JP2003045776A - Substrate processing apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate processing apparatus, capable of readily setting conditions on an inspection of substrates. SOLUTION: A plurality of inspection recipes are held in a magnetic disc 25 of an inspection unit 20. Different conditions on the inspection are described in each of the plurality of inspection recipes, and a different specific number (recipe number) is attached to each of the plurality of inspection recipes. As to which inspection recipe is used, an operator can select the recipe number, corresponding to any of the plurality of inspection recipes from an operation panel 61, and thus conditions on the inspection in the inspection unit 20 can be designated. The selected recipe number is described in a flow recipe, and transmitted from a transmission part 57 to the inspection unit 20. The inspection unit 20 conducts the inspection, in accordance with the designated inspection recipe.

Description

Detailed Description of the Invention

[0001]

The present invention relates to a semiconductor substrate, a glass substrate for a liquid crystal display device, a glass substrate for a photomask, a substrate for an optical disk, etc. (hereinafter simply referred to as "substrate"), which is subjected to a predetermined inspection, for example, a resist. The present invention relates to a substrate processing apparatus incorporating an inspection unit for measuring the film thickness of the substrate.

[0002]

As is well known, products such as semiconductors and liquid crystal displays are subjected to a series of various treatments such as cleaning, resist coating, exposure, development, etching, interlayer insulating film formation, heat treatment, and dicing on the above-mentioned substrate. It is manufactured by applying. To maintain the quality of such semiconductor products,
It is important to perform various inspections of the substrate to confirm the quality after the above-mentioned various processes are integrated.

For example, in a substrate processing apparatus (so-called coater & developer) for performing resist coating processing and development processing, conventionally, inspection such as line width measurement of a pattern on the substrate is performed in the final step of development processing. It was At this time, the substrate to be inspected is once carried out from the substrate processing apparatus, carried into a dedicated inspection apparatus provided at another position, and then subjected to the inspection. Then, the inspection result is fed back to the substrate processing apparatus, and various processing conditions are adjusted.

[0004]

[Background Art] However, in the past, since the substrate processing apparatus and the inspection apparatus were separately provided, the substrate to be inspected had to be transported to the inspection apparatus,
There was a waste of time and effort. In addition, it took a certain amount of time for the inspection result to be found as well as the time required to carry it into the inspection device. A considerable number of the processed substrates had been processed. For this reason, if there is a defect in the inspection result, it is necessary to reprocess a considerable number of substrates, resulting in a decrease in processing efficiency.

In order to solve such a problem, it is considered to incorporate an inspection device inside the substrate processing apparatus. If the inspection device is installed inside the substrate processing apparatus, the substrate can be transferred to the inspection apparatus by the transfer robot of the substrate processing apparatus, so that wasteful transfer time can be omitted and the inspection result can be obtained in a short time. Can be revealed. Therefore, even if the inspection result is defective, the number of substrates that need to be reprocessed can be reduced.

[0006]

However, in the prior art, the inspection apparatus incorporated in the substrate processing apparatus has a plurality of recipes describing the inspection conditions, and the inspection apparatus determines what kind of inspection is performed under what conditions. It was done independently by switching the recipe from the side. That is, it was necessary for the operator to set the inspection conditions of the inspection device separately from the setting of the substrate processing conditions and the like from the substrate processing device.

For this reason, there is a problem that the inspection efficiency of the board is lowered and that an operation error or the like is likely to occur.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a substrate processing apparatus capable of easily setting conditions relating to inspection of a substrate.

[0009]

In order to solve the above-mentioned problems, the invention of claim 1 is a substrate processing apparatus comprising a processing unit for performing a predetermined process on a substrate, wherein a predetermined inspection is performed on the substrate. Before carrying in the board to the inspection section, an inspecting section to be carried out, a carrying in / out means for carrying in / out the board to / from the inspecting section, a designating means for designating a condition regarding an inspection in the inspecting section And transmitting means for transmitting to the inspecting section the conditions relating to the inspection of the board designated by the designating means.

According to a second aspect of the present invention, in the substrate processing apparatus according to the first aspect of the present invention, the inspection unit holds a plurality of inspection recipes in which conditions related to inspection are described, and the designating unit stores the plurality of inspection recipes. The inspection conditions are specified by selecting one of the inspection recipes.

