KR102181639B1 - Substrate treatment management device, substrate treatment management method, and substrate treatment management program - Google Patents

Abstract

History display data for displaying a history of processing of a plurality of substrates in the substrate processing apparatus is obtained. Based on the acquired history display data, the history of processing of the plurality of substrates is displayed on the display unit as a history chart. When a plurality of elements corresponding to different substrates and corresponding to the same processing as an arbitrary part of the history chart displayed by the display section are accepted as the first and second elements, the accepted first and second elements correspond to each other The first or second auxiliary line passing through the portion is displayed on the history chart.

Description

Substrate treatment management device, substrate treatment management method, and substrate treatment management program

The present invention relates to a substrate processing management apparatus, a substrate processing management method, and a substrate processing management program for managing processing by a substrate processing apparatus.

In a lithography process in manufacturing a semiconductor device or the like, a coating film is formed by supplying a coating liquid such as a resist liquid onto a substrate. After the coating film is exposed to light, it is developed to form a predetermined pattern on the coating film. In Patent Document 1, a substrate processing apparatus disposed so as to be adjacent to an exposure apparatus is described.

The substrate processing apparatus of Patent Document 1 includes a carrier mounting unit, a processing block, and an interface unit. The substrate in the carrier placed on the carrier mounting portion is carried into the processing block, and a resist liquid is applied. After that, the substrate is conveyed to the exposure apparatus through the interface unit and exposed. The substrate after exposure is conveyed to the processing block through the interface unit and developed. The substrate after development is conveyed to the carrier mounting unit.

Unexamined Patent Publication No. 2004-152801

In the memory of the substrate processing apparatus described in Patent Literature 1, a transfer schedule in which each of the plurality of substrates is transferred at which timing and to which transfer destination is stored is stored. A plurality of substrates are continuously processed by being conveyed according to a conveyance schedule.

However, there are cases where the substrate is temporarily congested in the substrate processing apparatus, and a plurality of substrates are not processed according to the transfer schedule. In such a case, there is a possibility that an abnormality exists in the stagnant place of the substrate or the stagnant substrate in the substrate processing apparatus. For this reason, it is desirable to be able to easily specify which substrate has stagnated at which place in the substrate processing apparatus.

It is an object of the present invention to provide a substrate processing management apparatus, a substrate processing management method, and a substrate processing management program capable of easily specifying an abnormality in processing by the substrate processing apparatus.

(1) A substrate processing management apparatus according to an aspect of the present invention is a substrate processing management apparatus that manages processing in a substrate processing apparatus that sequentially performs processing on each of a plurality of substrates. A data acquisition unit that acquires history display data for displaying the processing history of the plurality of substrates; a display unit that displays the history of processing of the plurality of substrates as a history chart based on the history display data acquired by the data acquisition unit; , An operation unit operated by a user to designate an arbitrary part of the history chart displayed by the display unit, and a display control unit controlling display by the display unit based on the part designated by the operation unit, and the history chart is Each extended in the corresponding first direction and includes a plurality of band-shaped indices each representing a history of processing for a plurality of substrates, and the plurality of band-shaped indices intersect with the first direction in the order of starting the first processing. Lined up in the second direction, each strip-shaped index includes an element index corresponding to each process, and each element index has a length corresponding to the time required for processing and is located in a corresponding visual range on the time axis. , The display control unit, when a plurality of element indices corresponding to different substrates and corresponding to the same processing are designated as the first and second element indices by the operation unit, the designated first and second element indices corresponding to each other The display unit is controlled to display the basic auxiliary line passing through the part on the history chart.

In this substrate processing management apparatus, history display data for displaying the processing history of a plurality of substrates in the substrate processing apparatus is acquired. Based on the acquired history display data, the history of processing of the plurality of substrates is displayed on the display unit as a history chart. When a plurality of element indices corresponding to different substrates and corresponding to the same processing as an arbitrary part of the history chart displayed by the display are designated as the first and second element indices, the first and second element indices of these Basic auxiliary lines passing through the corresponding parts are displayed on the history chart.

According to this configuration, when the substrate is processed without being stagnated by the substrate processing apparatus, the basic auxiliary line passes through a specific portion of the element index corresponding to the first and second element index in different substrates. On the other hand, when the substrate is congested in the processing prior to the processing corresponding to the first and second element indexes, the basic auxiliary line is a specific part of the element index corresponding to the first and second element index in the other substrate. Do not pass.

Accordingly, the user can easily recognize whether or not processing of the substrate by the substrate processing apparatus has been stagnated by visually recognizing whether or not the basic auxiliary line passes through a specific portion of the plurality of element indexes. Further, by appropriately designating a plurality of element indices, it is possible to specify in which processing the processing of the substrate is stagnant. As a result, it is possible to easily specify an abnormality in processing by the substrate processing apparatus.

(2) The portions corresponding to each other of the first and second element indicators include portions indicating the start time of processing in the first and second element indicators, and the basic auxiliary line is of the first and second element indicators. You may include a first auxiliary line passing through the portion indicating the start time.

In this case, it is possible to easily specify that the substrate was stagnant before the treatment corresponding to the first and second element index was performed on any one of the substrates. Thereby, the abnormality of the said board|substrate or the part of the substrate processing apparatus which performs the said processing can be easily specified.

(3) The portions corresponding to each other of the first and second element indicators include portions indicating the end time of processing in the first and second element indicators, and the basic auxiliary line is the first and second element indicators. You may include a second auxiliary line passing through the portion indicating the end time.

In this case, it is possible to easily specify that the substrate was stagnant before or after the treatment corresponding to the first and second element indicators was performed on any one of the substrates. Thereby, the abnormality of the said board|substrate or the part of the substrate processing apparatus which performs the said processing can be easily specified.

(4) The display control unit passes through a specific portion in the designated third element index when an arbitrary element index among the plurality of element indexes corresponding to the plurality of substrates is further designated as the third element index by the operation unit. The display unit may be controlled so that the third auxiliary line parallel to the basic auxiliary line is displayed on the history chart.

According to this configuration, when the substrate is processed without being stagnated by the substrate processing apparatus, the third auxiliary line passes through a specific portion of the element index corresponding to the third element index in the plurality of substrates. On the other hand, when the substrate is stagnant in the processing prior to the processing corresponding to the third element index, the third auxiliary line does not pass through a specific part of the element index corresponding to the third element index in any one substrate. .

Accordingly, the user can easily recognize whether or not processing of the substrate by the substrate processing apparatus is stagnant by visually recognizing whether the basic auxiliary line and the third auxiliary line pass through a specific portion of a plurality of element indices. . Further, the user can more easily determine whether or not the substrate is stagnant between the processing corresponding to the first and second element indicators and the processing corresponding to the third element indicator.

(5) The specific portion in the third element index may include a portion indicating the start time of processing or a portion indicating the end time of processing in the third element index. In this case, it can be easily specified that the substrate was stagnant before or after the treatment corresponding to the third element index was performed on any one substrate.

