JP5005720B2 - Substrate processing apparatus control method and substrate processing apparatus - Google Patents

Description

  The present invention relates to a method for controlling a substrate processing apparatus and a substrate processing apparatus.

  For example, a photolithography process of a substrate in a semiconductor device manufacturing process is usually performed using a coating and developing apparatus. The coating and developing processing apparatus is provided in the main body adjacent to the loader / unloader unit for loading and unloading the substrate, a processing unit for performing a plurality of processes such as resist coating processing, development processing, and heat treatment. An interface unit for transferring the substrate to the exposure apparatus is provided, and each of these units is provided with a transport unit for transporting the substrate within each unit or between adjacent units.

  In recent years, there has been proposed a coating and developing apparatus provided with an inspection unit for inspecting the film thickness, line width, and the like of a substrate after processing (see, for example, Patent Document 1). According to this coating and developing apparatus, it is possible to immediately inspect the processed substrate and detect substrate processing defects and the like at an early stage.

  2. Description of the Related Art Conventionally, a substrate processing flow executed in a coating and developing treatment apparatus is executed by a control unit in the coating and developing treatment apparatus, for example. The control unit of the conventional coating and developing processing apparatus without the above-described inspection unit transfers the substrate carried from the loader / unloader unit to the processing unit, processes it, and returns the processed substrate to the loader / unloader unit. The flow was set. In the control unit of the coating and developing treatment apparatus provided with the above-described inspection unit, the inspection flow in the inspection unit is incorporated into the conventional flow, that is, the substrate carried from the loader / unloader unit is transferred to the processing unit for processing. Then, the substrate selected from the substrates that have been processed is inspected by the inspection unit, and then all the substrates are returned to the loader / unloader unit. For this reason, when the substrate processed by the coating and developing apparatus is carried into the loader / unloader unit, the substrate is always transferred to the processing unit and processed, and then selectively inspected by the inspection unit.

  By the way, at the time of starting up the coating and developing treatment apparatus, it is necessary to perform adjustment work for adjusting various settings of each processing unit in the processing section and evaluation work for evaluating the accuracy of the inspection section. The adjustment operation of the processing unit and the evaluation operation of the inspection unit must be performed independently to eliminate external factors. However, in the coating and developing treatment apparatus provided with the above-described inspection unit, when the substrate processing flow is executed, the substrate is always passed through the processing unit, and disturbance is applied to the substrate. could not. For this reason, when carrying out the evaluation work of the inspection unit, a dedicated evaluation unit having a mechanism for directly carrying in / out the substrate with respect to the inspection unit is separately provided adjacent to the inspection unit, and the substrate from the evaluation unit to the inspection unit It was done by carrying in and out. Therefore, a dedicated evaluation unit is required for the start-up operation of the coating and developing treatment apparatus. For example, for the board manufacturer, the cost for purchasing and maintaining the evaluation unit is a burden, and the apparatus manufacturer and the inspection are required. The equipment manufacturer was burdened with the development cost and development effort of the evaluation unit.

  In addition, when the inspection unit is being evaluated using a dedicated evaluation unit, the adjustment of the processing unit that is actually performed by flowing the substrate cannot be performed. Thus, the evaluation work of the inspection section and the investigation work of the processing section cannot be performed at the same time, and it takes a long time to start up the coating and developing treatment apparatus.

  Further, when the substrate processing is performed in the coating and developing apparatus, the substrate is often inspected at a rate of one per predetermined number, and the inspection unit is often empty. Therefore, it is desired to improve the operating rate of the inspection unit and use the inspection unit efficiently.

JP 2000-223401 A

  The present invention has been made in view of such points, and in a substrate processing apparatus such as a coating and developing processing apparatus provided with an inspection unit, the time required for starting the apparatus is shortened, the cost is reduced, and further inspection is performed. It is an object of the present invention to provide a substrate processing apparatus control method and a substrate processing apparatus that can improve the operation rate of a section.

