KR102595962B1 - 감광성 수지 조성물, 감광성 엘리먼트, 레지스터 패턴의 형성 방법 및 프린트 배선판의 제조 방법 - Google Patents

감광성 수지 조성물, 감광성 엘리먼트, 레지스터 패턴의 형성 방법 및 프린트 배선판의 제조 방법 Download PDF

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Publication number
KR102595962B1
KR102595962B1 KR1020177011223A KR20177011223A KR102595962B1 KR 102595962 B1 KR102595962 B1 KR 102595962B1 KR 1020177011223 A KR1020177011223 A KR 1020177011223A KR 20177011223 A KR20177011223 A KR 20177011223A KR 102595962 B1 KR102595962 B1 KR 102595962B1
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KR
South Korea
Prior art keywords
resin composition
photosensitive resin
component
group
mass
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KR1020177011223A
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English (en)
Korean (ko)
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KR20170085038A (ko
Inventor
에미코 오오타
유키코 무라마츠
켄 사와베
쇼타 오카데
상철 이
Original Assignee
가부시끼가이샤 레조낙
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Publication of KR20170085038A publication Critical patent/KR20170085038A/ko
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials For Photolithography (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
KR1020177011223A 2014-11-17 2015-11-17 감광성 수지 조성물, 감광성 엘리먼트, 레지스터 패턴의 형성 방법 및 프린트 배선판의 제조 방법 KR102595962B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014232451 2014-11-17
JPJP-P-2014-232451 2014-11-17
PCT/JP2015/082204 WO2016080375A1 (ja) 2014-11-17 2015-11-17 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法

Publications (2)

Publication Number Publication Date
KR20170085038A KR20170085038A (ko) 2017-07-21
KR102595962B1 true KR102595962B1 (ko) 2023-11-01

Family

ID=56013911

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020177011223A KR102595962B1 (ko) 2014-11-17 2015-11-17 감광성 수지 조성물, 감광성 엘리먼트, 레지스터 패턴의 형성 방법 및 프린트 배선판의 제조 방법

Country Status (5)

Country Link
JP (1) JP6690549B2 (zh)
KR (1) KR102595962B1 (zh)
CN (2) CN107077068B (zh)
TW (1) TWI695225B (zh)
WO (1) WO2016080375A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102230622B1 (ko) 2017-11-24 2021-03-22 주식회사 엘지화학 포토레지스트 조성물 및 이를 이용한 포토레지스트 필름
JP6870657B2 (ja) * 2018-05-17 2021-05-12 信越化学工業株式会社 感光性樹脂組成物、感光性ドライフィルム、及びパターン形成方法
CN114270262A (zh) * 2019-08-22 2022-04-01 富士胶片株式会社 感光性转印部件、电路配线的制造方法及触摸面板的制造方法
TW202422223A (zh) * 2019-10-15 2024-06-01 美商羅門哈斯電子材料有限公司 光致抗蝕劑組成物及圖案形成方法

Citations (2)

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WO2008105552A1 (ja) 2007-02-27 2008-09-04 Jsr Corporation 感放射線性樹脂組成物、液晶表示素子用スペーサーおよび保護膜ならびにそれらの形成方法
WO2013115262A1 (ja) * 2012-02-02 2013-08-08 日立化成株式会社 感光性樹脂組成物及びそれを用いた感光性エレメント、スペーサーの形成方法、並びに、スペーサー

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AU2001266324A1 (en) * 2000-06-22 2002-01-02 Hitachi Chemical Co. Ltd. Photosensitive resin composition, photosensitive element comprising the same, process for producing resist pattern, and process for producing printed circuit board
JP2003140329A (ja) 2001-11-01 2003-05-14 Hitachi Chem Co Ltd 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの製造法およびプリント配線板の製造法
JP2003215790A (ja) 2002-01-25 2003-07-30 Hitachi Ltd 感放射線組成物及び電子装置の製造方法
KR101035914B1 (ko) 2004-07-30 2011-05-23 엘지디스플레이 주식회사 평판 표시 소자 및 그의 제조방법
EP1957198B1 (en) * 2005-11-17 2018-08-22 Lucite International UK Limited Carbonylation of ethylenically unsaturated compounds
US8460852B2 (en) * 2008-04-28 2013-06-11 Hitachi Chemical Company, Ltd. Photosensitive resin composition, photosensitive element, method for forming resist pattern and method for manufacturing printed wiring board
KR20140130234A (ko) * 2010-11-17 2014-11-07 히타치가세이가부시끼가이샤 감광성 수지 조성물, 감광성 엘리먼트, 레지스트 패턴의 형성 방법 및 프린트 배선판의 제조 방법
KR102282817B1 (ko) * 2012-11-20 2021-07-27 쇼와덴코머티리얼즈가부시끼가이샤 감광성 수지 조성물, 감광성 엘리먼트, 레지스터 패턴의 형성 방법 및 프린트 배선판의 제조 방법
JP2015038607A (ja) * 2013-07-16 2015-02-26 三菱化学株式会社 感光性組成物、硬化物、スペーサー及び画像表示装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008105552A1 (ja) 2007-02-27 2008-09-04 Jsr Corporation 感放射線性樹脂組成物、液晶表示素子用スペーサーおよび保護膜ならびにそれらの形成方法
WO2013115262A1 (ja) * 2012-02-02 2013-08-08 日立化成株式会社 感光性樹脂組成物及びそれを用いた感光性エレメント、スペーサーの形成方法、並びに、スペーサー

Also Published As

Publication number Publication date
CN113156767A (zh) 2021-07-23
WO2016080375A1 (ja) 2016-05-26
JPWO2016080375A1 (ja) 2017-08-24
KR20170085038A (ko) 2017-07-21
TW201624131A (zh) 2016-07-01
CN107077068B (zh) 2021-03-12
TWI695225B (zh) 2020-06-01
CN107077068A (zh) 2017-08-18
JP6690549B2 (ja) 2020-04-28

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