KR102653153B1 - 기판 세정 장치 및 기판 세정 방법 - Google Patents

기판 세정 장치 및 기판 세정 방법 Download PDF

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Publication number
KR102653153B1
KR102653153B1 KR1020210187137A KR20210187137A KR102653153B1 KR 102653153 B1 KR102653153 B1 KR 102653153B1 KR 1020210187137 A KR1020210187137 A KR 1020210187137A KR 20210187137 A KR20210187137 A KR 20210187137A KR 102653153 B1 KR102653153 B1 KR 102653153B1
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South Korea
Prior art keywords
substrate
cleaning
brush
force
cleaning tool
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KR1020210187137A
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English (en)
Korean (ko)
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KR20220094161A (ko
Inventor
다카시 시노하라
Original Assignee
가부시키가이샤 스크린 홀딩스
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Publication of KR20220094161A publication Critical patent/KR20220094161A/ko
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    • H01L21/67046—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0412—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
    • B08B1/12—Brushes
    • H01L21/67253—
    • H01L21/67288—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0616—Monitoring of warpages, curvatures, damages, defects or the like
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning In General (AREA)
  • Cleaning By Liquid Or Steam (AREA)
KR1020210187137A 2020-12-28 2021-12-24 기판 세정 장치 및 기판 세정 방법 Active KR102653153B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2020-218543 2020-12-28
JP2020218543A JP7653785B2 (ja) 2020-12-28 2020-12-28 基板洗浄装置および基板洗浄方法

Publications (2)

Publication Number Publication Date
KR20220094161A KR20220094161A (ko) 2022-07-05
KR102653153B1 true KR102653153B1 (ko) 2024-04-01

Family

ID=82136388

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Application Number Title Priority Date Filing Date
KR1020210187137A Active KR102653153B1 (ko) 2020-12-28 2021-12-24 기판 세정 장치 및 기판 세정 방법

Country Status (4)

Country Link
JP (1) JP7653785B2 (https=)
KR (1) KR102653153B1 (https=)
CN (1) CN114695186B (https=)
TW (1) TWI841883B (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7843692B2 (ja) * 2022-12-23 2026-04-10 株式会社Ｓｃｒｅｅｎホールディングス 基板洗浄装置および基板洗浄方法
JP2024091091A (ja) * 2022-12-23 2024-07-04 株式会社Ｓｃｒｅｅｎホールディングス 基板洗浄装置および基板洗浄方法
JP2025135997A (ja) * 2024-03-06 2025-09-19 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002050602A (ja) 2000-08-01 2002-02-15 Ebara Corp 基板洗浄装置
JP2020150272A (ja) 2019-02-27 2020-09-17 株式会社荏原製作所 基板洗浄装置および基板洗浄装置で実行される方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10340873A (ja) * 1997-06-10 1998-12-22 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2000188274A (ja) * 1998-12-21 2000-07-04 Sony Corp 基板洗浄装置
JP4824664B2 (ja) * 2007-03-09 2011-11-30 大日本スクリーン製造株式会社 基板処理装置
JP4928343B2 (ja) * 2007-04-27 2012-05-09 大日本スクリーン製造株式会社 基板処理装置
JP5385537B2 (ja) * 2008-02-26 2014-01-08 大日本スクリーン製造株式会社 基板処理装置
CN102592961A (zh) * 2011-01-12 2012-07-18 柏连企业股份有限公司 晶片下片排片机
JP5878441B2 (ja) * 2012-08-20 2016-03-08 株式会社荏原製作所 基板洗浄装置及び基板処理装置
JP5904169B2 (ja) * 2013-07-23 2016-04-13 東京エレクトロン株式会社 基板洗浄装置、基板洗浄方法及び記憶媒体
JP6210935B2 (ja) * 2013-11-13 2017-10-11 東京エレクトロン株式会社 研磨洗浄機構、基板処理装置及び基板処理方法
JP2015220402A (ja) * 2014-05-20 2015-12-07 株式会社荏原製作所 基板洗浄装置および基板洗浄装置で実行される方法
JP6740065B2 (ja) * 2016-09-13 2020-08-12 株式会社Ｓｃｒｅｅｎホールディングス 基板洗浄装置、基板処理装置、基板洗浄方法および基板処理方法
JP6810631B2 (ja) * 2017-02-14 2021-01-06 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
TWI834489B (zh) * 2017-12-13 2024-03-01 日商東京威力科創股份有限公司 基板處理裝置
JP2019216153A (ja) * 2018-06-12 2019-12-19 ルネサスエレクトロニクス株式会社 半導体装置の製造方法及び洗浄装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002050602A (ja) 2000-08-01 2002-02-15 Ebara Corp 基板洗浄装置
JP2020150272A (ja) 2019-02-27 2020-09-17 株式会社荏原製作所 基板洗浄装置および基板洗浄装置で実行される方法

Also Published As

Publication number Publication date
CN114695186A (zh) 2022-07-01
JP7653785B2 (ja) 2025-03-31
JP2022103731A (ja) 2022-07-08
CN114695186B (zh) 2026-02-10
KR20220094161A (ko) 2022-07-05
TWI841883B (zh) 2024-05-11
TW202224791A (zh) 2022-07-01

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