In order to achieve the above object, the present invention has a loading / unloading unit for loading / unloading a substrate, a processing unit for processing the substrate, and an inspection unit for inspecting the substrate, and the substrate is interposed between these units. A method for controlling a substrate processing apparatus configured to be transported, wherein a substrate loaded in the loading / unloading unit is transported to the processing unit and processed, and loaded into the loading / unloading unit. were run and test flow of the substrate the substrate is inspected transported to the inspection unit, when the processing flow of the substrate is finished, when the inspection of another substrate by the measurement part is not performed, the When the substrate processing flow is completed, the substrate is transported to the inspection unit for inspection, and when the substrate processing flow is completed, when the inspection unit is inspecting another substrate, The substrate after the processing flow is returned to the loading / unloading section. The features.

According to the present invention, since the run inspection flow and processing flow of the substrate, for example, at the time of start-up of the substrate processing apparatus to perform the inspection flow of the substrate, the substrate directly for the carried-in example evaluated the transfer portion The inspection can be executed by sending it to the inspection unit. Since the inspection unit can be evaluated based on the result of the inspection, the conventional dedicated evaluation unit is not required, and the cost related to the evaluation unit can be reduced. In addition, the inspection flow and the processing flow of the substrate can be performed simultaneously, and the evaluation operation of the inspection unit and the adjustment operation of the processing unit can be performed simultaneously, so that the time required for starting up the substrate processing apparatus can be shortened. Moreover, since only the inspection unit of the substrate processing apparatus can be used alone, the availability of the inspection unit can be utilized to improve the operating rate of the inspection unit.

  You may make it perform the test | inspection flow of the said board | substrate with respect to the board | substrate which the process flow of the said board | substrate completed and returned to the said carrying in / out part.

  A predetermined inspection unit may be selected from a plurality of inspection units provided in the inspection unit, and the substrate may be transported to the selected inspection unit for inspection. In such a case, for example, necessary inspections can be freely selected for each substrate.

The present invention has a loading / unloading unit for loading / unloading a substrate, a processing unit for processing the substrate, and an inspection unit for inspecting the substrate, and the substrate configured to be able to transport the substrate between these units A processing apparatus, which is a processing flow of a substrate for transporting and processing a substrate carried into the carry-in / out unit to the processing unit, and a substrate carried into the carry-in / out unit to the inspection unit for inspection. an inspection flow substrate has executable control unit, wherein, when the processing flow of the substrate is finished, when the inspection of another substrate by the measurement part is not performed, the substrate When the processing flow of the substrate is transported to the inspection unit and inspected, and when the processing flow of the substrate is completed, when the inspection unit is inspecting another substrate, the processing of the substrate Returning the substrate after the flow to the loading / unloading unit, That.

According to the present invention, since the inspection flow and processing flow of the substrate can perform, for example, at the time of start-up of the substrate processing apparatus to perform the inspection flow of the substrate, the substrate directly for the carried-in example evaluated the transfer portion The inspection can be executed by sending it to the inspection unit. Since the inspection unit can be evaluated based on the result of the inspection, the conventional dedicated evaluation unit is not required, and the cost related to the evaluation unit can be reduced. In addition, since the inspection flow and the processing flow of the substrate can be executed at the same time and the evaluation operation of the inspection unit and the adjustment operation of the processing unit can be performed simultaneously, the time required for starting up the substrate processing apparatus can be shortened. Moreover, since only the inspection unit of the substrate processing apparatus can be used alone, the availability of the inspection unit can be utilized to improve the operating rate of the inspection unit.

  The control unit may execute the substrate inspection flow on the substrate returned to the loading / unloading unit after the substrate processing flow is completed.

  The inspection unit is provided with a plurality of inspection units, and the control unit selects a predetermined inspection unit from the plurality of inspection units and transports the substrate to the selected inspection unit to perform the inspection. It may be. In such a case, for example, necessary inspections can be freely selected for each substrate.

