the server 10 for management communicates with each substrate processing apparatus 20 via the communication line 5 and the data may be connected so that transmission and reception of

In the first embodiment, the first recipe correction may be performed in the main body control unit PC0, for example. In this case, for example, the arithmetic processing unit P05a of the main body control unit PC0 may have a function related to the first recipe correction of the arithmetic processing unit P15a of the control unit for schedule management PC1. Moreover, 1st recipe correction may be performed by at least 1 control unit of main body control unit PC0 and control unit for schedule management PC1, for example, main body control unit PC0 and control unit for schedule management. It may be done with the cooperation of (PC1). Further, for example, the functions of the main body control unit PC0 and the schedule management control unit PC1 may be realized by one control unit. In other words, the function of the arithmetic processing unit P05a of the main body control unit PC0 and the function of the arithmetic processing unit P15a of the control unit for schedule management PC1 may be appropriately allocated to one or more control units.

Further, for example, the substrate processing apparatus 20 includes, for example, a control unit that performs first recipe correction (also referred to as a first control unit) and a partial control unit as a second control unit that performs second recipe correction. You may have two or more control units including (PC2). If such a configuration is adopted, for example, the number of the plurality of processing units 21 is large, and the first control unit for controlling the operation in a wide range of configurations of the substrate processing apparatus 20, and the substrate processing apparatus ( 20), when there is a second control unit that controls operations in a narrow configuration such as an individual processing unit 21 or a part of processing units 21, the first control unit corrects the first recipe. and when the second control unit performs the second recipe correction, hierarchical control of the operation in the substrate processing apparatus 20 can be easily realized. As a result, for example, a batch correction of recipes for a group of substrates W (first recipe correction) and a state close to real time for some of the substrates W among the group of substrates W Correction of the recipe in (correction of the second recipe) can be efficiently performed in two steps. With this, for example, high-precision substrate processing suitable for circumstances can be efficiently performed.

In the first embodiment, the first recipe correction and the second recipe correction may be performed by one control unit, for example. That is, the first recipe correction and the second recipe correction may be performed by one or more control units. In this case, for example, in the function related to the 1st recipe correction|amendment in the arithmetic processing part P15a of the control unit for schedule management PC1, and the arithmetic processing part P25a of the some part control unit PC2 The functions related to the second recipe correction of may be appropriately distributed to one or more control units.

In the first embodiment, for example, a recipe for prescribing the processing of the substrate W in the processing unit 21 while the processing is being performed on the substrate W in the processing unit 21. The second recipe correction may be performed for . By this, for example, correction of a recipe in real time for some substrates W among a group of substrates W can be realized.

In the first embodiment, for example, only the first recipe correction may be performed or only the second recipe correction may be performed during the first recipe correction and the second recipe correction. That is, you may perform recipe correction of at least one of 1st recipe correction and 2nd recipe correction. In other words, with respect to the processing of at least one or more substrates W among a group of substrates W using one or more processing units 21 among the plurality of processing units 21, the number of processing units 21 Correction of the recipe may be performed based on a data group related to one or more types of indicators of the state of substrate processing in each case. Here, for example, in a configuration in which first recipe correction is performed and second recipe correction is not performed, in the plurality of processing units 21, processing for the substrate W suitable for the situation can be easily performed. . As a result, for example, the processing precision of the substrate W in each processing unit 21 of the substrate processing apparatus 20 can be easily improved.

In the first embodiment, for example, in the first recipe correction and the second recipe correction, among one or more types of indicators constituting the data group, according to the degree of influence given to the processing performed on the substrate W, , a correction equation defining a correction rule of the recipe may be set so as to be weighted in advance. For example, in the case of the second recipe correction, even if a correction formula is set that is weighted so that the influence of data related to one or more types of indices on the processing unit 21 in which processing according to the recipe to be corrected is performed is increased. do. Further, for example, in the second recipe correction, data for processing units 21 other than the processing unit 21 in which processing according to the recipe being corrected is performed is basically not adopted, Data related to numerical values of indicators representing the state of the processing liquid L1 common among the plurality of processing units 21 may be employed.

In the first embodiment, for example, in the first recipe correction and the second recipe correction, in addition to the increase or decrease in the processing time, other factors such as the condition of the position where the processing liquid L1 is discharged with respect to the substrate W The recipe may be corrected so as to change the processing conditions of . For example, when one or more types of indices include the distribution of the film thickness and the degree of nonuniformity of the substrate surface, the processing liquid L1 is applied to the substrate W based on the data related to these indices. The recipe may be corrected so that the condition of the discharge position is changed.

Needless to say, all or part of each of the above-described first embodiment and various modified examples can be combined appropriately and in a non-contradictory range.

1: substrate processing system 10: server for management
14, P04, P14, P24, P34: storage unit 14db, Db0: database
15, P05, P15, P25, P35: control unit
15a, P05a, P15a, P25a, P35a: calculation processing unit
20: substrate processing device 21: processing unit
21sb: imaging unit 23: liquid storage unit
24: transfer unit 214, 22s, 23s: sensor unit
DG1: data group F13: first correction unit
F14: schedule setting unit F23: second correction unit
F24, F32: Unit control unit Fm0: Film thickness meter
L1: Throughput NA1: Data storage
PC0: main body control unit PC1: control unit for scheduled management
PC2: Part Control Unit PC3: Liquid Management Control Unit
W: substrate

Claims (2)

a plurality of processing units for processing a substrate according to a recipe defining processing conditions;
a conveying unit that sequentially conveys a plurality of substrates in a group of substrates to the plurality of processing units;
a plurality of sensor units for acquiring signals related to one or more types of indicators of substrate processing conditions in each of the processing units;
a storage unit for storing a database accumulating a data group related to one or more types of indicators of substrate processing conditions in each of the plurality of processing units, based on signals acquired by the plurality of sensor units;
One or more control units for correcting at least a part of the recipe based on the data group for the processing of at least one or more substrates among the group of substrates using one or more processing units among the plurality of processing units. do,
The at least one control unit corrects a portion of the recipe based on the data group for processing of some substrates of the group of substrates using some of the processing units of the plurality of processing units, substrate processing Device. a plurality of substrate processing devices;
A server connected to the plurality of substrate processing apparatuses to enable transmission and reception of data,
Each of the substrate processing devices,
a plurality of processing units for processing a substrate according to a recipe defining processing conditions;
a conveying unit that sequentially conveys a plurality of substrates in a group of substrates to the plurality of processing units;
a plurality of sensor units for acquiring signals related to one or more types of indicators of substrate processing conditions in each of the processing units;
With one or more control units,
The server,
Based on the signals acquired by the plurality of sensor units, a data group related to one or more types of indicators of substrate processing conditions in each of the plurality of processing units of each of the plurality of substrate processing apparatuses is accumulated. It has a storage unit for storing a database,
In each of the substrate processing apparatuses, the one or more control units control the recipe based on the data group for processing of some substrates of the group of substrates using some processing units of the plurality of processing units. A substrate processing system that corrects a part of

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