KR102630496B1 - 반도체 디바이스의 오정합을 측정하는 데 유용한 디바이스 스케일 피쳐를 갖는 오정합 타겟 - Google Patents

반도체 디바이스의 오정합을 측정하는 데 유용한 디바이스 스케일 피쳐를 갖는 오정합 타겟 Download PDF

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KR102630496B1
KR102630496B1 KR1020227037760A KR20227037760A KR102630496B1 KR 102630496 B1 KR102630496 B1 KR 102630496B1 KR 1020227037760 A KR1020227037760 A KR 1020227037760A KR 20227037760 A KR20227037760 A KR 20227037760A KR 102630496 B1 KR102630496 B1 KR 102630496B1
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KR20230002526A (ko
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로이 볼코비치
리란 예루살미
라비브 요하난
마크 기노브커
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케이엘에이 코포레이션
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    • H01L23/544—
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
    • G01B21/22—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring angles or tapers; for testing the alignment of axes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70625—Dimensions, e.g. line width, critical dimension [CD], profile, sidewall angle or edge roughness
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H01L2223/54426—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/301—Marks applied to devices, e.g. for alignment or identification for alignment

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
KR1020227037760A 2020-04-15 2020-06-25 반도체 디바이스의 오정합을 측정하는 데 유용한 디바이스 스케일 피쳐를 갖는 오정합 타겟 Active KR102630496B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202063010096P 2020-04-15 2020-04-15
US63/010,096 2020-04-15
PCT/US2020/039475 WO2021211154A1 (en) 2020-04-15 2020-06-25 Misregistration target having device-scaled features useful in measuring misregistration of semiconductor devices

Publications (2)

Publication Number Publication Date
KR20230002526A KR20230002526A (ko) 2023-01-05
KR102630496B1 true KR102630496B1 (ko) 2024-01-29

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Country Status (7)

Country Link
US (1) US11532566B2 (https=)
EP (1) EP4111495A4 (https=)
JP (1) JP7369306B2 (https=)
KR (1) KR102630496B1 (https=)
CN (1) CN115428139B (https=)
TW (1) TWI851889B (https=)
WO (1) WO2021211154A1 (https=)

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US12416867B2 (en) * 2022-09-22 2025-09-16 United Microelectronics Corp. Overlay target and overlay method

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Also Published As

Publication number Publication date
CN115428139A (zh) 2022-12-02
CN115428139B (zh) 2024-04-12
TWI851889B (zh) 2024-08-11
EP4111495A1 (en) 2023-01-04
JP2023522847A (ja) 2023-06-01
KR20230002526A (ko) 2023-01-05
US20220013468A1 (en) 2022-01-13
JP7369306B2 (ja) 2023-10-25
EP4111495A4 (en) 2024-04-10
WO2021211154A1 (en) 2021-10-21
TW202205032A (zh) 2022-02-01
US11532566B2 (en) 2022-12-20

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