  According to the present invention, in a substrate processing apparatus provided with an inspection unit, it is possible to shorten the time required for start-up work, reduce costs, and further improve the operation rate of the inspection unit.

It is a top view which shows the outline of a structure of the coating and developing treatment apparatus in the technical structural example used as the premise of this invention. FIG. 2 is a front view of the coating and developing treatment apparatus of FIG. 1. FIG. 2 is a rear view of the coating and developing treatment apparatus of FIG. 1. It is explanatory drawing which shows the processing flow and inspection flow which are set to a coating and developing processing apparatus. It is explanatory drawing which shows the execution timing of a processing flow and a test | inspection flow. It is a flowchart in the case of performing the inspection flow with respect to the lot carried in from the outside. It is explanatory drawing which shows the execution timing of the inspection flow with respect to the lot carried in from the outside. It is a flowchart in the case of performing the inspection flow with respect to the lot carried in from the outside.

  Hereinafter, a technical configuration example which is a premise of the present invention will be described. FIG. 1 is a plan view showing an outline of a configuration of a coating and developing treatment apparatus 1 in which a photolithography process of a wafer as a substrate is performed, FIG. 2 is a front view of the coating and developing treatment apparatus 1, and FIG. 2 is a rear view of the coating and developing treatment apparatus 1. FIG.

  As shown in FIG. 1, the coating / developing apparatus 1 carries in, for example, 25 wafers W in the cassette unit from the outside to the coating / developing apparatus 1 and loads / unloads wafers W into / from the cassette C. As a processing unit comprising a multi-stage arrangement of a cassette station 2 as an output unit, an inspection station 3 as an inspection unit for inspecting the wafer W, and various processing units for performing predetermined processing in a single wafer type in the coating and developing process And the interface unit 5 for transferring the wafer W between the processing station 4 and an exposure apparatus (not shown) provided adjacent to the processing station 4 are integrally connected.

  In the cassette station 2, a plurality of, for example, five cassettes C can be placed in a line along a X direction (vertical direction in FIG. 1) at a predetermined position on the cassette mounting table 6. The cassette station 2 is provided with a wafer transfer body 8 that can move in the X direction on the transfer path 7. The wafer carrier 8 is also movable in the vertical direction, and can selectively access the wafers W arranged in the vertical direction in the cassette C. The wafer carrier 8 can rotate in the θ direction around the vertical axis, and can also access a delivery unit 10 on the inspection station 3 side described later.

  The inspection station 3 adjacent to the cassette station 2 includes, for example, an inspection unit group K in which a plurality of inspection units are arranged in multiple stages. The inspection station 3 includes a delivery unit 10 for delivering the wafer W to and from the cassette station 2. The delivery unit 10 is provided with a placement unit 10a on which, for example, a wafer W is placed. The inspection station 3 is provided with a wafer transfer device 12 that moves on a transfer path 11 extending in the X direction, for example. The wafer transfer device 12 can move, for example, in the vertical direction and can also rotate in the θ direction. Each inspection unit in the inspection unit group K to be described later, the transfer unit 10 and the third processing unit group G3 of the processing station 4 can be used. Each processing unit described later can be accessed.

  In the inspection unit group K, for example, as shown in FIG. 2, a film thickness / line width inspection unit 20 for measuring the thickness of the film formed on the wafer W and the line width of the pattern, and macro defects on the wafer surface are detected. A macro defect inspection unit 21 and an overlay inspection unit 22 for detecting an exposure overlay shift are stacked in three stages in order from the bottom.