(6) A substrate processing management method according to another aspect of the present invention is a substrate processing management method for managing processing in a substrate processing apparatus in which processing is sequentially performed on each of a plurality of substrates. Acquiring history display data for displaying the processing history of the plurality of substrates, displaying the history of processing of the plurality of substrates as a history chart on the display unit based on the acquired history display data, and displayed by the display unit It includes the step of accepting designation of an arbitrary part of the history chart, and displaying a basic auxiliary line on the display part based on the accepted part, wherein the history chart extends in the first direction corresponding to the time axis, and has a plurality of And a plurality of band-shaped indices each representing the history of processing on the substrate of, and the plurality of band-shaped indices are arranged in a second direction intersecting with the first direction in the order of initiation of the first treatment, and each band-shaped index Includes an element index corresponding to each processing, each element index has a length corresponding to the time required for processing and is located in a corresponding time range on the time axis, and displaying the basic auxiliary line on the display unit , When a plurality of element indices corresponding to different substrates as an arbitrary part of the history chart and also corresponding to the same treatment are accepted as the first and second element indices, the accepted first and second element indices corresponding to each other It includes displaying the basic auxiliary line passing through the part on the history chart of the display unit.

According to this substrate processing management method, the user can easily recognize whether or not processing of the substrate by the substrate processing apparatus is stagnant by visually recognizing whether the basic auxiliary line passes through a specific portion of a plurality of element indicators. have. Further, by appropriately designating a plurality of element indices, it is possible to specify in which processing the processing of the substrate is stagnant. As a result, it is possible to easily specify an abnormality in processing by the substrate processing apparatus.

(7) A substrate processing management program according to another aspect of the present invention is a substrate processing management program capable of performing processing management in a substrate processing apparatus that sequentially performs processing on each of a plurality of substrates by the processing apparatus. , A process of acquiring history display data for displaying the history of processing of a plurality of substrates in the substrate processing apparatus, and displaying the history of processing of a plurality of substrates as a history chart on the display unit based on the acquired history display data The processing, the processing of accepting the designation of an arbitrary portion of the history chart displayed by the display unit, and the processing of displaying the basic auxiliary line on the display unit based on the accepted portion, are caused by the processing device to execute, and the history chart, Each extended in the first direction corresponding to the time axis and includes a plurality of band-shaped indices each indicating a history of processing for a plurality of substrates, and the plurality of band-shaped indices are the first direction and the first direction in the order of initiation of the first processing. Arranged in the second direction intersecting, each band-shaped index includes an element index corresponding to each process, and each element index has a length corresponding to the time required for processing and a corresponding visual range on the time axis The processing of displaying the basic auxiliary line at the display unit is a case where a plurality of element indices corresponding to different substrates and corresponding to the same process as an arbitrary part of the history chart are accepted as the first and second element indices, And displaying a basic auxiliary line passing through corresponding portions of the received first and second element indicators on the history chart of the display unit.

According to this substrate processing management program, the user can easily recognize whether or not processing of the substrate by the substrate processing apparatus is stagnant by visually recognizing whether the basic auxiliary line passes through a specific portion of a plurality of element indicators. have. Further, by appropriately designating a plurality of element indices, it is possible to specify whether the processing of the substrate is stagnant in any one of the processing. As a result, it is possible to easily specify an abnormality in processing by the substrate processing apparatus.

Advantageous Effects of Invention According to the present invention, it is possible to easily identify an abnormality in processing by the substrate processing apparatus.

1 is a diagram showing the configuration of a substrate processing system including a substrate processing management apparatus according to an embodiment of the present invention.
2 is a history chart displayed by history display data.
3 is a partially enlarged view of the history display column of FIG. 2.
4 is a block diagram showing the configuration of the substrate processing management apparatus of FIG. 1.
5 is a diagram for describing an example of the operation of the substrate processing management apparatus.
6 is a diagram for explaining another example of the operation of the substrate processing management apparatus.
7 is a flowchart showing an auxiliary line display process for displaying an auxiliary line on a history chart.
Fig. 8 is a flowchart showing an auxiliary line display process for displaying an auxiliary line on a history chart.
9 is a schematic plan view of the substrate processing apparatus of FIG. 1.
Fig. 10 is a schematic side view showing an internal configuration of a coating treatment unit, a developing treatment unit, and a washing and drying treatment unit of Fig. 9.
11 is a schematic side view showing an internal configuration of a heat treatment unit and a cleaning and drying unit of FIG. 9.
12 is a schematic side view showing an internal configuration of a conveyance unit.

Hereinafter, a substrate processing management apparatus, a substrate processing management method, and a substrate processing management program according to an embodiment of the present invention will be described with reference to the drawings. In addition, in the following description, the substrate refers to a semiconductor substrate, a substrate for a liquid crystal display device, a substrate for a plasma display, a substrate for an optical disk, a substrate for a magnetic disk, a substrate for an optical magnetic disk, a substrate for a photomask, and the like.

(1) Schematic configuration of the substrate processing system

1 is a diagram showing a configuration of a substrate processing system including a substrate processing management apparatus according to an embodiment of the present invention. As shown in FIG. 1, the substrate processing system 500 includes one or more substrate processing apparatuses 100, a server 200, and one or more substrate processing management apparatuses 300. Each of the substrate processing apparatuses 100, the server 200, and each of the substrate processing management apparatuses 300 are connected to the network 510 so as to communicate with each other.

The substrate processing apparatus 100 includes a main controller 1, a storage unit 2, a plurality of processing chambers 3, and a plurality of transfer devices (transfer robots) 4. In the substrate processing apparatus 100 of FIG. 1, one processing chamber 3 and one conveying apparatus 4 are shown. The detailed configuration and operation of the substrate processing apparatus 100 will be described later.

In the storage unit 2, schedule information 2a indicating the transfer path of the substrate and the processing procedure in the plurality of processing chambers 3 are stored. The main controller 1 controls the operation of the plurality of processing chambers 3 and the plurality of conveying devices 4 based on the schedule information 2a stored in the storage unit 2. Thereby, the substrates are sequentially conveyed to the plurality of processing chambers 3, and predetermined processing is performed in each processing chamber 3.

The main controller 1 acquires the history information 2b indicating the start time and end time of the processing in each processing chamber 3 from each conveying device 4 and stores it in the storage unit 2. In addition, the main controller 1 generates history display data 2c for displaying a history chart visually indicating the history of processing of a plurality of substrates based on the schedule information 2a and the history information 2b. , Stored in the storage unit 2.

2 is a history chart displayed by history display data 2c. As shown in FIG. 2, the history chart 10 includes a name display field 11, a time display field 12, and a history display field 13. The name display field 11, the time display field 12, and the history display field 13 are arranged in this order from left to right.

In the name display field 11, a plurality of identification names ("Slot 1" to "Slot 15" in the example of Fig. 2) uniquely assigned to a plurality of substrates are displayed so as to be arranged in the vertical direction. The plurality of identification names are arranged in the order of the processing start time of the corresponding substrate, and the faster the processing start time, the corresponding identification name is located at the top. Accordingly, the example of FIG. 2 means that the processing of the substrate corresponding to "Slot 1" is started first, and the processing of the substrate corresponding to "Slot 15" is started last.

In the time display field 12, the start times of the plurality of substrates are displayed next to the identification names of the corresponding plurality of substrates in the name display field 11 so as to be arranged in the vertical direction. In the history display field 13, the start of the corresponding plurality of substrates in the time display field 12 so that a plurality of band-shaped indicators 14 respectively indicating processing times of the plurality of substrates are arranged in the vertical direction. It is displayed next to the time. Each of the strip-shaped indicators 14 extends in the left-right direction, and the left and right ends of the strip-shaped indicator 14 represent the processing start time and the processing end time of the corresponding substrate, respectively.