According to a third aspect of the present invention, in the substrate processing apparatus according to the second aspect of the present invention, different codes are associated with the plurality of inspection recipes, and the designating means stores the plurality of inspection recipes. The condition relating to the inspection is specified by selecting the code associated with either one.

According to a fourth aspect of the invention, in the substrate processing apparatus according to the third aspect of the invention, the code selected by the designating means is described in a flow recipe describing a substrate processing procedure.

[0013]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described in detail below with reference to the drawings.

FIG. 1 is a perspective view showing an outline of the whole substrate processing apparatus according to the present invention. Further, FIG. 2 is a plan view showing a schematic configuration of this substrate processing apparatus. 1 and 2
And in FIG. 3, in order to clarify their directional relationship, Z
XYZ with the axial direction as the vertical direction and the XY plane as the horizontal plane
Cartesian coordinate system is attached. This substrate processing apparatus uses a substrate W
Is a substrate processing apparatus (so-called coater & developer) for performing resist coating processing and developing processing, and is roughly classified into an indexer ID, a unit arrangement section MP, and an interface I
And FB.

The indexer ID is the transfer robot TF, the inspection units 10 and 20 (inspection unit), and the mounting stage 3.
0, and a display unit 62 is installed on the outer wall surface of the indexer ID. On the mounting stage 30, four carriers C can be arranged and mounted in the horizontal direction (Y-axis direction). Each carrier C is engraved with a multi-stage storage groove, and one substrate W can be accommodated in each groove in a horizontal posture (with its main surface along a horizontal plane). Therefore, a plurality of substrates W (for example, 25 substrates) can be stored in each carrier C in a horizontal posture and in a state of being stacked in multiple stages at predetermined intervals. In addition, as a form of the carrier C, a FOUP (front opening unified pod) for housing the substrate W in a closed space, or
It may be any OC (open casette) that exposes the storage substrate W to the outside air.

FIG. 3 is an external perspective view of the transfer robot TF. The transfer robot TF is provided with an arm stage 35 provided with one transfer arm 75 on the upper part of the telescopic body 40, and the telescopic type multistage nested structure is realized by the telescopic body 40.

The elastic body 40 is composed of four divided bodies 4 in order from the top.
It is composed of 0a, 40b, 40c and 40d. The divided body 40a can be accommodated in the divided body 40b, the divided body 40b can be accommodated in the divided body 40c, and the divided body 4b can be accommodated.
0c can be accommodated in the divided body 40d. Then, the expandable body 40 contracts by accommodating the divided bodies 40a to 40d sequentially, and conversely, the elastic body 40 extends by drawing out the divided bodies 40a to 40d sequentially. That is, when the stretchable body 40 contracts, the divided body 40a is accommodated in the divided body 40b, and the divided body 40b is divided into the divided body 40c.
The divided body 40c is accommodated in the divided body 40d. On the other hand, when the stretchable body 40 is extended, the split body 40
a is drawn out of the divided body 40b, divided body 40b is drawn out of the divided body 40c, divided body 40c is divided body 40d
Drawn from.

The expansion / contraction operation of the expansion / contraction body 40 is realized by an expansion / contraction elevating mechanism provided therein. As the expansion / contraction mechanism, for example, a mechanism in which a motor drives a combination of a plurality of belts and rollers can be adopted. The transfer robot TF can perform a lifting operation along the vertical direction (Z-axis direction) of the transfer arm 75 by such a telescopic lifting mechanism.

Further, as shown in FIG. 3, the transfer robot T
The transfer arm 75 of F has a male screw 77 and a guide rail 76.
It is possible to move along the Y-axis direction by a Y drive mechanism that is a drive mechanism in the Y-axis direction including the above.
That is, by rotating the male screw 77 by an electric motor (not shown), the divided body 40d screwed onto the male screw 77.
Can be slid along the Y-axis direction.