  The processing station 4 adjacent to the inspection station 3 includes, for example, five processing unit groups G1 to G5 in which a plurality of processing units are arranged in multiple stages as shown in FIG. A first processing unit group G1 and a second processing unit group G2 are sequentially arranged from the inspection station 3 side on the X direction negative direction (downward direction in FIG. 1) side of the processing station 4. A third processing unit group G3, a fourth processing unit group G4, and a fifth processing unit group G5 are sequentially arranged from the inspection station 3 side on the X direction positive direction (upward in FIG. 1) side of the processing station 4. Has been placed. A first transport unit 30 is provided between the third processing unit group G3 and the fourth processing unit group G4. The first transfer unit 30 can selectively access the first processing unit group G1, the third processing unit group G3, and the fourth processing unit group G4 to transfer the wafer W. A second transport unit 31 is provided between the fourth processing unit group G4 and the fifth processing unit group G5. The second transfer unit 31 can selectively access the second processing unit group G2, the fourth processing unit group G4, and the fifth processing unit group G5 to transfer the wafer W.

  As shown in FIG. 2, in the first processing unit group G1, a liquid processing unit for supplying a predetermined liquid to the wafer W to perform processing, for example, resist coating units 40, 41, and 42 for applying a resist solution to the wafer W. Bottom coating units 43 and 44 for forming an antireflection film for preventing reflection of light during the exposure process are stacked in five stages in order from the bottom. In the second processing unit group G2, liquid processing units, for example, development processing units 50 to 54 for developing the wafer W are stacked in five stages in order from the bottom. In addition, chemical chambers 60 and 61 for supplying various processing liquids to the liquid processing units in the processing unit groups G1 and G2 are provided at the bottom of the first processing unit group G1 and the second processing unit group G2. Are provided.

  For example, as shown in FIG. 3, the third processing unit group G3 includes a temperature control unit 70, a transition unit 71 for delivering the wafer W, and a high-precision temperature for heat-processing the wafer W under high-precision temperature control. The adjustment units 72 to 74 and the high temperature heat treatment units 75 to 78 for heat-treating the wafer W at a high temperature are sequentially stacked in nine steps from the bottom.

  In the fourth processing unit group G4, for example, a high-precision temperature control unit 80, pre-baking units 81 to 84 that heat-process the wafer W after the resist coating process, and post-baking units 85 to 85 that heat-process the wafer W after the development process. 89 are stacked in 10 steps from the bottom.

  In the fifth processing unit group G5, there are a plurality of heat treatment units that heat-treat the wafer W, for example, high-precision temperature control units 90 to 93, and post-exposure baking units 94 to 99 that heat-treat the exposed wafer W in order from the bottom. It is stacked on the stage.

  As shown in FIG. 1, a plurality of processing units are arranged on the positive side in the X direction of the first transfer unit 30. For example, as shown in FIG. 3, an adhesion for hydrophobizing the wafer W is performed. The units 100 and 101 and the heating units 102 and 103 for heating the wafer W are stacked in four stages in order from the bottom. As shown in FIG. 1, a peripheral exposure unit 104 that selectively exposes only the edge portion of the wafer W, for example, is disposed on the positive side in the X direction of the second transfer unit 31.

  For example, as shown in FIG. 1, the interface unit 5 includes a wafer transfer body 111 that moves on a transfer path 110 that extends in the X direction, and a buffer cassette 112. The wafer carrier 111 is movable in the Z direction and rotatable in the θ direction, and accesses an exposure apparatus (not shown) adjacent to the interface unit 5, the buffer cassette 112, and the fifth processing unit group G5. The wafer W can be transferred.

The control of the coating and developing treatment apparatus 1 configured as described above is performed by a control unit 120 as a control unit provided at the side of the cassette station 2 as shown in FIGS. 1 and 2, for example. The control unit 120 stores a control program P. The control unit 120 controls the operations of the processing unit, the inspection unit, and the transport unit in the coating and developing treatment apparatus 1 according to the control program P, and performs coating and developing processing. The wafer processing process in the apparatus 1 can be controlled. For example, as shown in FIG. 4, the control program P transfers the wafer W from the cassette station 2 to the processing station 4 through the inspection station 3, executes processing by the processing station 4 and the exposure apparatus, and then passes through the inspection station 3. The processing flow F ₁ of the wafer W returned to the cassette station 2 and the inspection flow F _{2 of the} wafer W transferred to the inspection station 3 after carrying the wafer W of the cassette station 2 to the inspection station 3 and performing a predetermined inspection. And can be executed independently.