3 is a partially enlarged view of the history display field 13 of FIG. 2. As shown in Fig. 3, each strip-shaped index 14 includes a plurality of rectangular element indexes 15 each indicating a plurality of processing times of a substrate by a plurality of processing chambers 3 (Fig. 1). . The left end and the right end of each element index 15 indicate the start time and end time of processing of the substrate by the corresponding treatment chamber 3, respectively. Above the plurality of strip-shaped indicators 14, the processing time of the substrate corresponding to the position of the strip-shaped indicator 14 may be displayed. In the lower part of the element index 15, based on the schedule information 2a (FIG. 1), a rectangular time index 15a indicating the required time for processing by the corresponding processing chamber 3 is displayed.

On the upper part of each element index 15, the name of the corresponding processing chamber 3 ("processing chamber C" to "processing chamber J" in the example of FIG. 3) is displayed. The name of the processing chamber 3 indicates the type of the processing chamber 3. A plurality of processing chambers 3 of the same name may be provided. In addition, in the time index 15a, the names of the processes performed by the corresponding processing chamber 3 ("process C" to "process J" in the example of FIG. 3) are displayed. The name of the treatment indicates the type of treatment. When the name of the processing chamber 3 or the name of the processing does not fall within the display area in the element index 15 or in the time index 15a, the name of the processing chamber 3 or a part or all of the name of the processing is displayed. Omitted.

In the following description, each of the plurality of element indicators 15 is simply referred to as an element. In each of the strip-shaped indexes 14, elements corresponding to the processing chamber 3 that perform the same type of processing are displayed in the same color. For example, in "Process Room E" and "Process Room H", the same type of treatment is performed on the substrate, and in "Process Room F" and "Process Room I", the same type of treatment is performed on the substrate. For this reason, elements respectively corresponding to "process room F" and "process room I" are displayed in the same color, and elements respectively corresponding to "process room F" and "process room I" are displayed in different and identical colors. In addition, in the example of FIG. 3, the color is represented by a dot pattern or a hatching pattern.

The server 200 in Fig. 1 is constituted by a large-capacity storage device. The history information 2b and the history display data 2c generated by each of the substrate processing apparatuses 100 are transmitted to and stored in the server 200 via the network 510. In this example, since the capacity of the storage unit 2 of the substrate processing apparatus 100 is small, the generated history information 2b and the history display data 2c are sequentially updated, and a relatively short period of time (for example, 1 Over a week). In contrast, the history information 2b and the history display data 2c stored in the server 200 are held over a long period (for example, 6 months or longer).

(2) Configuration of substrate processing management device

4 is a block diagram showing the configuration of the substrate processing management apparatus 300 of FIG. 1. As shown in FIG. 4, the substrate processing management apparatus 300 includes a control unit 310, a storage unit 320, an operation unit 330, a display unit 340, and a communication unit 350. The control unit 310 is configured by a central processing unit (CPU). The storage unit 320 is constituted by, for example, a nonvolatile memory or a hard disk. The substrate processing management program is stored in the storage unit 320.

The operation unit 330 is configured by a keyboard and a pointing device. The pointing device includes a mouse or a joystick. The display unit 340 is constituted by, for example, an LCD (liquid crystal display) panel or an organic EL (electroluminescence) panel. The communication unit 350 is configured by an interface for connecting the substrate processing management apparatus 300 to the network 510.

The control unit 310 includes a data acquisition unit 311, a display control unit 312, an element receiving unit 313, an element determining unit 314, and an auxiliary line determining unit 315. The control unit 310 executes the substrate processing management program stored in the storage unit 320 to determine the data acquisition unit 311, the display control unit 312, the element reception unit 313, the element determination unit 314, and the auxiliary line. The function of the unit 315 is realized.

By operating the operation unit 330, the user can designate the desired history display data 2c to the data acquisition unit 311 from the history display data 2c (Figure 1) stored in the server 200 (Figure 1). have. The data acquisition unit 311 acquires the history display data 2c specified by the user from the server 200 via the communication unit 350 and the network 510. The display control unit 312 controls the display unit 340 to display the history chart 10 (FIG. 2) based on the history display data 2c acquired by the data acquisition unit 311.

A user can designate a desired element of the history chart 10 displayed on the display unit 340 by manipulating the manipulation unit 330. The element accepting unit 313 accepts designation of an element by a user. In addition, the user can instruct the determination of element designation by operating the operation unit 330. The element determination unit 314 accepts an instruction for a decision by the user.

The auxiliary line determining unit 315 determines an auxiliary line based on the element received by the element accepting unit 313 in response to acceptance of the determination by the element determining unit 314. The display control unit 312 controls the display unit 340 to display the auxiliary line determined by the auxiliary line determination unit 315 on the history chart 10.

(3) Operation of the substrate processing management device

5 is a diagram for describing an example of the operation of the substrate processing management apparatus 300. As shown in FIG. 5, a history chart 10 based on the history display data 2c (FIG. 1) acquired by the data acquisition unit 311 (FIG. 4) is displayed on the display unit 340. In FIG. 5, a part of the history display column 13 (FIG. 2) of the history chart 10 is enlarged and displayed. The same applies to Fig. 6 described later.

By operating the operation unit 330, the user can designate an element corresponding to a desired processing on a desired substrate from among a plurality of elements of the history chart 10 displayed on the display unit 340. The element accepting unit 313 (FIG. 4) accepts an element designated by the user as the first element 15A. The frame of the received first element 15A is highlighted by a thick line.

After designation of the element, the user can further manipulate the operation unit 330 to designate an element corresponding to a desired process on another desired substrate from among a plurality of elements of the history chart 10 displayed on the display unit 340. . The element accepting unit 313 accepts the element designated by the user as the second element 15B. The frame of the received second element 15B is highlighted by a thick line.

After designation of the two elements, the user can instruct the determination of designation of the elements by further operating the operation unit 330. In addition, if the user does not instruct the decision to designate the element at this point, the user can further designate the element. Details will be described later. When two elements are designated and the element determination unit 314 (FIG. 4) accepts the instruction of the determination, the auxiliary line determination unit 315 is configured to first and second elements 15A and 15B. And second auxiliary lines L1 and L2 are determined.

Specifically, the auxiliary line determination unit 315 determines predetermined points P1 and P2 at the left and right ends of the first element 15A, respectively. In addition, the auxiliary line determination unit 315 determines predetermined points P3 and P4 at the left and right ends of the second element 15B, respectively. Here, in this example, the predetermined points at the left and right ends of each element are the midpoints in the vertical direction. Thereafter, the auxiliary line determination unit 315 determines a straight line passing through the points P1 and P3 as the first auxiliary line L1, and the straight line passing through the points P2 and P4 is a second auxiliary line ( It is determined as L2). The determined first and second auxiliary lines L1 and L2 are displayed on the display unit 340 so as to overlap the history chart 10.

In the example of Fig. 5, the user can determine whether the substrate has stagnated in the processing chamber 3 (Fig. 1) corresponding to the first and second elements 15A and 15B. When the substrate is processed without stagnating, the first and second auxiliary lines L1 and L2 become substantially parallel. Accordingly, the user can easily recognize that the substrate has been normally processed by visually recognizing that the first and second auxiliary lines L1 and L2 are parallel.