Further, the transfer robot TF can also perform the horizontal advancing / retreating movement and rotating operation of the transfer arm 75. Specifically, an arm stage 35 is provided above the split body 40a, and the arm stage 35 performs horizontal advancing / retreating movement and rotation operation of the transfer arm 75. In other words, the arm stage 35 bends and extends the arm segment of the transfer arm 75 to move the transfer arm 7.
5 performs horizontal advancing / retreating movements, and the arm stage 35 itself rotates the telescopic body 40, whereby the transfer arm 75 rotates.

Therefore, the transfer robot TF can move the transfer arm 75 up and down in the height direction, horizontally move it along the Y-axis direction, rotate it, and move it forward and backward in the horizontal direction. . That is, the transfer robot TF can move the transfer arm 75 three-dimensionally.

By such an operation of the transfer robot TF, the indexer ID takes out the unprocessed substrate W from the carrier C capable of accommodating a plurality of substrates W and transfers it to the unit arranging section MP, and also from the unit arranging section MP. The processed substrate W can be received and stored in the carrier C. The indexer ID also carries in and out the substrate W with respect to the inspection unit 10 and the inspection unit 20 by the transfer robot TF.

The inspection unit 10 is an inspection unit (macro defect inspection unit) for performing macro defect inspection. The “macro defect inspection” is an inspection for determining the presence or absence of a relatively large defect appearing on the substrate W, for example, particles. On the other hand, the inspection unit 20 is an inspection unit that measures resist film thickness, pattern line width, and pattern overlay measurement. That is, the inspection unit 20 can perform three types of inspections with one inspection unit. "Measurement of resist film thickness" refers to substrate W
This is an inspection for measuring the film thickness of the resist applied on top.
“Pattern line width measurement” is an inspection for measuring the line width of a pattern formed on the substrate W by exposure and development processing. “Pattern overlay measurement” is an inspection for measuring the deviation of the pattern formed on the substrate W by the exposure and development processes.

Inspection unit 10 and inspection unit 20
Are arranged at both upper corners inside the indexer ID. More precisely, when viewed from above ((-
Z)), the inspection unit 10 and the inspection unit 20 are completely included in the indexer ID.

In the unit arranging portion MP, a plurality of processing units for performing a predetermined processing on the substrate W are arranged. That is, two coating processing units SC are arranged on the front surface side (−Y side) of the unit arrangement portion MP. The coating processing unit SC is a so-called spin coater that uniformly coats the resist by dropping the photoresist onto the main surface of the substrate W while rotating the substrate W.

The rear side of the unit arrangement portion MP (+ Y
Two developing processing units SD are arranged at the same height position as the coating processing unit SC. The development processing unit SD is a so-called spin developer that performs development processing by supplying a developing solution onto the exposed substrate W. The coating processing unit SC and the development processing unit SD are arranged opposite to each other with the transport path 4 interposed therebetween.

Above each of the two coating processing units SC and the two developing processing units SD, a heat treatment unit group 5 is arranged with a fan filter unit (not shown) interposed therebetween (for convenience of illustration, in FIG. 2). (The heat treatment unit group 5 is omitted). In the heat treatment unit group 5, a so-called hot plate that heats the substrate W to raise it to a predetermined temperature and the substrate W is cooled to lower the temperature to a predetermined temperature and the substrate W is maintained at the predetermined temperature. The so-called cool plate is incorporated. The hot plate includes an adhesion enhancing unit that performs adhesion enhancing processing on the substrate before resist coating processing and a post-exposure bake unit that performs baking processing on the substrate after exposure. In this specification, the hot plate and the cool plate are collectively referred to as a heat treatment unit, and the coating processing unit SC, the development processing unit SD, and the heat treatment unit are collectively referred to as a processing unit (processing unit).

A transfer robot TR is arranged on the transfer path 4 sandwiched between the coating processing unit SC and the development processing unit SD. The transfer robot TR includes two transfer arms, and by the same mechanism as the transfer robot TF, the transfer arm is moved up and down along the vertical direction, rotated in a horizontal plane, and in the horizontal plane. You can move forward and backward. As a result, the transport robot TR can circulate and transport the substrate W between the processing units arranged in the unit arranging section MP according to a predetermined processing procedure. In addition, the transfer robot TR includes the transfer robot TF of the indexer ID and the interface IF.
The substrate W can be transferred to and from B as well.