Next, the operation of the coating and developing treatment apparatus 1 configured as described above will be described. First, when the coating and developing treatment apparatus 1 is started up, for example, the control unit 120 executes the processing flow F ₁ and the inspection flow F _{2 of} the control program P. For example, when the cassette C containing the evaluation wafer W is placed on the cassette mounting table 6, the evaluation wafer W is transferred to the transfer unit 10 by the wafer transfer body 7, and the wafer transfer from the transfer unit 10 is performed. When the inspection unit 20 to 22 completes the inspection, the wafer is returned to the cassette C via the wafer transfer device 12, the transfer unit 10, and the wafer transfer body 8. For example, the evaluation operation of the inspection units 20 to 22 is performed by evaluating the measurement values in the inspection units 20 to 22 for the wafer W for evaluation. For example, when the cassette C containing the processing wafer W is placed on the cassette mounting table 6, the processing wafer W passes through the wafer carrier 8, the delivery unit 10, and the wafer transport device 12. After being transferred to the processing station 4 and processed in a predetermined processing unit to be adjusted, it is returned to the cassette C via the wafer transfer device 12, the transfer unit 10 and the wafer transfer body 8 again. For example, the adjustment operation of each processing unit is performed by adjusting the setting of each processing unit based on the processing state of the wafer W returned to the cassette C.

Next, the operation of the coating and developing treatment apparatus 1 when the start-up operation of the coating and developing treatment apparatus 1 is completed and the wafer W is actually processed in the coating and developing treatment apparatus 1 will be described. In this configuration example, for example, as shown in FIG. 1, cassettes C ₁ , C ₂ , and C ₃ are placed on a cassette placing table 6, and a plurality of wafers constituting the lot R ₁ are placed in the cassette C _1. W ₁ is accommodated, the cassette C _2, the wafer W ₂ of the plurality is received which constitutes the lot R _2, the cassette C _3, a plurality of wafers W ₃ constituting the lot R ₃ is accommodated An example will be described. FIG. 5 is an explanatory diagram showing execution timings of the processing flow F ₁ and the inspection flow F ₂ .

First, when the coating and developing treatment apparatus 1 is operated, for example, the processing flow F ₁ and the inspection flow F _{2 of the} control program P are both executable by the control unit 120. By executing the processing flow F ₁ for Lot R _1, a plurality of wafers W ₁ in the cassette C ₁ on the cassette mounting table 6, passed the transfer unit 10 sequentially one by one by the wafer carrier 8, the wafer transfer The apparatus 12 is transported to the temperature control unit 70 belonging to the third processing unit group G3 of the processing station 4. In the processing station 4, each wafer W _{1 is} subjected to temperature control processing by the temperature control unit 70, antireflection film formation processing by the bottom coating unit 43, heat processing by the heating unit 102, and high temperature heating by the high temperature heat processing unit 75. Processing, temperature adjustment by the high-precision temperature control unit 80, resist coating processing by the resist coating unit 40, pre-baking processing by the pre-baking unit 81, peripheral exposure processing by the peripheral exposure unit 104, and temperature adjustment by the high-precision temperature control unit 93 are sequentially performed. Done. Thereafter, each wafer W ₁ is sequentially transferred to the exposure apparatus via the interface unit 5 by the wafer transfer body 111, and returned to the processing station 4 via the interface unit 5 again after the exposure processing is completed.

Thereafter, each wafer W ₁ is subjected to heat treatment by the post-exposure baking unit 94, temperature adjustment by the high-precision temperature control unit 91, development processing by the development processing unit 50, heat treatment by the post-baking unit 85, and high-precision temperature control unit 72. The cooling process is sequentially performed and transferred from the transition unit 71 to the transfer unit 10 of the inspection station 3 by the wafer transfer device 12. Each wafer W ₁ is returned from the transfer unit 10 to the cassette C ₁ by the wafer carrier 8.