In addition, when the substrate is processed without congestion, the second auxiliary line L2 is a plurality of elements identical to those of the first and second elements 15A, 15B (in the example of FIG. 5, ``processing chamber E'' is shown). It passes near the midpoint in the vertical direction at the right end of the element). Therefore, the user easily recognizes that the substrate has been normally processed by visually recognizing that the second auxiliary line L2 passes through predetermined points of the same plurality of elements as the first and second elements 15A and 15B. can do.

On the other hand, when the substrate is stagnant in either of the processing chambers 3 corresponding to the first and second elements 15A and 15B, the first and second auxiliary lines L1 and L2 become non-parallel. Accordingly, the user can easily recognize that there is a possibility that an abnormality may have occurred in the processing chamber 3 or the substrate by visually recognizing the parallelism of the first and second auxiliary lines L1 and L2.

In addition, when the substrate is stagnant in either of the processing chambers 3 corresponding to the same elements as the first and second elements 15A and 15B, the second auxiliary line L2 corresponds to the processing chamber 3. It does not pass through a predetermined point in the element to be. Therefore, the user can easily recognize that there is a possibility that an abnormality may have occurred in the processing chamber 3 or the substrate corresponding to the element by visually recognizing an element in which the second auxiliary line L2 does not pass through a predetermined point. have.

6 is a diagram for explaining another example of the operation of the substrate processing management apparatus 300. After designation of the two elements, the user can further designate the elements as shown in Fig. 6 by operating the operation unit 330 without instructing to determine the designation of the elements. In the example of Fig. 6, the designated element corresponds to a process performed immediately after the process corresponding to the first element 15A.

The element accepting unit 313 accepts an element further designated by the user as the third element 15C. The frame of the received third element 15C is highlighted by a thick line. In a state in which three elements are designated, when the element determination unit 314 accepts the instruction of the determination, the auxiliary line determination unit 315 is configured to first and third elements based on the first to third elements 15A to 15C. Determine the auxiliary lines (L1, L3).

Specifically, in addition to the points P1 and P3 and the first auxiliary line L1 in the example of FIG. 5, the auxiliary line determination unit 315 is provided at the right end of the third element 15C. Further determine the point P5. After that, the auxiliary line determination unit 315 determines a straight line passing through the point P5 and parallel to the first auxiliary line L1 as the third auxiliary line L3. The determined first and third auxiliary lines L1 and L3 are displayed on the display unit 340 so as to overlap the history chart 10.

In the example of FIG. 6, the user can determine whether the substrate is stagnant in any one of the processing chambers 3 corresponding to the first and third elements 15A and 15C, respectively. When the substrate is processed without congestion, the third auxiliary line L3 is at the right end of a plurality of elements identical to those of the third element 15C (elements representing ``processing chamber F'' in the example of Fig. 6). Passes near the midpoint in the vertical direction of Accordingly, the user can easily recognize that the substrate has been normally processed by visually recognizing that the third auxiliary line L3 passes through predetermined points of the same plurality of elements as the third element 15C.

On the other hand, when the substrate is stagnant in any one of the processing chambers 3 corresponding to the first and third elements 15A and 15C, respectively, the third auxiliary line L3 is the same as the third element 15C. It does not pass through a predetermined point in any one of the plurality of elements. Therefore, by visually recognizing an element in which the third auxiliary line L3 does not pass through a predetermined point, the user can easily recognize that there is a possibility that an abnormality has occurred in the processing chamber 3 or the substrate corresponding to the element. have.

(4) auxiliary line display processing

7 and 8 are flowcharts showing an auxiliary line display process for displaying an auxiliary line on the history chart 10. Hereinafter, an auxiliary line display process by the control unit 310 of the substrate processing management apparatus 300 will be described with reference to the substrate processing management apparatus 300 of FIG. 4 and the flowcharts of FIGS. 7 and 8.

First, the control unit 310 determines whether or not the history display data 2c (Fig. 1) has been designated (step S1). By operating the operation unit 330, the user can designate the desired history display data 2c (Fig. 1) stored in the server 200 (Fig. 1). When the history display data 2c is not designated, the control unit 310 waits until the history display data 2c is designated.

When the history display data 2c is specified in step S1, the control unit 310 acquires the specified history display data 2c from the server 200 via the network 510 (step S2). Further, the control unit 310 causes the display unit 340 to display the history chart 10 (Fig. 2) based on the acquired history display data 2c (step S3).

Next, the control unit 310 determines whether or not an element has been designated (step S4). A user can designate a desired element from the history chart 10 displayed on the display unit 340 by manipulating the operation unit 330. If the element is not designated, the control unit 310 waits until the element is designated. When an element is designated, the control unit 310 accepts the designated element as the first element 15A (Fig. 5) (step S5).

Subsequently, the control unit 310 determines whether or not another element has been designated (step S6). The user can designate other desired elements from the history chart 10 displayed on the display unit 340 by manipulating the operation unit 330. If no other element is designated, the control unit 310 waits until another element is designated. When another element is designated, the control unit 310 accepts the designated other element as the second element 15B (Fig. 5) (step S7).

After that, the control unit 310 determines whether or not the determination of the element has been instructed (step S8). The user can instruct the determination of the element by operating the operation unit 330. When the determination of the element is instructed, the control unit 310 determines the first and second auxiliary lines L1 and L2 (Fig. 5) based on the first and second elements 15A and 15B (step S9). ). Further, the control unit 310 displays the determined first and second auxiliary lines L1 and L2 on the display unit 340 so as to overlap the history chart 10 (step S10), and ends the process.

When the determination of the element is not instructed in step S8, the control unit 310 determines whether or not the element is further designated (step S11). The user can further designate elements from the history chart 10 displayed on the display unit 340 by manipulating the operation unit 330. The element specified here may be the same as or different from any one of the elements already specified.

If no element is further specified in step S11, the control unit 310 returns to the process of step S8. The processing of steps S8 and S11 is repeated until determination of the element is instructed or until the element is further designated. When an element is further designated in step S11, the control unit 310 accepts the designated element as the third element 15C (Fig. 6) (step S12).

After that, the control unit 310 determines whether or not the determination of the element has been instructed (step S13). The user can instruct the determination of the element by operating the operation unit 330. If the determination of the element is not instructed, the control unit 310 waits until the determination of the element is instructed. If the determination of the element is instructed in step S13, the control unit 310 determines the first and third auxiliary lines L1 and L3 (Fig. 6) based on the first to third elements 15A to 15C. (Step S14). Further, the control unit 310 displays the determined first and third auxiliary lines L1 and L3 on the display unit 340 so as to overlap the history chart 10 (step S15), and ends the process.

(5) Configuration of substrate processing apparatus

Hereinafter, a detailed configuration of the substrate processing apparatus 100 of FIG. 1 will be described. 9 is a schematic plan view of the substrate processing apparatus 100 of FIG. 1. In the predetermined drawings in Fig. 9 and later, arrows indicating the X, Y and Z directions orthogonal to each other are attached to clarify the positional relationship. The X and Y directions are orthogonal to each other in the horizontal plane, and the Z direction corresponds to the vertical direction.

As shown in Fig. 9, the substrate processing apparatus 100 includes an indexer block 110, a coating block 120, a developing block 130, a cleaning and drying processing block 140A, and a carry-in/out block 140B. . The interface block 140 is constituted by the washing and drying processing block 140A and the carry-in/out block 140B. The exposure apparatus 150 is arranged so as to be adjacent to the carry-in/out block 140B.