The interface IFB receives the resist-coated substrate W from the unit arranging portion MP and transfers it to an exposure device (stepper) not shown in the drawing, and also receives the exposed substrate W from the exposure device and transfers it to the unit arranging portion MP. It has a function to return to. In order to realize this function, a transfer robot (not shown) for transferring the substrate W is arranged in the interface IFB. Further, the interface IFB is also provided with a buffer unit for temporarily storing the substrate W in order to eliminate the difference between the processing time in the unit arranging unit MP and the processing time in the exposure apparatus.

FIG. 4 is a functional block diagram for explaining the control mechanism of the substrate processing apparatus. The substrate processing equipment
A control unit 50 for controlling the entire apparatus is provided inside thereof. The control unit 50 is composed of a computer, and is a main body of the control unit 50 that performs arithmetic processing.
A ROM 52 that is a read-only memory, a RAM 53 that is a readable / writable memory, and a magnetic disk 55 that stores control software and data.
A communication unit 56 for communicating with a host computer or the like provided outside the substrate processing apparatus;
20 is provided with a transmission unit 57 which is an interface for notifying the recipe number. CPU 51 and magnetic disk 55
The transmission unit 57 and the like are electrically connected via a bus line 59. Further, an operation panel 61 of the substrate processing apparatus, a display unit 62, a processing unit, a transfer robot TR, a transfer robot TF, etc. are electrically connected to the bus line 59 of the control unit 50. The processing unit, the transfer robot TR, and the transfer robot TF are as described above.

The operation panel 61 is composed of a keyboard or the like provided on the outer wall surface of the substrate processing apparatus. The display unit 62 is a display attached to the operation panel 61. The operator can input commands, parameters, etc. from the operation panel 61 while confirming the contents displayed on the display unit 62. The operation panel 61 and the display unit 62 may be integrally configured as a touch panel.

Further, the operator can set and input a flow recipe describing a substrate processing procedure from the operation panel 61. The input flow recipe is stored in the magnetic disk 55. The CPU 51 of the control unit 50 controls the transfer robot TR and the transfer robot TF according to the flow recipe stored in the magnetic disk 55, and transfers the substrate W according to the processing procedure described in the flow recipe. Further, the operator can set and input a recipe number, which will be described later, from the operation panel 61.

The inspection unit 20 also has a built-in inspection mechanism 29 for optically inspecting the substrate W and a magnetic disk 25. The magnetic disk 25 stores a processing program for operating the inspection mechanism 29, as well as a plurality of inspection recipes that describe inspection conditions. Although not shown in FIG. 4, the inspection unit 10 has the same configuration as the inspection unit 20.

FIG. 5 is a diagram showing a plurality of inspection recipes held by the inspection unit 20. Each inspection recipe describes conditions related to the inspection, such as “inspection point” and “inspection time” which are positions on the substrate W to be inspected. Further, when a plurality of types of inspections can be performed like the inspection unit 20, which inspection is to be performed is also described in the inspection recipe. A different recipe number is assigned to each of the plurality of inspection recipes. The inspection unit 20 performs the inspection on the substrate W according to the inspection condition described in any of the plurality of inspection recipes.

Next, processing in the substrate processing apparatus having the above structure will be described. The substrate processing is performed by the CPU 51 of the control unit 50 according to the flow recipe stored in the magnetic disk 55 according to the transfer robot TR and the transfer robot T.
It is advanced by controlling F. Table 1 below shows an example of the flow recipe.

[0036]

[Table 1]

Such a flow recipe is set and input by the operator from the operation panel 61 into the control unit 50. Further, the flow recipe as shown in Table 1 may be transmitted from the host computer outside the substrate processing apparatus to the control unit 50 via the communication unit 56. In either case, the set and input flow recipe is stored in the magnetic disk 55 of the control unit 50. When inputting the setting of the flow recipe, if the inspection unit 10 or the inspection unit 20 is included in the transfer destination of the substrate W, the operator selects / designates the recipe number used in the inspection unit from the operation panel 61. The recipe number selected is step 1
It is described in the flow recipe in association with the second transport destination “inspection unit”. In Table 1, the recipe number is "N
o. 2 ”is described. Then, the CPU 41 controls the transfer robot TR and the transfer robot TF so that the substrates are sequentially transferred according to the flow recipe of Table 1.