Lot R ₁ against processing flow F ₁ of the cassette C ₁ is executed and all of the wafer W ₁ from the cassette C ₁ is taken out, the cassette C ₂ on continuing the cassette mounting table 6, as shown in FIG. 5 lots The processing flow F ₁ for R ₂ is executed, and a plurality of wafers W ₂ are taken out from the cassette C ₂ and processed through the same path as each wafer W ₁ . Further in the cassette C ₂ is empty, the process flow F ₁ with respect to lot R ₃ of the cassette C ₃ is performed and processed wafers W ₃ also passes through the same path. In this way, the processing flow F ₁ is sequentially executed for each of the lots R _{1 to} R ₃ .

On the other hand, when the wafer W ₁ lot R ₁ ended the processing flow F ₁ is returned to the cassette C _1, the execution of the inspection flow F _2, Lot R wafer W ₁ several sheets selected from within the ₁ one The wafers are transferred one by one to the transfer unit 10 of the inspection station 3 by the wafer transfer body 8. The wafer W ₁ is the wafer transfer apparatus 12 by, for example, the inspection unit group K film thickness and line width inspection unit 20, the macro defect inspection unit 21, is carried in order to overlay inspection unit 22, a predetermined inspection in each inspection unit Applied. The inspected wafer W ₁ is transferred to the transfer unit 10 by the wafer transfer device 12, and returned from the transfer unit 10 to the cassette C ₁ by the wafer transfer body 8. Similarly, the inspection flow F ₂ is executed for the lots R ₂ and R ₃ returned to the cassettes C ₂ and C ₃ that have completed the processing flow F ₁ .

Next, in order to perform only the inspection, the case where the cassette C ₄ is placed on the cassette table 6 from the outside of the apparatus as shown in FIG. For example, the cassette C ₄ contains a plurality of wafers W ₄ constituting a lot R ₄ that has already been processed by another processing apparatus. FIG. 6 shows a flowchart in such a case. For example, in the processing flow F ₁ for Lot R ₁ run, the cassette C ₄ lots R ₄ is mounted on the cassette mounting table 6, the execution of the inspection flow F ₂ for lots R ₄ is started at the time In this case, for example, the control unit 120 confirms whether or not the execution period of the lot R ₄ overlaps with the execution period of the next inspection flow F ₂ for the lot R ₁ being processed in the coating and developing treatment apparatus 1. . When the execution periods overlap, the inspection flow F ₂ for the lot R ₁ is executed first, and at this time, the lot R ₄ stands by in the cassette C ₄ on the cassette mounting table 6. Then, as shown in FIG. 7, the inspection flow F ₂ for the lot R ₄ is executed after the inspection for the lot R ₁ is completed. On the other hand, if the execution period do not overlap, inspection flow F ₂ is executed immediately for lots R _4. Thus, inspection flow F ₂ of the coating and developing apparatus lot R ₁ which is processed in the 1 is performed preferentially over lots R ₄ from the outside. Further, when the cassette C ₄ is placed on the cassette mounting table 6, as in the case of processing flow F ₁ lot R ₂ or lot R ₃ is executed, if the overlap execution period of inspection flow F ₂ , the inspection flow _{F 2} lots _{R 2} or _{R 3} to be next performed than lots _{R 4} is preferentially performed, the execution period and lot _R 2 of the inspection flow _{F 2} for lot _{R 4,} the execution period of _{R 3} It is adjusted so that and do not overlap.

According to the above configuration example, the processing flow F ₁ and the inspection flow F ₂ of the control program P can be executed independently by the control unit 120, so that, for example, at the start-up operation of the coating and developing treatment apparatus 1, Evaluation work of each inspection unit 20-22 and adjustment work of each processing unit of processing station 4 can be performed at the same time. Therefore, the start-up work time is shortened. Further, since each inspection unit 20 to 22 can be directly accessed from the cassette station 2 of the coating and developing treatment apparatus 1, a dedicated evaluation unit for evaluation work is not required as in the prior art, and the cost related to the evaluation unit can be reduced. .