The indexer block 110 includes a plurality of carrier placing units 111 and transport units 112. In each of the carrier mounting portions 111, a carrier 113 which accommodates a plurality of substrates W in multiple stages is mounted. In the conveyance part 112, the main controller 1 of FIG. 1, the storage part 2 of FIG. 1, and the conveyance device 115 are provided. The main controller 1 controls various components of the substrate processing apparatus 100. The conveying device 115 conveys the substrate W while holding the substrate W.

The coating block 120 includes an application processing unit 121, a transport unit 122, and a heat treatment unit 123. The coating treatment unit 121 and the heat treatment unit 123 are provided so as to face each other by sandwiching the conveyance unit 122. Between the conveyance part 122 and the indexer block 110, the board|substrate mounting parts PASS1-PASS4 (FIG. 12 mentioned later) on which the board|substrate W is mounted are provided. The conveying unit 122 is provided with conveying apparatuses 127 and 128 (FIG. 12 to be described later) that convey the substrate W.

The developing block 130 includes a developing processing unit 131, a conveying unit 132, and a heat treatment unit 133. The developing processing unit 131 and the heat treatment unit 133 are provided so as to face each other by sandwiching the conveying unit 132. Between the conveyance part 132 and the conveyance part 122, the board|substrate mounting parts PASS5-PASS8 (FIG. 12 mentioned later) on which the board|substrate W is mounted are provided. In the conveyance part 132, conveyance devices 137, 138 (FIG. 12 mentioned later) which convey the board|substrate W are provided.

The washing and drying processing block 140A includes washing and drying processing units 161 and 162 and a conveying unit 163. The washing and drying processing units 161 and 162 are provided so as to face each other with the conveying unit 163 interposed therebetween. Transport devices 141 and 142 are provided in the transport unit 163.

Between the conveyance part 163 and the conveyance part 132, a mounting combined buffer part (P-BF1, P-BF2) (FIG. 12 mentioned later) is provided. The mounting combined buffer units P-BF1 and P-BF2 are configured to accommodate a plurality of substrates W.

Moreover, between the conveyance devices 141 and 142, the board|substrate mounting part PASS9 and the mounting combined cooling part P-CP (FIG. 12 mentioned later) are provided so that it may be adjacent to the carry-in/out block 140B. The mounting combined cooling unit P-CP has a function of cooling the substrate W (eg, a cooling plate). In the mounting combined cooling unit P-CP, the substrate W is cooled to a temperature suitable for exposure processing. The conveyance device 143 is provided in the carry-in/out block 140B. The conveyance device 143 carries in and carries out the board|substrate W to the exposure apparatus 150.

Each of the above conveying devices 115, 127, 128, 137, 138, and 141 to 143 corresponds to the conveying device 4 of FIG. 1. Each of the conveying devices 115, 127, 128, 137, 138, and 141 to 143 is provided with a detection device such as a photoelectric sensor that detects whether or not the substrate W is held. The main controller 1 processes in each processing chamber 3 (FIG. 1) based on the output result of the detection device installed in each of the conveyance devices 115, 127, 128, 137, 138, and 141 to 143. The history information 2b (FIG. 1) indicating the start time and end time, etc. of is acquired.

(6) Coating processing unit and developing processing unit

FIG. 10 is a schematic side view showing the internal configuration of the coating processing unit 121, the developing processing unit 131, and the washing and drying processing unit 161 of FIG. 9. As shown in FIG. 10, in the coating processing unit 121, coating processing chambers 21, 22, 23 and 24 are hierarchically installed. In each of the coating processing chambers 21 to 24, a coating processing unit 129 (spin coater) is provided. In the developing processing unit 131, developing processing chambers 31, 32, 33, and 34 are arranged hierarchically. In each of the developing processing chambers 31 to 34, a developing processing unit 139 (spin developer) is installed.

Each coating processing unit 129 includes a spin chuck 25 for holding the substrate W and a cup 27 provided to cover the periphery of the spin chuck 25. In the example of FIG. 10, two sets of spin chuck 25 and cup 27 are provided in each coating unit 129. The spin chuck 25 is rotationally driven by a drive device (for example, an electric motor) not shown. In addition, as shown in FIG. 9, each coating processing unit 129 is provided with a plurality of processing liquid nozzles 28 for discharging the processing liquid, and a nozzle conveying device 29 for conveying the processing liquid nozzle 28 do.

In the coating processing unit 129, the spin chuck 25 is rotated by a driving device (not shown), and at the same time, one of the processing liquid nozzles 28 among the plurality of processing liquid nozzles 28 is a nozzle conveying device ( It is moved above the substrate W by 29), and the processing liquid is discharged from the processing liquid nozzle 28. Thereby, the processing liquid is applied on the substrate W. Further, the rinse liquid is discharged to the peripheral portion of the substrate W from an edge rinse nozzle (not shown). Thereby, the processing liquid adhering to the periphery of the substrate W is removed.

In the coating processing unit 129 of the coating processing chambers 22 and 24, the processing liquid for an antireflection film is supplied from the processing liquid nozzle 28 to the substrate W. In the coating processing unit 129 of the coating processing chambers 21 and 23, a processing liquid for a resist film is supplied from the processing liquid nozzle 28 to the substrate W.

The developing processing unit 139 includes a spin chuck 35 and a cup 37 similarly to the coating processing unit 129. In addition, as shown in FIG. 9, the developing processing unit 139 includes two developing nozzles 38 for discharging a developer, and a moving device 39 for moving the developing nozzles 38 in the X direction.

In the developing processing unit 139, while the spin chuck 35 is rotated by a driving device (not shown), one developing nozzle 38 moves in the X direction to supply a developer to each substrate W. Then, while the other developing nozzle 38 moves, a developer is supplied to each of the substrates W. In this case, the developing solution is supplied to the substrate W, whereby the substrate W is developed.

The washing and drying processing unit 161 is provided with a plurality of washing and drying processing units SD1 (four in the example of FIG. 10 ). In the cleaning and drying processing unit SD1, cleaning and drying processing of the substrate W before exposure processing are performed. Each of the coating processing chambers 21 to 24, the developing processing chambers 31 to 34, and the washing and drying processing unit SD1 corresponds to the processing chamber 3 of FIG. 1.

(7) Heat treatment part

11 is a schematic side view showing the internal configurations of the heat treatment units 123 and 133 and the washing and drying treatment unit 162 of FIG. 9. As shown in FIG. 11, the heat treatment part 123 has an upper end heat treatment part 101 provided above and a lower end heat treatment part 102 provided below. In the upper heat treatment unit 101 and the lower heat treatment unit 102, a plurality of heat treatment units (PHP), a plurality of adhesion strengthening treatment units (PAHP), and a plurality of cooling units (CP) are provided.

A local controller 124 is installed at the top of the heat treatment unit 123. The local controller 124 controls the operation of the coating processing unit 121, the conveying unit 122, and the heat treatment unit 123 based on a command from the main controller 1 in FIG. 9.

In the heat treatment unit PHP, heat treatment and cooling treatment of the substrate W are performed. In the adhesion strengthening processing unit PAHP, adhesion strengthening treatment for improving the adhesion between the substrate W and the antireflection film is performed. Specifically, in the adhesion strengthening processing unit PAHP, an adhesion strengthening agent such as HMDS (hexamethyldisilazane) is applied to the substrate W, and a heat treatment is performed on the substrate W. In the cooling unit CP, the cooling process of the board|substrate W is performed.

