KR102539889B1 - 화학증폭형 감광성 수지 조성물 및 이로부터 제조된 절연막 - Google Patents

화학증폭형 감광성 수지 조성물 및 이로부터 제조된 절연막 Download PDF

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KR102539889B1
KR102539889B1 KR1020160102289A KR20160102289A KR102539889B1 KR 102539889 B1 KR102539889 B1 KR 102539889B1 KR 1020160102289 A KR1020160102289 A KR 1020160102289A KR 20160102289 A KR20160102289 A KR 20160102289A KR 102539889 B1 KR102539889 B1 KR 102539889B1
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KR
South Korea
Prior art keywords
group
carbon atoms
formula
resin
chemically amplified
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KR1020160102289A
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English (en)
Korean (ko)
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KR20180017843A (ko
Inventor
임민주
김종백
박한우
Original Assignee
동우 화인켐 주식회사
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Priority to KR1020160102289A priority Critical patent/KR102539889B1/ko
Priority to JP2017152762A priority patent/JP6734234B2/ja
Priority to TW106126571A priority patent/TWI710856B/zh
Priority to CN201710675703.8A priority patent/CN107728428B/zh
Publication of KR20180017843A publication Critical patent/KR20180017843A/ko
Application granted granted Critical
Publication of KR102539889B1 publication Critical patent/KR102539889B1/ko

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L29/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical; Compositions of hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Compositions of derivatives of such polymers
    • C08L29/02—Homopolymers or copolymers of unsaturated alcohols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • C08L33/062—Copolymers with monomers not covered by C08L33/06
    • C08L33/068—Copolymers with monomers not covered by C08L33/06 containing glycidyl groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133345—Insulating layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions

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  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Nonlinear Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mathematical Physics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Materials For Photolithography (AREA)
  • Liquid Crystal (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
KR1020160102289A 2016-08-11 2016-08-11 화학증폭형 감광성 수지 조성물 및 이로부터 제조된 절연막 KR102539889B1 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020160102289A KR102539889B1 (ko) 2016-08-11 2016-08-11 화학증폭형 감광성 수지 조성물 및 이로부터 제조된 절연막
JP2017152762A JP6734234B2 (ja) 2016-08-11 2017-08-07 化学増幅型感光性樹脂組成物及びそれから製造された絶縁膜
TW106126571A TWI710856B (zh) 2016-08-11 2017-08-07 化學增幅型感光性樹脂組合物及由其製造的絕緣膜
CN201710675703.8A CN107728428B (zh) 2016-08-11 2017-08-09 化学增幅型感光性树脂组合物及由其制造的绝缘膜

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020160102289A KR102539889B1 (ko) 2016-08-11 2016-08-11 화학증폭형 감광성 수지 조성물 및 이로부터 제조된 절연막

Publications (2)

Publication Number Publication Date
KR20180017843A KR20180017843A (ko) 2018-02-21
KR102539889B1 true KR102539889B1 (ko) 2023-06-05

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KR1020160102289A KR102539889B1 (ko) 2016-08-11 2016-08-11 화학증폭형 감광성 수지 조성물 및 이로부터 제조된 절연막

Country Status (4)

Country Link
JP (1) JP6734234B2 (zh)
KR (1) KR102539889B1 (zh)
CN (1) CN107728428B (zh)
TW (1) TWI710856B (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110412829A (zh) * 2018-04-26 2019-11-05 东友精细化工有限公司 负型感光性树脂组合物、光固化图案及图像显示装置
JP7103852B2 (ja) * 2018-05-31 2022-07-20 大阪ガスケミカル株式会社 硬化性組成物及びその硬化物
KR102564141B1 (ko) * 2018-08-20 2023-08-04 동우 화인켐 주식회사 포지티브형 감광성 수지 조성물 및 이로부터 형성된 절연막
ES2917898T3 (es) * 2019-03-11 2022-07-12 Samsung Electronics Co Ltd Dispositivo electrónico que incluye una placa conductora plegable

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JP2011209681A (ja) 2009-10-16 2011-10-20 Fujifilm Corp 感光性樹脂組成物、硬化膜の形成方法、硬化膜、有機ｅｌ表示装置、及び、液晶表示装置
KR101404005B1 (ko) * 2010-04-28 2014-06-05 제이에스알 가부시끼가이샤 포지티브형 감방사선성 조성물, 표시 소자용 층간 절연막 및 그 형성 방법
JP2014174235A (ja) 2013-03-06 2014-09-22 Jsr Corp 感放射線性樹脂組成物、硬化膜、その形成方法、及び表示素子

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JP5504823B2 (ja) * 2009-10-28 2014-05-28 Ｊｓｒ株式会社 感放射線性組成物、保護膜、層間絶縁膜、及びそれらの形成方法
JP5191567B2 (ja) * 2011-01-12 2013-05-08 富士フイルム株式会社 ポジ型感光性樹脂組成物、硬化膜の形成方法、硬化膜、有機ｅｌ表示装置、及び、液晶表示装置
TW201310166A (zh) * 2011-08-31 2013-03-01 Everlight Chem Ind Corp 層間絕緣膜暨保護膜用之樹脂及感光樹脂組成物
JP5555732B2 (ja) * 2012-02-29 2014-07-23 富士フイルム株式会社 感光性樹脂組成物、これを用いた硬化膜の製造方法、硬化膜、液晶表示装置および有機ｅｌ表示装置
JP6065789B2 (ja) * 2012-09-27 2017-01-25 信越化学工業株式会社 化学増幅ポジ型レジスト材料及びパターン形成方法
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JP2011209681A (ja) 2009-10-16 2011-10-20 Fujifilm Corp 感光性樹脂組成物、硬化膜の形成方法、硬化膜、有機ｅｌ表示装置、及び、液晶表示装置
KR101404005B1 (ko) * 2010-04-28 2014-06-05 제이에스알 가부시끼가이샤 포지티브형 감방사선성 조성물, 표시 소자용 층간 절연막 및 그 형성 방법
JP2014174235A (ja) 2013-03-06 2014-09-22 Jsr Corp 感放射線性樹脂組成物、硬化膜、その形成方法、及び表示素子

Also Published As

Publication number Publication date
JP2018025799A (ja) 2018-02-15
CN107728428B (zh) 2022-02-08
CN107728428A (zh) 2018-02-23
KR20180017843A (ko) 2018-02-21
TWI710856B (zh) 2020-11-21
JP6734234B2 (ja) 2020-08-05
TW201823867A (zh) 2018-07-01

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