First, the indexer ID transfer robot TF.
Takes out the unprocessed substrate W from the carrier C and transfers it to the transport robot TR of the unit placement portion MP. When the unprocessed substrate W is taken out, the carrier C containing the substrate W is stored.
The transfer robot TF moves to the front surface of the substrate W and inserts the transfer arm 75 below the substrate W. And the transfer robot TF
Holds the substrate W by slightly raising the transfer arm 75,
The unprocessed substrate W is taken out by retracting the transfer arm 75.

The substrate W passed to the unit placement section MP is
According to the flow recipe of Table 1, the transfer robot TR circulates and transfers between the processing units, and the processes are sequentially performed.
That is, the substrate W having been subjected to the adhesion strengthening process (step 1) on the hot plate is transported to the cool plate and subjected to the cooling process (step 2), and then transported to the coating processing unit SC to perform the resist coating process (step 3). )I do. After that, the substrate W coated with the resist is transferred to a hot plate for prebaking (step 4) and then transferred to a cool plate for cooling (step 5) to form a resist film. The substrate W on which the resist film is formed is transferred to the exposure device via the interface IFB, and the pattern exposure process (step 6) is performed.

The substrate W for which the exposure processing has been completed is again exposed from the exposure apparatus via the interface IFB to the unit placement section M.
Returned to P. The exposed substrate W is conveyed to a hot plate and subjected to post-exposure bake processing (step 7),
After the cooling process (step 8) is performed on the cool plate, it is conveyed to the development processing unit SD and the development process (step 9) is performed. After the development process is completed, the substrate W is further subjected to a baking process (step 10) on the hot plate and a cooling process (step 11) on the cool plate, and then the indexer ID is transferred from the transport robot TR of the unit placement section MP. Passed to the loading robot TF. The transfer robot TF that has received the substrate W conveys the substrate W to the inspection unit 20 (step 12). In this embodiment, the line width of the pattern is measured on the substrate W as an inspection. The substrate W after the inspection is taken out from the inspection unit 20 by the transfer robot TF and stored in the carrier C (step 13).

Here, the content of the inspection of the substrate W is not limited to the measurement of the line width of the pattern, and the stage of performing the inspection is not limited to after the final cooling process (step 11). For example, among various inspections, it is preferable to measure the film thickness of the resist on the substrate W that has not been carried into the exposure apparatus after prebaking. In this case, the substrate W for which the pre-baking process has been completed is once returned from the unit placement section MP to the indexer ID, and the transfer robot TF carries the substrate W into the inspection unit 20. The substrate W after the measurement of the resist film thickness is inspected by the transfer robot TF.
From the unit placement unit MP to the interface IFB from the transport robot TR of the unit placement unit MP, and is carried into the exposure apparatus.

Further, the macro defect inspection and the pattern overlay measurement are preferably performed on the substrate W which has returned to the indexer ID after all the processing is completed, similarly to the above-mentioned pattern line width measurement. . Regarding the macro defect inspection, the transfer robot TF inspects the substrate W that has returned to the indexer ID after all the processing is completed.
Carry it in and carry it out. On the other hand, for the pattern overlay measurement, the indexer I
The transfer robot TF carries in the substrate W returned to D to the inspection unit 20 to perform it. In any case, the substrate W that has been inspected is stored in the carrier C from the inspection unit 10 or the inspection unit 20 by the transfer robot TF.

As described above, it is possible to freely set to which inspection unit and at which stage the substrate W is to be conveyed by a flow recipe. Therefore, for example, it is possible to freely set whether to perform the inspection before all the processes or to perform two or more types of inspections by describing that in the flow recipe. Then, C is set so that the substrates are sequentially transported according to the set flow recipe.
Inspection of various patterns is realized by the PU 41 controlling the transport robot TR. Therefore, the degree of freedom of the board inspection is increased, and the board can be efficiently inspected.

The conditions under which the substrate W carried into the inspection unit 20 is inspected depend on which inspection recipe is used. In the example described above, the operator selects the recipe number “No. 2” from the operation panel 61, and the recipe number is described in the flow recipe (Table 1). Before the transfer robot TF carries the substrate into the inspection unit 20, the transmission unit 57 of the control unit 50 that controls according to the flow recipe indicates that the recipe number selected for the substrate is “No.
2 ”is transmitted. And the inspection unit 20
Is the recipe number No. The inspection is performed on the substrate under the conditions described in the inspection recipe No. 2.