The heat treatment part 133 has an upper heat treatment part 103 installed above and a lower heat treatment part 104 installed below. The upper heat treatment part 103 and the lower heat treatment part 104 are provided with a cooling unit CP, a plurality of heat treatment units PHP, and an edge exposure part EEW. The heat treatment unit PHP of the upper heat treatment part 103 and the lower heat treatment part 104 is configured to be able to carry the substrate W from the cleaning and drying treatment block 140A.

A local controller 134 is installed at the top of the heat treatment unit 133. The local controller 134 controls the operation of the developing processing unit 131, the conveying unit 132, and the heat treatment unit 133 based on a command from the main controller 1 in FIG. 9.

In the edge exposed portion EEW, exposure processing (edge exposure processing) of the peripheral portion of the substrate W is performed. By performing the edge exposure treatment on the substrate W, the resist film on the periphery of the substrate W is removed during the subsequent development treatment. Thereby, in the case where the peripheral portion of the substrate W comes into contact with another portion after the development treatment, the resist film on the peripheral portion of the substrate W is prevented from peeling off and forming particles.

The washing and drying processing unit 162 is provided with a plurality (five in this example) of washing and drying processing units SD2. In the cleaning drying processing unit SD2, cleaning and drying processing of the substrate W after exposure processing is performed. Each of the heat treatment unit (PHP), the adhesion strengthening treatment unit (PAHP), the cooling unit (CP), the edge exposure unit (EEW), and the washing and drying treatment unit SD2 correspond to the treatment chamber 3 of FIG. 1. .

(8) Transfer section

12 is a schematic side view showing the internal configuration of the conveyance units 122, 132, 163. As shown in FIG. 12, the conveyance unit 122 has an upper end conveyance chamber 125 and a lower end conveyance chamber 126. The conveying unit 132 has an upper conveying chamber 135 and a lower conveying chamber 136. A conveying device 127 is installed in the upper conveying chamber 125, and a conveying device 128 is installed in the lower conveying chamber 126. Moreover, a conveyance device 137 is installed in the upper conveyance chamber 135, and a conveyance device 138 is installed in the lower conveyance chamber 136.

Between the conveyance part 112 and the upper conveyance chamber 125, the board|substrate mounting parts PASS1, PASS2 are provided, and between the conveyance part 112 and the lower conveyance chamber 126, the board|substrate mounting part PASS3, PASS4) is installed. Between the upper conveyance chamber 125 and the upper conveyance chamber 135, a board|substrate mounting part (PASS5, PASS6) is provided, and between the lower conveyance chamber 126 and the lower conveyance chamber 136, the substrate placement part ( PASS7, PASS8) are installed.

Between the upper transfer chamber 135 and the transfer unit 163, a mounting combined buffer unit (P-BF1) is provided, and between the lower transfer chamber 136 and the transfer unit 163, a mounting combined buffer unit (P) is provided. -BF2) is installed. In the conveyance part 163, the board|substrate mounting part PASS9 and a plurality of mounting combined cooling parts P-CP are provided so that it may be adjacent to the carry-in/out block 140B. Each of the substrate mounting portions PASS1 to PASS9, the mounting combined buffer units P-BF1 and P-BF2, and the mounting combined cooling unit P-CP correspond to the processing chamber 3 of FIG. 1.

The mounting combined buffer unit P-BF1 is configured to enable the carrying in and carrying out of the substrate W by the transfer device 137 and the transfer device 141 (FIG. 9). The mounting and use buffer unit P-BF2 is configured to enable carrying in and carrying out of the substrate W by the transfer device 138 and the transfer device 141 (FIG. 9 ). The board|substrate mounting part PASS9 is comprised so that carrying-in and carrying-out of the board|substrate W by the transfer device 142 (FIG. 9) and the transfer device 143 is possible. The mounting combined cooling unit (P-CP) is configured to be capable of carrying in and carrying out the substrate W by the transfer device 141 and the transfer device 143.

The conveyance device 127 supplies the substrate W to the coating processing chambers 21 and 22 (FIG. 10), the substrate mounting portions PASS1, PASS2, PASS5, PASS6, and the upper end heat treatment portion 101 (FIG. 11). Receiving is carried out. The conveyance device 128 supplies the substrate W to the coating processing chambers 23 and 24 (FIG. 10), the substrate mounting portions PASS3, PASS4, PASS7, PASS8, and the lower end heat treatment portion 102 (FIG. 11). Conduct receiving.

The conveyance device 137 is for the developing processing chambers 31 and 32 (FIG. 10), the substrate placing portions PASS5, PASS6, the placement combined buffer portion P-BF1, and the upper end heat treatment portion 103 (FIG. 11). The substrate W is exchanged. The conveyance device 138 is for the developing processing chambers 33 and 34 (FIG. 10), the substrate placing portions PASS7, PASS8, the placement combined buffer portion P-BF2, and the lower end heat treatment portion 104 (FIG. 11). The substrate W is exchanged.

(9) substrate treatment

The substrate processing will be described with reference to FIGS. 9 to 12. In the carrier placing portion 111 (FIG. 9) of the indexer block 110, a carrier 113 in which an unprocessed substrate W is accommodated is placed. The conveyance device 115 conveys the unprocessed board|substrate W from the carrier 113 to the board|substrate mounting parts PASS1, PASS3 (FIG. 12). Moreover, the conveyance apparatus 115 conveys the processed board|substrate W placed on the board|substrate mounting parts PASS2, PASS4 (FIG. 12) to the carrier 113.

In the coating block 120, the transfer device 127 (FIG. 12) adheres the unprocessed substrate W placed on the substrate placement unit PASS1 to a tightly reinforced processing unit PAHP (FIG. 11), and a cooling unit ( CP) (Fig. 11) and the coating treatment chamber 22 (Fig. 10). Next, the conveyance device 127 transfers the substrate W of the coating processing chamber 22 to a heat treatment unit (PHP) (Fig. 11), a cooling unit (CP) (Fig. 11), and a coating treatment chamber 21 (Fig. 10). ), the heat treatment unit (PHP) (Fig. 11), and the substrate mounting unit (PASS5) (Fig. 12).

In this case, in the adhesion strengthening processing unit PAHP, after the adhesion strengthening treatment is performed on the substrate W, in the cooling unit CP, the substrate W is cooled to a temperature suitable for formation of the antireflection film. Next, in the coating processing chamber 22, an antireflection film is formed on the substrate W by the coating processing unit 129 (FIG. 10). Next, in the heat treatment unit PHP, after the heat treatment of the substrate W is performed, in the cooling unit CP, the substrate W is cooled to a temperature suitable for formation of a resist film. Next, in the coating processing chamber 21, a resist film is formed on the substrate W by the coating processing unit 129 (FIG. 10). Thereafter, in the heat treatment unit PHP, heat treatment of the substrate W is performed, and the substrate W is placed on the substrate mounting portion PASS5.

Moreover, the conveyance device 127 conveys the board|substrate W after the development process placed on the board|substrate mounting part PASS6 (FIG. 12) to the board|substrate mounting part PASS2 (FIG. 12).

