KR102554514B1 - 감광성 수지 조성물 - Google Patents
감광성 수지 조성물 Download PDFInfo
- Publication number
- KR102554514B1 KR102554514B1 KR1020180034365A KR20180034365A KR102554514B1 KR 102554514 B1 KR102554514 B1 KR 102554514B1 KR 1020180034365 A KR1020180034365 A KR 1020180034365A KR 20180034365 A KR20180034365 A KR 20180034365A KR 102554514 B1 KR102554514 B1 KR 102554514B1
- Authority
- KR
- South Korea
- Prior art keywords
- resin composition
- photosensitive resin
- mass
- component
- photosensitive
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0042—Photosensitive materials with inorganic or organometallic light-sensitive compounds not otherwise provided for, e.g. inorganic resists
- G03F7/0043—Chalcogenides; Silicon, germanium, arsenic or derivatives thereof; Metals, oxides or alloys thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/031—Organic compounds not covered by group G03F7/029
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Metallurgy (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Materials For Photolithography (AREA)
- Polymerisation Methods In General (AREA)
- Epoxy Resins (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017063498A JP6720910B2 (ja) | 2017-03-28 | 2017-03-28 | 感光性樹脂組成物 |
JPJP-P-2017-063498 | 2017-03-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20180109726A KR20180109726A (ko) | 2018-10-08 |
KR102554514B1 true KR102554514B1 (ko) | 2023-07-13 |
Family
ID=63864261
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020180034365A KR102554514B1 (ko) | 2017-03-28 | 2018-03-26 | 감광성 수지 조성물 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP6720910B2 (zh) |
KR (1) | KR102554514B1 (zh) |
TW (1) | TWI776864B (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112266576A (zh) * | 2020-11-04 | 2021-01-26 | 纽宝力精化(广州)有限公司 | 一种纸基板用溴化环氧树脂组合物 |
CN112759668A (zh) * | 2020-12-25 | 2021-05-07 | 深圳市容大感光科技股份有限公司 | 光引发剂组合物、含有其的感光阻焊组合物及印刷电路板 |
CN113311664A (zh) * | 2021-06-24 | 2021-08-27 | 江苏广信感光新材料股份有限公司 | 一种具有稠环萘结构的碱可溶感光性树脂及其组合物和制备方法 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006335807A (ja) | 2005-05-31 | 2006-12-14 | Taiyo Ink Mfg Ltd | 絶縁性硬化性樹脂組成物及びその硬化物 |
WO2009125806A1 (ja) | 2008-04-10 | 2009-10-15 | リンテック株式会社 | エネルギー線硬化性層用樹脂組成物および貫通孔形成用シート |
JP2010205127A (ja) | 2009-03-05 | 2010-09-16 | Nec Corp | ラック収容機器管理システム及びラック収容機器管理方法 |
JP2012133364A (ja) | 2010-12-21 | 2012-07-12 | Dongwoo Fine-Chem Co Ltd | スペーサー形成用感光性樹脂組成物、これを用いて製造された表示装置用スペーサー及びこれを備えた表示装置 |
WO2013161756A1 (ja) | 2012-04-23 | 2013-10-31 | 日立化成株式会社 | 感光性樹脂組成物、感光性フィルム、永久マスクレジスト及び永久マスクレジストの製造方法 |
JP2015011265A (ja) * | 2013-07-01 | 2015-01-19 | 日立化成株式会社 | 感光性樹脂組成物、これを用いた感光性フィルム、永久レジスト及び永久レジストの製造方法 |
WO2016006264A1 (ja) * | 2014-07-10 | 2016-01-14 | 太陽インキ製造株式会社 | 樹脂絶縁層の形成方法、樹脂絶縁層およびプリント配線板 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4023594B2 (ja) * | 2002-07-09 | 2007-12-19 | 日本化薬株式会社 | エポキシ樹脂組成物、及びその硬化物 |
TW200710571A (en) * | 2005-05-31 | 2007-03-16 | Taiyo Ink Mfg Co Ltd | Curable resin composition and cured object obtained therefrom |
JP2012073600A (ja) * | 2010-08-31 | 2012-04-12 | Fujifilm Corp | 感光性組成物、並びに、感光性フィルム、永久パターン、永久パターン形成方法、及びプリント基板 |
KR102003575B1 (ko) * | 2011-08-10 | 2019-07-24 | 히타치가세이가부시끼가이샤 | 감광성 수지 조성물, 감광성 필름, 영구 레지스터 및 영구 레지스터의 제조 방법 |
JP5729495B2 (ja) | 2014-01-24 | 2015-06-03 | 日立化成株式会社 | 感光性樹脂組成物を用いた感光性エレメント、ソルダーレジスト及びプリント配線板 |
TWI656403B (zh) * | 2015-01-28 | 2019-04-11 | 日商互應化學工業股份有限公司 | 感光性樹脂組成物、乾膜及印刷線路板(一) |
JP6704224B2 (ja) * | 2015-04-15 | 2020-06-03 | 太陽インキ製造株式会社 | 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板 |
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2017
- 2017-03-28 JP JP2017063498A patent/JP6720910B2/ja active Active
-
2018
- 2018-03-08 TW TW107107822A patent/TWI776864B/zh active
- 2018-03-26 KR KR1020180034365A patent/KR102554514B1/ko active IP Right Grant
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006335807A (ja) | 2005-05-31 | 2006-12-14 | Taiyo Ink Mfg Ltd | 絶縁性硬化性樹脂組成物及びその硬化物 |
WO2009125806A1 (ja) | 2008-04-10 | 2009-10-15 | リンテック株式会社 | エネルギー線硬化性層用樹脂組成物および貫通孔形成用シート |
JP2010205127A (ja) | 2009-03-05 | 2010-09-16 | Nec Corp | ラック収容機器管理システム及びラック収容機器管理方法 |
JP2012133364A (ja) | 2010-12-21 | 2012-07-12 | Dongwoo Fine-Chem Co Ltd | スペーサー形成用感光性樹脂組成物、これを用いて製造された表示装置用スペーサー及びこれを備えた表示装置 |
WO2013161756A1 (ja) | 2012-04-23 | 2013-10-31 | 日立化成株式会社 | 感光性樹脂組成物、感光性フィルム、永久マスクレジスト及び永久マスクレジストの製造方法 |
JP2015011265A (ja) * | 2013-07-01 | 2015-01-19 | 日立化成株式会社 | 感光性樹脂組成物、これを用いた感光性フィルム、永久レジスト及び永久レジストの製造方法 |
WO2016006264A1 (ja) * | 2014-07-10 | 2016-01-14 | 太陽インキ製造株式会社 | 樹脂絶縁層の形成方法、樹脂絶縁層およびプリント配線板 |
Also Published As
Publication number | Publication date |
---|---|
TW201842407A (zh) | 2018-12-01 |
KR20180109726A (ko) | 2018-10-08 |
JP6720910B2 (ja) | 2020-07-08 |
TWI776864B (zh) | 2022-09-11 |
JP2018165798A (ja) | 2018-10-25 |
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