KR102615097B1 - 회로 접속용 접착제 조성물 및 구조체 - Google Patents

회로 접속용 접착제 조성물 및 구조체 Download PDF

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Publication number
KR102615097B1
KR102615097B1 KR1020187017184A KR20187017184A KR102615097B1 KR 102615097 B1 KR102615097 B1 KR 102615097B1 KR 1020187017184 A KR1020187017184 A KR 1020187017184A KR 20187017184 A KR20187017184 A KR 20187017184A KR 102615097 B1 KR102615097 B1 KR 102615097B1
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KR
South Korea
Prior art keywords
mass
circuit
adhesive composition
circuit connection
parts
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KR1020187017184A
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English (en)
Korean (ko)
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KR20180084929A (ko
Inventor
도모키 모리지리
가즈야 마츠다
마사루 다나카
다카시 다츠자와
겐고 시노하라
야스노리 가와바타
Original Assignee
가부시끼가이샤 레조낙
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Application filed by 가부시끼가이샤 레조낙 filed Critical 가부시끼가이샤 레조낙
Publication of KR20180084929A publication Critical patent/KR20180084929A/ko
Application granted granted Critical
Publication of KR102615097B1 publication Critical patent/KR102615097B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Combinations Of Printed Boards (AREA)
KR1020187017184A 2015-11-25 2016-11-24 회로 접속용 접착제 조성물 및 구조체 KR102615097B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015229924 2015-11-25
JPJP-P-2015-229924 2015-11-25
PCT/JP2016/084747 WO2017090659A1 (ja) 2015-11-25 2016-11-24 回路接続用接着剤組成物及び構造体

Publications (2)

Publication Number Publication Date
KR20180084929A KR20180084929A (ko) 2018-07-25
KR102615097B1 true KR102615097B1 (ko) 2023-12-18

Family

ID=58764257

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020187017184A KR102615097B1 (ko) 2015-11-25 2016-11-24 회로 접속용 접착제 조성물 및 구조체

Country Status (5)

Country Link
JP (1) JP6870618B2 (zh)
KR (1) KR102615097B1 (zh)
CN (2) CN118291047A (zh)
TW (3) TWI836720B (zh)
WO (1) WO2017090659A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112752802B (zh) 2018-09-27 2023-03-03 日产化学株式会社 包含无机氧化物粒子的丙烯酸系涂布组合物
JPWO2020184583A1 (zh) * 2019-03-13 2020-09-17
KR20230135612A (ko) * 2021-01-25 2023-09-25 가부시끼가이샤 레조낙 필름상 접착제 및 접속 구조체의 제조 방법
JP2024042257A (ja) * 2022-09-15 2024-03-28 株式会社レゾナック 接着剤組成物、接着剤フィルム、接続構造体及びその製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010106244A (ja) * 2008-09-30 2010-05-13 Sony Chemical & Information Device Corp アクリル系絶縁性接着剤
JP2014024949A (ja) * 2012-07-26 2014-02-06 Hitachi Chemical Co Ltd 回路接続用接着剤、回路部材の接続構造体及び太陽電池モジュール

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006199778A (ja) 2005-01-19 2006-08-03 Hitachi Chem Co Ltd 接着剤組成物、回路接続用接着剤及びこれを用いた回路接続方法、接続体
KR20100080628A (ko) 2007-11-12 2010-07-09 히다치 가세고교 가부시끼가이샤 회로 접속 재료, 및 회로 부재의 접속 구조
WO2011111784A1 (ja) * 2010-03-12 2011-09-15 日立化成工業株式会社 接着材リール
JP2012046756A (ja) 2011-09-28 2012-03-08 Hitachi Chem Co Ltd 回路接続用接着剤及びこれらを用いた回路接続方法、接続体
JP5392333B2 (ja) 2011-09-28 2014-01-22 日立化成株式会社 回路接続用接着剤及びこれらを用いた回路接続方法、接続体
JP2012046757A (ja) 2011-09-28 2012-03-08 Hitachi Chem Co Ltd 回路接続用接着剤及びこれらを用いた回路接続方法、接続体
JP6029922B2 (ja) * 2012-10-05 2016-11-24 デクセリアルズ株式会社 回路接続材料及びその製造方法、並びにそれを用いた実装体の製造方法
JP5887304B2 (ja) * 2013-06-21 2016-03-16 株式会社タムラ製作所 異方性導電性ペーストおよびそれを用いたプリント配線基板
JP2015098575A (ja) * 2013-10-16 2015-05-28 日立化成株式会社 接着剤組成物及び接続体
JP6417675B2 (ja) * 2014-03-03 2018-11-07 日立化成株式会社 接着剤組成物及び接続体

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010106244A (ja) * 2008-09-30 2010-05-13 Sony Chemical & Information Device Corp アクリル系絶縁性接着剤
JP2014024949A (ja) * 2012-07-26 2014-02-06 Hitachi Chemical Co Ltd 回路接続用接着剤、回路部材の接続構造体及び太陽電池モジュール

Also Published As

Publication number Publication date
TW201728721A (zh) 2017-08-16
CN108291114A (zh) 2018-07-17
WO2017090659A1 (ja) 2017-06-01
TWI836720B (zh) 2024-03-21
KR20180084929A (ko) 2018-07-25
CN118291047A (zh) 2024-07-05
JP6870618B2 (ja) 2021-05-12
TW202402994A (zh) 2024-01-16
TW202313896A (zh) 2023-04-01
JPWO2017090659A1 (ja) 2018-09-13

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