The conveyance device 128 (FIG. 12) adheres to the unprocessed substrate W placed on the substrate placement unit PASS3, the adhesion strengthening processing unit PAHP (FIG. 11), the cooling unit CP (FIG. 11) and coating It is conveyed in the order of the processing chamber 24 (FIG. 10). Next, the transfer device 128 transfers the substrate W of the coating processing chamber 24 to a heat treatment unit (PHP) (Fig. 11), a cooling unit (CP) (Fig. 11), and a coating treatment chamber 23 (Fig. 10). ), the heat treatment unit (PHP) (Fig. 11), and the substrate mounting unit (PASS7) (Fig. 12).

Moreover, the conveyance apparatus 128 (FIG. 12) conveys the board|substrate W after the development process placed on the board|substrate placing part PASS8 (FIG. 12) to the board|substrate placing part PASS4 (FIG. 12). The processing contents of the substrate W in the coating processing chambers 23 and 24 (FIG. 10) and the lower heat treatment section 102 (FIG. 11) are as follows: the coating processing chambers 21 and 22 (FIG. 10) and the top heat treatment It is the same as the processing contents of the substrate W in the unit 101 (Fig. 11), respectively.

In the developing block 130, the transfer device 137 (FIG. 12) uses both the edge exposure portion EEW (FIG. 11) and the substrate W after formation of the resist film placed on the substrate placing portion PASS5. It conveys in the order of the buffer part P-BF1 (FIG. 12). In this case, in the edge exposure part EEW, an edge exposure process is performed on the board|substrate W. The board|substrate W after the edge exposure process is mounted on the mounting combined use buffer part P-BF1.

In addition, the transfer device 137 (FIG. 12) takes out the substrate W after exposure treatment and heat treatment from the heat treatment unit PHP (FIG. 11) adjacent to the cleaning and drying treatment block 140A. The transfer device 137 transfers the substrate W to a cooling unit CP (Fig. 11), a development chamber 31, 32 (Fig. 10), a heat treatment unit (PHP) (Fig. 11), and a substrate It conveys in the order of the subsidiary PASS6 (FIG. 12).

In this case, in the cooling unit CP, after the substrate W is cooled to a temperature suitable for development, in either of the developing chambers 31 and 32, the substrate W is ) Development treatment is performed. Thereafter, in the heat treatment unit PHP, heat treatment of the substrate W is performed, and the substrate W is placed on the substrate mounting portion PASS6.

The transfer device 138 (FIG. 12) includes an edge exposure portion EEW (FIG. 11) and a combined buffer portion P-BF2 (P-BF2) of the substrate W placed on the substrate placing portion PASS7 after formation of the resist film. It is conveyed in the order of FIG. 12).

Further, the transfer device 138 (FIG. 12) takes out the substrate W after exposure treatment and heat treatment from the heat treatment unit PHP (FIG. 11) adjacent to the interface block 140. The transfer device 138 transfers the substrate W to a cooling unit CP (Fig. 11), a development chamber 33, 34 (Fig. 10), a heat treatment unit (PHP) (Fig. 11), and a substrate It is conveyed in the order of the part PASS8 (FIG. 12). The processing contents of the substrate W in the developing chambers 33 and 34 and the lower heat treatment unit 104 are as follows. It is the same as each of the processing contents.

In the cleaning and drying processing block 140A, the transfer device 141 (FIG. 9) cleans the substrate W placed on the placement combined buffer unit (P-BF1, P-BF2) (FIG. 12). It conveys in the order of (SD1) (FIG. 10) and mounting combined cooling part (P-CP) (FIG. 12). In this case, after cleaning and drying the substrate W in the cleaning and drying processing unit SD1, the exposure processing by the exposure apparatus 150 (Fig. 9) in the mounting combined cooling unit P-CP The substrate W is cooled to an appropriate temperature.

The conveyance device 142 (FIG. 9) cleans the substrate W after exposure treatment placed on the substrate placing portion PASS9 (FIG. 12), and the drying processing unit SD2 (FIG. 11) and the upper end heat treatment portion 103 Or, it is conveyed in the order of the heat treatment unit (PHP) (FIG. 11) of the lower heat treatment part 104. In this case, after the substrate W is cleaned and dried in the cleaning and drying processing unit SD2, a post-exposure bake (PEB) processing is performed in the heat treatment unit PHP.

In the carry-in/out block 140B, the transfer device 143 (FIG. 9) transfers the substrate W before exposure treatment placed on the mounting combined cooling unit P-CP (FIG. 12) to the exposure apparatus 150. Return. Moreover, the conveyance apparatus 143 (FIG. 9) takes out the substrate W after exposure processing from the exposure apparatus 150, and conveys the substrate W to the substrate mounting part PASS9 (FIG. 12).

(10) effect

In the substrate processing management apparatus 300 according to the present embodiment, the user can designate the first and second elements 15A and 15B on the history chart 10 displayed on the display unit 340. According to this configuration, the first auxiliary line L1 passes through a portion of the plurality of substrates W indicating a processing start time of the elements corresponding to the first and second elements 15A and 15B. For this reason, the user visually recognizes whether or not the first auxiliary line L1 passes through a specific portion of the plurality of elements, so that the processing corresponding to the first and second elements 15A and 15B is performed on several substrates ( It can be easily specified that the substrate W has been stagnant before being applied to W).

On the other hand, the second auxiliary line L2 passes through a portion of the plurality of substrates W indicating the processing end time of the elements corresponding to the first and second elements 15A and 15B. For this reason, the user visually recognizes whether or not the second auxiliary line L2 passes through a specific portion of a plurality of elements, so that the processing corresponding to the first and second elements 15A and 15B is performed on several substrates ( It can be easily specified that the substrate W was stagnant before or after the implementation of W).

In addition, when the substrate W is processed by the substrate processing apparatus 100 without being stagnant, the first and second auxiliary lines L1 and L2 become parallel. Accordingly, the user can easily recognize that there is a possibility that an abnormality may have occurred in the processing chamber 3 or the substrate W by visually recognizing the parallelism of the first and second auxiliary lines L1 and L2.

The user can further designate the third element 15C on the history chart 10 displayed on the display unit 340. According to this configuration, when the substrate W is processed by the substrate processing apparatus 100 without being stagnated, the third auxiliary line L3 is the third element 15C in the plurality of substrates W. Passes through the part indicating the processing end time of the element corresponding to. On the other hand, when the substrate W is stagnant in the processing prior to the processing corresponding to the third element 15C, the third auxiliary line L3 is the third element 15C in any one of the substrates W. ) Does not pass through a specific part of the element corresponding to.

Accordingly, the user visually recognizes whether or not the first and third auxiliary lines L1 and L3 pass through a specific portion of a plurality of elements, so that the processing of the substrate W by the substrate processing apparatus 100 is stagnant. It can be easily recognized whether or not. In addition, the user can more easily determine whether the substrate W has stagnated between the processing corresponding to the first and second elements 15A and 15B and the processing corresponding to the third element 15C. .

When the above two first and second elements 15A and 15B, or three first to third elements 15A to 15C are properly designated, the processing of the substrate W is stagnant in any one of the treatments. You can specify whether or not. As a result, an abnormality in the processing by the substrate processing apparatus 100 can be easily specified.

(11) Other embodiments

(a) In the above embodiment, when the first and second elements 15A and 15B are specified, both of the first and second auxiliary lines L1 and L2 are displayed on the history chart 10, but , The present invention is not limited to this. When the first and second elements 15A and 15B are designated, either of the first and second auxiliary lines L1 and L2 may be displayed on the history chart 10.

