KR102541675B1 - 기판 처리 장치, 및 기판 처리 방법 - Google Patents

기판 처리 장치, 및 기판 처리 방법 Download PDF

Info

Publication number
KR102541675B1
KR102541675B1 KR1020237001511A KR20237001511A KR102541675B1 KR 102541675 B1 KR102541675 B1 KR 102541675B1 KR 1020237001511 A KR1020237001511 A KR 1020237001511A KR 20237001511 A KR20237001511 A KR 20237001511A KR 102541675 B1 KR102541675 B1 KR 102541675B1
Authority
KR
South Korea
Prior art keywords
liquid
opening degree
pipe
substrate
flow path
Prior art date
Application number
KR1020237001511A
Other languages
English (en)
Korean (ko)
Other versions
KR20230014863A (ko
Inventor
다카히로 야마구치
Original Assignee
가부시키가이샤 스크린 홀딩스
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 스크린 홀딩스 filed Critical 가부시키가이샤 스크린 홀딩스
Publication of KR20230014863A publication Critical patent/KR20230014863A/ko
Application granted granted Critical
Publication of KR102541675B1 publication Critical patent/KR102541675B1/ko

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • B05C11/1007—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to condition of liquid or other fluent material
    • B05C11/1013—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to condition of liquid or other fluent material responsive to flow or pressure of liquid or other fluent material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/027—Coating heads with several outlets, e.g. aligned transversally to the moving direction of a web to be coated
    • B05C5/0275—Coating heads with several outlets, e.g. aligned transversally to the moving direction of a web to be coated flow controlled, e.g. by a valve
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
KR1020237001511A 2018-09-21 2019-08-20 기판 처리 장치, 및 기판 처리 방법 KR102541675B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2018177249A JP7132054B2 (ja) 2018-09-21 2018-09-21 基板処理装置、及び基板処理方法
JPJP-P-2018-177249 2018-09-21
KR1020217007888A KR102489705B1 (ko) 2018-09-21 2019-08-20 기판 처리 장치, 및 기판 처리 방법
PCT/JP2019/032435 WO2020059385A1 (ja) 2018-09-21 2019-08-20 基板処理装置、及び基板処理方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020217007888A Division KR102489705B1 (ko) 2018-09-21 2019-08-20 기판 처리 장치, 및 기판 처리 방법

Publications (2)

Publication Number Publication Date
KR20230014863A KR20230014863A (ko) 2023-01-30
KR102541675B1 true KR102541675B1 (ko) 2023-06-13

Family

ID=69887088

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020237001511A KR102541675B1 (ko) 2018-09-21 2019-08-20 기판 처리 장치, 및 기판 처리 방법
KR1020217007888A KR102489705B1 (ko) 2018-09-21 2019-08-20 기판 처리 장치, 및 기판 처리 방법

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020217007888A KR102489705B1 (ko) 2018-09-21 2019-08-20 기판 처리 장치, 및 기판 처리 방법

Country Status (5)

Country Link
JP (1) JP7132054B2 (zh)
KR (2) KR102541675B1 (zh)
CN (1) CN112753094A (zh)
TW (1) TWI722550B (zh)
WO (1) WO2020059385A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102585104B1 (ko) * 2021-06-03 2023-10-06 세메스 주식회사 액 처리 장치 및 약액 제어 방법
KR20230010072A (ko) 2021-07-08 2023-01-18 주식회사 제우스 식각 장치 및 그 제어 방법
CN115881578A (zh) * 2021-09-29 2023-03-31 盛美半导体设备(上海)股份有限公司 基板处理装置
JP2023098079A (ja) * 2021-12-28 2023-07-10 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置及び基板処理方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008267640A (ja) 2007-04-17 2008-11-06 Sumitomo Heavy Ind Ltd 冷却装置および半導体検査装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3744574B2 (ja) * 1995-10-20 2006-02-15 Ｔｄｋ株式会社 間欠塗布方法
JP4298384B2 (ja) * 2003-06-04 2009-07-15 大日本スクリーン製造株式会社 液供給装置および基板処理装置
JP5319942B2 (ja) 2008-03-18 2013-10-16 大日本スクリーン製造株式会社 ダイヤフラムバルブおよびこれを備えた基板処理装置
JP5714449B2 (ja) * 2011-08-25 2015-05-07 東京エレクトロン株式会社 液処理装置、液処理方法および記憶媒体
DE112014001258T5 (de) * 2013-03-14 2015-12-17 Musashi Engineering, Inc. Flüssigmaterialabgabevorrichtung, Auftragungsvorrichtung von dieser und Auftragungsverfahren
JP6725374B2 (ja) * 2016-09-13 2020-07-15 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP6959743B2 (ja) * 2017-02-22 2021-11-05 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP6975018B2 (ja) * 2017-02-22 2021-12-01 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008267640A (ja) 2007-04-17 2008-11-06 Sumitomo Heavy Ind Ltd 冷却装置および半導体検査装置

Also Published As

Publication number Publication date
TWI722550B (zh) 2021-03-21
TW202023690A (zh) 2020-07-01
KR102489705B1 (ko) 2023-01-17
JP7132054B2 (ja) 2022-09-06
WO2020059385A1 (ja) 2020-03-26
KR20230014863A (ko) 2023-01-30
CN112753094A (zh) 2021-05-04
KR20210046033A (ko) 2021-04-27
JP2020047884A (ja) 2020-03-26

Similar Documents

Publication Publication Date Title
KR102541675B1 (ko) 기판 처리 장치, 및 기판 처리 방법
CN108461418B (zh) 基板处理装置
KR102142189B1 (ko) 약액 생성 방법, 약액 생성 장치 및 기판 처리 장치
JP6817860B2 (ja) 基板処理装置および基板処理方法
TWI635556B (zh) Substrate processing method
KR101897318B1 (ko) 기판 처리 장치
US11260436B2 (en) Substrate processing apparatus and substrate processing method
JP2014197592A (ja) 基板処理装置
KR20180034244A (ko) 회수 배관 세정 방법 및 기판 처리 장치
US20180236510A1 (en) Substrate processing apparatus and substrate processing method
TW202100255A (zh) 用於供應液體之單元、用於處理具有該單元之基板的設備及方法
CN108630571B (zh) 处理液供给装置、基板处理装置以及处理液供给方法
KR20180016588A (ko) 기판 처리 방법 및 기판 처리 장치
JP7312304B2 (ja) 基板処理装置、及び基板処理方法
WO2023127493A1 (ja) 基板処理装置及び基板処理方法
KR101939905B1 (ko) 기판 처리 장치 및 기판 처리 방법

Legal Events

Date Code Title Description
A107 Divisional application of patent
E701 Decision to grant or registration of patent right
GRNT Written decision to grant