CN114695186B - 衬底洗净装置及衬底洗净方法 - Google Patents

衬底洗净装置及衬底洗净方法

Info

Publication number
CN114695186B
CN114695186B CN202111571492.6A CN202111571492A CN114695186B CN 114695186 B CN114695186 B CN 114695186B CN 202111571492 A CN202111571492 A CN 202111571492A CN 114695186 B CN114695186 B CN 114695186B
Authority
CN
China
Prior art keywords
substrate
cleaning
cleaning tool
force
brush
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202111571492.6A
Other languages
English (en)
Chinese (zh)
Other versions
CN114695186A (zh
Inventor
篠原敬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Screen Holdings Co Ltd
Original Assignee
Screen Holdings Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Screen Holdings Co Ltd filed Critical Screen Holdings Co Ltd
Publication of CN114695186A publication Critical patent/CN114695186A/zh
Application granted granted Critical
Publication of CN114695186B publication Critical patent/CN114695186B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0412—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
    • B08B1/12—Brushes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0616—Monitoring of warpages, curvatures, damages, defects or the like
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning In General (AREA)
  • Cleaning By Liquid Or Steam (AREA)
CN202111571492.6A 2020-12-28 2021-12-21 衬底洗净装置及衬底洗净方法 Active CN114695186B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-218543 2020-12-28
JP2020218543A JP7653785B2 (ja) 2020-12-28 2020-12-28 基板洗浄装置および基板洗浄方法

Publications (2)

Publication Number Publication Date
CN114695186A CN114695186A (zh) 2022-07-01
CN114695186B true CN114695186B (zh) 2026-02-10

Family

ID=82136388

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202111571492.6A Active CN114695186B (zh) 2020-12-28 2021-12-21 衬底洗净装置及衬底洗净方法

Country Status (4)

Country Link
JP (1) JP7653785B2 (https=)
KR (1) KR102653153B1 (https=)
CN (1) CN114695186B (https=)
TW (1) TWI841883B (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7843692B2 (ja) * 2022-12-23 2026-04-10 株式会社Ｓｃｒｅｅｎホールディングス 基板洗浄装置および基板洗浄方法
JP2024091091A (ja) * 2022-12-23 2024-07-04 株式会社Ｓｃｒｅｅｎホールディングス 基板洗浄装置および基板洗浄方法
JP2025135997A (ja) * 2024-03-06 2025-09-19 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201537632A (zh) * 2013-11-13 2015-10-01 東京威力科創股份有限公司 硏磨洗淨機構、基板處理裝置及基板處理方法
CN109962027A (zh) * 2017-12-13 2019-07-02 东京毅力科创株式会社 基板处理装置和基板处理方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10340873A (ja) * 1997-06-10 1998-12-22 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2000188274A (ja) * 1998-12-21 2000-07-04 Sony Corp 基板洗浄装置
JP3953716B2 (ja) 2000-08-01 2007-08-08 株式会社荏原製作所 基板洗浄装置
JP4824664B2 (ja) * 2007-03-09 2011-11-30 大日本スクリーン製造株式会社 基板処理装置
JP4928343B2 (ja) * 2007-04-27 2012-05-09 大日本スクリーン製造株式会社 基板処理装置
JP5385537B2 (ja) * 2008-02-26 2014-01-08 大日本スクリーン製造株式会社 基板処理装置
CN102592961A (zh) * 2011-01-12 2012-07-18 柏连企业股份有限公司 晶片下片排片机
JP5878441B2 (ja) * 2012-08-20 2016-03-08 株式会社荏原製作所 基板洗浄装置及び基板処理装置
JP5904169B2 (ja) * 2013-07-23 2016-04-13 東京エレクトロン株式会社 基板洗浄装置、基板洗浄方法及び記憶媒体
JP2015220402A (ja) * 2014-05-20 2015-12-07 株式会社荏原製作所 基板洗浄装置および基板洗浄装置で実行される方法
JP6740065B2 (ja) * 2016-09-13 2020-08-12 株式会社Ｓｃｒｅｅｎホールディングス 基板洗浄装置、基板処理装置、基板洗浄方法および基板処理方法
JP6810631B2 (ja) * 2017-02-14 2021-01-06 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP2019216153A (ja) * 2018-06-12 2019-12-19 ルネサスエレクトロニクス株式会社 半導体装置の製造方法及び洗浄装置
JP6895565B2 (ja) 2019-02-27 2021-06-30 株式会社荏原製作所 基板洗浄装置および基板洗浄装置で実行される方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201537632A (zh) * 2013-11-13 2015-10-01 東京威力科創股份有限公司 硏磨洗淨機構、基板處理裝置及基板處理方法
CN109962027A (zh) * 2017-12-13 2019-07-02 东京毅力科创株式会社 基板处理装置和基板处理方法

Also Published As

Publication number Publication date
KR102653153B1 (ko) 2024-04-01
CN114695186A (zh) 2022-07-01
JP7653785B2 (ja) 2025-03-31
JP2022103731A (ja) 2022-07-08
KR20220094161A (ko) 2022-07-05
TWI841883B (zh) 2024-05-11
TW202224791A (zh) 2022-07-01

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