(b) In the above embodiment, when the first to third elements 15A to 15C are specified, the first and third auxiliary lines L1 and L3 are displayed on the history chart 10 and the second The auxiliary line L2 is not displayed on the history chart 10, but the present invention is not limited thereto. When the first to third elements 15A to 15C are designated, a second auxiliary line L2 may be displayed on the history chart 10 in addition to the first and third auxiliary lines L1 and L3.

(c) In the above embodiment, the first auxiliary line L1 passes through the portion indicating the processing start time of the elements corresponding to the first and second elements 15A and 15B, but the present invention is Not limited. The first auxiliary line L1 may pass through a portion indicating a predetermined time of an element corresponding to the first and second elements 15A and 15B.

Similarly, the second auxiliary line L2 passes through a portion indicating the processing end time of the elements corresponding to the first and second elements 15A and 15B, but the present invention is not limited thereto. The second auxiliary line L2 may pass through a portion indicating a predetermined time of the element corresponding to the first and second elements 15A and 15B.

The third auxiliary line L3 passes through a portion indicating the processing end time of the element corresponding to the third element 15C, but the present invention is not limited to this. The third auxiliary line L3 may pass through a portion indicating the processing start time of the element corresponding to the third element 15C, or may pass through a portion indicating another predetermined time.

(d) In the above embodiment, the substrate processing management apparatus 300 acquires the history display data 2c from the server 200, but the present invention is not limited to this. The substrate processing management apparatus 300 may acquire the history display data 2c from the substrate processing apparatus 100. Alternatively, the substrate processing management device 300 acquires the schedule information 2a and the history information 2b from the substrate processing device 100 or the server 200, and the acquired schedule information 2a and the history information 2b ), you may generate the history display data 2c.

(12) Correspondence relationship between each component of the claim and each element of the embodiment

Hereinafter, examples of correspondence between each component of the claims and each of the embodiments will be described, but the present invention is not limited to the following examples.

In the above embodiment, the substrate W is an example of a substrate, the substrate processing device 100 is an example of a substrate processing device, and the substrate processing management device 300 is an example of a substrate processing management device, and history display data (2c) is an example of history display data. The data acquisition unit 311 is an example of a data acquisition unit, the history chart 10 is an example of a history chart, the display unit 340 is an example of a display unit, and the operation unit 330 is an example of an operation unit.

The display control unit 312 is an example of the display control unit, the belt-shaped index 14 is an example of the belt-shaped index, the element index 15 is an example of the element index, and the first to third elements 15A to 15C are These are examples of indicators of the first to third elements, respectively. The first and second auxiliary lines L1 and L2 are examples of basic auxiliary lines, the first to third auxiliary lines L1 to L3 are examples of the first to third auxiliary lines, respectively, and the control unit 310 is This is an example of a processing device.

As each element of the claim, various other elements having the configuration or function described in the claim may be used.

The present invention can be effectively used for management of various substrate processing.

Claims (7)

A substrate processing management device that manages processing in a substrate processing device that sequentially performs processing on each of a plurality of substrates, comprising:
A data acquisition unit for acquiring history display data for displaying a history of processing of a plurality of substrates in the substrate processing apparatus;
A display unit that displays a history of processing of a plurality of substrates as a history chart based on the history display data acquired by the data acquisition unit;
An operation unit operated by a user to designate an arbitrary part of the history chart displayed by the display unit,
And a display control unit for controlling display by the display unit based on a portion designated by the operation unit,
The history chart includes a plurality of band-shaped indices each extending in a first direction corresponding to the time axis and each indicating a history of processing for a plurality of substrates, and the plurality of band-shaped indices are the start of the first processing. They are arranged in a second direction intersecting with the first direction in order, and each strip-shaped index includes an element index corresponding to each process, and each element index has a length corresponding to the time required for processing. It is also located in the corresponding visual range on the time axis,
When a plurality of element indices corresponding to different substrates and corresponding to the same process are designated as first and second element indices by the operation unit, the display control unit is A substrate processing management apparatus for controlling the display unit to display a basic auxiliary line passing through a corresponding portion on the history chart. The method according to claim 1,
The portions corresponding to each other of the first and second element indicators include portions indicating a start time of processing in the first and second element indicators, and the basic auxiliary line is the first and second element indicators And a first auxiliary line passing through a portion indicating the start time of the substrate. The method according to claim 1 or 2,
The portions corresponding to each other of the first and second element indicators include a portion indicating an end time of processing in the first and second element indicators, and the basic auxiliary line is the first and second element indicators And a second auxiliary line passing through a portion indicating the end time of the substrate processing management apparatus. The method according to claim 1 or 2,
The display control unit passes through a specific portion of the designated third element index when an arbitrary element index among a plurality of element indexes corresponding to the plurality of substrates is further designated as a third element index by the operation unit, and A substrate processing management apparatus for controlling the display unit to display a third auxiliary line parallel to the basic auxiliary line on the history chart. The method of claim 4,
The substrate processing management apparatus, wherein the specific portion in the third element index includes a portion indicating a start time of processing or a portion indicating an end time of processing in the third element index. As a substrate processing management method for managing processing in a substrate processing apparatus that sequentially performs processing on each of a plurality of substrates,
Acquiring history display data for displaying a history of processing of a plurality of substrates in the substrate processing apparatus;
Displaying the processing history of the plurality of substrates as a history chart on the display unit based on the acquired history display data;
Accepting designation of an arbitrary part of the history chart displayed by the display unit,
And displaying a basic auxiliary line on the display unit based on the received portion,
The history chart includes a plurality of band-shaped indices each extending in a first direction corresponding to the time axis and each indicating a history of processing for a plurality of substrates, and the plurality of band-shaped indices are the start of the first processing. They are arranged in a second direction intersecting with the first direction in order, and each strip-shaped index includes an element index corresponding to each process, and each element index has a length corresponding to the time required for processing. It is also located in the corresponding visual range on the time axis,
The step of displaying the basic auxiliary line on the display unit is, when a plurality of element indices corresponding to different substrates and corresponding to the same process as an arbitrary part of the history chart are accepted as the first and second element indices. And displaying on the history chart of the display unit a basic auxiliary line passing through corresponding portions of the indented first and second element indicators. A substrate processing management program recorded on a recording medium capable of performing management of processing in a substrate processing apparatus sequentially performing processing on each of a plurality of substrates by the processing apparatus,
A process of acquiring history display data for displaying a history of processing of a plurality of substrates in the substrate processing apparatus;
A process of displaying the history of processing of a plurality of substrates on the display unit as a history chart based on the acquired history display data;
A process of accepting designation of an arbitrary part of the history chart displayed by the display unit,
Processing of displaying the basic auxiliary line on the display unit based on the received part,
Cause the processing device to execute,
The history chart includes a plurality of band-shaped indices each extending in a first direction corresponding to a time axis and each indicating a history of processing for a plurality of substrates, and the plurality of band-shaped indices is the start of the first processing. They are arranged in a second direction intersecting with the first direction in order, and each strip-shaped index includes an element index corresponding to each process, and each element index has a length corresponding to the time required for processing. It is also located in the corresponding visual range on the time axis,
The processing of displaying the basic auxiliary line on the display unit is received when a plurality of element indices corresponding to different substrates and corresponding to the same processing as an arbitrary part of the history chart are accepted as first and second element indices. And displaying a basic auxiliary line passing through corresponding portions of the entered first and second element indicators on the history chart of the display unit.

Images