KR102653979B1 - 광/습기 경화형 수지 조성물, 전자 부품용 접착제, 및, 표시 소자용 접착제 - Google Patents

광/습기 경화형 수지 조성물, 전자 부품용 접착제, 및, 표시 소자용 접착제 Download PDF

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KR102653979B1
KR102653979B1 KR1020177034627A KR20177034627A KR102653979B1 KR 102653979 B1 KR102653979 B1 KR 102653979B1 KR 1020177034627 A KR1020177034627 A KR 1020177034627A KR 20177034627 A KR20177034627 A KR 20177034627A KR 102653979 B1 KR102653979 B1 KR 102653979B1
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South Korea
Prior art keywords
moisture
curable resin
resin composition
meth
formula
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KR1020177034627A
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Korean (ko)
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KR20180089280A (ko
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아키라 유우키
도루 다카하시
다쿠미 기다
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세키스이가가쿠 고교가부시키가이샤
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F20/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
    • C08F20/02—Monocarboxylic acids having less than ten carbon atoms, Derivatives thereof
    • C08F20/10—Esters
    • C08F20/12—Esters of monohydric alcohols or phenols
    • C08F20/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
    • C08F20/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08—Processes
    • C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/544—Silicon-containing compounds containing nitrogen
    • C08K5/5477—Silicon-containing compounds containing nitrogen containing nitrogen in a heterocyclic ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/548—Silicon-containing compounds containing sulfur
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D175/00—Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
    • C09D175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Materials Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polymerisation Methods In General (AREA)
  • Graft Or Block Polymers (AREA)
  • Materials For Photolithography (AREA)
KR1020177034627A 2015-12-02 2016-12-01 광/습기 경화형 수지 조성물, 전자 부품용 접착제, 및, 표시 소자용 접착제 KR102653979B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015235796 2015-12-02
JPJP-P-2015-235796 2015-12-02
PCT/JP2016/085708 WO2017094831A1 (ja) 2015-12-02 2016-12-01 光湿気硬化型樹脂組成物、電子部品用接着剤、及び、表示素子用接着剤

Publications (2)

Publication Number Publication Date
KR20180089280A KR20180089280A (ko) 2018-08-08
KR102653979B1 true KR102653979B1 (ko) 2024-04-02

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KR1020177034627A KR102653979B1 (ko) 2015-12-02 2016-12-01 광/습기 경화형 수지 조성물, 전자 부품용 접착제, 및, 표시 소자용 접착제

Country Status (5)

Country Link
JP (1) JP6921535B2 (ja)
KR (1) KR102653979B1 (ja)
CN (1) CN107709369B (ja)
TW (1) TWI712665B (ja)
WO (1) WO2017094831A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2019203277A1 (ja) * 2018-04-19 2021-03-18 積水化学工業株式会社 硬化性樹脂組成物、硬化体、電子部品及び組立部品
WO2020166414A1 (ja) * 2019-02-14 2020-08-20 日立化成株式会社 反応性ホットメルト接着剤組成物、並びに接着体及びその製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006521447A (ja) * 2003-03-13 2006-09-21 エイチ・ビー・フラー・ライセンジング・アンド・ファイナンシング・インコーポレーテッド 水分硬化性放射線硬化性シーラント組成物
JP2008291169A (ja) * 2007-05-28 2008-12-04 Konishi Co Ltd 硬化性樹脂組成物

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JP2000178342A (ja) 1998-12-17 2000-06-27 Sumitomo Bakelite Co Ltd 絶縁ペースト
JP3825368B2 (ja) * 2002-05-16 2006-09-27 アトミクス株式会社 湿気硬化型塗料組成物
JP4196160B2 (ja) * 2002-07-31 2008-12-17 株式会社スリーボンド アルミニウム合金用接着剤組成物
JP2006265349A (ja) * 2005-03-23 2006-10-05 Lintec Corp 感圧接着剤組成物及び光学部材
JP5013585B2 (ja) 2006-09-06 2012-08-29 日立化成ポリマー株式会社 反応性ホットメルト接着剤組成物及びそれを用いた接着方法
JP5228370B2 (ja) 2007-04-27 2013-07-03 東亞合成株式会社 一液湿気硬化型ウレタン系ホットメルト接着剤組成物及びその使用方法
JP2010053334A (ja) * 2008-07-31 2010-03-11 Sekisui Chem Co Ltd エポキシ系樹脂組成物、プリプレグ、硬化体、シート状成形体、積層板及び多層積層板
JP2012078390A (ja) * 2010-09-30 2012-04-19 Dainippon Printing Co Ltd 電磁波反射フィルム
JP5775726B2 (ja) * 2011-04-13 2015-09-09 株式会社ブリヂストン ゴム組成物及びそれを用いたタイヤ
WO2013016133A2 (en) * 2011-07-22 2013-01-31 H.B. Fuller Company A one-component, dual-cure adhesive for use on electronics
SG11201606984PA (en) * 2014-03-28 2016-09-29 Lintec Corp Protective film-forming film and method of manufacturing semiconductor chip with protective film
CN105814094B (zh) * 2014-05-13 2019-01-18 积水化学工业株式会社 光湿固化型树脂组合物、电子部件用粘接剂及显示元件用粘接剂
JP6039080B2 (ja) * 2014-05-30 2016-12-07 積水化学工業株式会社 狭額縁設計表示素子用接着剤

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006521447A (ja) * 2003-03-13 2006-09-21 エイチ・ビー・フラー・ライセンジング・アンド・ファイナンシング・インコーポレーテッド 水分硬化性放射線硬化性シーラント組成物
JP2008291169A (ja) * 2007-05-28 2008-12-04 Konishi Co Ltd 硬化性樹脂組成物

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Publication number Publication date
CN107709369B (zh) 2021-04-23
TWI712665B (zh) 2020-12-11
TW201734161A (zh) 2017-10-01
WO2017094831A1 (ja) 2017-06-08
CN107709369A (zh) 2018-02-16
JPWO2017094831A1 (ja) 2018-09-20
KR20180089280A (ko) 2018-08-08
JP6921535B2 (ja) 2021-08-18

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