In other words, in this embodiment, different inspection conditions are described for each of the plurality of inspection recipes, and different unique numbers (recipe numbers) are associated with the plurality of inspection recipes. The inspection recipe itself is held in the inspection unit 20. Then, as to which inspection recipe to use, the operator can select a recipe number associated with any of a plurality of inspection recipes from the operation panel 61,
Thereby, the condition regarding the inspection in the inspection unit 20 can be designated. The selected recipe number is described in the flow recipe, and is transmitted to the inspection unit 20 from the transmission unit 57 of the control unit 50 that performs control according to the flow recipe. The inspection unit 20 inspects the board according to the inspection recipe associated with the selected recipe number.
In other words, the inspection recipe and the flow recipe are linked by describing the recipe number in the flow recipe.

In this way, the operator can select the inspection recipe from the substrate processing apparatus side by selecting the recipe number at the time of inputting the flow recipe, and the conditions concerning the inspection of the substrate can be easily set. Can be set to. Therefore, it is possible to improve the inspection efficiency of the substrate W and prevent operation mistakes and the like.
An inspection recipe is selected for the inspection unit 10 as well.

Although the embodiments of the present invention have been described above, the present invention is not limited to the above examples.
For example, in the above-described embodiment, the so-called string is attached by describing the recipe number selected from the operation panel 61 in the flow recipe, but the present invention is not limited to this, and the operation panel 61 can be used. The selected recipe number may be directly transmitted from the transmission unit 57 to the inspection unit at the timing when the substrate W is loaded into the inspection unit.

Further, instead of the recipe number, a code having an identification function such as an alphabet or a symbol may be used. In this case, by selecting a code from the operation panel 61, the inspection recipe used in the inspection unit is determined, and the inspection conditions are specified.

That is, various methods can be adopted as long as the inspection recipe used in the inspection unit can be designated from the side of the substrate processing apparatus.

In the above embodiment, two inspection units (inspection unit 10 and inspection unit 2) are used.
0) was arranged inside the indexer ID, but the invention is not limited to this, and the inspection unit is 1
It may be one or two or more. Also,
The arrangement position of the inspection unit is not limited to the inside of the indexer ID, and may be inside the unit arrangement part MP or the interface IFB, or may be attached outside the substrate processing apparatus. Each inspection unit has at least one of film thickness measurement for measuring resist film thickness, line width measurement for pattern line width, overlay measurement for pattern overlay, and macro defect inspection. It may be an inspection unit that performs the inspection.

In the above embodiment, the transfer robot TF of the indexer ID has a so-called single arm having one transfer arm, but it may have a so-called double arm having two transfer arms. .
When the indexer ID is provided with the inspection unit, the transfer robot TF naturally has a higher access frequency than in the past, and thus the transfer robot TF having the two transfer arms improves the transfer efficiency of the substrate W. However, the throughput of the substrate processing apparatus is improved.

In the above embodiment, the substrate processing apparatus is an apparatus for performing resist coating processing and development processing on the substrate, and the inspection unit has a function of performing inspection related to so-called photolithography. The technique is not limited to this. For example,
As the inspection unit, an inspection unit having an inspection function for measuring the amine or ammonia concentration may be adopted. Further, an inspection unit for inspecting particles may be arranged in a substrate processing apparatus (so-called spin scrubber or the like) that removes particles and the like attached to the substrate. Further, an inspection unit for inspecting the firing state of the interlayer insulating film may be arranged in an apparatus for forming an interlayer insulating film by applying SOD (Spin-on-Dielectronics) on the substrate. Further, the inspection unit may be arranged in a substrate processing apparatus that carries in a substrate processed by another substrate processing apparatus, inspects the substrate, and feeds the inspection result to the processing condition. In any case, by selecting a recipe number from the operation panel 61 and designating an inspection recipe to be used in the inspection unit, it is possible to select an inspection recipe from the substrate processing apparatus side. The condition regarding can be easily set.

