KR102540568B1 - 솔더 페이스트 - Google Patents

솔더 페이스트 Download PDF

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Publication number
KR102540568B1
KR102540568B1 KR1020210128581A KR20210128581A KR102540568B1 KR 102540568 B1 KR102540568 B1 KR 102540568B1 KR 1020210128581 A KR1020210128581 A KR 1020210128581A KR 20210128581 A KR20210128581 A KR 20210128581A KR 102540568 B1 KR102540568 B1 KR 102540568B1
Authority
KR
South Korea
Prior art keywords
mass
less
flux
solder paste
alloy
Prior art date
Application number
KR1020210128581A
Other languages
English (en)
Korean (ko)
Other versions
KR20220044667A (ko
Inventor
히로요시 가와사키
마사토 시라토리
히로아키 가와마타
Original Assignee
센주긴조쿠고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 센주긴조쿠고교 가부시키가이샤 filed Critical 센주긴조쿠고교 가부시키가이샤
Publication of KR20220044667A publication Critical patent/KR20220044667A/ko
Application granted granted Critical
Publication of KR102540568B1 publication Critical patent/KR102540568B1/ko

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362—Selection of compositions of fluxes
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Conductive Materials (AREA)
  • Die Bonding (AREA)
KR1020210128581A 2020-10-02 2021-09-29 솔더 페이스트 KR102540568B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020168038A JP6928294B1 (ja) 2020-10-02 2020-10-02 ソルダペースト
JPJP-P-2020-168038 2020-10-02

Publications (2)

Publication Number Publication Date
KR20220044667A KR20220044667A (ko) 2022-04-11
KR102540568B1 true KR102540568B1 (ko) 2023-06-07

Family

ID=77456294

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020210128581A KR102540568B1 (ko) 2020-10-02 2021-09-29 솔더 페이스트

Country Status (4)

Country Link
JP (1) JP6928294B1 (ja)
KR (1) KR102540568B1 (ja)
CN (1) CN114378475B (ja)
TW (1) TWI782723B (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7450318B2 (ja) 2021-09-16 2024-03-15 株式会社タムラ製作所 はんだ組成物およびフレキシブル回路基板の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014205677A (ja) 2008-06-23 2014-10-30 イーエルシー マネージメント エルエルシー 持続性化粧品形成用組成物
JP2017100137A (ja) 2014-11-21 2017-06-08 荒川化学工業株式会社 スクリーン印刷用フラックス

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100958652B1 (ko) * 2005-07-01 2010-05-20 닛코킨조쿠 가부시키가이샤 고순도 주석 또는 주석 합금 및 고순도 주석의 제조방법
JP5019764B2 (ja) * 2006-03-09 2012-09-05 新日鉄マテリアルズ株式会社 鉛フリーハンダ合金、ハンダボール及び電子部材
JP4385061B2 (ja) * 2006-08-28 2009-12-16 ハリマ化成株式会社 はんだペースト組成物およびその用途
ES2702983T3 (es) * 2010-06-01 2019-03-06 Senju Metal Industry Co Pasta de soldadura sin limpieza y sin plomo
JP6717559B2 (ja) 2013-10-16 2020-07-01 三井金属鉱業株式会社 半田合金及び半田粉
JP5590260B1 (ja) * 2014-02-04 2014-09-17 千住金属工業株式会社 Ａｇボール、Ａｇ核ボール、フラックスコートＡｇボール、フラックスコートＡｇ核ボール、はんだ継手、フォームはんだ、はんだペースト、Ａｇペースト及びＡｇ核ペースト
WO2016135938A1 (ja) * 2015-02-27 2016-09-01 千住金属工業株式会社 フラックス
CN111344106B (zh) * 2017-11-24 2022-03-04 千住金属工业株式会社 软钎料材料、焊膏和钎焊接头
JP6540788B1 (ja) * 2017-12-29 2019-07-10 千住金属工業株式会社 フラックス及びソルダペースト
JP6521160B1 (ja) * 2018-07-20 2019-05-29 千住金属工業株式会社 はんだ合金、はんだ粉末、はんだペースト、およびこれらを用いたはんだ継手
EP3895838A1 (en) * 2018-12-03 2021-10-20 Senju Metal Industry Co., Ltd. Flux, solder alloy, joined body, and method for producing joined body
JP6643745B1 (ja) * 2019-05-27 2020-02-12 千住金属工業株式会社 はんだペースト及びはんだペースト用フラックス

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014205677A (ja) 2008-06-23 2014-10-30 イーエルシー マネージメント エルエルシー 持続性化粧品形成用組成物
JP2017100137A (ja) 2014-11-21 2017-06-08 荒川化学工業株式会社 スクリーン印刷用フラックス

Also Published As

Publication number Publication date
JP2022060052A (ja) 2022-04-14
TWI782723B (zh) 2022-11-01
CN114378475A (zh) 2022-04-22
JP6928294B1 (ja) 2021-09-01
CN114378475B (zh) 2023-05-23
TW202221146A (zh) 2022-06-01
KR20220044667A (ko) 2022-04-11

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