Further, even in the process flow F ₁ is running in the coating and developing processing apparatus 1, when the vacant inspection units 20 to 22, it is possible to perform the inspection flow F ₂ against lots R ₄ from the outside The operating rate of the inspection units 20 to 22 can be improved. In addition, since the inspection flow F ₂ for the lot R ₁ to the lot R 3 in which the processing flow F ₁ is performed in the coating and developing treatment apparatus 1 is performed preferentially over the external lot R ₄ , the external lot Even if the inspection of R ₄ is performed, the processing efficiency of the wafer in the coating and developing treatment apparatus 1 is not lowered.

In the above configuration example, than inspection flow F ₂ for lots R ₄ carried into the cassette mounting table 6 from the outside, preferentially the inspection flow F ₂ lots R ₁ to R ₃ which has been treated with the coating and developing treatment apparatus 1 However, the inspection flow F ₂ for the lot R ₄ from the outside may be prioritized. FIG. 8 shows a flowchart in such a case. For example, when the cassette C ₄ from the outside is placed on the cassette placing table 6, it is confirmed whether or not the inspection flow F ₂ for another lot is being executed at that time. If the inspection flow F ₂ is running, Lot R ₄ stands on the cassette mounting table 6 until the inspection flow F ₂ of the running is completed, then test the flow F ₂ lots R ₄ is performed Is done. When the cassette C ₄ is placed on the cassette mounting table 6, the inspection flow F ₂ of another lot if not running, test flow F ₂ lots R ₄ is executed immediately. During execution of the inspection flow _{F 2} for Lot _{R 4,} applied when the developing device 1 inside the process flow _{F 1} of the terminated for example Lot _R 1 to R ₃ has returned to the cassette _C 1 -C _3, lots _{R 4} Lots R _{1 to} R ₃ stand by on the cassette mounting table 6 until the inspection flow F ₂ is completed. Inspection flow _{F 2} lots _R 1 to R ₃ is performed after the inspection flow _{F 2} lots _{R 4} ends. In this example, for example, the lot R ₄ having a predetermined situation can be inspected preferentially over the lot in the coating and developing treatment apparatus 1.

Note that the priority of the inspection flow F ₂ modes such outside to lot R _4, in the inspection flow F ₂ priority mode and the control unit 120 for Lot R ₁ to R ₃ which has been treated with the coating and developing treatment apparatus 1 It may be possible to be switched. In such a case, the external lot R ₄ and the internal lots R _{1 to} R ₃ can be prioritized as necessary.

In the processing flow F ₁ in the above configuration example, the wafer W is transferred from the cassette station 2 to the processing station 4, and thereafter processed by the processing station 4 and the exposure apparatus, and then directly returned to the cassette station 2. In the embodiment of the present invention, the wafer W processed by the processing station 4 and the exposure apparatus may be selectively inspected by the inspection station 3 and then returned to the cassette station 2. In such a case, for example, when a series of processes in the processing station 4 and the exposure apparatus is completed and the wafer W passes through the inspection station 3 and the inspection units 20 to 22 are vacant, the wafer W is inspected by the inspection units 20 to 22. Is returned to the cassette station 2, and if the inspection units 20 to 22 are not empty, they are returned to the cassette station 2 as they are. The wafer W that has not been inspected is returned to the cassette station 2 and then inspected by executing the inspection flow 2. In this case, since the wafer W does not pass through the inspection station 3 and is returned to the cassette station 2 even though the inspection units 20 to 22 are empty, the operating rate of the inspection units 20 to 22 is improved. Can do.

