KR102590797B1 - 흡착 시스템, 흡착 방법, 및 이를 이용한 성막 장치, 성막 방법, 전자 디바이스의 제조 방법 - Google Patents

흡착 시스템, 흡착 방법, 및 이를 이용한 성막 장치, 성막 방법, 전자 디바이스의 제조 방법 Download PDF

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KR102590797B1
KR102590797B1 KR1020180131560A KR20180131560A KR102590797B1 KR 102590797 B1 KR102590797 B1 KR 102590797B1 KR 1020180131560 A KR1020180131560 A KR 1020180131560A KR 20180131560 A KR20180131560 A KR 20180131560A KR 102590797 B1 KR102590797 B1 KR 102590797B1
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South Korea
Prior art keywords
absorbed
adsorbent
adsorption
electrostatic chuck
alignment mark
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KR1020180131560A
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English (en)
Korean (ko)
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KR20200048915A (ko
Inventor
카즈히토 카시쿠라
히로시 이시이
Original Assignee
캐논 톡키 가부시키가이샤
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Priority to KR1020180131560A priority Critical patent/KR102590797B1/ko
Priority to JP2019074987A priority patent/JP7336867B2/ja
Priority to CN201910478797.9A priority patent/CN111128836B/zh
Publication of KR20200048915A publication Critical patent/KR20200048915A/ko
Application granted granted Critical
Publication of KR102590797B1 publication Critical patent/KR102590797B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682—Mask-wafer alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/20—Changing the shape of the active layer in the devices, e.g. patterning
    • H10K71/231—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers
    • H10K71/233—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers by photolithographic etching

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
KR1020180131560A 2018-10-31 2018-10-31 흡착 시스템, 흡착 방법, 및 이를 이용한 성막 장치, 성막 방법, 전자 디바이스의 제조 방법 KR102590797B1 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020180131560A KR102590797B1 (ko) 2018-10-31 2018-10-31 흡착 시스템, 흡착 방법, 및 이를 이용한 성막 장치, 성막 방법, 전자 디바이스의 제조 방법
JP2019074987A JP7336867B2 (ja) 2018-10-31 2019-04-10 吸着システム、成膜装置、吸着方法、成膜方法、及び電子デバイスの製造方法
CN201910478797.9A CN111128836B (zh) 2018-10-31 2019-06-04 吸附系统及方法、成膜装置及方法、电子器件的制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020180131560A KR102590797B1 (ko) 2018-10-31 2018-10-31 흡착 시스템, 흡착 방법, 및 이를 이용한 성막 장치, 성막 방법, 전자 디바이스의 제조 방법

Publications (2)

Publication Number Publication Date
KR20200048915A KR20200048915A (ko) 2020-05-08
KR102590797B1 true KR102590797B1 (ko) 2023-10-17

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KR1020180131560A KR102590797B1 (ko) 2018-10-31 2018-10-31 흡착 시스템, 흡착 방법, 및 이를 이용한 성막 장치, 성막 방법, 전자 디바이스의 제조 방법

Country Status (3)

Country Link
JP (1) JP7336867B2 (zh)
KR (1) KR102590797B1 (zh)
CN (1) CN111128836B (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022007540A (ja) * 2020-06-26 2022-01-13 キヤノントッキ株式会社 アライメント装置、成膜装置、アライメント方法、電子デバイスの製造方法、プログラム及び記憶媒体
KR20220034993A (ko) * 2020-09-11 2022-03-21 삼성디스플레이 주식회사 증착 장치 및 증착 장치의 마스크 착좌 방법

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005206939A (ja) * 2003-12-26 2005-08-04 Seiko Epson Corp 薄膜形成方法、薄膜形成装置、有機エレクトロルミネッセンス装置の製造方法、有機エレクトロルミネッセンス装置、及び電子機器
JP2008024956A (ja) * 2006-07-18 2008-02-07 Ulvac Japan Ltd アライメント装置及びアライメント方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003332215A (ja) * 2002-05-14 2003-11-21 Toshiba Corp 加工方法、半導体装置の製造方法、及び加工装置
JP2004183044A (ja) * 2002-12-03 2004-07-02 Seiko Epson Corp マスク蒸着方法及び装置、マスク及びマスクの製造方法、表示パネル製造装置、表示パネル並びに電子機器
KR101289345B1 (ko) 2005-07-19 2013-07-29 주성엔지니어링(주) 섀도우 마스크와 이를 이용한 정렬장치
JP2006279081A (ja) * 2006-07-10 2006-10-12 Toshiba Corp 加工方法、半導体装置の製造方法、及び加工装置
JP2010147264A (ja) * 2008-12-19 2010-07-01 Nikon Corp 物体保持装置、物体保持方法、露光方法、露光装置及び電子デバイスの製造方法
JP2013001947A (ja) * 2011-06-15 2013-01-07 Ulvac Japan Ltd アライメント装置
KR102337670B1 (ko) * 2015-03-30 2021-12-09 삼성디스플레이 주식회사 박막 증착 장치 및 이를 이용한 박막 증착 방법

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005206939A (ja) * 2003-12-26 2005-08-04 Seiko Epson Corp 薄膜形成方法、薄膜形成装置、有機エレクトロルミネッセンス装置の製造方法、有機エレクトロルミネッセンス装置、及び電子機器
JP2008024956A (ja) * 2006-07-18 2008-02-07 Ulvac Japan Ltd アライメント装置及びアライメント方法

Also Published As

Publication number Publication date
CN111128836B (zh) 2023-11-14
KR20200048915A (ko) 2020-05-08
JP7336867B2 (ja) 2023-09-01
JP2020070492A (ja) 2020-05-07
CN111128836A (zh) 2020-05-08

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