[0053]

As described above, according to the first aspect of the invention, before the loading / unloading means loads the substrate into the inspection section,
Since the condition related to the inspection of the substrate specified by the specifying unit is transmitted to the inspection unit, the condition related to the inspection can be specified from the substrate processing apparatus side, and the condition related to the inspection of the substrate can be easily set.

According to the second aspect of the present invention, the inspection unit holds a plurality of inspection recipes in which the inspection conditions are described, and the designating means selects one of the plurality of inspection recipes so that the inspection conditions are satisfied. Therefore, it is possible to easily set the condition relating to the inspection of the board through the inspection recipe.

According to the third aspect of the present invention, different codes are associated with the plurality of inspection recipes, and the designating means selects the code associated with any of the plurality of inspection recipes to perform the inspection. The inspection recipe can be easily specified because the conditions for the inspection are specified.

Further, according to the invention of claim 4, since the code selected by the designating means is described in the flow recipe describing the processing procedure of the substrate, the substrate processing apparatus side surely designates the condition concerning the inspection. Therefore, it is possible to easily set the conditions regarding the inspection of the substrate.

[Brief description of drawings]

FIG. 1 is a perspective view showing an outline of an entire substrate processing apparatus according to the present invention.

FIG. 2 is a plan view showing a schematic configuration of the substrate processing apparatus of FIG.

FIG. 3 is an external perspective view of a transfer robot.

FIG. 4 is a functional block diagram for explaining a control mechanism of the substrate processing apparatus.

FIG. 5 is a diagram showing a plurality of inspection recipes held by an inspection unit.

[Explanation of symbols]

1 Substrate processing equipment 10, 20 inspection unit 50 control unit 57 Transmitter 61 Operation panel TF transfer robot SC coating unit SD development unit W board

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Kenji Kasaki             4-chome Tenjin, which runs up to Teranouchi, Horikawa-dori, Kamigyo-ku, Kyoto             1 Kitamachi No. 1 Dai Nippon Screen Manufacturing Co., Ltd.             Inside the company (72) Inventor Masami Otani             4-chome Tenjin, which runs up to Teranouchi, Horikawa-dori, Kamigyo-ku, Kyoto             1 Kitamachi No. 1 Dai Nippon Screen Manufacturing Co., Ltd.             Inside the company (72) Inventor Shuichi Nishimura             4-chome Tenjin, which runs up to Teranouchi, Horikawa-dori, Kamigyo-ku, Kyoto             1 Kitamachi No. 1 Dai Nippon Screen Manufacturing Co., Ltd.             Inside the company F term (reference) 4M106 AA01 DG03 DG08 DJ38                 5F031 CA01 CA02 CA05 DA01 DA08                       FA01 FA07 FA11 FA13 GA02                       GA43 GA47 GA48 GA49 GA50                       JA32 JA37 JA45 LA12 LA13                       MA02 MA03 MA11 MA23 MA24                       MA26 MA33 PA04                 5F046 AA28 CD01 CD05 JA21

Claims (4)

[Claims] 1. A substrate processing apparatus including a processing unit for performing a predetermined process on a substrate, comprising: an inspection unit for performing a predetermined inspection on the substrate; and a carry-in / carry-out for carrying the substrate in and out of the inspection unit. A unit, a designating unit that designates a condition related to the inspection in the inspection unit, and a condition related to the inspection regarding the substrate specified by the designating unit before the loading / unloading unit loads the substrate into the inspection unit. A substrate processing apparatus, comprising: a transmission unit that transmits the inspection unit. 2. The substrate processing apparatus according to claim 1, wherein the inspection unit holds a plurality of inspection recipes in which conditions regarding inspection are described, and the designating unit selects one of the plurality of inspection recipes. A substrate processing apparatus, characterized in that conditions for inspection are designated thereby. 3. The substrate processing apparatus according to claim 2, wherein different codes are associated with the plurality of inspection recipes, and the designating unit assigns a code associated with any of the plurality of inspection recipes. A substrate processing apparatus, characterized in that conditions for inspection are specified by selection. 4. The substrate processing apparatus according to claim 3, wherein the code selected by the designating unit is described in a flow recipe that describes a substrate processing procedure.