In inspection flow F ₂ described above, the inspection units 20 to 22 are subjected to the inspection in the inspection unit group K may be selected arbitrarily, for example, in each lot or every each wafer. In addition, inspection conditions such as a position to be inspected and a range to be inspected in the same inspection units 20 to 22 may be changed for each wafer and each lot.

  The above embodiment shows an example of the present invention, and the present invention is not limited to this example and can take various forms. For example, the type and number of inspection units in the inspection station 3 in the above embodiment can be arbitrarily selected. In the coating and developing treatment apparatus 1 in the above embodiment, the inspection station 3 is provided between the cassette station 2 and the processing station 4. For example, the inspection station 3 is provided between the processing station 4 and the interface unit 5. It may be provided. In the above embodiment, the present invention is applied to the coating and developing treatment apparatus 1, but the present invention can also be applied to other substrate processing apparatuses such as a cleaning apparatus and an etching apparatus. Moreover, although the said embodiment was the application | coating development processing apparatus which processes the wafer W, this invention is a board | substrate other than a wafer, for example, other board | substrates, such as a FPD (flat panel display) board | substrate, a mask board | substrate, a reticle board | substrate. It can also be applied to.

  The present invention is useful for shortening the start-up time of a substrate processing apparatus having a substrate inspection unit and improving the operating rate of the inspection unit.

1 coating and developing treatment apparatus 2 cassette station 3 inspection station 4 treatment stations 20 to 22 inspection unit 120 control unit F ₁ processing flow F ₂ inspection flow C ₁ -C ₄ cassettes R ₁ to R ₄ Lot W ₁ to _W-4 wafer

Claims (6)

Controls a substrate processing apparatus having a loading / unloading unit for loading / unloading a substrate, a processing unit for processing a substrate, and an inspection unit for inspecting a substrate, and configured to be able to transport the substrate between these units A way to
And the processing flow of the substrate to be processed by transporting the substrate carried on the transfer portion to the processing unit, and a test flow of substrates transported to inspecting a substrate carried into the carry-out unit to the inspection unit run,
When the processing flow of the substrate is completed, if the inspection unit is not inspecting the other substrate, the substrate after the processing flow of the substrate is transported to the inspection unit for inspection,
When the processing flow of the substrate is completed, if another inspection of the substrate is performed in the inspection unit, the substrate for which the processing flow of the substrate has been completed is returned to the loading / unloading unit. A method for controlling a processing apparatus. The method for controlling a substrate processing apparatus according to claim 1, wherein an inspection flow of the substrate is executed on the substrate returned to the loading / unloading unit after the processing flow of the substrate is completed. The inspection unit according to claim 1, wherein a predetermined inspection unit is selected from a plurality of inspection units provided in the inspection unit, and the substrate is transported to the selected inspection unit to perform inspection. A method for controlling a substrate processing apparatus. A substrate processing apparatus having a loading / unloading unit for loading / unloading a substrate, a processing unit for processing a substrate, and an inspection unit for inspecting a substrate, and configured to be able to transport the substrate between these units. And
And the processing flow of the substrate to be processed by transporting the substrate carried on the transfer portion to the processing unit, and a test flow of substrates transported to inspecting a substrate carried into the carry-out unit to the inspection unit have executable control unit,
The controller is
When the processing flow of the substrate is completed, if the inspection unit is not inspecting the other substrate, the substrate after the processing flow of the substrate is transported to the inspection unit for inspection,
When the processing flow of the substrate is completed, if another inspection of the substrate is performed in the inspection unit, the substrate for which the processing flow of the substrate has been completed is returned to the loading / unloading unit. Processing equipment. The substrate processing apparatus according to claim 4, wherein the control unit executes an inspection flow of the substrate on the substrate returned to the loading / unloading unit after the processing flow of the substrate is completed. The inspection unit is provided with a plurality of inspection units,
6. The substrate according to claim 4, wherein the control unit selects a predetermined inspection unit from the plurality of inspection units, transports the substrate to the selected inspection unit, and performs inspection. Processing equipment.

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